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WO2008000551A3 - Cooling member - Google Patents

Cooling member Download PDF

Info

Publication number
WO2008000551A3
WO2008000551A3 PCT/EP2007/054881 EP2007054881W WO2008000551A3 WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3 EP 2007054881 W EP2007054881 W EP 2007054881W WO 2008000551 A3 WO2008000551 A3 WO 2008000551A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
cooling member
conducting
recess
electronic subassembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2007/054881
Other languages
German (de)
French (fr)
Other versions
WO2008000551A2 (en
Inventor
Ian Trevor Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2008000551A2 publication Critical patent/WO2008000551A2/en
Publication of WO2008000551A3 publication Critical patent/WO2008000551A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Disclosed is a cooling member (30) for dissipating heat from an electronic subassembly (12, 28). Said cooling member (30) comprises a heat-conducting base (14) that is provided with a recess (18), and a heat-conducting medium (16) which is disposed in the recess (18) and is in heat-conducting contact with the base (14). The heat-conducting medium (16) is configured and arranged such that the electronic subassembly (12, 28) protrudes at least in part into the recess (18) and is in heat-conducting contact with the heat-conducting medium (16) when the electronic subassembly (12, 28) is properly coupled to the cooling member (30).
PCT/EP2007/054881 2006-06-27 2007-05-21 Cooling member Ceased WO2008000551A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006029463.7 2006-06-27
DE102006029463 2006-06-27

Publications (2)

Publication Number Publication Date
WO2008000551A2 WO2008000551A2 (en) 2008-01-03
WO2008000551A3 true WO2008000551A3 (en) 2008-04-17

Family

ID=38434061

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/054881 Ceased WO2008000551A2 (en) 2006-06-27 2007-05-21 Cooling member

Country Status (1)

Country Link
WO (1) WO2008000551A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011006632A1 (en) * 2011-04-01 2012-10-04 Robert Bosch Gmbh electronic module
JP2015018971A (en) * 2013-07-11 2015-01-29 富士通株式会社 Heat radiation plate, and submarine apparatus
DE102017200556A1 (en) * 2017-01-16 2018-07-19 Zf Friedrichshafen Ag Electromechanically adjustable roll stabilizer and method for its production

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011696A (en) * 1998-05-28 2000-01-04 Intel Corporation Cartridge and an enclosure for a semiconductor package
WO2003034489A1 (en) * 2001-10-18 2003-04-24 Intel Corporation Thermal interface material and electronic assembly having such a thermal interface material
US20030227959A1 (en) * 2002-06-11 2003-12-11 Charles Balian Thermal interface material with low melting alloy
US20050224220A1 (en) * 2003-03-11 2005-10-13 Jun Li Nanoengineered thermal materials based on carbon nanotube array composites

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6011696A (en) * 1998-05-28 2000-01-04 Intel Corporation Cartridge and an enclosure for a semiconductor package
WO2003034489A1 (en) * 2001-10-18 2003-04-24 Intel Corporation Thermal interface material and electronic assembly having such a thermal interface material
US20030227959A1 (en) * 2002-06-11 2003-12-11 Charles Balian Thermal interface material with low melting alloy
US20050224220A1 (en) * 2003-03-11 2005-10-13 Jun Li Nanoengineered thermal materials based on carbon nanotube array composites

Also Published As

Publication number Publication date
WO2008000551A2 (en) 2008-01-03

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