[go: up one dir, main page]

WO2005118207A1 - Appareil à rayon laser - Google Patents

Appareil à rayon laser Download PDF

Info

Publication number
WO2005118207A1
WO2005118207A1 PCT/JP2004/007893 JP2004007893W WO2005118207A1 WO 2005118207 A1 WO2005118207 A1 WO 2005118207A1 JP 2004007893 W JP2004007893 W JP 2004007893W WO 2005118207 A1 WO2005118207 A1 WO 2005118207A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing apparatus
optical
beam splitter
polarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/007893
Other languages
English (en)
Japanese (ja)
Inventor
Tomohiro Kyoto
Tadashi Kuroiwa
Nobutaka Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2004/007893 priority Critical patent/WO2005118207A1/fr
Priority to JP2006519188A priority patent/JP4539652B2/ja
Priority to CN2004800107713A priority patent/CN1777489B/zh
Priority to TW093126144A priority patent/TWI265063B/zh
Publication of WO2005118207A1 publication Critical patent/WO2005118207A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • Fig. 9 1 is a laser oscillator, 2 is a laser beam, 3 is a mask that cuts out the laser beam of the necessary part from the incident laser beam to make the processing hole the desired size and shape, and 4 is a laser. Multiple mirrors that reflect light 2 and guide the optical path.
  • 24 is the first polarization beam splitter that splits the laser beam 2 into two laser beams
  • 6 is the first laser beam split by the first polarization beam splitter 24
  • 6 p is the polarization direction of the laser beam 6
  • 7 is the other laser beam split by the first polarization beam splitter
  • 7 s is the polarization direction of the laser beam 7
  • 25 is the laser beam 6 reflected and transmitted through the laser beam 7
  • the second galvanoscan mirror 1 2 is a second polarization beam splitter for guiding to 2.
  • the laser beam 11 can be oscillated within a set range with respect to the optical axis of the laser beam 10, for example, within a range of 4 mm square. Yes.
  • 26 is the window portion of the polarization beam splitter, and in the case of a carbon dioxide laser, ZnSe and Ge are used.
  • 27 is a mirror for turning the laser beam back to 90 °.
  • the polarization beam splitter 24 has a Brewster angle with respect to the incident beam for polarization separation.
  • the component with polarization direction 28p (P wave component) is transmitted and the component with polarization direction 28s (S wave component) is reflected.
  • P wave component the component with polarization direction 28p
  • S wave component the component with polarization direction 28s
  • the laser beam is equally divided if it is a circularly polarized light in which all polarization directions exist uniformly, or a polarization direction that forms an angle of 45 ° to the P wave and S wave, and the energy of the laser light 29 and laser light 30 Have the property of being equal. Therefore, the incident beam 2 to the first polarizing beam splitter 2 4 is By making the angle of 45 ° to circularly polarized light, P wave, or 5 wave, energy is separated equally.
  • the incident beam to the second polarizing beam splitter 25 can be obtained without energy loss by making the laser beam 7 only the P wave component and the laser beam 6 only the S wave component.
  • the galvanometer scan mirror 1 2 is used.
  • the incident angle of the laser beam to the window portion 26 is the pre-Easter angle for both the first polarization beam splitter 24 and the second polarization beam splitter 25.
  • the laser beam 2 is split into S wave and P wave components by arranging the windows so that, for example, if a window made of ZnSe is used for the carbon dioxide laser spectroscopy, If the Brewster angle is 67.5 ° and the incident angle to the window is large, and the diameter of the laser beam guided to the polarizing beam splitter is ⁇ 3 5 mm, the laser beam diameter on the window is in the major axis direction. 9 4 mm. Therefore, the window needs to have an effective diameter that is at least 2.5 times the laser beam diameter, which makes it difficult to maintain manufacturing accuracy.
  • the laser beam 6 transmitted as the P wave component through the first polarizing beam splitter 24 needs to be reflected as the S wave component by the second polarizing beam splitter 25.
  • the first polarizing beam splitter 2 Since the laser beam 7 reflected by 4 as the S wave component needs to be transmitted as the P wave component in the second polarization beam splitter 25, the laser beam 9 is sent to the first and second polarization beam splitters, respectively. 0. Mira 1 to wrap to 2 7
  • the relative positional relationship between the window portion 2 6 and the mirror 2 7 greatly affects the accuracy of the optical path after the polarization beam splitter, so pay attention to the relative positional relationship between the window portion 2 6 and the mirror 2 7.
  • the polarizing beam splitter became a more expensive optical component because it was necessary to manufacture the polarizing beam splitter.
  • the individual optical components used in the optical system always have distortion (convergence) in the manufacturing process, and the lower the required accuracy for flatness, the worse the yield and the higher the cost.
  • it is manufactured with an optical distortion of about 110 to 120 of the laser wavelength ⁇ . If an optical system that combines multiple optical components without considering these optical components is constructed, individual aberrations accumulate and astigmatism occurs, making it impossible to obtain the required processing quality. There was also a problem that there was a case.
  • the present invention has been made to solve such a problem, and uses an inexpensive optical component as a polarization separation means in a laser processing apparatus that performs processing using a laser beam dispersed by the polarization separation means.
  • the first object of the present invention is to obtain a laser processing apparatus that can reduce the diameter of the laser beam on the workpiece.
  • a second object is to obtain a laser processing apparatus that can reduce the aberration due to the surface shape of the optical component and improve the processing quality. Disclosure of the invention
  • the first and second polarization separation means are polarization beam splitters having a dielectric multilayer coating formed on the surface.
  • the first polarization separation means has a concave surface on the side that reflects the laser light and a convex shape on the back surface, and is reflected by the first polarization separation means.
  • the laser beam is guided to the first galvano scan mirror having a convex surface shape
  • the second polarized light separating means has a convex surface on the side that reflects the laser light and a concave surface on the back surface. It is. r
  • the concave or convex shapes on the surfaces of the first and second polarization separation means have an accuracy of ⁇ 20 or less when the wavelength of the laser beam is ⁇ . Is formed.
  • the laser processing apparatus in the optical system, a pair of optical components having substantially the same surface shape is used, and the beam incident surface of one optical component is perpendicular to the beam incident surface of the other optical component.
  • the beam incident angle to one optical component is arranged to be the same as the beam incident angle to the other optical component.
  • the optical processing apparatus includes a holder for individually fixing the set of optical components, and when the holder has directionality, the axis indicating the directionality is set to each optical component. Are arranged in the same direction with respect to the incident surface. .
  • the one set of optical components The surface shape is formed with an accuracy of ⁇ 10 to I20, where I is the wavelength of the laser beam.
  • the first and second polarization separation means include a mechanism capable of adjusting an angle in two axial directions perpendicular to the traveling direction of the laser light and orthogonal to each other. Is.
  • a damper for absorbing laser light leaking as energy loss from the second polarization separation means there is provided a damper for absorbing laser light leaking as energy loss from the second polarization separation means.
  • a polarization beam splitter having an incident angle of 45 ° as the polarization separating means, a laser beam having a larger diameter can be made incident on the f ⁇ lens.
  • the diameter of light can be made smaller, and finer processing can be performed.
  • the polarized light separating means is inexpensive and can reduce the cost.
  • FIG. 1 is a block diagram of the laser processing apparatus showing Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view of a part of the holder for fixing the polarization beam splitter showing the first embodiment of the present invention.
  • FIG. 3 is a block diagram of a laser processing apparatus showing Embodiment 2 of the present invention.
  • FIG. 4 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 2 of the present invention.
  • FIG. 5 is a schematic diagram for explaining the arrangement of optical components of the laser machining apparatus according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic diagram for explaining the relationship between the refractive power and the arrangement of optical component holders having directionality of the laser processing apparatus according to the second embodiment of the present invention.
  • FIG. 7 is a block diagram of a laser processing apparatus showing Embodiment 3 of the present invention.
  • FIG. 8 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 3 of the present invention.
  • FIG. 9 is a block diagram of a laser processing apparatus showing the prior art according to the present invention.
  • FIG. 10 is a schematic diagram for explaining a polarization beam splitter of a laser processing apparatus showing the prior art according to the present invention.
  • FIG. 1 relates to Embodiment 1 of the present invention.
  • a polarization beam splitter having an incident angle of 45 ° is used as a polarization separation means, one laser beam is split into two laser beams, and the two laser beams are independently used.
  • FIG. 2 is a configuration diagram showing a laser processing apparatus for drilling that can perform processing at two locations simultaneously by scanning. The same components as those in FIG. 9 of the prior art are designated by the same reference numerals and detailed description thereof is omitted.
  • 5 is the first polarization beam splitter
  • 6 is the laser beam transmitted through the first polarization beam splitter
  • 6p is the P wave component for the first polarization beam splitter of laser
  • 6 s is the polarization direction of the S-wave component for the first polarization beam splitter of the laser beam
  • 7 is the laser beam reflected from the first polarization beam splitter
  • 7 s is the laser beam 7.
  • 7 p Is the polarization direction that becomes the P wave component for the first polarization beam splitter of laser light
  • 8 is the second polarization beam splitter
  • 9 is a damper that receives the laser light generated as energy loss
  • 10 is the laser.
  • the laser light reflected by the second polarizing beam splitter 8 and 11 is the laser light transmitted through the second polarizing beam splitter 8 out of the laser light 7.
  • the incident angle is set to 45 ° with respect to the optical axis instead of the Brewster angle. Transmits the P wave with a constant accuracy, reflects the S wave with a certain accuracy, and divides the energy of the laser light equally.
  • a polarization beam splitter coated to transmit 95% of the P wave and 5% of the S wave and reflect 95% of the S wave and 5 ⁇ 1 ⁇ 2 of the P wave will be described.
  • the laser light 6 transmitted through the first polarizing beam splitter 5 has a P wave component of 47.5 o / o and an S wave. Contains 2.5 o / o ingredients.
  • the second polarization beam splitter 8 receives laser light including 47.5 ⁇ 1 ⁇ 2 S wave component and 2.5% P wave component, and reflects the second polarization beam splitter 8.
  • the laser beam contains 45.125% S wave component and 0.125% P wave component, and the energy of the laser beam 10 guided to the second galvanoscan mirror 12 is final. 4 5. 2 5%.
  • the laser beam that causes energy loss through the second polarizing beam splitter 8 contains 2.375% S wave component and 2.375 o / o P wave component. 1 "1 thing.
  • the laser beam 7 reflected from the first polarizing beam splitter 5 goes through the same process, and 45.25% of the energy is led to the second galvanoski Yanmira 1 2 and 4. 5% energy Is a loss. Therefore, a total of 9.5% is not led to the second galvanoscan mirror 1 or 2 as energy loss, but when the optical path according to the present embodiment is configured, the loss of the laser beam 6 is the second loss. Because it passes through the polarizing beam splitter and reflects the loss of the laser beam 7, all the laser beam that causes this energy loss can be collected in the part of the damper 9, and the optical components by the laser beam for the loss, etc. Can prevent damage.
  • the polarizing beam splitter transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave at an incident angle of 45 °.
  • the incident angle deviates from 45 °.
  • the ratio of the transmitted P wave and the reflected S wave will decrease and the energy loss will increase, so it is desirable to arrange them at an incident angle of 45 °.
  • the energy loss of a polarized beam splitter that transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave is 9.5%.
  • the P-wave transmittance and S-wave reflectance are made higher than 95%, the energy loss will be smaller than 9.5%.
  • the polarization beam splitter according to the present embodiment is arranged so that the incident angle of the laser beam is 45 °, if the diameter of the laser beam guided to the polarization beam splitter is ⁇ 35 mm, the laser beam diameter on the window This is 52 mm in the long axis direction, which is about 1.5 times the laser beam diameter, and the window effective diameter of a conventional polarizing beam splitter with an incident angle of Brewster angle of at least 2.5 times the incident laser beam diameter. Compared to existing products, they can be manufactured in smaller shapes. You can.
  • the minor axis direction can be 35 mm in all directions, so the polarization beam splitter with an incident angle of 45 ° can reduce the area by 44.6% compared to the conventional polarization beam splitter. . This makes it possible to reduce the size of the processing apparatus.
  • the conventional polarizing beam splitter has a Brewster angle of 67.5 °.
  • Incident angle 45 ° Polarizing beam splitter is ⁇ 35 mm, which makes it possible to construct an optical path with a larger relaser beam diameter.
  • the beam spot diameter d and the focal point of the f 0 lens The relationship between the distance f and the incident beam diameter D can be expressed by the following equation. d o f ⁇ D (1)
  • Equation (1) shows that the beam spot diameter d collected on the workpiece by the f 0 lens with the focal length f is inversely proportional to the beam diameter of the laser light incident on the f 0 lens.
  • the polarizing beam splitter with an incident angle of 45 ° as described above can secure the effective diameter of the laser beam more effectively, and the same f 0 lens
  • the beam diameter D incident on the f ⁇ lens can be increased, which makes it possible to carry out processing with a smaller beam spot diameter.
  • the polarization beam splitter is cheaper and the cost of the processing apparatus can be reduced.
  • the scanning direction of the two-axis galvanoscan mirror is orthogonal on the XY table 18, so as shown in Fig. 1, aligning this orthogonal direction with the XY direction allows the X direction and Y
  • Each direction can correspond to the galvano scan mirror on a one-to-one basis, and the control of the galvano scan mirror during machining is easy to understand and a simple configuration can be achieved.
  • the effective diameter of the polarizing beam splitter can be increased and processing with a smaller beam spot diameter can be performed.
  • the scanning direction of the two-axis galvano scan mirror does not go straight on the XY table.
  • the Y direction is the same as the other galvano scan mirror. Since scanning is possible only by combining with the galvano scan mirror in the X direction, the control of the galvano scan mirror during processing is more complicated than the optical path that turns the laser beam back to 90 °.
  • Embodiment 2 Embodiment 2.
  • the two laser beams that have been split must pass through the second polarizing beam splitter and be parallel to the axis in the X direction in Fig. 1 and be guided to the center of the second galvano scan mirror 1 2. It is necessary to adjust the optical axes of the laser beams 6 and 7 independently.
  • the laser beam 10 can be adjusted in the optical axis by the mirror 4z immediately before the first polarization beam splitter 5 and the second polarization beam splitter 8, while the laser beam 1
  • the optical axis 1 can be adjusted by the first polarization beam splitter 5 and the first galvano scan mirror 13.
  • the first galvano scan mirror 13 has two mirrors that can be adjusted in the direction of twist with respect to each other, and has the same function as one mirror that can be adjusted in the direction of two axes perpendicular to each other. It can be considered.
  • FIG. 2 relates to the second embodiment of the present invention, and is a diagram showing a mechanism capable of adjusting the angle of the polarization beam splitter in two axial directions perpendicular to the traveling direction of the laser light and perpendicular to each other. is there.
  • the polarization beam splitter 5 or 8 is supported by a fixed holder 31.
  • the fixed holder 31 is rotatable to the holder 31 via a first rotating shaft 35a. Is supported.
  • the holder support 32 is supported by the optical base 36 supporting the optical system via a second rotation shaft 35 b perpendicular to the first rotation shaft 35 a.
  • a first adjustment hole 3 4 a that is long in the rotation direction of the fixed holder 3 1 is provided at a joint portion of the holder support 3 2 with the fixed holder 3 1, and the first fixing screw 3 3 a passes therethrough. It is screwed into the fixed holder 3 1, and after the rotation adjustment, the fixed holder 3 1 can be fixed to the holder support 3 2 by tightening the first fixing screw 3 3 a.
  • the joint between the holder support 3 2 and the optical base 3 6 can be fixed after rotation adjustment by the second adjustment hole 3 4 b and the second fixing screw 3 3 b.
  • the change in the optical axis of the laser beam transmitted through the polarizing beam splitter by adjusting the angle of the polarizing beam splitter is extremely small compared to the reflected laser beam and is negligible.
  • Re-reflected laser light 7, 11 Laser light 6 that is transmitted even if the optical axis of 1 is adjusted, 10
  • the optical axis of 10 is hardly affected, and the laser light 6 that is reflected by the second polarization beam splitter 8 Adjusting the optical axis of 10 has almost no effect on the optical axis of transmitted laser light 7 and 11 and can be adjusted independently.
  • the incident angle to the polarizing beam splitter may deviate from 45 °.
  • the angle adjustment is usually small and the energy loss is also small.
  • correction by the output of the laser oscillator is also possible, so it is desirable to give priority to improving machining accuracy by adjusting the optical axis.
  • the laser beams 10 and 11 move in the same direction on the second galvano scan mirror 13. Therefore, as the order of the optical axis adjustment direction, first, after the optical axis adjustment of the laser beam 10 using the mirror 4 z acting on the two laser beams is completed, the optical axis adjustment of the laser beam 11 is performed. There is a need. Once the adjustment of the optical axis has been completed, the two lasers on the second galvano-scan mirror 1 2 can be obtained by adjusting the angle of the mirror 4 Z immediately before the first polarizing beam splitter 5.
  • FIG. 3 relates to the third embodiment of the present invention.
  • a drilling laser processing device that can be used, it has an optical system that performs mask transfer, and in particular a mirror that is a set of optical components that have substantially the same surface shape to be placed after the mask.
  • FIG. 3 the beam incident surface of one mirror is perpendicular to the beam incident surface of the other mirror, and the beam incident angle on one mirror is the same as the beam incident angle on the other mirror (for example, 45 °) (for example, a configuration where the laser beam incident from the X direction is reflected in the Z direction by the first mirror and then reflected in the Y direction by the other mirror)
  • 4a and 4b are mirrors having substantially the same surface shape for guiding the laser beam 2 from the mask 3 to the first polarization beam splitter 5
  • 14a and 14b are the first polarization.
  • This is a mirror having substantially the same surface shape for guiding from the beam splitter 5 to the second polarizing beam splitter 8.
  • the third embodiment is the same as the first embodiment with respect to the polarization beam splitter, but the arrangement or surface shape of the mirror 4. 14 is different. This will be described with reference to the drawings.
  • P ru (a) and P rv (Of) are the refractive powers in the u and V directions related to the reflected beam that is incident on the beam incident angle 0;
  • P tu (a) and P tva) are the refractive powers in the u direction and the V direction related to the transmitted beam in which the incident beam incident at the beam incident angle of passes through the mirror.
  • the u direction is perpendicular to the traveling direction of each beam and parallel to the beam incident surface (the surface formed by the incident beam and the reflected beam), and the V direction is perpendicular to the traveling direction of each beam.
  • the direction is perpendicular to the beam entrance plane.
  • the refractive power is a parameter that represents the refracting performance of the optical component. It is one of the lamellae and indicates the state of the refracting surface, and is generally inversely proportional to the surface curvature radius R and proportional to the refractive index n.
  • the surface radius of curvature R is concentrically uniform and sufficiently large for the optical system (assuming the surface shape of the optical component is substantially flat), and the refractive index is n.
  • the refractive powers P ru () and P r V () are given by the following equations.
  • a general optical component has a surface curvature radius R of about 1 1 0 to 1 20.
  • R a surface curvature radius
  • mirror 14a reflects laser light incident from the X direction in the Z direction
  • mirror 14b reflects laser light reflected by the mirror 14a in the Y direction.
  • the mirror surface radius of curvature of the mirror 14 a is R a
  • the mirror surface radius of curvature of the mirror 14 b is R b.
  • the power in the u direction of mirror 14 a is P aru (45 °)
  • the power in the v direction is P arv (45 °)
  • the power in the u direction of mirror 14 b is P bru (45 °)
  • the refractive power in the v direction is P brv (45 °)
  • the refractive power P r V is as follows.
  • the surface curvature radius of the mirror supported by this holder changes along the directionality and astigmatism occurs.
  • the mirrors supported by one set of the holders are aligned in the same direction with respect to each incident surface, and the beam incident surface of one optical component is incident on the beam of the other optical component. It is arranged so that it is perpendicular to the surface and the beam incident angle to one optical component is the same as the beam incident angle to the other optical component.
  • Figure 6 shows an example.
  • the first optical component 3 7a and the second optical component 3 7b are optical components having the same surface shape, and the first holder member 3 8a and the second holder one member 3 8b have the same shape.
  • a and B indicate the directional axes of each holder member.
  • the radius of curvature of the mirror surface is RA in the A direction and RB in the B direction.
  • the first optical component 3 7 a and the second optical component 3 7 b are connected to the first optical component 3 7 a.
  • the beam incident surface of the first optical component 3 7 a is the beam of the second optical component 3 7 b.
  • the beam incidence angle to the first optical component 37a is When the second optical component 3 7 b is placed so that it is the same as the beam incident angle (for example, 45 °), and the direction A is parallel to the incident surface to match the direction of the holder member, the second
  • the bending forces P ru and P rv in the u and V directions when the optical component 3 7 b is reflected are as follows.
  • an inexpensive holder member having directionality can be used, and the cost of the processing apparatus is reduced.
  • FIG. 5 relates to Embodiment 4 of the present invention.
  • a first polarization separation means a polarization beam splitter having a convex shape on the front surface and a concave shape on the back surface
  • a second polarization separation means Using a polarized beam splitter with a concave surface and a convex back surface, one laser beam is split into two laser beams, and the two laser beams are scanned independently, thereby simultaneously processing two locations.
  • FIG. 3 is a configuration diagram showing a laser processing apparatus for drilling that can be performed.
  • each surface shape is determined by the shape of the polishing machine that is the production machine, so by controlling the production method, either the concave shape or the convex shape can be selected with the flatness of the desired processing accuracy. Can be produced.
  • the fourth embodiment is different from the first embodiment in the configuration of the surface shape of the polarizing beam splitter, and the shape of the polarizing beam splitter, which is a feature of the present invention, will be described.
  • P tu () and P t V (Of) are the refractive powers in the u and V directions of the transmitted beam through which the incident beam incident at the beam incident angle passes through the optical component. If the radius R is concentrically uniform and sufficiently large for the optical system (assuming that the surface shape of the optical component is a substantially flat surface), and the refractive index is n, the refractive power P tu (a) P t V (Of) is given by
  • the refractive power during transmission of the polarizing beam splitter In addition to the refractive power at the surface of the polarizing beam splitter, the refractive power at the back is added.
  • the refractive powers P tua (45 °) and P tva (45 °) in the u direction and direction during transmission are expressed as 1 and 2 on the front and back sides, respectively, from the equations (14) and (15). The following is shown as a subscript.
  • the surface shape of the polarizing beam splitter in this invention needs to have the same absolute value of the radius of curvature of the front surface and the back surface, it is desirable to improve the processing accuracy as usual, and i Z 20 or less is desirable. .
  • the surface shape of the first galvano scan mirrors 1 3 a and 1 3 b is a strong concave shape
  • the surface shape of the first polarizing beam splitter 2 2 is a convex shape
  • the back surface shape is a concave shape
  • the surface of the second polarizing beam splitter 2 3 is concave, and the back is convex.
  • the aberration component of each optical component is canceled in the optical system, and as a result, an optical system with less optical aberrations such as astigmatism and focal difference is obtained. effective.
  • the laser processing apparatus splits one laser beam into two or more laser beams, and simultaneously reduces the manufacturing difficulty and cost in the case of performing laser processing at two or more locations. Suitable for improving processing quality.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

Un appareil à rayon laser pour traitement d'une pièce de fabrication (20), comprenant un système optique consistant en composants optiques pour guider un rayon laser émis à partir d'un oscillateur laser (1) vers la pièce de fabrication (20), dans laquelle un rayon laser est divisé par un premier moyen de division par polarisation (5) en deux rayons laser, un des rayons passe à travers un miroir (14) pendant que l'autre est utilisé par un premier miroir galvano de balayage (13) pour balayer dans deux directions axiales, les deux rayons laser sont guidés vers un deuxième moyen de division par polarisation (8) et utilisés par un second miroir galvano de balayage (12) pour balayer. Les premier et deuxième moyens de division par polarisation sont disposés à 45° par rapport à l'axe optique de la lumière laser.
PCT/JP2004/007893 2004-06-01 2004-06-01 Appareil à rayon laser Ceased WO2005118207A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2004/007893 WO2005118207A1 (fr) 2004-06-01 2004-06-01 Appareil à rayon laser
JP2006519188A JP4539652B2 (ja) 2004-06-01 2004-06-01 レーザ加工装置
CN2004800107713A CN1777489B (zh) 2004-06-01 2004-06-01 激光加工装置
TW093126144A TWI265063B (en) 2004-06-01 2004-08-31 Laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/007893 WO2005118207A1 (fr) 2004-06-01 2004-06-01 Appareil à rayon laser

Publications (1)

Publication Number Publication Date
WO2005118207A1 true WO2005118207A1 (fr) 2005-12-15

Family

ID=35462780

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/007893 Ceased WO2005118207A1 (fr) 2004-06-01 2004-06-01 Appareil à rayon laser

Country Status (4)

Country Link
JP (1) JP4539652B2 (fr)
CN (1) CN1777489B (fr)
TW (1) TWI265063B (fr)
WO (1) WO2005118207A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010172961A (ja) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp 分光ユニット及びそれを用いたレーザ加工装置
JP2011251306A (ja) * 2010-06-01 2011-12-15 Mitsubishi Electric Corp 偏光方位角調整装置およびレーザ加工装置
CN101439442B (zh) * 2007-11-21 2012-03-21 三菱电机株式会社 激光加工装置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979277B2 (ja) * 2006-06-07 2012-07-18 三菱電機株式会社 レーザ発振装置
JP4297952B2 (ja) * 2007-05-28 2009-07-15 三菱電機株式会社 レーザ加工装置
JP5692969B2 (ja) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
US8873599B2 (en) * 2010-09-17 2014-10-28 Mitsubishi Electric Corporation Gas laser device
TWI459039B (zh) * 2011-05-18 2014-11-01 Uni Via Technology Inc 雷射光束轉換裝置及方法
TWI606880B (zh) * 2012-09-13 2017-12-01 Hamamatsu Photonics Kk Optical modulation control method, control program, control device, and laser light irradiation device
CN103894734A (zh) * 2012-12-31 2014-07-02 上海微电子装备有限公司 一种激光退火装置及其操作方法
JP7348647B2 (ja) * 2019-12-20 2023-09-21 株式会社ブイ・テクノロジー レーザ照射装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05232317A (ja) * 1992-02-18 1993-09-10 Asahi Optical Co Ltd 偏光ビームスプリッター
WO2003041904A1 (fr) * 2001-11-15 2003-05-22 Mitsubishi Denki Kabushiki Kaisha Appareil d'usinage a faisceau laser
JP2003279337A (ja) * 2002-03-20 2003-10-02 Olympus Optical Co Ltd 偏向角検出装置、光信号スイッチシステム、情報記録再生システム、偏向角検出方法および光信号スイッチング方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2382502Y (zh) * 1999-06-10 2000-06-14 吴建良 一种高效防伪掩模式激光打标装置
CN2454077Y (zh) * 2000-12-12 2001-10-17 魏学惠 激光加工机光学装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05232317A (ja) * 1992-02-18 1993-09-10 Asahi Optical Co Ltd 偏光ビームスプリッター
WO2003041904A1 (fr) * 2001-11-15 2003-05-22 Mitsubishi Denki Kabushiki Kaisha Appareil d'usinage a faisceau laser
JP2003279337A (ja) * 2002-03-20 2003-10-02 Olympus Optical Co Ltd 偏向角検出装置、光信号スイッチシステム、情報記録再生システム、偏向角検出方法および光信号スイッチング方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101439442B (zh) * 2007-11-21 2012-03-21 三菱电机株式会社 激光加工装置
JP2010172961A (ja) * 2009-02-02 2010-08-12 Mitsubishi Electric Corp 分光ユニット及びそれを用いたレーザ加工装置
JP2011251306A (ja) * 2010-06-01 2011-12-15 Mitsubishi Electric Corp 偏光方位角調整装置およびレーザ加工装置

Also Published As

Publication number Publication date
CN1777489A (zh) 2006-05-24
TWI265063B (en) 2006-11-01
JPWO2005118207A1 (ja) 2008-04-03
TW200539981A (en) 2005-12-16
JP4539652B2 (ja) 2010-09-08
CN1777489B (zh) 2010-05-05

Similar Documents

Publication Publication Date Title
JP4466561B2 (ja) レーザ加工装置
KR101681337B1 (ko) 레이저 가공장치
EP1286201B1 (fr) Méthode d'alignement pour optimiser le rapport d'extinction des diviseurs de faisceaux de polarisation
JP4611431B1 (ja) レーザー照射装置及びレーザー加工方法
KR100955150B1 (ko) 레이저 가공 장치
TW200902207A (en) Laser processing apparatus
TW540194B (en) Laser machining apparatus
KR101265843B1 (ko) 편광 방위각 조정 장치 및 레이저 가공 장치
WO2005118207A1 (fr) Appareil à rayon laser
US12147020B2 (en) Laser device including lens assembly
KR100819616B1 (ko) 레이저 가공 장치
EP3139384B1 (fr) Élément de conversion de polarisation
US20060102603A1 (en) Laser machine tool
JP5178557B2 (ja) 分光ユニット及びそれを用いたレーザ加工装置
US6627845B2 (en) Method and apparatus for laser machining using a laser beam
CN206305608U (zh) 一种激光功率和光路的调节装置
CN120858001A (zh) 激光加工装置及使用该装置形成激光光束的方法
TW201343295A (zh) 雷射網點加工之光學系統
US20250180812A1 (en) Device for coupling a laser beam into a multi-clad fibre and optical system
US12440921B2 (en) Laser processing apparatus and laser processing method
CN113369717A (zh) 一种激光加工系统及方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2006519188

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 20048107713

Country of ref document: CN

AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 1020067005112

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

WWW Wipo information: withdrawn in national office

Ref document number: DE

122 Ep: pct application non-entry in european phase