RU2286600C1 - Electronic module for non-contact identification - Google Patents

Abstract

FIELD: technology for identification of individuals, stationary or moveable objects, products and analogical items, namely, portable electronic means like label or mark, making it possible to detect and recognize an object, to which such a mark is attached.

SUBSTANCE: electronic module contains bodiless integration circuit, inductance coil and capacitor, forming an antenna, and mounting board, made of polyimide ribbon with one-sided metallization, on which using thin-film photo-lithography methods flat coil is formed with mounting clamps and flexible leaf, connected to mounting clamp, bend of leaf is made with bending radius not less than thickness of commutation conductor.

EFFECT: planarization of module, decreased dimensions and decreased laboriousness of manufacture, expanded range of working temperatures and, therefore, expanded area of application of device, including radiation resistance.

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Description

The present invention relates to the field of identification of persons, stationary or moving objects, products and similar objects, namely, portable electronic means such as a label or tag, which allows to detect and identify the object to which such a tag is attached. The module can be used to identify and allow people to access certain rooms, workplaces or to terminals of communication and information systems, search and recognition of animals, marking biological samples, chemicals and medical instruments, in automated security systems, electronic payment systems and other systems.

A known design of an identification device containing a frameless integrated circuit, an inductor and a capacitor forming an antenna, and a mounting plate made of polyimide tape with one-side metallization, on which two electrically conductive patch tracks are formed in the longitudinal direction by thin-film photolithography, and the tape is folded several times with a bend radius of not less than the thickness of the switching conductors and glued between folded parallel sections with glue when thickness not a glue joint not less than the thickness of the conductors of the switching tracks [1]. The disadvantage of the proposed technical solution is the impossibility of using the device in planar structures, which does not provide microminiaturization.

A known design of a high-frequency identification device mounted on a flexible board. The module, which transmits a signal with identification information in response to a request from the polling system, contains a flexible card with an encoder IC located on it for recording identification information, an antenna and a generator transmitting an RF signal modulated by identification information to the antenna. The device can be manufactured by creating on a flexible substrate, for example, a polyethylene, printed circuit conductors using conductive inks based on graphite or silver [2]. The device can be made in the form of a bracelet and can be used to access protected areas. The disadvantage of this device is the rather large dimensions and the need to use an internal power source to provide communication, since otherwise the range of reliable communication between the polling system and the device is sharply reduced.

The closest in technical essence to the proposed module, adopted as a prototype, is an electronic proximity module designed to be embedded in identification cards or labels. The electronic module contains a substrate for mounting an electronic microcircuit, which is configured to be connected to the antenna to ensure contactless operation of the module, the antenna is completely located on the module and contains turns made on the plane of the substrate, and the microcircuit and antenna are located on two opposite sides of the module substrate, contact terminals antennas are connected to the terminals of the microcircuit by means of connecting wires drawn through the channels made in the base [3]. The disadvantage of the proposed technical solution is the impossibility of using the module in planar structures, it requires the presence of additional connecting wires to ensure switching of the IC chip with the antenna located on opposite sides of the substrate, thereby complicating the design, increasing the complexity of manufacturing and reducing the reliability of the module. In addition, the use of wires for switching the microcircuit with the antenna eliminates the use of aluminum as the material of the inductor, thereby significantly reducing the radiation resistance of the module and, as a result, the field of application of such devices.

The purpose of the invention is the creation of a planar electronic module of contactless identification, which ensures microminiaturization of the module — minimization of overall dimensions and automation of assembly of the module and, as a result, increased reliability and reduced labor intensity.

The basis of the invention is the creation of a planar design of a contactless identification module, devoid of these disadvantages and significantly expand the scope of application of such devices. The device should not contain internal power sources, operate in a wide temperature range, have small weight and size indicators, reproducible parameters with high accuracy, have a low cost, due to the possibility of manufacturing a module based on automated equipment. The electronic module contains a housing-free integrated circuit, an inductor and a capacitor forming an antenna, and a mounting plate made of a polymer tape with one-side metallization, on which a flat coil with mounting leads and a flexible lobe connected to the mounting lead are formed by thin-film photolithography, the petal is bent with a bend radius of not less than the thickness of the switching conductor.

Figure 1 shows the design of the electronic module for contactless identification prior to assembly, where 1 is the mounting substrate; 2 - coil turns; 3 - internal output of the coil; 4, 5 - mounting conclusions of the microcircuit; 6 - external output of the coil; 7 - flexible petal of the substrate.

Figure 2 shows the electronic module of contactless identification, where 8 is a frameless IC.

The solution to this problem is achieved by the fact that in the identification module, which contains an open-circuit integrated circuit 8 for recording and issuing identification information, an inductor and a capacitor forming an antenna for bi-directional contactless communication with the interrogation system, and mounting substrate 1, are made of a flexible polymer tape with one-sided metallization. The use of polyimide with a temperature resistance range from liquid nitrogen temperatures to plus 350 ° C as a flexible tape allows you to expand the range of operating temperatures of the module, and in combination with aluminum metallization provides radiation resistance of the module. Coils 2 are formed from the metallization layer by thin-film photolithography methods. The internal output of the coil 3 is one of the mounting terminals of the microcircuit 4, the second mounting terminal 5 is a continuation of the external output of the coil 6, which is placed on the flexible lobe of the substrate 7 and connected to the mounting terminal through holes in the substrate . To exclude breakage and peeling of conductors, the radius of the bend of the tape should not be less than the thickness of the switching layer.

The design and method of manufacturing the proposed module can be illustrated in the following examples.

Example 1. The electronic contactless identification module is assembled on a flexible mounting substrate of a 12 μm thick polyimide film coated with a 30 μm thick aluminum layer. The conductive switching conductors of the coil and lobe turns are formed with a resolution of thin-film photolithography. The length of the conductors (the number of turns of the coil), and therefore the initial dimensions of the substrate, provide a resonant frequency of 13.56 MHz for a given loop capacitance. Planarization is achieved by mounting the microcircuit on a substrate, on the opposite side of which are located the turns of the coil. The contact terminals of the antenna with the mounting terminals of the chip is carried out through channels in the substrate, made by chemical etching of polyimide. Installation is carried out by the widely used, automated and reliable method of ultrasonic microwelding in the electronic industry. The internal output of the coil is one of the mounting terminals of the microcircuit, the second mounting output is a continuation of the external output of the coil, which is placed on a flexible lobe of the substrate and connected to the mounting output through holes in the substrate. This design provides an antenna circuit, and the bend of the petal is made with a bend radius of 50 μm and eliminates the breakage and peeling of the conductor.

Example 2. In a similar manner to that described in Example 1, a module was assembled on a flexible mounting substrate of 50 μm thick Teflon coated with a 50 μm thick copper layer. Installation is carried out by the group method of thermocompression using ball leads previously formed on the microcircuit. The bend of the petal is made with a bend radius of 100 μm.

Using the proposed design and a method of manufacturing an electronic contactless identification module in comparison with the prototype provides planarization of the module, increases radiation resistance, extends the range of operating temperatures, allows the use of group automated methods of microelectronic technology in its manufacture, which accordingly reduces the complexity. Thanks to this, the field of application of such electronic contactless identification modules is expanding.

Information sources

1. Patent RU 2242798 C2, 7 G 06 K 19/077.

2. Patent WO 99/13441, MKI G 08 V 13/187.

3. Patent RU 2194306 C2, 7 G 06 K 19/077, G 09 F 3/00, prototype.

Claims (1)

A non-contact identification electronic module containing a substrate for mounting a microcircuit, which is configured to connect to an antenna completely located on the substrate and containing coil coils made on the plane of the substrate, the microcircuit and antenna are located on opposite sides of the substrate, the antenna terminals are connected to the terminals of the microcircuit through channels made in the substrate, characterized in that the internal output of the coil is one of the mounting terminals of the chip, the second mounting terminal S THE continuation external output coil, which is disposed on the flexible substrate and connected to a petal mounting terminal through holes in a substrate, the bend tab configured bend radius not less than the output thickness.

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