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TW200616864A - Novel packaging solution for highly filled phase-change thermal interface material - Google Patents

Novel packaging solution for highly filled phase-change thermal interface material

Info

Publication number
TW200616864A
TW200616864A TW094123746A TW94123746A TW200616864A TW 200616864 A TW200616864 A TW 200616864A TW 094123746 A TW094123746 A TW 094123746A TW 94123746 A TW94123746 A TW 94123746A TW 200616864 A TW200616864 A TW 200616864A
Authority
TW
Taiwan
Prior art keywords
thermal interface
interface material
highly filled
packaging solution
change thermal
Prior art date
Application number
TW094123746A
Other languages
Chinese (zh)
Inventor
Robert A Rauch
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of TW200616864A publication Critical patent/TW200616864A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Packages (AREA)
  • Laminated Bodies (AREA)

Abstract

A packaging system, packaging method and method of depositing a thin layer of material at a desired location upon a substrate, and in particular a layer of thermally-conductive phase change material at the interface between a heat-dissipating component and heat sink coupled therewith. The packaging comprises a thin layer of material sandwiched between a first base liner and a second top liner. A segment of tape is adhesively bound to the top liner and preferably includes a graspable portion, such as a tab, to enable the same to pull the top liner away from the material to thus leave the layer of material deposited upon the substrate.
TW094123746A 2004-07-13 2005-07-13 Novel packaging solution for highly filled phase-change thermal interface material TW200616864A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58745304P 2004-07-13 2004-07-13

Publications (1)

Publication Number Publication Date
TW200616864A true TW200616864A (en) 2006-06-01

Family

ID=35839576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123746A TW200616864A (en) 2004-07-13 2005-07-13 Novel packaging solution for highly filled phase-change thermal interface material

Country Status (4)

Country Link
US (1) US20080302064A1 (en)
CN (1) CN100546822C (en)
TW (1) TW200616864A (en)
WO (1) WO2006017193A1 (en)

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US7780713B2 (en) * 2006-01-04 2010-08-24 Roberts John B Heat absorbing pack
US8445102B2 (en) 2007-11-05 2013-05-21 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US8545987B2 (en) 2007-11-05 2013-10-01 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US9795059B2 (en) 2007-11-05 2017-10-17 Laird Technologies, Inc. Thermal interface materials with thin film or metallization
WO2009129237A1 (en) * 2008-04-15 2009-10-22 Jbc Technologies, Inc. Thermal interface material delivery system
US20110065218A1 (en) * 2009-09-14 2011-03-17 Bridgelux Inc. Pre-thermal greased led array
CN103346132A (en) * 2013-06-26 2013-10-09 苏州天脉导热科技有限公司 Production equipment for phase change thermal interface material
CN103381927A (en) * 2013-08-13 2013-11-06 苏州瀚墨材料技术有限公司 Packaging structure with fine supporting performance
CN105899714B (en) 2013-12-05 2018-09-21 霍尼韦尔国际公司 Stannous methanesulfonate solution with pH after the adjustment
HUE061592T2 (en) 2014-07-07 2023-07-28 Honeywell Int Inc Thermal interface material with ion scavenger
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
MX393621B (en) 2016-03-08 2025-03-24 Honeywell Int Inc PHASE CHANGE MATERIAL.
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
US10580976B2 (en) 2018-03-19 2020-03-03 Sandisk Technologies Llc Three-dimensional phase change memory device having a laterally constricted element and method of making the same
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
CN113335676A (en) * 2021-06-07 2021-09-03 上海海事大学 Phase change energy storage device material filling equipment for spaceflight

Family Cites Families (16)

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US4571826A (en) * 1984-11-19 1986-02-25 At&T Teletype Corporation Method of manufacturing a thermal print head
US5542175A (en) * 1994-12-20 1996-08-06 International Business Machines Corporation Method of laminating and circuitizing substrates having openings therein
AU723258B2 (en) * 1996-04-29 2000-08-24 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5904796A (en) * 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US6315038B1 (en) * 1998-09-22 2001-11-13 Intel Corporation Application of pressure sensitive adhesive (PSA) to pre-attach thermal interface film/tape to cooling device
US5912805A (en) * 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US6329034B1 (en) * 1999-01-18 2001-12-11 Roger L. Pendry Label having tab member and methods for forming, applying and using the same
US6644395B1 (en) * 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad
US6652705B1 (en) * 2000-05-18 2003-11-25 Power Devices, Inc. Graphitic allotrope interface composition and method of fabricating the same
US6672378B2 (en) * 2001-06-07 2004-01-06 Loctite Corporation Thermal interface wafer and method of making and using the same
US6483707B1 (en) * 2001-06-07 2002-11-19 Loctite Corporation Heat sink and thermal interface having shielding to attenuate electromagnetic interference
US7709070B2 (en) * 2001-12-20 2010-05-04 The Procter & Gamble Company Articles and methods for applying color on surfaces
US6797086B2 (en) * 2002-08-15 2004-09-28 Hewlett-Packard Development Company, Lp. Anticipative temperature control for thermal transfer overcoating
US7311956B2 (en) * 2002-11-26 2007-12-25 3M Innovative Properties Company Laminate and method used for applying a design to a substrate
US6904796B2 (en) * 2003-04-21 2005-06-14 G-5 Electronics, Llc Remote tire monitoring systems tool

Also Published As

Publication number Publication date
CN101010196A (en) 2007-08-01
CN100546822C (en) 2009-10-07
US20080302064A1 (en) 2008-12-11
WO2006017193A1 (en) 2006-02-16

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