WO2008081741A1 - 抵抗変化型素子および抵抗変化型記憶装置 - Google Patents
抵抗変化型素子および抵抗変化型記憶装置 Download PDFInfo
- Publication number
- WO2008081741A1 WO2008081741A1 PCT/JP2007/074556 JP2007074556W WO2008081741A1 WO 2008081741 A1 WO2008081741 A1 WO 2008081741A1 JP 2007074556 W JP2007074556 W JP 2007074556W WO 2008081741 A1 WO2008081741 A1 WO 2008081741A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- resistance variable
- storage device
- resistance
- variable element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0007—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of switching materials, e.g. deposition of layers
- H10N70/026—Formation of switching materials, e.g. deposition of layers by physical vapor deposition, e.g. sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/30—Resistive cell, memory material aspects
- G11C2213/31—Material having complex metal oxide, e.g. perovskite structure
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
- G11C2213/70—Resistive array aspects
- G11C2213/72—Array wherein the access device being a diode
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/518,400 US8018760B2 (en) | 2006-12-28 | 2007-12-20 | Resistance variable element and resistance variable memory apparatus |
| CN200780029617.4A CN101501851B (zh) | 2006-12-28 | 2007-12-20 | 电阻变化型元件和电阻变化型存储装置 |
| JP2008513046A JP4202411B2 (ja) | 2006-12-28 | 2007-12-20 | 抵抗変化型素子および抵抗変化型記憶装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-354218 | 2006-12-28 | ||
| JP2006354218 | 2006-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008081741A1 true WO2008081741A1 (ja) | 2008-07-10 |
Family
ID=39588425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2007/074556 Ceased WO2008081741A1 (ja) | 2006-12-28 | 2007-12-20 | 抵抗変化型素子および抵抗変化型記憶装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8018760B2 (ja) |
| JP (1) | JP4202411B2 (ja) |
| CN (1) | CN101501851B (ja) |
| WO (1) | WO2008081741A1 (ja) |
Families Citing this family (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010048127A2 (en) | 2008-10-20 | 2010-04-29 | The Regents Of The University Of Michigan | A silicon based nanoscale crossbar memory |
| US9012307B2 (en) | 2010-07-13 | 2015-04-21 | Crossbar, Inc. | Two terminal resistive switching device structure and method of fabricating |
| US9570678B1 (en) | 2010-06-08 | 2017-02-14 | Crossbar, Inc. | Resistive RAM with preferental filament formation region and methods |
| US8946046B1 (en) | 2012-05-02 | 2015-02-03 | Crossbar, Inc. | Guided path for forming a conductive filament in RRAM |
| US9601692B1 (en) | 2010-07-13 | 2017-03-21 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| WO2011155210A1 (ja) * | 2010-06-10 | 2011-12-15 | パナソニック株式会社 | 不揮発性記憶素子およびそれを備えた不揮発性記憶装置 |
| US8441835B2 (en) | 2010-06-11 | 2013-05-14 | Crossbar, Inc. | Interface control for improved switching in RRAM |
| KR101883236B1 (ko) | 2010-06-11 | 2018-08-01 | 크로스바, 인크. | 메모리 디바이스를 위한 필러 구조 및 방법 |
| US8351241B2 (en) | 2010-06-24 | 2013-01-08 | The Regents Of The University Of Michigan | Rectification element and method for resistive switching for non volatile memory device |
| US8374018B2 (en) | 2010-07-09 | 2013-02-12 | Crossbar, Inc. | Resistive memory using SiGe material |
| US8168506B2 (en) | 2010-07-13 | 2012-05-01 | Crossbar, Inc. | On/off ratio for non-volatile memory device and method |
| US8467227B1 (en) | 2010-11-04 | 2013-06-18 | Crossbar, Inc. | Hetero resistive switching material layer in RRAM device and method |
| US8569172B1 (en) | 2012-08-14 | 2013-10-29 | Crossbar, Inc. | Noble metal/non-noble metal electrode for RRAM applications |
| US8947908B2 (en) | 2010-11-04 | 2015-02-03 | Crossbar, Inc. | Hetero-switching layer in a RRAM device and method |
| US8884261B2 (en) | 2010-08-23 | 2014-11-11 | Crossbar, Inc. | Device switching using layered device structure |
| US8889521B1 (en) | 2012-09-14 | 2014-11-18 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US9401475B1 (en) | 2010-08-23 | 2016-07-26 | Crossbar, Inc. | Method for silver deposition for a non-volatile memory device |
| US8492195B2 (en) | 2010-08-23 | 2013-07-23 | Crossbar, Inc. | Method for forming stackable non-volatile resistive switching memory devices |
| US8404553B2 (en) | 2010-08-23 | 2013-03-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device and method |
| US8391049B2 (en) | 2010-09-29 | 2013-03-05 | Crossbar, Inc. | Resistor structure for a non-volatile memory device and method |
| US8558212B2 (en) | 2010-09-29 | 2013-10-15 | Crossbar, Inc. | Conductive path in switching material in a resistive random access memory device and control |
| US8502185B2 (en) | 2011-05-31 | 2013-08-06 | Crossbar, Inc. | Switching device having a non-linear element |
| USRE46335E1 (en) | 2010-11-04 | 2017-03-07 | Crossbar, Inc. | Switching device having a non-linear element |
| US8088688B1 (en) | 2010-11-05 | 2012-01-03 | Crossbar, Inc. | p+ polysilicon material on aluminum for non-volatile memory device and method |
| US8930174B2 (en) | 2010-12-28 | 2015-01-06 | Crossbar, Inc. | Modeling technique for resistive random access memory (RRAM) cells |
| US9153623B1 (en) | 2010-12-31 | 2015-10-06 | Crossbar, Inc. | Thin film transistor steering element for a non-volatile memory device |
| US8815696B1 (en) | 2010-12-31 | 2014-08-26 | Crossbar, Inc. | Disturb-resistant non-volatile memory device using via-fill and etchback technique |
| US8791010B1 (en) | 2010-12-31 | 2014-07-29 | Crossbar, Inc. | Silver interconnects for stacked non-volatile memory device and method |
| US8450710B2 (en) | 2011-05-27 | 2013-05-28 | Crossbar, Inc. | Low temperature p+ silicon junction material for a non-volatile memory device |
| US8394670B2 (en) | 2011-05-31 | 2013-03-12 | Crossbar, Inc. | Vertical diodes for non-volatile memory device |
| US9620206B2 (en) | 2011-05-31 | 2017-04-11 | Crossbar, Inc. | Memory array architecture with two-terminal memory cells |
| US8619459B1 (en) | 2011-06-23 | 2013-12-31 | Crossbar, Inc. | High operating speed resistive random access memory |
| US9166163B2 (en) | 2011-06-30 | 2015-10-20 | Crossbar, Inc. | Sub-oxide interface layer for two-terminal memory |
| US8659929B2 (en) | 2011-06-30 | 2014-02-25 | Crossbar, Inc. | Amorphous silicon RRAM with non-linear device and operation |
| US8946669B1 (en) | 2012-04-05 | 2015-02-03 | Crossbar, Inc. | Resistive memory device and fabrication methods |
| US9564587B1 (en) | 2011-06-30 | 2017-02-07 | Crossbar, Inc. | Three-dimensional two-terminal memory with enhanced electric field and segmented interconnects |
| US9627443B2 (en) | 2011-06-30 | 2017-04-18 | Crossbar, Inc. | Three-dimensional oblique two-terminal memory with enhanced electric field |
| CN103828047A (zh) | 2011-07-22 | 2014-05-28 | 科洛斯巴股份有限公司 | 用于非易失性存储器装置的p+硅锗材料的种子层及方法 |
| US9729155B2 (en) | 2011-07-29 | 2017-08-08 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| US10056907B1 (en) | 2011-07-29 | 2018-08-21 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| US8674724B2 (en) | 2011-07-29 | 2014-03-18 | Crossbar, Inc. | Field programmable gate array utilizing two-terminal non-volatile memory |
| US8716098B1 (en) | 2012-03-09 | 2014-05-06 | Crossbar, Inc. | Selective removal method and structure of silver in resistive switching device for a non-volatile memory device |
| JP2013201276A (ja) | 2012-03-23 | 2013-10-03 | Toshiba Corp | 抵抗変化素子及び不揮発性記憶装置 |
| US9087576B1 (en) | 2012-03-29 | 2015-07-21 | Crossbar, Inc. | Low temperature fabrication method for a three-dimensional memory device and structure |
| US9685608B2 (en) | 2012-04-13 | 2017-06-20 | Crossbar, Inc. | Reduced diffusion in metal electrode for two-terminal memory |
| US8658476B1 (en) | 2012-04-20 | 2014-02-25 | Crossbar, Inc. | Low temperature P+ polycrystalline silicon material for non-volatile memory device |
| US8796658B1 (en) | 2012-05-07 | 2014-08-05 | Crossbar, Inc. | Filamentary based non-volatile resistive memory device and method |
| US8765566B2 (en) | 2012-05-10 | 2014-07-01 | Crossbar, Inc. | Line and space architecture for a non-volatile memory device |
| US9583701B1 (en) | 2012-08-14 | 2017-02-28 | Crossbar, Inc. | Methods for fabricating resistive memory device switching material using ion implantation |
| US10096653B2 (en) | 2012-08-14 | 2018-10-09 | Crossbar, Inc. | Monolithically integrated resistive memory using integrated-circuit foundry compatible processes |
| US8946673B1 (en) | 2012-08-24 | 2015-02-03 | Crossbar, Inc. | Resistive switching device structure with improved data retention for non-volatile memory device and method |
| US9312483B2 (en) | 2012-09-24 | 2016-04-12 | Crossbar, Inc. | Electrode structure for a non-volatile memory device and method |
| WO2014052316A1 (en) * | 2012-09-25 | 2014-04-03 | Advanced Technology Materials, Inc. | Cobalt precursors for low temperature ald or cvd of cobalt-based thin films |
| US9576616B2 (en) | 2012-10-10 | 2017-02-21 | Crossbar, Inc. | Non-volatile memory with overwrite capability and low write amplification |
| US11068620B2 (en) | 2012-11-09 | 2021-07-20 | Crossbar, Inc. | Secure circuit integrated with memory layer |
| US8982647B2 (en) | 2012-11-14 | 2015-03-17 | Crossbar, Inc. | Resistive random access memory equalization and sensing |
| US9412790B1 (en) | 2012-12-04 | 2016-08-09 | Crossbar, Inc. | Scalable RRAM device architecture for a non-volatile memory device and method |
| US9406379B2 (en) | 2013-01-03 | 2016-08-02 | Crossbar, Inc. | Resistive random access memory with non-linear current-voltage relationship |
| US9324942B1 (en) | 2013-01-31 | 2016-04-26 | Crossbar, Inc. | Resistive memory cell with solid state diode |
| US9112145B1 (en) | 2013-01-31 | 2015-08-18 | Crossbar, Inc. | Rectified switching of two-terminal memory via real time filament formation |
| US8934280B1 (en) | 2013-02-06 | 2015-01-13 | Crossbar, Inc. | Capacitive discharge programming for two-terminal memory cells |
| US10290801B2 (en) | 2014-02-07 | 2019-05-14 | Crossbar, Inc. | Scalable silicon based resistive memory device |
| US9425237B2 (en) | 2014-03-11 | 2016-08-23 | Crossbar, Inc. | Selector device for two-terminal memory |
| US9768234B2 (en) | 2014-05-20 | 2017-09-19 | Crossbar, Inc. | Resistive memory architecture and devices |
| US9633724B2 (en) | 2014-07-07 | 2017-04-25 | Crossbar, Inc. | Sensing a non-volatile memory device utilizing selector device holding characteristics |
| US10211397B1 (en) | 2014-07-07 | 2019-02-19 | Crossbar, Inc. | Threshold voltage tuning for a volatile selection device |
| US9698201B2 (en) | 2014-07-09 | 2017-07-04 | Crossbar, Inc. | High density selector-based non volatile memory cell and fabrication |
| US9460788B2 (en) | 2014-07-09 | 2016-10-04 | Crossbar, Inc. | Non-volatile memory cell utilizing volatile switching two terminal device and a MOS transistor |
| US10115819B2 (en) | 2015-05-29 | 2018-10-30 | Crossbar, Inc. | Recessed high voltage metal oxide semiconductor transistor for RRAM cell |
| US9685483B2 (en) | 2014-07-09 | 2017-06-20 | Crossbar, Inc. | Selector-based non-volatile cell fabrication utilizing IC-foundry compatible process |
| US10096362B1 (en) | 2017-03-24 | 2018-10-09 | Crossbar, Inc. | Switching block configuration bit comprising a non-volatile memory cell |
| US10944052B2 (en) | 2018-08-14 | 2021-03-09 | Newport Fab, Llc | Phase-change material (PCM) radio frequency (RF) switch using a chemically protective and thermally conductive layer |
| US10593404B2 (en) * | 2018-08-14 | 2020-03-17 | Newport Fab, Llc | Array architecture for large scale integration of phase-change material (PCM) radio frequency (RF) switches |
| US10529922B1 (en) | 2018-08-14 | 2020-01-07 | Newport Fab, Llc | Substrates and heat spreaders for heat management and RF isolation in integrated semiconductor devices having phase-change material (PCM) radio frequency (RF) switches |
| US10862477B2 (en) | 2018-08-14 | 2020-12-08 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing of functionality of phase-change material (PCM) radio frequency (RF) switches |
| US10978639B2 (en) | 2018-08-14 | 2021-04-13 | Newport Fab, Llc | Circuits for reducing RF signal interference and for reducing DC power loss in phase-change material (PCM) RF switches |
| US11196401B2 (en) | 2018-08-14 | 2021-12-07 | Newport Fab, Llc | Radio frequency (RF) module using a tunable RF filter with non-volatile RF switches |
| US10739290B2 (en) | 2018-08-14 | 2020-08-11 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing and characterization of conductivity skew of phase-change material (PCM) in PCM radio frequency (RF) switches |
| US10749109B2 (en) | 2018-08-14 | 2020-08-18 | Newport Fab, Llc | Read out integrated circuit (ROIC) for rapid testing and characterization of resistivity change of heating element in phase-change material (PCM) radio frequency (RF) switch |
| US11158794B2 (en) | 2018-08-14 | 2021-10-26 | Newport Fab, Llc | High-yield tunable radio frequency (RF) filter with auxiliary capacitors and non-volatile RF switches |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004185756A (ja) * | 2002-12-05 | 2004-07-02 | Sharp Corp | 不揮発性メモリ装置 |
| WO2005101420A1 (en) * | 2004-04-16 | 2005-10-27 | Matsushita Electric Industrial Co. Ltd. | Thin film memory device having a variable resistance |
| WO2006028117A1 (ja) * | 2004-09-09 | 2006-03-16 | Matsushita Electric Industrial Co., Ltd. | 抵抗変化素子とその製造方法 |
| JP2006080259A (ja) * | 2004-09-09 | 2006-03-23 | Matsushita Electric Ind Co Ltd | 抵抗変化素子およびそれを用いた不揮発性メモリ、ならびにこれらの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6204139B1 (en) | 1998-08-25 | 2001-03-20 | University Of Houston | Method for switching the properties of perovskite materials used in thin film resistors |
| CN1169745C (zh) * | 2001-11-27 | 2004-10-06 | 南京大学 | 具有巨磁电阻效应的锌铁氧体材料及其制备方法 |
| JP2004241396A (ja) | 2002-02-07 | 2004-08-26 | Sharp Corp | 抵抗変化素子の製造方法および不揮発性抵抗変化メモリデバイスの製造方法、並びに不揮発性抵抗変化メモリデバイス |
| US6887523B2 (en) | 2002-12-20 | 2005-05-03 | Sharp Laboratories Of America, Inc. | Method for metal oxide thin film deposition via MOCVD |
| KR100773537B1 (ko) | 2003-06-03 | 2007-11-07 | 삼성전자주식회사 | 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법 |
-
2007
- 2007-12-20 JP JP2008513046A patent/JP4202411B2/ja not_active Expired - Fee Related
- 2007-12-20 WO PCT/JP2007/074556 patent/WO2008081741A1/ja not_active Ceased
- 2007-12-20 US US12/518,400 patent/US8018760B2/en not_active Expired - Fee Related
- 2007-12-20 CN CN200780029617.4A patent/CN101501851B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004185756A (ja) * | 2002-12-05 | 2004-07-02 | Sharp Corp | 不揮発性メモリ装置 |
| WO2005101420A1 (en) * | 2004-04-16 | 2005-10-27 | Matsushita Electric Industrial Co. Ltd. | Thin film memory device having a variable resistance |
| WO2006028117A1 (ja) * | 2004-09-09 | 2006-03-16 | Matsushita Electric Industrial Co., Ltd. | 抵抗変化素子とその製造方法 |
| JP2006080259A (ja) * | 2004-09-09 | 2006-03-23 | Matsushita Electric Ind Co Ltd | 抵抗変化素子およびそれを用いた不揮発性メモリ、ならびにこれらの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100008127A1 (en) | 2010-01-14 |
| CN101501851B (zh) | 2010-11-17 |
| CN101501851A (zh) | 2009-08-05 |
| JPWO2008081741A1 (ja) | 2010-04-30 |
| JP4202411B2 (ja) | 2008-12-24 |
| US8018760B2 (en) | 2011-09-13 |
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