WO2008033297A3 - Heat transfer plate with retainer assembly - Google Patents
Heat transfer plate with retainer assembly Download PDFInfo
- Publication number
- WO2008033297A3 WO2008033297A3 PCT/US2007/019648 US2007019648W WO2008033297A3 WO 2008033297 A3 WO2008033297 A3 WO 2008033297A3 US 2007019648 W US2007019648 W US 2007019648W WO 2008033297 A3 WO2008033297 A3 WO 2008033297A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- heat transfer
- retainer assembly
- transfer plate
- direct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
- H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat transfer plate adapted for direct contact with heat-generating electronic devices on a circuit board and including a pair of retainer assemblies (40) adapted to releasably retain the plate (20) within an electronic enclosure structuren (92) in a relationship wherein the edges of the plate are positioned in a direct, compressive, surface-to-surface relationship with the cold wall (90) of the electronic enclosure structure to allow the direct transfer, via conduction, of the heat generated by the electronic devices on the circuit board from the edges of the plate into the cold wall. The retainer assembly comprises, among other elements, a rotatable rod (50) with a head defining an interior cavity adapted to receive the head of a standard tool for rotating the rod.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84398106P | 2006-09-12 | 2006-09-12 | |
| US60/843,981 | 2006-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2008033297A2 WO2008033297A2 (en) | 2008-03-20 |
| WO2008033297A3 true WO2008033297A3 (en) | 2008-05-08 |
Family
ID=39031075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2007/019648 Ceased WO2008033297A2 (en) | 2006-09-12 | 2007-09-10 | Heat transfer plate with retainer assembly |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2008033297A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7796384B2 (en) | 2008-08-27 | 2010-09-14 | Honeywell International Inc. | Hybrid chassis cooling system |
| US8059409B2 (en) | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
| US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
| US8023267B2 (en) | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US8222541B2 (en) | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3982807A (en) * | 1975-03-27 | 1976-09-28 | International Telephone And Telegraph Corporation | Zero force printed circuit board connector |
| GB2128417A (en) * | 1982-10-18 | 1984-04-26 | Int Electronic Res Corp | Low insertion force retainer for printed circuit boards |
| US5200882A (en) * | 1992-01-17 | 1993-04-06 | International Electronic Research Corporation | Circuit board retainer |
-
2007
- 2007-09-10 WO PCT/US2007/019648 patent/WO2008033297A2/en not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3982807A (en) * | 1975-03-27 | 1976-09-28 | International Telephone And Telegraph Corporation | Zero force printed circuit board connector |
| GB2128417A (en) * | 1982-10-18 | 1984-04-26 | Int Electronic Res Corp | Low insertion force retainer for printed circuit boards |
| US5200882A (en) * | 1992-01-17 | 1993-04-06 | International Electronic Research Corporation | Circuit board retainer |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008033297A2 (en) | 2008-03-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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| NENP | Non-entry into the national phase |
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| 122 | Ep: pct application non-entry in european phase |
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