TWI265063B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
- Publication number
- TWI265063B TWI265063B TW093126144A TW93126144A TWI265063B TW I265063 B TWI265063 B TW I265063B TW 093126144 A TW093126144 A TW 093126144A TW 93126144 A TW93126144 A TW 93126144A TW I265063 B TWI265063 B TW I265063B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- laser light
- light
- beam splitter
- mirror
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 58
- 230000003287 optical effect Effects 0.000 claims abstract description 91
- 230000010287 polarization Effects 0.000 claims abstract description 65
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- 238000000034 method Methods 0.000 claims abstract description 7
- 230000008569 process Effects 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 19
- 239000007888 film coating Substances 0.000 claims description 2
- 238000009501 film coating Methods 0.000 claims description 2
- 201000009310 astigmatism Diseases 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000001615 p wave Methods 0.000 description 7
- 230000000149 penetrating effect Effects 0.000 description 7
- 230000004075 alteration Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000035515 penetration Effects 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
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- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000283690 Bos taurus Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 206010061218 Inflammation Diseases 0.000 description 1
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- 230000001154 acute effect Effects 0.000 description 1
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- 210000004556 brain Anatomy 0.000 description 1
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- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
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- 238000004611 spectroscopical analysis Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2004/007893 WO2005118207A1 (fr) | 2004-06-01 | 2004-06-01 | Appareil à rayon laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200539981A TW200539981A (en) | 2005-12-16 |
| TWI265063B true TWI265063B (en) | 2006-11-01 |
Family
ID=35462780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093126144A TWI265063B (en) | 2004-06-01 | 2004-08-31 | Laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4539652B2 (fr) |
| CN (1) | CN1777489B (fr) |
| TW (1) | TWI265063B (fr) |
| WO (1) | WO2005118207A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI497851B (zh) * | 2010-09-17 | 2015-08-21 | Mitsubishi Electric Corp | 氣體雷射裝置及雷射加工裝置 |
| US9415461B2 (en) | 2008-09-01 | 2016-08-16 | Hamamatsu Photonics K.K. | Aberration-correcting method, laser processing method using said aberration-correcting method, laser irradiation method using said aberration-correction method, aberration-correction device and aberration-correcting program |
| TWI606880B (zh) * | 2012-09-13 | 2017-12-01 | Hamamatsu Photonics Kk | Optical modulation control method, control program, control device, and laser light irradiation device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4979277B2 (ja) * | 2006-06-07 | 2012-07-18 | 三菱電機株式会社 | レーザ発振装置 |
| JP4297952B2 (ja) * | 2007-05-28 | 2009-07-15 | 三菱電機株式会社 | レーザ加工装置 |
| JP4401410B2 (ja) * | 2007-11-21 | 2010-01-20 | 三菱電機株式会社 | レーザ加工装置 |
| JP5178557B2 (ja) * | 2009-02-02 | 2013-04-10 | 三菱電機株式会社 | 分光ユニット及びそれを用いたレーザ加工装置 |
| JP5349406B2 (ja) * | 2010-06-01 | 2013-11-20 | 三菱電機株式会社 | 偏光方位角調整装置およびレーザ加工装置 |
| TWI459039B (zh) * | 2011-05-18 | 2014-11-01 | Uni Via Technology Inc | 雷射光束轉換裝置及方法 |
| CN103894734A (zh) * | 2012-12-31 | 2014-07-02 | 上海微电子装备有限公司 | 一种激光退火装置及其操作方法 |
| JP7348647B2 (ja) * | 2019-12-20 | 2023-09-21 | 株式会社ブイ・テクノロジー | レーザ照射装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05232317A (ja) * | 1992-02-18 | 1993-09-10 | Asahi Optical Co Ltd | 偏光ビームスプリッター |
| CN2382502Y (zh) * | 1999-06-10 | 2000-06-14 | 吴建良 | 一种高效防伪掩模式激光打标装置 |
| CN2454077Y (zh) * | 2000-12-12 | 2001-10-17 | 魏学惠 | 激光加工机光学装置 |
| JP4148138B2 (ja) * | 2001-11-15 | 2008-09-10 | 三菱電機株式会社 | レーザ加工装置 |
| JP2003279337A (ja) * | 2002-03-20 | 2003-10-02 | Olympus Optical Co Ltd | 偏向角検出装置、光信号スイッチシステム、情報記録再生システム、偏向角検出方法および光信号スイッチング方法 |
-
2004
- 2004-06-01 JP JP2006519188A patent/JP4539652B2/ja not_active Expired - Fee Related
- 2004-06-01 CN CN2004800107713A patent/CN1777489B/zh not_active Expired - Fee Related
- 2004-06-01 WO PCT/JP2004/007893 patent/WO2005118207A1/fr not_active Ceased
- 2004-08-31 TW TW093126144A patent/TWI265063B/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9415461B2 (en) | 2008-09-01 | 2016-08-16 | Hamamatsu Photonics K.K. | Aberration-correcting method, laser processing method using said aberration-correcting method, laser irradiation method using said aberration-correction method, aberration-correction device and aberration-correcting program |
| US10324285B2 (en) | 2008-09-01 | 2019-06-18 | Hamamatsu Photonics K.K. | Aberration-correction method, laser processing method using said aberration-correcting method, laser irradiation method using said aberration-correcting method, aberration-correcting device and aberration-correcting program |
| TWI497851B (zh) * | 2010-09-17 | 2015-08-21 | Mitsubishi Electric Corp | 氣體雷射裝置及雷射加工裝置 |
| TWI606880B (zh) * | 2012-09-13 | 2017-12-01 | Hamamatsu Photonics Kk | Optical modulation control method, control program, control device, and laser light irradiation device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200539981A (en) | 2005-12-16 |
| JP4539652B2 (ja) | 2010-09-08 |
| CN1777489B (zh) | 2010-05-05 |
| JPWO2005118207A1 (ja) | 2008-04-03 |
| CN1777489A (zh) | 2006-05-24 |
| WO2005118207A1 (fr) | 2005-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |