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WO2006017193A1 - Nouvelle solution d’emballage pour un matériau à interface thermique à phase changeante fortement chargé - Google Patents

Nouvelle solution d’emballage pour un matériau à interface thermique à phase changeante fortement chargé Download PDF

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Publication number
WO2006017193A1
WO2006017193A1 PCT/US2005/024343 US2005024343W WO2006017193A1 WO 2006017193 A1 WO2006017193 A1 WO 2006017193A1 US 2005024343 W US2005024343 W US 2005024343W WO 2006017193 A1 WO2006017193 A1 WO 2006017193A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
liner
tape
top liner
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2005/024343
Other languages
English (en)
Inventor
Robert A. Rauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel Corp
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Priority to US11/571,748 priority Critical patent/US20080302064A1/en
Publication of WO2006017193A1 publication Critical patent/WO2006017193A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • Transferring heat away from a heat-dissipating component which typically comprises microprocessors and other electronic componentry, is essential for many electronic devices to function properly. To the extent heat is not removed, such electronic componentry will operate sub-optimally and can become damaged, sometimes irreparably.
  • the aforementioned compositions and systems address such issue by facilitating the ability to draw heat away from the heat generating source to a heat dissipating object, which typically comprises a heat sink .
  • heat sinks are typically formed from a material having excellent heat conducting properties, such as aluminum, that are provided with an enlarged surface area, typically defined by protuberances, fins, or other like materials that are operative to dissipate the heat transferred thereto into the surrounding air.
  • fans are frequently utilized to thus provide adequate air circulation and thus facilitate the dissipation of heat.
  • the top liner adhesively bound thereto will peal away from the layer of material, with the material staying at rest and remaining adhered to the interface due to its much greater inertia than the tape and top liner.
  • pulling on the tape which is adhesively attached to the interface creates a resistive force, opposite to the pull.
  • the pull continues and the resistive force stops, resulting in a rate of change of acceleration being imparted to the top liner through the tape.
  • the resulting acceleration of the top liner is not transferred to the material due to incomplete adhesion between the material and the top liner.
  • the material stays at rest and remains on the interface surface while the top liner is removed for final assembly.
  • the layer of material is precisely and uniformly put into position quickly and easily, and further, advantageously dispenses with the need for any type of substrate to properly position such material.
  • Another object of the present invention is to provide packaging system, method of packaging, and method of applying a layer of material at a desired location upon a substrate, and in particular a layer of phase change material operative to facilitate the transfer of heat from a heat-dissipating component to a heat sink, that provides for better product protection and substantially conserves the amount of material utilized to facilitate the transfer of heat than prior art practices.
  • Figure 2 is the cross-sectional view of Figure 1 wherein the lower base liner of the packaging is shown removed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)

Abstract

L’invention concerne un système d’emballage, une méthode d’emballage et une méthode de dépôt d’une fine couche de matériau en un endroit souhaité sur un substrat, et en particulier une couche d’un matériau conducteur thermique à phase changeante sur l’interface entre un composant dissipateur de chaleur et un puits thermique couplé avec ce dernier. L’emballage comprend une fine couche de matériau placée entre une première doublure inférieure et une seconde doublure supérieure. Un segment de scotch est lié de manière adhésive à la doublure supérieure et comprend de préférence une portion pouvant être attrapée, telle qu’une languette, afin de permettre au dit segment de scotch de tirer la doublure supérieure loin du matériau, permettant de ce fait à la couche de matériau déposée de rester sur le substrat.
PCT/US2005/024343 2004-07-13 2005-07-08 Nouvelle solution d’emballage pour un matériau à interface thermique à phase changeante fortement chargé Ceased WO2006017193A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/571,748 US20080302064A1 (en) 2004-07-13 2005-07-08 Novel Packaging Solution for Highly Filled Phase-Change Thermal Interface Material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58745304P 2004-07-13 2004-07-13
US60/587,453 2004-07-13

Publications (1)

Publication Number Publication Date
WO2006017193A1 true WO2006017193A1 (fr) 2006-02-16

Family

ID=35839576

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/024343 Ceased WO2006017193A1 (fr) 2004-07-13 2005-07-08 Nouvelle solution d’emballage pour un matériau à interface thermique à phase changeante fortement chargé

Country Status (4)

Country Link
US (1) US20080302064A1 (fr)
CN (1) CN100546822C (fr)
TW (1) TW200616864A (fr)
WO (1) WO2006017193A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009129237A1 (fr) * 2008-04-15 2009-10-22 Jbc Technologies, Inc. Système de distribution de matériau d'interface thermique
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization

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US7780713B2 (en) * 2006-01-04 2010-08-24 Roberts John B Heat absorbing pack
US20110065218A1 (en) * 2009-09-14 2011-03-17 Bridgelux Inc. Pre-thermal greased led array
CN103346132A (zh) * 2013-06-26 2013-10-09 苏州天脉导热科技有限公司 一种相变化热界面材料的生产设备
CN103381927A (zh) * 2013-08-13 2013-11-06 苏州瀚墨材料技术有限公司 支撑性能好的包装结构
EP3077578A4 (fr) 2013-12-05 2017-07-26 Honeywell International Inc. Solution de méthanesulfonate stanneux à ph ajusté
CN106536609B (zh) 2014-07-07 2022-04-29 霍尼韦尔国际公司 具有离子清除剂的热界面材料
MX390215B (es) 2014-12-05 2025-03-20 Honeywell Int Inc Materiales de interfaz termica de alto rendimiento con baja impedancia termica.
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
KR102554661B1 (ko) 2016-03-08 2023-07-13 허니웰 인터내셔널 인코포레이티드 상 변화 물질
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US10580976B2 (en) 2018-03-19 2020-03-03 Sandisk Technologies Llc Three-dimensional phase change memory device having a laterally constricted element and method of making the same
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113335676A (zh) * 2021-06-07 2021-09-03 上海海事大学 航天用相变储能装置材料充装设备

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US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
US6644395B1 (en) * 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear

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US4571826A (en) * 1984-11-19 1986-02-25 At&T Teletype Corporation Method of manufacturing a thermal print head
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6329034B1 (en) * 1999-01-18 2001-12-11 Roger L. Pendry Label having tab member and methods for forming, applying and using the same
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) * 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6483707B1 (en) * 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US7709070B2 (en) * 2001-12-20 2010-05-04 The Procter & Gamble Company Articles and methods for applying color on surfaces
US6797086B2 (en) * 2002-08-15 2004-09-28 Hewlett-Packard Development Company, Lp. Anticipative temperature control for thermal transfer overcoating
US7311956B2 (en) * 2002-11-26 2007-12-25 3M Innovative Properties Company Laminate and method used for applying a design to a substrate
US6904796B2 (en) * 2003-04-21 2005-06-14 G-5 Electronics, Llc Remote tire monitoring systems tool

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Publication number Priority date Publication date Assignee Title
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US6644395B1 (en) * 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
WO2009129237A1 (fr) * 2008-04-15 2009-10-22 Jbc Technologies, Inc. Système de distribution de matériau d'interface thermique

Also Published As

Publication number Publication date
US20080302064A1 (en) 2008-12-11
CN101010196A (zh) 2007-08-01
TW200616864A (en) 2006-06-01
CN100546822C (zh) 2009-10-07

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