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WO2007124028A3 - Support structure for planar cooling devices and methods - Google Patents

Support structure for planar cooling devices and methods Download PDF

Info

Publication number
WO2007124028A3
WO2007124028A3 PCT/US2007/009619 US2007009619W WO2007124028A3 WO 2007124028 A3 WO2007124028 A3 WO 2007124028A3 US 2007009619 W US2007009619 W US 2007009619W WO 2007124028 A3 WO2007124028 A3 WO 2007124028A3
Authority
WO
WIPO (PCT)
Prior art keywords
support structure
cooling device
spacer
casing
cooling devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/009619
Other languages
French (fr)
Other versions
WO2007124028A2 (en
Inventor
George A Meyer Iv
Ki Bu Nam
Sung Sik Kwack
Jae Joon Chol
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celsia Technologies Korea Inc
Original Assignee
Celsia Technologies Korea Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060034917A external-priority patent/KR100775013B1/en
Application filed by Celsia Technologies Korea Inc filed Critical Celsia Technologies Korea Inc
Publication of WO2007124028A2 publication Critical patent/WO2007124028A2/en
Anticipated expiration legal-status Critical
Publication of WO2007124028A3 publication Critical patent/WO2007124028A3/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A support structure for a compact planar cooling device is presented. The support structure (230) allows the cooling device to be made with a simpler structure than most conventional cooling devices. The cooling device includes a planar casing (200,210), a wick layer (220), and the support structure (230). The support structure (230) includes a flat plate with a portion cut out to form an opening (231 ) and a spacer on the flat plate. The spacer (235,236) is made by bending or folding the cut-out portion of the plate. The spacer (235,236) enhances coolant circulation inside the cooling device by pushing the wick layer (220) against the inner surface of the casing and maintaining a set distance between the support structure (230) and the casing to allow unimpeded coolant movement. The cooling device can be made cost-effectively without compromising heat transfer efficiency.
PCT/US2007/009619 2006-04-18 2007-04-18 Support structure for planar cooling devices and methods Ceased WO2007124028A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2006-0034917 2006-04-18
KR1020060034917A KR100775013B1 (en) 2006-04-18 2006-04-18 Plate heat transfer device
US11/410,772 2006-04-24
US11/410,772 US20070240860A1 (en) 2006-04-18 2006-04-24 Support structure for a planar cooling device

Publications (2)

Publication Number Publication Date
WO2007124028A2 WO2007124028A2 (en) 2007-11-01
WO2007124028A3 true WO2007124028A3 (en) 2008-10-23

Family

ID=38625603

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/009619 Ceased WO2007124028A2 (en) 2006-04-18 2007-04-18 Support structure for planar cooling devices and methods

Country Status (1)

Country Link
WO (1) WO2007124028A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2930465B1 (en) * 2008-04-28 2010-09-24 Air Liquide METHOD FOR MANUFACTURING A PLATE HEAT EXCHANGER USING A PLATE ASSEMBLY
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
CN109773434A (en) * 2014-09-17 2019-05-21 科罗拉多州立大学董事会法人团体 Enable the hot ground plane of microtrabeculae
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
CN106403674B (en) * 2015-07-27 2019-01-04 极致科技股份有限公司 Plate temperature equalization system
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
CN113720185B (en) 2017-05-08 2024-11-15 开文热工科技公司 Thermal Management Plane
CN110715346A (en) * 2019-09-09 2020-01-21 靳宏杰 Plastic metal composite header pipe and heating radiator using same
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266567A (en) * 1962-12-20 1966-08-16 Borg Warner Heat exchanger
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US20010047859A1 (en) * 1997-12-08 2001-12-06 Yoshio Ishida Heat pipe and method for processing the same
US20020021556A1 (en) * 1999-07-15 2002-02-21 Dibene Joseph T. Vapor chamber with integrated pin array
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266567A (en) * 1962-12-20 1966-08-16 Borg Warner Heat exchanger
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US20010047859A1 (en) * 1997-12-08 2001-12-06 Yoshio Ishida Heat pipe and method for processing the same
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US20020021556A1 (en) * 1999-07-15 2002-02-21 Dibene Joseph T. Vapor chamber with integrated pin array
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe

Also Published As

Publication number Publication date
WO2007124028A2 (en) 2007-11-01

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