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MY159909A - Antenna sheet, transponder and book form - Google Patents

Antenna sheet, transponder and book form

Info

Publication number
MY159909A
MY159909A MYPI2010001110A MYPI2010001110A MY159909A MY 159909 A MY159909 A MY 159909A MY PI2010001110 A MYPI2010001110 A MY PI2010001110A MY PI2010001110 A MYPI2010001110 A MY PI2010001110A MY 159909 A MY159909 A MY 159909A
Authority
MY
Malaysia
Prior art keywords
transponder
antenna sheet
book form
substrate
module
Prior art date
Application number
MYPI2010001110A
Inventor
Junsuke Tanaka
Akihisa Yamamoto
Makoto Maehira
Yoshiyuki Mizuguchi
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Publication of MY159909A publication Critical patent/MY159909A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Details Of Aerials (AREA)

Abstract

AN ANTENNA SHEET (1) IS PROVIDED WITH A FLEXIBLE SUBSTRATE (2), AND AN ANTENNA COIL (4),WHICH IS CONNECTED TO A TERMINAL SECTION OF AN EXTERNAL IC MODULE HAVING AN IC CHIP AND IS ARRANGED ON THE SUBSTRATE. ON THE SUBSTRATE,A STORING SECTION THAT STORES AT LEAST A PART OF THE IC MODULE IS FORMED. FIGURE 4B
MYPI2010001110A 2007-09-14 2008-09-12 Antenna sheet, transponder and book form MY159909A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007239982 2007-09-14
JP2008187007 2008-07-18

Publications (1)

Publication Number Publication Date
MY159909A true MY159909A (en) 2017-02-15

Family

ID=40452100

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2010001110A MY159909A (en) 2007-09-14 2008-09-12 Antenna sheet, transponder and book form

Country Status (15)

Country Link
US (1) US8519905B2 (en)
EP (2) EP2192530B1 (en)
JP (1) JP5370154B2 (en)
KR (2) KR101163300B1 (en)
CN (1) CN101836225B (en)
AU (1) AU2008297839B2 (en)
BR (1) BRPI0817336A2 (en)
CA (1) CA2699552C (en)
ES (2) ES2563451T3 (en)
MX (1) MX2010002872A (en)
MY (1) MY159909A (en)
PL (2) PL2192530T3 (en)
RU (1) RU2471232C2 (en)
TW (1) TWI379241B (en)
WO (1) WO2009035094A1 (en)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2467393C2 (en) * 2008-02-22 2012-11-20 Топпан Принтинг Ко., Лтд. Transponder and booklet
WO2010125818A1 (en) * 2009-04-28 2010-11-04 凸版印刷株式会社 Antenna sheet, data carrier with non-contact ic, and method for producing antenna sheet
JP2010257416A (en) * 2009-04-28 2010-11-11 Toppan Printing Co Ltd Information recording medium, data carrier with non-contact type IC, and method for manufacturing information recording medium
DE102009023715A1 (en) * 2009-06-03 2010-12-09 Leonhard Kurz Stiftung & Co. Kg The security document
WO2011024844A1 (en) * 2009-08-26 2011-03-03 凸版印刷株式会社 Non-contact communication medium
JP5428761B2 (en) * 2009-10-30 2014-02-26 凸版印刷株式会社 Antenna sheet, transponder and booklet
JP5397193B2 (en) * 2009-11-30 2014-01-22 凸版印刷株式会社 Non-contact information medium and non-contact information medium attached booklet
JP2011237969A (en) * 2010-05-10 2011-11-24 Toppan Printing Co Ltd Non-contact information medium and booklet incorporating the same
JP2012037957A (en) * 2010-08-04 2012-02-23 Nippon Signal Co Ltd:The Reader/writer and door opening/closing device
JP2012073725A (en) * 2010-09-28 2012-04-12 Toppan Printing Co Ltd Non-contact communication medium, booklet and manufacturing method thereof
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
JP2012160108A (en) * 2011-02-02 2012-08-23 Toppan Printing Co Ltd Contactless information recording medium
JP5834585B2 (en) * 2011-07-25 2015-12-24 凸版印刷株式会社 Non-contact communication medium and method for manufacturing the same
TWI453677B (en) * 2011-12-01 2014-09-21 Mutual Pak Technology Co Ltd Radio frequency identification tag and cloth having the same
US8763914B2 (en) * 2012-01-17 2014-07-01 On Track Innovations Ltd. Decoupled contactless bi-directional systems and methods
JPWO2013161781A1 (en) * 2012-04-24 2015-12-24 凸版印刷株式会社 Non-contact type information medium and non-contact type information medium booklet
US9093756B2 (en) * 2012-09-18 2015-07-28 Panasonic Intellectual Property Management Co., Ltd. Antenna, transmitter device, receiver device, three-dimensional integrated circuit, and contactless communication system
FR3001070B1 (en) * 2013-01-17 2016-05-06 Inside Secure ANTENNA SYSTEM FOR CONTACTLESS MICROCIRCUIT
US10909440B2 (en) * 2013-08-22 2021-02-02 Texas Instruments Incorporated RFID tag with integrated antenna
FR3013152A1 (en) * 2013-11-14 2015-05-15 Smart Packaging Solutions DOUBLE-SIDED ANTENNA FOR CHIP CARD
US10218049B2 (en) * 2013-12-05 2019-02-26 Uniqarta, Inc. Electronic device incorporated into a sheet
US11514288B2 (en) * 2014-08-10 2022-11-29 Amatech Group Limited Contactless metal card constructions
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
MX395538B (en) 2016-07-27 2025-03-25 Composecure Llc OVERMOLDED ELECTRONIC COMPONENTS FOR TRANSACTION CARDS AND METHODS FOR MAKING THE SAME.
CN106909962A (en) * 2017-02-08 2017-06-30 珠海恒冠宇科技有限公司 Flexible contact type IC assertive evidences, read-write implement and used equipment upgrading method
WO2018180035A1 (en) * 2017-03-30 2018-10-04 住友電気工業株式会社 Planar antenna and wireless module
WO2019045638A1 (en) * 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd Integrated circuit modules and smart cards incorporating the same
KR102714896B1 (en) 2017-09-07 2024-10-07 컴포시큐어 엘엘씨 Transaction cards with embedded electronic components and processes for their manufacture
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
DK4109337T3 (en) 2017-10-18 2024-12-02 Composecure Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and backlighting
KR102129590B1 (en) * 2019-06-13 2020-07-02 신혜중 Hybrid type wireless charging and receiving antenna device and manufacturing Method for the Same
JP7426693B2 (en) * 2019-12-13 2024-02-02 日本パッケージ・システム株式会社 RFID inlay
USD1032613S1 (en) * 2020-02-02 2024-06-25 Federal Card Services, LLC Smart card
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
JP7095825B1 (en) 2022-03-30 2022-07-05 豊田合成株式会社 Vehicle exterior parts
CN115424832B (en) * 2022-09-05 2025-09-12 京东方科技集团股份有限公司 Coil structure and electronic equipment

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996009175A1 (en) * 1994-09-22 1996-03-28 Rohm Co., Ltd. Non-contact type ic card and method of manufacturing same
JPH09109577A (en) * 1995-10-13 1997-04-28 Toppan Printing Co Ltd Card having contactless storage medium and method of manufacturing the same
AU709049B2 (en) 1996-02-12 1999-08-19 Smartrac Ip B.V. Process and device for contacting a wire conductor
TW297501U (en) 1996-06-22 1997-02-01 yun-rong Xue Finned-pipe type evaporating device utilizing hot air to defrost
US5708419A (en) * 1996-07-22 1998-01-13 Checkpoint Systems, Inc. Method of wire bonding an integrated circuit to an ultraflexible substrate
US6157344A (en) * 1999-02-05 2000-12-05 Xertex Technologies, Inc. Flat panel antenna
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
JP2002042068A (en) 2000-07-21 2002-02-08 Dainippon Printing Co Ltd Non-contact data carrier and booklet having non-contact data carrier
JP2002109502A (en) 2000-07-28 2002-04-12 Oji Paper Co Ltd IC package and manufacturing method thereof
ATE480843T1 (en) * 2001-04-30 2010-09-15 Neology Inc IDENTIFICATION ITEM HAVING A TRANSPONDER AND A DISCONTINUOUS METALLICATED, RETROREFLECTIVE OR HOLOGRAPHIC IMAGE FIELD AND METHOD FOR PRODUCING SUCH AN ITEM
FR2826154B1 (en) * 2001-06-14 2004-07-23 A S K CHIP CARD WITHOUT CONTACT WITH AN ANTENNA SUPPORT AND CHIP SUPPORT OF FIBROUS MATERIAL
EP1439608A4 (en) * 2001-09-28 2008-02-06 Mitsubishi Materials Corp Antenna coil and rfid-use tag using it, transponder-use antenna
JP3881366B2 (en) 2002-12-06 2007-02-14 株式会社フジクラ antenna
JP2004280503A (en) * 2003-03-17 2004-10-07 Toppan Printing Co Ltd Combination IC card
US7090606B2 (en) 2003-07-03 2006-08-15 The Gates Corporation Adjustable tensioner
JP2005084757A (en) 2003-09-04 2005-03-31 Seiko Epson Corp Business card with wireless communication IC device
EP1684338A1 (en) 2003-11-11 2006-07-26 Toray Engineering Co., Ltd. Non-contact id card and manufacturing method thereof
WO2005071608A1 (en) * 2004-01-23 2005-08-04 Semiconductor Energy Laboratory Co., Ltd. Id label, id card, and id tag
US7083083B2 (en) * 2004-04-27 2006-08-01 Nagraid S.A. Portable information carrier with transponders
WO2006005000A1 (en) * 2004-06-29 2006-01-12 Kanzaki Specialty Papers Inc. A multifunction, direct thermal recording material
JP2006155224A (en) * 2004-11-29 2006-06-15 Mitsubishi Polyester Film Copp Polyester film for RFID tags
JPWO2006077732A1 (en) * 2005-01-18 2008-06-19 コニカミノルタエムジー株式会社 Printing plate material, plate making method, printing method, package for lithographic printing plate material assembly, assembly of lithographic printing plate material and plate making printing method
FR2882174B1 (en) 2005-02-11 2007-09-07 Smart Packaging Solutions Sps METHOD FOR MANUFACTURING A MICROELECTRONIC DEVICE WITH NON-CONTACT FUNCTIONING, IN PARTICULAR FOR ELECTRONIC PASSPORT
RU2286600C1 (en) 2005-05-18 2006-10-27 Государственное образовательное учреждение высшего профессионального образования Московский государственный институт электронной техники (технический университет) Electronic module for non-contact identification
JP5352045B2 (en) 2005-06-03 2013-11-27 株式会社半導体エネルギー研究所 Method for manufacturing integrated circuit device
US7545276B2 (en) * 2005-09-13 2009-06-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
TW200713074A (en) 2005-09-26 2007-04-01 Ind Tech Res Inst Flexible RFID label and manufacturing method thereof
TWI297501B (en) 2006-03-17 2008-06-01 Elite Semiconductor Esmt Method and apparatus for determining sensing timing of flash memory
TWM305942U (en) 2006-05-25 2007-02-01 Sunbest Technology Co Ltd Radio frequency identification clothing tag
JP4855880B2 (en) * 2006-09-20 2012-01-18 リンテック株式会社 Antenna circuit, antenna circuit manufacturing method, IC inlet, IC tag
US7581308B2 (en) * 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip

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US8519905B2 (en) 2013-08-27
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CN101836225A (en) 2010-09-15
CA2699552A1 (en) 2009-03-19
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ES2563451T3 (en) 2016-03-15

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