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WO2005118207A1 - Laser beam apparatus - Google Patents

Laser beam apparatus Download PDF

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Publication number
WO2005118207A1
WO2005118207A1 PCT/JP2004/007893 JP2004007893W WO2005118207A1 WO 2005118207 A1 WO2005118207 A1 WO 2005118207A1 JP 2004007893 W JP2004007893 W JP 2004007893W WO 2005118207 A1 WO2005118207 A1 WO 2005118207A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing apparatus
optical
beam splitter
polarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2004/007893
Other languages
French (fr)
Japanese (ja)
Inventor
Tomohiro Kyoto
Tadashi Kuroiwa
Nobutaka Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to PCT/JP2004/007893 priority Critical patent/WO2005118207A1/en
Priority to JP2006519188A priority patent/JP4539652B2/en
Priority to CN2004800107713A priority patent/CN1777489B/en
Priority to TW093126144A priority patent/TWI265063B/en
Publication of WO2005118207A1 publication Critical patent/WO2005118207A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/101Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • Fig. 9 1 is a laser oscillator, 2 is a laser beam, 3 is a mask that cuts out the laser beam of the necessary part from the incident laser beam to make the processing hole the desired size and shape, and 4 is a laser. Multiple mirrors that reflect light 2 and guide the optical path.
  • 24 is the first polarization beam splitter that splits the laser beam 2 into two laser beams
  • 6 is the first laser beam split by the first polarization beam splitter 24
  • 6 p is the polarization direction of the laser beam 6
  • 7 is the other laser beam split by the first polarization beam splitter
  • 7 s is the polarization direction of the laser beam 7
  • 25 is the laser beam 6 reflected and transmitted through the laser beam 7
  • the second galvanoscan mirror 1 2 is a second polarization beam splitter for guiding to 2.
  • the laser beam 11 can be oscillated within a set range with respect to the optical axis of the laser beam 10, for example, within a range of 4 mm square. Yes.
  • 26 is the window portion of the polarization beam splitter, and in the case of a carbon dioxide laser, ZnSe and Ge are used.
  • 27 is a mirror for turning the laser beam back to 90 °.
  • the polarization beam splitter 24 has a Brewster angle with respect to the incident beam for polarization separation.
  • the component with polarization direction 28p (P wave component) is transmitted and the component with polarization direction 28s (S wave component) is reflected.
  • P wave component the component with polarization direction 28p
  • S wave component the component with polarization direction 28s
  • the laser beam is equally divided if it is a circularly polarized light in which all polarization directions exist uniformly, or a polarization direction that forms an angle of 45 ° to the P wave and S wave, and the energy of the laser light 29 and laser light 30 Have the property of being equal. Therefore, the incident beam 2 to the first polarizing beam splitter 2 4 is By making the angle of 45 ° to circularly polarized light, P wave, or 5 wave, energy is separated equally.
  • the incident beam to the second polarizing beam splitter 25 can be obtained without energy loss by making the laser beam 7 only the P wave component and the laser beam 6 only the S wave component.
  • the galvanometer scan mirror 1 2 is used.
  • the incident angle of the laser beam to the window portion 26 is the pre-Easter angle for both the first polarization beam splitter 24 and the second polarization beam splitter 25.
  • the laser beam 2 is split into S wave and P wave components by arranging the windows so that, for example, if a window made of ZnSe is used for the carbon dioxide laser spectroscopy, If the Brewster angle is 67.5 ° and the incident angle to the window is large, and the diameter of the laser beam guided to the polarizing beam splitter is ⁇ 3 5 mm, the laser beam diameter on the window is in the major axis direction. 9 4 mm. Therefore, the window needs to have an effective diameter that is at least 2.5 times the laser beam diameter, which makes it difficult to maintain manufacturing accuracy.
  • the laser beam 6 transmitted as the P wave component through the first polarizing beam splitter 24 needs to be reflected as the S wave component by the second polarizing beam splitter 25.
  • the first polarizing beam splitter 2 Since the laser beam 7 reflected by 4 as the S wave component needs to be transmitted as the P wave component in the second polarization beam splitter 25, the laser beam 9 is sent to the first and second polarization beam splitters, respectively. 0. Mira 1 to wrap to 2 7
  • the relative positional relationship between the window portion 2 6 and the mirror 2 7 greatly affects the accuracy of the optical path after the polarization beam splitter, so pay attention to the relative positional relationship between the window portion 2 6 and the mirror 2 7.
  • the polarizing beam splitter became a more expensive optical component because it was necessary to manufacture the polarizing beam splitter.
  • the individual optical components used in the optical system always have distortion (convergence) in the manufacturing process, and the lower the required accuracy for flatness, the worse the yield and the higher the cost.
  • it is manufactured with an optical distortion of about 110 to 120 of the laser wavelength ⁇ . If an optical system that combines multiple optical components without considering these optical components is constructed, individual aberrations accumulate and astigmatism occurs, making it impossible to obtain the required processing quality. There was also a problem that there was a case.
  • the present invention has been made to solve such a problem, and uses an inexpensive optical component as a polarization separation means in a laser processing apparatus that performs processing using a laser beam dispersed by the polarization separation means.
  • the first object of the present invention is to obtain a laser processing apparatus that can reduce the diameter of the laser beam on the workpiece.
  • a second object is to obtain a laser processing apparatus that can reduce the aberration due to the surface shape of the optical component and improve the processing quality. Disclosure of the invention
  • the first and second polarization separation means are polarization beam splitters having a dielectric multilayer coating formed on the surface.
  • the first polarization separation means has a concave surface on the side that reflects the laser light and a convex shape on the back surface, and is reflected by the first polarization separation means.
  • the laser beam is guided to the first galvano scan mirror having a convex surface shape
  • the second polarized light separating means has a convex surface on the side that reflects the laser light and a concave surface on the back surface. It is. r
  • the concave or convex shapes on the surfaces of the first and second polarization separation means have an accuracy of ⁇ 20 or less when the wavelength of the laser beam is ⁇ . Is formed.
  • the laser processing apparatus in the optical system, a pair of optical components having substantially the same surface shape is used, and the beam incident surface of one optical component is perpendicular to the beam incident surface of the other optical component.
  • the beam incident angle to one optical component is arranged to be the same as the beam incident angle to the other optical component.
  • the optical processing apparatus includes a holder for individually fixing the set of optical components, and when the holder has directionality, the axis indicating the directionality is set to each optical component. Are arranged in the same direction with respect to the incident surface. .
  • the one set of optical components The surface shape is formed with an accuracy of ⁇ 10 to I20, where I is the wavelength of the laser beam.
  • the first and second polarization separation means include a mechanism capable of adjusting an angle in two axial directions perpendicular to the traveling direction of the laser light and orthogonal to each other. Is.
  • a damper for absorbing laser light leaking as energy loss from the second polarization separation means there is provided a damper for absorbing laser light leaking as energy loss from the second polarization separation means.
  • a polarization beam splitter having an incident angle of 45 ° as the polarization separating means, a laser beam having a larger diameter can be made incident on the f ⁇ lens.
  • the diameter of light can be made smaller, and finer processing can be performed.
  • the polarized light separating means is inexpensive and can reduce the cost.
  • FIG. 1 is a block diagram of the laser processing apparatus showing Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view of a part of the holder for fixing the polarization beam splitter showing the first embodiment of the present invention.
  • FIG. 3 is a block diagram of a laser processing apparatus showing Embodiment 2 of the present invention.
  • FIG. 4 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 2 of the present invention.
  • FIG. 5 is a schematic diagram for explaining the arrangement of optical components of the laser machining apparatus according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic diagram for explaining the relationship between the refractive power and the arrangement of optical component holders having directionality of the laser processing apparatus according to the second embodiment of the present invention.
  • FIG. 7 is a block diagram of a laser processing apparatus showing Embodiment 3 of the present invention.
  • FIG. 8 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 3 of the present invention.
  • FIG. 9 is a block diagram of a laser processing apparatus showing the prior art according to the present invention.
  • FIG. 10 is a schematic diagram for explaining a polarization beam splitter of a laser processing apparatus showing the prior art according to the present invention.
  • FIG. 1 relates to Embodiment 1 of the present invention.
  • a polarization beam splitter having an incident angle of 45 ° is used as a polarization separation means, one laser beam is split into two laser beams, and the two laser beams are independently used.
  • FIG. 2 is a configuration diagram showing a laser processing apparatus for drilling that can perform processing at two locations simultaneously by scanning. The same components as those in FIG. 9 of the prior art are designated by the same reference numerals and detailed description thereof is omitted.
  • 5 is the first polarization beam splitter
  • 6 is the laser beam transmitted through the first polarization beam splitter
  • 6p is the P wave component for the first polarization beam splitter of laser
  • 6 s is the polarization direction of the S-wave component for the first polarization beam splitter of the laser beam
  • 7 is the laser beam reflected from the first polarization beam splitter
  • 7 s is the laser beam 7.
  • 7 p Is the polarization direction that becomes the P wave component for the first polarization beam splitter of laser light
  • 8 is the second polarization beam splitter
  • 9 is a damper that receives the laser light generated as energy loss
  • 10 is the laser.
  • the laser light reflected by the second polarizing beam splitter 8 and 11 is the laser light transmitted through the second polarizing beam splitter 8 out of the laser light 7.
  • the incident angle is set to 45 ° with respect to the optical axis instead of the Brewster angle. Transmits the P wave with a constant accuracy, reflects the S wave with a certain accuracy, and divides the energy of the laser light equally.
  • a polarization beam splitter coated to transmit 95% of the P wave and 5% of the S wave and reflect 95% of the S wave and 5 ⁇ 1 ⁇ 2 of the P wave will be described.
  • the laser light 6 transmitted through the first polarizing beam splitter 5 has a P wave component of 47.5 o / o and an S wave. Contains 2.5 o / o ingredients.
  • the second polarization beam splitter 8 receives laser light including 47.5 ⁇ 1 ⁇ 2 S wave component and 2.5% P wave component, and reflects the second polarization beam splitter 8.
  • the laser beam contains 45.125% S wave component and 0.125% P wave component, and the energy of the laser beam 10 guided to the second galvanoscan mirror 12 is final. 4 5. 2 5%.
  • the laser beam that causes energy loss through the second polarizing beam splitter 8 contains 2.375% S wave component and 2.375 o / o P wave component. 1 "1 thing.
  • the laser beam 7 reflected from the first polarizing beam splitter 5 goes through the same process, and 45.25% of the energy is led to the second galvanoski Yanmira 1 2 and 4. 5% energy Is a loss. Therefore, a total of 9.5% is not led to the second galvanoscan mirror 1 or 2 as energy loss, but when the optical path according to the present embodiment is configured, the loss of the laser beam 6 is the second loss. Because it passes through the polarizing beam splitter and reflects the loss of the laser beam 7, all the laser beam that causes this energy loss can be collected in the part of the damper 9, and the optical components by the laser beam for the loss, etc. Can prevent damage.
  • the polarizing beam splitter transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave at an incident angle of 45 °.
  • the incident angle deviates from 45 °.
  • the ratio of the transmitted P wave and the reflected S wave will decrease and the energy loss will increase, so it is desirable to arrange them at an incident angle of 45 °.
  • the energy loss of a polarized beam splitter that transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave is 9.5%.
  • the P-wave transmittance and S-wave reflectance are made higher than 95%, the energy loss will be smaller than 9.5%.
  • the polarization beam splitter according to the present embodiment is arranged so that the incident angle of the laser beam is 45 °, if the diameter of the laser beam guided to the polarization beam splitter is ⁇ 35 mm, the laser beam diameter on the window This is 52 mm in the long axis direction, which is about 1.5 times the laser beam diameter, and the window effective diameter of a conventional polarizing beam splitter with an incident angle of Brewster angle of at least 2.5 times the incident laser beam diameter. Compared to existing products, they can be manufactured in smaller shapes. You can.
  • the minor axis direction can be 35 mm in all directions, so the polarization beam splitter with an incident angle of 45 ° can reduce the area by 44.6% compared to the conventional polarization beam splitter. . This makes it possible to reduce the size of the processing apparatus.
  • the conventional polarizing beam splitter has a Brewster angle of 67.5 °.
  • Incident angle 45 ° Polarizing beam splitter is ⁇ 35 mm, which makes it possible to construct an optical path with a larger relaser beam diameter.
  • the beam spot diameter d and the focal point of the f 0 lens The relationship between the distance f and the incident beam diameter D can be expressed by the following equation. d o f ⁇ D (1)
  • Equation (1) shows that the beam spot diameter d collected on the workpiece by the f 0 lens with the focal length f is inversely proportional to the beam diameter of the laser light incident on the f 0 lens.
  • the polarizing beam splitter with an incident angle of 45 ° as described above can secure the effective diameter of the laser beam more effectively, and the same f 0 lens
  • the beam diameter D incident on the f ⁇ lens can be increased, which makes it possible to carry out processing with a smaller beam spot diameter.
  • the polarization beam splitter is cheaper and the cost of the processing apparatus can be reduced.
  • the scanning direction of the two-axis galvanoscan mirror is orthogonal on the XY table 18, so as shown in Fig. 1, aligning this orthogonal direction with the XY direction allows the X direction and Y
  • Each direction can correspond to the galvano scan mirror on a one-to-one basis, and the control of the galvano scan mirror during machining is easy to understand and a simple configuration can be achieved.
  • the effective diameter of the polarizing beam splitter can be increased and processing with a smaller beam spot diameter can be performed.
  • the scanning direction of the two-axis galvano scan mirror does not go straight on the XY table.
  • the Y direction is the same as the other galvano scan mirror. Since scanning is possible only by combining with the galvano scan mirror in the X direction, the control of the galvano scan mirror during processing is more complicated than the optical path that turns the laser beam back to 90 °.
  • Embodiment 2 Embodiment 2.
  • the two laser beams that have been split must pass through the second polarizing beam splitter and be parallel to the axis in the X direction in Fig. 1 and be guided to the center of the second galvano scan mirror 1 2. It is necessary to adjust the optical axes of the laser beams 6 and 7 independently.
  • the laser beam 10 can be adjusted in the optical axis by the mirror 4z immediately before the first polarization beam splitter 5 and the second polarization beam splitter 8, while the laser beam 1
  • the optical axis 1 can be adjusted by the first polarization beam splitter 5 and the first galvano scan mirror 13.
  • the first galvano scan mirror 13 has two mirrors that can be adjusted in the direction of twist with respect to each other, and has the same function as one mirror that can be adjusted in the direction of two axes perpendicular to each other. It can be considered.
  • FIG. 2 relates to the second embodiment of the present invention, and is a diagram showing a mechanism capable of adjusting the angle of the polarization beam splitter in two axial directions perpendicular to the traveling direction of the laser light and perpendicular to each other. is there.
  • the polarization beam splitter 5 or 8 is supported by a fixed holder 31.
  • the fixed holder 31 is rotatable to the holder 31 via a first rotating shaft 35a. Is supported.
  • the holder support 32 is supported by the optical base 36 supporting the optical system via a second rotation shaft 35 b perpendicular to the first rotation shaft 35 a.
  • a first adjustment hole 3 4 a that is long in the rotation direction of the fixed holder 3 1 is provided at a joint portion of the holder support 3 2 with the fixed holder 3 1, and the first fixing screw 3 3 a passes therethrough. It is screwed into the fixed holder 3 1, and after the rotation adjustment, the fixed holder 3 1 can be fixed to the holder support 3 2 by tightening the first fixing screw 3 3 a.
  • the joint between the holder support 3 2 and the optical base 3 6 can be fixed after rotation adjustment by the second adjustment hole 3 4 b and the second fixing screw 3 3 b.
  • the change in the optical axis of the laser beam transmitted through the polarizing beam splitter by adjusting the angle of the polarizing beam splitter is extremely small compared to the reflected laser beam and is negligible.
  • Re-reflected laser light 7, 11 Laser light 6 that is transmitted even if the optical axis of 1 is adjusted, 10
  • the optical axis of 10 is hardly affected, and the laser light 6 that is reflected by the second polarization beam splitter 8 Adjusting the optical axis of 10 has almost no effect on the optical axis of transmitted laser light 7 and 11 and can be adjusted independently.
  • the incident angle to the polarizing beam splitter may deviate from 45 °.
  • the angle adjustment is usually small and the energy loss is also small.
  • correction by the output of the laser oscillator is also possible, so it is desirable to give priority to improving machining accuracy by adjusting the optical axis.
  • the laser beams 10 and 11 move in the same direction on the second galvano scan mirror 13. Therefore, as the order of the optical axis adjustment direction, first, after the optical axis adjustment of the laser beam 10 using the mirror 4 z acting on the two laser beams is completed, the optical axis adjustment of the laser beam 11 is performed. There is a need. Once the adjustment of the optical axis has been completed, the two lasers on the second galvano-scan mirror 1 2 can be obtained by adjusting the angle of the mirror 4 Z immediately before the first polarizing beam splitter 5.
  • FIG. 3 relates to the third embodiment of the present invention.
  • a drilling laser processing device that can be used, it has an optical system that performs mask transfer, and in particular a mirror that is a set of optical components that have substantially the same surface shape to be placed after the mask.
  • FIG. 3 the beam incident surface of one mirror is perpendicular to the beam incident surface of the other mirror, and the beam incident angle on one mirror is the same as the beam incident angle on the other mirror (for example, 45 °) (for example, a configuration where the laser beam incident from the X direction is reflected in the Z direction by the first mirror and then reflected in the Y direction by the other mirror)
  • 4a and 4b are mirrors having substantially the same surface shape for guiding the laser beam 2 from the mask 3 to the first polarization beam splitter 5
  • 14a and 14b are the first polarization.
  • This is a mirror having substantially the same surface shape for guiding from the beam splitter 5 to the second polarizing beam splitter 8.
  • the third embodiment is the same as the first embodiment with respect to the polarization beam splitter, but the arrangement or surface shape of the mirror 4. 14 is different. This will be described with reference to the drawings.
  • P ru (a) and P rv (Of) are the refractive powers in the u and V directions related to the reflected beam that is incident on the beam incident angle 0;
  • P tu (a) and P tva) are the refractive powers in the u direction and the V direction related to the transmitted beam in which the incident beam incident at the beam incident angle of passes through the mirror.
  • the u direction is perpendicular to the traveling direction of each beam and parallel to the beam incident surface (the surface formed by the incident beam and the reflected beam), and the V direction is perpendicular to the traveling direction of each beam.
  • the direction is perpendicular to the beam entrance plane.
  • the refractive power is a parameter that represents the refracting performance of the optical component. It is one of the lamellae and indicates the state of the refracting surface, and is generally inversely proportional to the surface curvature radius R and proportional to the refractive index n.
  • the surface radius of curvature R is concentrically uniform and sufficiently large for the optical system (assuming the surface shape of the optical component is substantially flat), and the refractive index is n.
  • the refractive powers P ru () and P r V () are given by the following equations.
  • a general optical component has a surface curvature radius R of about 1 1 0 to 1 20.
  • R a surface curvature radius
  • mirror 14a reflects laser light incident from the X direction in the Z direction
  • mirror 14b reflects laser light reflected by the mirror 14a in the Y direction.
  • the mirror surface radius of curvature of the mirror 14 a is R a
  • the mirror surface radius of curvature of the mirror 14 b is R b.
  • the power in the u direction of mirror 14 a is P aru (45 °)
  • the power in the v direction is P arv (45 °)
  • the power in the u direction of mirror 14 b is P bru (45 °)
  • the refractive power in the v direction is P brv (45 °)
  • the refractive power P r V is as follows.
  • the surface curvature radius of the mirror supported by this holder changes along the directionality and astigmatism occurs.
  • the mirrors supported by one set of the holders are aligned in the same direction with respect to each incident surface, and the beam incident surface of one optical component is incident on the beam of the other optical component. It is arranged so that it is perpendicular to the surface and the beam incident angle to one optical component is the same as the beam incident angle to the other optical component.
  • Figure 6 shows an example.
  • the first optical component 3 7a and the second optical component 3 7b are optical components having the same surface shape, and the first holder member 3 8a and the second holder one member 3 8b have the same shape.
  • a and B indicate the directional axes of each holder member.
  • the radius of curvature of the mirror surface is RA in the A direction and RB in the B direction.
  • the first optical component 3 7 a and the second optical component 3 7 b are connected to the first optical component 3 7 a.
  • the beam incident surface of the first optical component 3 7 a is the beam of the second optical component 3 7 b.
  • the beam incidence angle to the first optical component 37a is When the second optical component 3 7 b is placed so that it is the same as the beam incident angle (for example, 45 °), and the direction A is parallel to the incident surface to match the direction of the holder member, the second
  • the bending forces P ru and P rv in the u and V directions when the optical component 3 7 b is reflected are as follows.
  • an inexpensive holder member having directionality can be used, and the cost of the processing apparatus is reduced.
  • FIG. 5 relates to Embodiment 4 of the present invention.
  • a first polarization separation means a polarization beam splitter having a convex shape on the front surface and a concave shape on the back surface
  • a second polarization separation means Using a polarized beam splitter with a concave surface and a convex back surface, one laser beam is split into two laser beams, and the two laser beams are scanned independently, thereby simultaneously processing two locations.
  • FIG. 3 is a configuration diagram showing a laser processing apparatus for drilling that can be performed.
  • each surface shape is determined by the shape of the polishing machine that is the production machine, so by controlling the production method, either the concave shape or the convex shape can be selected with the flatness of the desired processing accuracy. Can be produced.
  • the fourth embodiment is different from the first embodiment in the configuration of the surface shape of the polarizing beam splitter, and the shape of the polarizing beam splitter, which is a feature of the present invention, will be described.
  • P tu () and P t V (Of) are the refractive powers in the u and V directions of the transmitted beam through which the incident beam incident at the beam incident angle passes through the optical component. If the radius R is concentrically uniform and sufficiently large for the optical system (assuming that the surface shape of the optical component is a substantially flat surface), and the refractive index is n, the refractive power P tu (a) P t V (Of) is given by
  • the refractive power during transmission of the polarizing beam splitter In addition to the refractive power at the surface of the polarizing beam splitter, the refractive power at the back is added.
  • the refractive powers P tua (45 °) and P tva (45 °) in the u direction and direction during transmission are expressed as 1 and 2 on the front and back sides, respectively, from the equations (14) and (15). The following is shown as a subscript.
  • the surface shape of the polarizing beam splitter in this invention needs to have the same absolute value of the radius of curvature of the front surface and the back surface, it is desirable to improve the processing accuracy as usual, and i Z 20 or less is desirable. .
  • the surface shape of the first galvano scan mirrors 1 3 a and 1 3 b is a strong concave shape
  • the surface shape of the first polarizing beam splitter 2 2 is a convex shape
  • the back surface shape is a concave shape
  • the surface of the second polarizing beam splitter 2 3 is concave, and the back is convex.
  • the aberration component of each optical component is canceled in the optical system, and as a result, an optical system with less optical aberrations such as astigmatism and focal difference is obtained. effective.
  • the laser processing apparatus splits one laser beam into two or more laser beams, and simultaneously reduces the manufacturing difficulty and cost in the case of performing laser processing at two or more locations. Suitable for improving processing quality.

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Abstract

A laser beam apparatus for processing a workpiece (20), comprising an optical system consisting of optical components for guiding a laser beam emitted from a laser oscillator (1) to the workpiece (20), wherein one laser beam is split by a first polarization splitting means (5) into two laser beams, one of the beams is passed through a mirror (14) while the other is used by a first galvano scan mirror (13) for scanning in two axial directions, the two laser beams are guided to a second polarization splitting means (8) and used by a second galvano scan mirror (12) for scanning. The first and second polarization splitting means are arranged at 45° relative to the optical axis of the laser light.

Description

明 細 書 レーザ加工装置 技術分野  Technical details Laser processing equipment Technical field

この発明は、 プリン卜基板等の被加工物に対して穴あけ加工を主目的 としたレーザ加工装置に関するものであり、 特にその生産性、 及び加工 品質向上を図るものである。 背景技術  The present invention relates to a laser processing apparatus whose main purpose is drilling a workpiece such as a printed circuit board, and in particular, to improve productivity and processing quality. Background art

従来のプリン卜基板等の被加工物に対して穴あけ加工を主目的とした レーザ加工装置の中で、 特に 2箇所同時に加工を実施することができる レーザ加工装置は、 例えば国際公開番号 W O 0 3 / 0 4 1 9 0 4号公報 において第 9図で示すような構成となっている。  Among laser processing apparatuses mainly used for drilling a conventional workpiece such as a pudding substrate, a laser processing apparatus capable of performing processing at two locations at the same time is, for example, an international publication number WO 0 3 The configuration as shown in FIG.

第 9図において、 1 はレーザ発振器、 2はレーザ光、 3は加工穴を所 望の大きさ、 形状にするために入射するレーザ光から必要な部分のレー ザ光を切り取るマスク、 4はレーザ光 2を反射して光路を導く複数のミ ラーである。 2 4はレーザ光 2を 2つのレーザ光に分光する第 の偏光 ビームスプリッタ、 6は第一の偏光ビームスプリッタ 2 4で分光された —方のレーザ光、 6 pはレーザ光 6の偏光方向、 7は第一の偏光ビーム スプリッタで分光されたもう一方のレーザ光、 7 sはレーザ光 7の偏光 方向、 2 5はレーザ光 6を反射しレーザ光 7を透過し第二のガルバノス キャンミラー 1 2に導くための第二の偏光ビームスプリッタである。 1 0は第二の偏光ビームスプリッタにて反射されたレーザ光、 1 1は第二 の偏光ビームスプリッタにて透過されたレーザ光、 1 4はレーザ光 6を 第二の偏光ビームスプリッタ 2 5に導くためのミラー、 1 7はレーザ光 1 0、 1 1 を被加工物 2 0上に集光させるための f 0 レンズ、 1 3はレ 一ザ光 7を 2軸方向に走査し、 第二の偏光ビームスプリッタ 2 5に導く ための第一のガルバノスキャンミラ一、 1 2はレーザ光 1 0とレーザ光 1 1 を 2軸方向に走査し被加工物 2 0に導くための第二のガルバノスキ ヤンミラーである。 1 8は被加工物 2 0を X Y方向に移動させるための X Yテーブル、 1 9は f 0 レンズ 1 7から出射されるレーザ光のエネル ギーを測定するパワーセンサ、 1 5はレーザ光 6を遮る第一のシャツタ 一、 1 6はレーザ光 7を遮る第二のシャッターである。 尚、 パワーセン サ 1 9は、 X Y亍一ブル 1 8に固定されており、 レーザ光のエネルギー を測定する際は、 パワーセンサ 1 9の受光部にレーザ光が当たる位置に 移動可能となっている。 In Fig. 9, 1 is a laser oscillator, 2 is a laser beam, 3 is a mask that cuts out the laser beam of the necessary part from the incident laser beam to make the processing hole the desired size and shape, and 4 is a laser. Multiple mirrors that reflect light 2 and guide the optical path. 24 is the first polarization beam splitter that splits the laser beam 2 into two laser beams, 6 is the first laser beam split by the first polarization beam splitter 24, 6 p is the polarization direction of the laser beam 6, 7 is the other laser beam split by the first polarization beam splitter, 7 s is the polarization direction of the laser beam 7, 25 is the laser beam 6 reflected and transmitted through the laser beam 7, and the second galvanoscan mirror 1 2 is a second polarization beam splitter for guiding to 2. 10 is the laser beam reflected by the second polarizing beam splitter, 11 is the laser beam transmitted by the second polarizing beam splitter, 14 is the laser beam 6 to the second polarizing beam splitter 25 Mirror for guiding, 1 7 is laser light F 0 lens for condensing 1 0, 1 1 onto the workpiece 20, 1 3 for scanning the laser beam 7 in two directions and guiding it to the second polarizing beam splitter 25 The first galvanoscan mirrors 1 and 12 are second galvanoscan mirrors for scanning the laser beam 10 and the laser beam 11 in two axial directions and guiding them to the workpiece 20. 1 8 is an XY table for moving the workpiece 20 in the XY direction, 19 is a power sensor that measures the energy of the laser beam emitted from the f 0 lens 17, and 15 is a shield for the laser beam 6 The first shirt 1, 16 is a second shutter that blocks the laser beam 7. The power sensor 19 is fixed to the XY table 18 and can be moved to a position where the laser beam hits the light receiving part of the power sensor 19 when measuring the energy of the laser beam. .

第 9図に示される如く、 1つのレーザ光を偏光ビームスプリッタで 2 つのレーザ光に分光し、 2つのレーザ光を独立に走査することにより、 2箇所同時に加工を実施することができる穴あけ加工用レーザ加工装置 では、 レーザ発振器 1 より直線偏光にて発振されたレーザ光 2は、 マス ク 3、 ミラー 4を経由して第一の偏光ビームスプリッタ 2 4に導かれる。 そして、 第一の偏光ビームスプリッタ 2 4にて、 レーザ光 2の P波成 分は偏光ビームスプリッタ 2 4を透過しレーザ光 6となり、 S波成分は 偏光ビームスプリッタ 2 4で反射しレーザ光 7に分光される。  As shown in Fig. 9, one laser beam is split into two laser beams with a polarizing beam splitter, and the two laser beams are scanned independently, allowing drilling to be performed at two locations simultaneously. In the laser processing apparatus, the laser beam 2 oscillated by the linearly polarized light from the laser oscillator 1 is guided to the first polarization beam splitter 24 via the mask 3 and the mirror 4. Then, in the first polarization beam splitter 24, the P wave component of the laser beam 2 is transmitted through the polarization beam splitter 24 and becomes the laser beam 6, and the S wave component is reflected by the polarization beam splitter 24 and is reflected by the laser beam 7 Spectral.

第一の偏光ビームスプリッタ 2 4を透過したレーザ光 6は、 ミラー 1 を経由して、 第二の偏光ビームスプリッタ 2 5に導かれる。  The laser beam 6 that has passed through the first polarization beam splitter 24 is guided to the second polarization beam splitter 25 via the mirror 1.

一方、 第一のビームスプリッタ 2 4で反射したレーザ光 7は、 第一の ガルバノスキャンミラー 1 3により 2軸方向に走査された後、 第二の偏 光ビ一ムスプリッタ 2 5に導かれる。  On the other hand, the laser beam 7 reflected by the first beam splitter 24 is scanned in the biaxial direction by the first galvano scan mirror 13 and then guided to the second polarization beam splitter 25.

尚、 レーザ光 6はいつも同じ位置で第二の偏光ビームスプリッタ 2 5 に導かれるが、 レーザ光 7は第一のガルバノスキャンミラー 1 3の振り 角を制御することにより第二の偏光ビームスプリッタ 2 5に入射する位 置、 角度を調整することができる。 The laser beam 6 is always guided to the second polarization beam splitter 25 at the same position, but the laser beam 7 is swung by the first galvano scan mirror 1 3. By controlling the angle, the position and angle of incidence on the second polarizing beam splitter 25 can be adjusted.

その後、 レーザ光 1 0、 1 1は第二のガルバノスキャンミラ一 1 2に より 2軸方向に走査された後、 f 0レンズ 1 7に導かれ、 それぞれ被加 ェ物 2 0の所定位置に集光される。  Thereafter, the laser beams 10 and 11 are scanned in the biaxial direction by the second galvanoscan mirror 1 1 2 and then guided to the f 0 lens 1 7, respectively, at a predetermined position of the workpiece 20. Focused.

このときレーザ光 1 1は、 第一のガルバノスキャンミラー 1 3を走査 することにより、 レーザ光 1 0の光軸に対してある設定範囲内、 例えば 4 m m角の範囲内で振ることを可能としている。 これにより例えば、 5 0 m m四方等加工可能な範囲で振れる第二のガルバノスキャンミラー 1 2を介して、 被加工物 2 0上の任意の異なる 2点に同時にレーザ光を照 射することを可能としている。  At this time, by scanning the first galvano scan mirror 13, the laser beam 11 can be oscillated within a set range with respect to the optical axis of the laser beam 10, for example, within a range of 4 mm square. Yes. This makes it possible to irradiate laser light to any two different points on the workpiece 20 at the same time via the second galvano scan mirror 12 that swings within a range that can be machined, for example, 50 mm square. It is said.

第 1 0図は、 偏光ピームスプリッタ 2 4の原理を説明するための模式 図を示し、 正面図を中央に、 その左右に側面図、 上部に上面図を示して いる。  FIG. 10 shows a schematic diagram for explaining the principle of the polarization beam splitter 24, showing a front view at the center, a side view at the left and right, and a top view at the top.

第 1 0図において、 2 6は偏光ビームスプリッタのウィンドウ部分で 炭酸ガスレーザの場合、 Z n S eや G eが使用される。 2 7はレーザ光 を 9 0 ° に折り返すためのミラーである。  In FIG. 10, 26 is the window portion of the polarization beam splitter, and in the case of a carbon dioxide laser, ZnSe and Ge are used. 27 is a mirror for turning the laser beam back to 90 °.

偏光 一ムスプリッタ 2 4は、 偏光分離をするために入射ビームに対 して、 ブリュースター角となる構造となっている。  The polarization beam splitter 24 has a Brewster angle with respect to the incident beam for polarization separation.

したがって、 この偏光ビームスプリッタ 2 4にレーザ光 2 8を入射す ると偏光方向 2 8 pの成分 (P波成分) は透過し、 偏光方向 2 8 sの成 分 (S波成分) は反射する性質を持っている。  Therefore, when the laser beam 28 enters the polarization beam splitter 24, the component with polarization direction 28p (P wave component) is transmitted and the component with polarization direction 28s (S wave component) is reflected. Have nature.

また、 あらゆる偏光方向が均質に存在する円偏光や、 P波、 S波に 4 5 ° の角度をなす偏光方向であればレーザ光は等分され、 レーザ光 2 9 とレーザ光 3 0のエネルギーは等しくなるという性質を持っている。 したがって、 第一の偏光ビームスプリッタ 2 4への入射ビーム 2は、 円偏光、 或いは P波、 5波に4 5 ° の角度をなすようにすることにより、 エネルギーを等しく分離する構成になっている。 In addition, the laser beam is equally divided if it is a circularly polarized light in which all polarization directions exist uniformly, or a polarization direction that forms an angle of 45 ° to the P wave and S wave, and the energy of the laser light 29 and laser light 30 Have the property of being equal. Therefore, the incident beam 2 to the first polarizing beam splitter 2 4 is By making the angle of 45 ° to circularly polarized light, P wave, or 5 wave, energy is separated equally.

また、 当然、 偏光ビームスプリッタ 2 4に入射するレーザ光の偏光方 向が P波成分のみであれば全て透過し、 S波成分のみであれば全て反射 するという性質を持っている。  Of course, if the polarization direction of the laser light incident on the polarization beam splitter 24 is only the P-wave component, all the laser beam is transmitted, and if only the S-wave component is reflected, the laser beam is reflected.

したがって、 第二の偏光ビームスプリッタ 2 5への入射ビームは、 レ 一ザ光 7が P波成分のみを、 レーザ光 6が S波成分のみになるようにす ることで、 エネルギーロスなく第二のガルバノスキャンミラー 1 2に導 く構成となっている。 上記のような従来のレーザ加工装置では、 第一の偏光ビームスプリッ タ 2 4、 第二の偏光ビ一ムスプリッタ 2 5ともに、 レーザ光のウィンド ゥ部分 2 6への入射角がプリユースター角になるようウィンドウを配置 することによリ レーザ光 2を S波、 P波成分に分光しているが、 例えば、 炭酸ガスレーザの分光に Z n S eを材質としたウィンドウを使用した場 合、 ブリュースタ一角は 6 7 . 5 ° とウィンドウへの入射角が大きくな リ、 偏光ビームスプリッタに導かれるレーザ光の径が φ 3 5 m mとする と、 ウィンドウ上のレーザ光径は長軸方向で 9 4 m mとなってしまう。 よって、 ウィンドウは上記レーザ光径の 2 . 5倍以上の有効径が必要と なり、 製作精度の維持が困難であるという問題点があった。  Therefore, the incident beam to the second polarizing beam splitter 25 can be obtained without energy loss by making the laser beam 7 only the P wave component and the laser beam 6 only the S wave component. The galvanometer scan mirror 1 2 is used. In the conventional laser processing apparatus as described above, the incident angle of the laser beam to the window portion 26 is the pre-Easter angle for both the first polarization beam splitter 24 and the second polarization beam splitter 25. The laser beam 2 is split into S wave and P wave components by arranging the windows so that, for example, if a window made of ZnSe is used for the carbon dioxide laser spectroscopy, If the Brewster angle is 67.5 ° and the incident angle to the window is large, and the diameter of the laser beam guided to the polarizing beam splitter is φ 3 5 mm, the laser beam diameter on the window is in the major axis direction. 9 4 mm. Therefore, the window needs to have an effective diameter that is at least 2.5 times the laser beam diameter, which makes it difficult to maintain manufacturing accuracy.

また、 第一の偏光ビームスプリッタ 2 4を P波成分として透過したレ 一ザ光 6は第二の偏光ビームスプリッタ 2 5において、 S波成分として 反射させる必要があり、 第一の偏光ビームスプリッタ 2 4を S波成分と して反射したレーザ光 7は第二の偏光ビームスプリッタ 2 5において、 P波成分として透過させる必要があるため 第一、 第二の偏光ビームス プリッタにはそれぞれレーザ光を 9 0。 に折り返すためのミラ一 2 7を 備える必要があり、 また、 ウィンドウ部分 2 6とミラー 2 7の相対位置 関係は偏光ビームスプリッタ後の光路の精度に大きな影響を及ぼすため、 ウィンドウ部分 2 6とミラー 2 7の相対位置関係に注意し、 偏光ビーム スプリッタを製作する必要もあったため、 偏光ビームスプリッタがより 高価な光学部品となるという問題点もあった。 In addition, the laser beam 6 transmitted as the P wave component through the first polarizing beam splitter 24 needs to be reflected as the S wave component by the second polarizing beam splitter 25. The first polarizing beam splitter 2 Since the laser beam 7 reflected by 4 as the S wave component needs to be transmitted as the P wave component in the second polarization beam splitter 25, the laser beam 9 is sent to the first and second polarization beam splitters, respectively. 0. Mira 1 to wrap to 2 7 In addition, the relative positional relationship between the window portion 2 6 and the mirror 2 7 greatly affects the accuracy of the optical path after the polarization beam splitter, so pay attention to the relative positional relationship between the window portion 2 6 and the mirror 2 7. There was also a problem that the polarizing beam splitter became a more expensive optical component because it was necessary to manufacture the polarizing beam splitter.

また、 f 0レンズ 1 7の特性を考慮し、 より安定した加工品質を得る ため、 第一の偏光ビ一ムスプリッタ 2 4から f 0レンズ 1 7間の光路長 を極力短くする必要があり、 偏光ビームスプリッタの有効径を大きくす る必要があった。 しかし、 偏光ビームスプリッタの有効径を十分大きく 設計することが困難なため、 実際は偏光ビームスプリッタの有効径が十 分でなく、 f 0レンズ 1 7へ導かれるレーザ光の径が所望の径ょリも小 さく制約されると、 f 0 レンズの焦点距離が一定の場合、 被加工物上の レーザ光の径は所望の径ょリも大きく制約され、 よリ小さい穴加工に適 した光路を構成することができなくなり、 要求される加工品質を得るこ とができないという問題点もあった。  In addition, in order to obtain more stable processing quality in consideration of the characteristics of the f0 lens 17, it is necessary to shorten the optical path length between the first polarization beam splitter 24 and the f0 lens 17 as much as possible. It was necessary to increase the effective diameter of the polarizing beam splitter. However, since it is difficult to design the effective diameter of the polarizing beam splitter sufficiently large, the effective diameter of the polarizing beam splitter is actually not sufficient, and the diameter of the laser beam guided to the f 0 lens 17 is the desired diameter. However, if the focal length of the f0 lens is constant, the laser beam diameter on the workpiece is greatly restricted by the desired diameter, and an optical path suitable for drilling smaller holes is formed. There is also a problem that the required processing quality cannot be obtained.

また、 光学系に使用される個々の光学部品は製作工程上必ず歪み (収 差) を持ち、 平面度については要求精度を小さくすればするほど、 歩留 まりが悪化し、 コストが高くなるため、 一般的にはレーザ波長 λの 1 1 0〜 1 2 0程度の光学歪みで製作される。 この程度の光学部品を何 も考慮せずに複数枚組み合わせた光学系を構 Ι すると、 個々の収差が積 み重なり、 非点収差等が発生し、 要求される加工品質を得ることができ ない場合があ.るという問題点もあった。  In addition, the individual optical components used in the optical system always have distortion (convergence) in the manufacturing process, and the lower the required accuracy for flatness, the worse the yield and the higher the cost. Generally, it is manufactured with an optical distortion of about 110 to 120 of the laser wavelength λ. If an optical system that combines multiple optical components without considering these optical components is constructed, individual aberrations accumulate and astigmatism occurs, making it impossible to obtain the required processing quality. There was also a problem that there was a case.

また、 それぞれの表面形状が平面の光学部品は一般的には表面と裏面 を製作する製作工程は同じであるため、 表面と裏面の表面形状は共に凸 形状、 或いは凹形状となる傾向が強く、 透過型の光学部品では光学歪み (収差) を増大するという問題点もあった。 この発明は、 かかる問題点を解決するためになされたもので、 偏光分 離手段により、 分光したレーザ光を用いて加工を行うレーザ加工装置に おいて、 偏光分離手段として安価な光学部品を使用することができ、 ま た被加工物上のレーザ光の径をよリ小さくできるレーザ加工装置を得る ことを第 1の目的としている。 In addition, since optical parts with flat surface shapes generally have the same manufacturing process for manufacturing the front and back surfaces, both the front and back surface shapes tend to be convex or concave. There is also a problem that the optical distortion (aberration) increases in the transmission type optical component. The present invention has been made to solve such a problem, and uses an inexpensive optical component as a polarization separation means in a laser processing apparatus that performs processing using a laser beam dispersed by the polarization separation means. The first object of the present invention is to obtain a laser processing apparatus that can reduce the diameter of the laser beam on the workpiece.

また、 光学部品の表面形状による収差を低減し加工品質を向上できる レーザ加工装置を得ることを第 2の目的としている。 発明の開示  A second object is to obtain a laser processing apparatus that can reduce the aberration due to the surface shape of the optical component and improve the processing quality. Disclosure of the invention

上記目的を達成するために、 第 1の発明に係るレーザ加工装置におい ては、 レーザ発振器よリ出射されたレーザ光を被加工物まで導く複数の 光学部品からなる光学系を有し、 1つのレーザ光を第一の偏光分離手段 で 2つのレーザ光に分光し、 一方はミラーを経由し、 他方は第一のガル バノスキャンミラーで 2軸方向に走査し、 2つのレーザ光を第二の偏光 分離手段へ導いた後、 第二のガルバノスキャンミラーで走査し、 被加工 物を加工するレーザ加工装置において、 前記第一および第二の偏光分離 手段をレーザ光の光軸に対して 4 5 ° に配置したものである。  In order to achieve the above object, the laser processing apparatus according to the first invention has an optical system comprising a plurality of optical components that guide the laser beam emitted from the laser oscillator to the workpiece. The laser beam is split into two laser beams by the first polarization separation means, one passes through the mirror, the other scans in the biaxial direction by the first galvano scan mirror, and the two laser beams are In the laser processing apparatus for processing a workpiece by scanning with a second galvano-scanning means, the first and second polarization-separating means are arranged with respect to the optical axis of the laser beam. It was placed at 5 °.

第 2の発明に係るレーザ加工装置においては、 第一および第二の偏光 分離手段は、 表面に誘電体多層膜コーティングが形成された偏光ビーム スプリッタである。  In the laser processing apparatus according to the second invention, the first and second polarization separation means are polarization beam splitters having a dielectric multilayer coating formed on the surface.

第 3の発明に係るレーザ加工装置においては、 前記第一および第二の 偏光分離手段は、 片方の面が凹形状、 その裏面が凸形状である。  In the laser processing apparatus according to the third aspect of the invention, the first and second polarized light separating means have a concave shape on one side and a convex shape on the back side.

第 4の発明に係るレーザ加工装置においては、 前記第一の偏光分離手 段は、 レーザ光を反射する側の面を凸形状、 その裏面を凹形状とし、 該 第一の偏光分離手段において反射されたレーザ光を表面形状が凹形状の 前記第一のガルバノスキャンミラーに導き、 前記第二の偏光分離手段は、 レーザ光を反射する側の面を凹形状、 その裏面を凸形状としたものであ る。 · In the laser processing apparatus according to the fourth aspect of the invention, the first polarization separation means has a convex surface on the side that reflects the laser light and a concave shape on the back surface, and is reflected by the first polarization separation means. The surface shape of the laser beam is concave The second polarized light separating means led to the first galvano scan mirror has a concave surface on the side that reflects the laser beam and a convex surface on the back surface. ·

第 5の発明に係るレーザ加工装置においては、 前記第一の偏光分離手 段は、 レーザ光を反射する側の面を凹形状、 その裏面を凸形状とし、 該 第一の偏光分離手段において反射されたレーザ光を表面形状が凸形状の 前記第一のガルバノスキャンミラーに導き、 前記第二の偏光分離手段は、 レーザ光を反射する側の面を凸形状、 その裏面を凹形状としたものであ る。 r In the laser processing apparatus according to the fifth invention, the first polarization separation means has a concave surface on the side that reflects the laser light and a convex shape on the back surface, and is reflected by the first polarization separation means. The laser beam is guided to the first galvano scan mirror having a convex surface shape, and the second polarized light separating means has a convex surface on the side that reflects the laser light and a concave surface on the back surface. It is. r

第 6の発明に係るレーザ加工装置においては、 前記第一および第二の 偏光分離手段の表面の凹または凸形状は、 前記レーザ光の波長を λとし た場合、 λ Ζ 2 0以下の精度で形成されているものである。  In the laser processing apparatus according to the sixth aspect of the invention, the concave or convex shapes on the surfaces of the first and second polarization separation means have an accuracy of λλ20 or less when the wavelength of the laser beam is λ. Is formed.

第 7の発明に係るレーザ加工装置においては、 前記光学系において、 略同一表面形状である 1組の光学部品を、 一方の光学部品のビーム入射 面が他方の光学部品のビーム入射面に対し垂直で、 かつ一方の光学部品 へのビーム入射角が他方の光学部品へのビー Α入射角と同一となるよう に配置するものである。  In the laser processing apparatus according to a seventh aspect of the present invention, in the optical system, a pair of optical components having substantially the same surface shape is used, and the beam incident surface of one optical component is perpendicular to the beam incident surface of the other optical component. In addition, the beam incident angle to one optical component is arranged to be the same as the beam incident angle to the other optical component.

第 8の発明に係るレーザ加工装置においては、 前記レーザ発振器から 出射されたレーザ光が前記第 1の偏光分離手段に至るまでのレーザ光路 中にマスクを設け、 このマスクと前記被加工物との間に前記 1組の光学 部品を配置したものである。  In the laser processing apparatus according to the eighth aspect of the present invention, a mask is provided in the laser beam path from the laser beam emitted from the laser oscillator to the first polarization separation unit, and the mask and the workpiece The set of optical components is placed between them.

第 9の発明に係るレーザ加工装置においては、 前記 1組の光学部品を 個々に固定するホルダーを有し、 前記ホルダーに方向性がある場合、 こ の方向性を示す軸を、 それぞれの光学部品の入射面に対して同じ方向に 配置したものである。 .  In the laser processing apparatus according to the ninth aspect of the present invention, the optical processing apparatus includes a holder for individually fixing the set of optical components, and when the holder has directionality, the axis indicating the directionality is set to each optical component. Are arranged in the same direction with respect to the incident surface. .

第 1 0の発明に係るレーザ加工装置においては、 前記 1組の光学部品 の表面形状は、 前記レーザ光の波長を; Iとした場合、 λ Ζ 1 0〜 I 2 0の精度で形成されているものである。 In the laser processing apparatus according to the tenth invention, the one set of optical components The surface shape is formed with an accuracy of λΖ10 to I20, where I is the wavelength of the laser beam.

第 1 1の発明に係るレーザ加工装置においては、 前記第一および第二 の偏光分離手段は、 レーザ光の進行方向に垂直で、 かつ互いに直交する 2軸方向に角度調整可能な機構を備えたものである。  In the laser processing apparatus according to the first aspect of the invention, the first and second polarization separation means include a mechanism capable of adjusting an angle in two axial directions perpendicular to the traveling direction of the laser light and orthogonal to each other. Is.

第 1 2の発明に係るレーザ加工装置においては、 前記第二の偏光分離 手段からエネルギーロスとして漏れるレーザ光を吸収するためにダンバ 一を備えナ;:ものである。 この発明によれば、 偏光分離手段として入射角が 4 5 ° の偏光ビーム スプリツタを用いたことによリ、 f Θレンズにより大きい径のレーザ光 を入射させることができ、 被加工物上のレーザ光の径をより小さくでき、 より微細な加工を実施することができる。 また、 偏光分離手段が安価と なリコス ト低減ができる。 図面の簡単な説明  In the laser processing apparatus according to the 12th aspect of the invention, there is provided a damper for absorbing laser light leaking as energy loss from the second polarization separation means. According to the present invention, by using a polarization beam splitter having an incident angle of 45 ° as the polarization separating means, a laser beam having a larger diameter can be made incident on the f Θ lens. The diameter of light can be made smaller, and finer processing can be performed. In addition, the polarized light separating means is inexpensive and can reduce the cost. Brief Description of Drawings

第 1図は、 この発明の実施の形態 1 を示すレーザ加工装置の構成図で あ" 5) o ' .  FIG. 1 is a block diagram of the laser processing apparatus showing Embodiment 1 of the present invention.

第 2図は、 この発明の実施の形態 1 を示す偏光ビームスプリッタを固 定するホルダ一部分の概略図である。  FIG. 2 is a schematic view of a part of the holder for fixing the polarization beam splitter showing the first embodiment of the present invention.

第 3図は、 この発明の実施の形態 2を示すレーザ加工装置の構成図で める。  FIG. 3 is a block diagram of a laser processing apparatus showing Embodiment 2 of the present invention.

第 4図は、 この発明の実施の形態 2であるレーザ加工装置の光学部品 表面形状と屈折力との関係を説明するための模式図である。  FIG. 4 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 2 of the present invention.

第 5図は、 この発明の実施の形態 2であるレーザ加工装置の光学部品 の配置を説明するための模式図である。 第 6図は、 この発明の実施の形態 2であるレーザ加工装置の方向性を 持った光学部品ホルダーの配置と屈折力との関係を説明するための模式 図である。 FIG. 5 is a schematic diagram for explaining the arrangement of optical components of the laser machining apparatus according to Embodiment 2 of the present invention. FIG. 6 is a schematic diagram for explaining the relationship between the refractive power and the arrangement of optical component holders having directionality of the laser processing apparatus according to the second embodiment of the present invention.

第 7図は、 この発明の実施の形態 3を示すレーザ加工装置の構成図で める。  FIG. 7 is a block diagram of a laser processing apparatus showing Embodiment 3 of the present invention.

第 8図は、 この発明の実施の形態 3であるレーザ加工装置の光学部品 表面形状と屈折力との関係を説明するための模式図である。  FIG. 8 is a schematic diagram for explaining the relationship between the surface shape and refractive power of the optical component of the laser machining apparatus according to Embodiment 3 of the present invention.

第 9図は、 この発明に係る従来技術を示すレーザ加工装置の構成図で ある。  FIG. 9 is a block diagram of a laser processing apparatus showing the prior art according to the present invention.

第 1 0図は、 この発明に係る従来技術を示すレーザ加工装置の偏光ビ 一ムスプリッタを説明するための模式図である。 発明を実施するための最良の形態  FIG. 10 is a schematic diagram for explaining a polarization beam splitter of a laser processing apparatus showing the prior art according to the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

実施の形態 1 . Embodiment 1.

第 1図はこの発明の実施の形態 1に係り、 偏光分離手段として入射角 4 5 ° の偏光ビームスプリッタを用い、 1つのレーザ光を 2つのレーザ 光に分光し、 2つのレーザ光を独立に走査することにより、 2箇所同時 に加工を実施することができる穴あけ用レーザ加工装置を示す構成図で ある。 従来技術の第 9図と同一構成については同一番号を付与し、 詳細 な説明は省略する。  FIG. 1 relates to Embodiment 1 of the present invention. A polarization beam splitter having an incident angle of 45 ° is used as a polarization separation means, one laser beam is split into two laser beams, and the two laser beams are independently used. FIG. 2 is a configuration diagram showing a laser processing apparatus for drilling that can perform processing at two locations simultaneously by scanning. The same components as those in FIG. 9 of the prior art are designated by the same reference numerals and detailed description thereof is omitted.

第 1図において、 5は第一の偏光ビームスプリッタ、 6は第一の偏光 ビームスプリッタ 5を透過したレーザ光、 6 pはレーザ 6の第一の偏光 ビ一ムスプリッタにとつて P波成分となる偏光方向、 6 sはレーザ光 6 の第一の偏光ビームスプリッタにとつて S波成分となる偏光方向、 7は 第一の偏光ビームスプリッタ 5を反射したレーザ光、 7 sはレーザ光 7 の第一の偏光ビームスプリッタにとつて S波成分となる偏光方向、 7 p はレーザ光 7の第一の偏光ビームスプリッタにとつて P波成分となる偏 光方向、 8は第二の偏光ビー厶スプリッタ、 9はエネルギーロスとして 発生するレーザ光を受け止めるダンパー、 1 0はレーザ光 6のうち第二 の偏光ビームスプリッタ 8で反射したレーザ光、 1 1 はレーザ光 7のう ち第二の偏光ビームスプリッタ 8で透過したレーザ光である。 In FIG. 1, 5 is the first polarization beam splitter, 6 is the laser beam transmitted through the first polarization beam splitter 5, 6p is the P wave component for the first polarization beam splitter of laser 6, and 6 s is the polarization direction of the S-wave component for the first polarization beam splitter of the laser beam 6, 7 is the laser beam reflected from the first polarization beam splitter 5, and 7 s is the laser beam 7. For the first polarization beam splitter, the polarization direction that becomes the S wave component, 7 p Is the polarization direction that becomes the P wave component for the first polarization beam splitter of laser light 7, 8 is the second polarization beam splitter, 9 is a damper that receives the laser light generated as energy loss, and 10 is the laser. Of the light 6, the laser light reflected by the second polarizing beam splitter 8, and 11 is the laser light transmitted through the second polarizing beam splitter 8 out of the laser light 7.

従来技術においてレーザ光を偏光分離する場合は、 入射角をプリユー スター角としたウィンドウを用い、 P波成分、 S波成分を等しく含むレ 一ザ光を偏光分離することにより、 透過する P波成分と反射する S波成 分を等分配し、 レ一ザ光のエネルギーを等しく分割している。  When laser light is polarized and separated in the prior art, a P-wave component that is transmitted by using a window with an incident angle as the pre-Uster angle and polarization-separating laser light that equally contains the P-wave component and S-wave component. The reflected S wave component is equally distributed, and the energy of the laser light is equally divided.

しかしながら、 本実施の形態においては、 反射面に例えば誘電体多層 膜のコーティングを施した偏光ビームスプリッタを用いることにより、 入射角をブリュースター角ではなく光軸に対し 4 5 ° の配置として、 一 定の精度で P波を透過し、 かつある一定の精度で S波を反射させ、 レ一 ザ光のエネルギーを等しく分割する。  However, in this embodiment, by using a polarizing beam splitter having a reflective surface coated with a dielectric multilayer film, for example, the incident angle is set to 45 ° with respect to the optical axis instead of the Brewster angle. Transmits the P wave with a constant accuracy, reflects the S wave with a certain accuracy, and divides the energy of the laser light equally.

一例として、 P波の 9 5 %と S波の 5 %を透過し、 S波の 9 5 %と P 波の 5 <½を反射するようにコーティングされた偏光ビームスプリッタを 使用した場合について説明する。 第一の偏光ビームスプリッタ 5に入射 するレーザ光のエネルギーを 1 0 0 %とすると、 第一の偏光ビームスプ リツタ 5を透過したレーザ光 6は P波成分を 4 7 . 5 o/o、 S波成分を 2 . 5 o/o含むことになる。 その後、 第二の偏光ビームスプリッタ 8には、 4 7 . 5 <½の S波成分と 2 . 5 %の P波成分を含むレ一ザ光が入射され、 第二の偏光ビームスプリッタ 8を反射するレーザ光は 4 5 . 1 2 5 %の S波成分と 0 . 1 2 5 %の P波成分を含み、 第二のガルバノスキャンミ ラー 1 2へ導かれるレーザ光 1 0のエネルギーは最終的に 4 5 . 2 5 % となる。 第二の偏光ビームスプリッタ 8を透過するエネルギーロスとな るレーザ光は 2 . 3 7 5 %の S波成分と 2 . 3 7 5 o/oの P波成分を含む 1 "1 こととなる。 As an example, a polarization beam splitter coated to transmit 95% of the P wave and 5% of the S wave and reflect 95% of the S wave and 5 <½ of the P wave will be described. . Assuming that the energy of the laser light incident on the first polarizing beam splitter 5 is 100%, the laser light 6 transmitted through the first polarizing beam splitter 5 has a P wave component of 47.5 o / o and an S wave. Contains 2.5 o / o ingredients. After that, the second polarization beam splitter 8 receives laser light including 47.5 <½ S wave component and 2.5% P wave component, and reflects the second polarization beam splitter 8. The laser beam contains 45.125% S wave component and 0.125% P wave component, and the energy of the laser beam 10 guided to the second galvanoscan mirror 12 is final. 4 5. 2 5%. The laser beam that causes energy loss through the second polarizing beam splitter 8 contains 2.375% S wave component and 2.375 o / o P wave component. 1 "1 thing.

一方、 第一の偏光ビームスプリッタ 5を反射したレーザ光 7について 'も同様の過程を経て、 45. 25 %のエネルギーが第二のガルバノスキ ヤンミラ一 1 2へ導かれ、 4. フ 5%のエネルギーがロスとなる。 よって、 計 9. 5%がエネルギーロスとして第二のガルバノスキャン ミラ一 1 2に導かれることはないが、 本実施の形態による光路を構成し た場合、 レーザ光 6のロス分は第二の偏光ビームスプリッタを透過し'、 レーザ光 7のロス分は反射するので、 このエネルギーロスとなるレーザ 光は.、 ダンパー 9の部分に全て集めることができ、 ロス分のレーザ光に よる光学部品等の損傷を防止することができる。  On the other hand, the laser beam 7 reflected from the first polarizing beam splitter 5 goes through the same process, and 45.25% of the energy is led to the second galvanoski Yanmira 1 2 and 4. 5% energy Is a loss. Therefore, a total of 9.5% is not led to the second galvanoscan mirror 1 or 2 as energy loss, but when the optical path according to the present embodiment is configured, the loss of the laser beam 6 is the second loss. Because it passes through the polarizing beam splitter and reflects the loss of the laser beam 7, all the laser beam that causes this energy loss can be collected in the part of the damper 9, and the optical components by the laser beam for the loss, etc. Can prevent damage.

上記偏光ビームスプリッタは、 入射角 45° で P波の 95 %と S波の 5%を透過し、 S波の 95%と P波の 5%を反射するとしたが、 入射角 が 45° からずれた場合は、 透過する P波と反射す.る S波の割合が減少 し、 エネルギーロスが増加することとなるので、 入射角 45° で配置す ることが望ましい。  The polarizing beam splitter transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave at an incident angle of 45 °. However, the incident angle deviates from 45 °. In this case, the ratio of the transmitted P wave and the reflected S wave will decrease and the energy loss will increase, so it is desirable to arrange them at an incident angle of 45 °.

上記では、 P波の 9 5 %と S波の 5 %を透過し、 S波の 95%と P波 の 5 %を反射する偏光ビームスプリツタのェネルギ一ロスが 9 · 5 %で あることを説明したが、 P波の透過率および S波の反射率を 95%よリ 高くすれば、 エネルギーロスは 9. 5 %より小さくなることは明らかで ある。  In the above, the energy loss of a polarized beam splitter that transmits 95% of the P wave and 5% of the S wave and reflects 95% of the S wave and 5% of the P wave is 9.5%. As explained, it is clear that if the P-wave transmittance and S-wave reflectance are made higher than 95%, the energy loss will be smaller than 9.5%.

また、 本実施の形態による偏光ビームスプリッタは、 レ一ザ光の入射 角を 45° で配置するため、 偏光ビームスプリッタに導かれるレーザ光 の径を ø 35 mmとすると、 ウィンドウ上のレーザ光径は長軸方向で 5 2mmと前記レーザ光径の 1 . 5倍程度となり、 入射角がブリュースタ —角の従来の偏光ビームスプリッタのウィンドウ有効径が入射レーザ光 径の 2. 5倍以上必要であるのに比較し、 より小さい形状で製作するこ とができる。 ウィンドウの面積で比較すると、 短軸方向はいずれも 3 5 m mでよいので、 入射角 4 5 ° の偏光ビームスプリッタは従来の偏光ビ 一ムスプリッタに比べ 4 4 . 6 %の面積の削減ができる。 これにより、 加工装置の小型化が可能となる。 In addition, since the polarization beam splitter according to the present embodiment is arranged so that the incident angle of the laser beam is 45 °, if the diameter of the laser beam guided to the polarization beam splitter is ø35 mm, the laser beam diameter on the window This is 52 mm in the long axis direction, which is about 1.5 times the laser beam diameter, and the window effective diameter of a conventional polarizing beam splitter with an incident angle of Brewster angle of at least 2.5 times the incident laser beam diameter. Compared to existing products, they can be manufactured in smaller shapes. You can. Compared with the area of the window, the minor axis direction can be 35 mm in all directions, so the polarization beam splitter with an incident angle of 45 ° can reduce the area by 44.6% compared to the conventional polarization beam splitter. . This makes it possible to reduce the size of the processing apparatus.

また、 同じ径のウィンドウ、 例えば 5 3 m mの場合、 従来の偏光ビー ムスプリッタではブリュースター角が 6 7 . 5 ° の関係上、 分光可能な レーザ光径は ø 2 0 m m程度であるが、 入射角 4 5 ° 偏光ビ一ムスプ リツタでは ø 3 5 m mであり、 よリレーザ光の径が大きい光路を構成す ることが可能になる。 ここで、 ビーム径 Dのレーザ光を焦点距離 f の f 0 レンズに入射し、 このとき被加工物上で集光されるビームスポッ ト径 を dとすると、 ビームスポッ ト径 dと f 0レンズの焦点距離 f 、 入射ビ ーム径 Dの関係は次式で表すことがきる。 d o f ノ D ( 1 )  In the case of a window with the same diameter, for example, 53 mm, the conventional polarizing beam splitter has a Brewster angle of 67.5 °. Incident angle 45 ° Polarizing beam splitter is ø35 mm, which makes it possible to construct an optical path with a larger relaser beam diameter. Here, when a laser beam having a beam diameter D is incident on an f 0 lens having a focal length f and the beam spot diameter collected on the workpiece is d, the beam spot diameter d and the focal point of the f 0 lens The relationship between the distance f and the incident beam diameter D can be expressed by the following equation. d o f ノ D (1)

( 1 ) 式は、 焦点距離 f の f 0 レンズにより、 ワーク上で集光される ビームスポッ 卜径 dは、 f 0レンズに入射するレーザ光のビーム径りに 反比例することを示して る。 Equation (1) shows that the beam spot diameter d collected on the workpiece by the f 0 lens with the focal length f is inversely proportional to the beam diameter of the laser light incident on the f 0 lens.

よって、 同じ径のウィンドウで偏光ビームスプリッタを構成すること を考えた場合、 上記のように入射角が 4 5 ° の偏光ビームスプリッタは より有効にレーザ光の有効径を確保でき、 同じ f 0 レンズを使う場合、 f Θ レンズに入射するビーム径 Dを大きくすることができるため、 さら にビームスポッ ト径の小さい加工を実施することを可能にしている。 また、 光路を 9 0 ° に折り返すミラーは不要となるため、 偏光ビーム スプリッタがより安価となり加工装置のコス ト削減が可能となる。  Therefore, when considering the construction of a polarizing beam splitter with windows of the same diameter, the polarizing beam splitter with an incident angle of 45 ° as described above can secure the effective diameter of the laser beam more effectively, and the same f 0 lens When is used, the beam diameter D incident on the fΘ lens can be increased, which makes it possible to carry out processing with a smaller beam spot diameter. In addition, since a mirror that turns the optical path to 90 ° is not required, the polarization beam splitter is cheaper and the cost of the processing apparatus can be reduced.

尚、 この発明の実施形態では、 レーザ光を 9 0 ° に折り返す光路 構 成しているため、 入射角が 4 5 ° の偏光ビームスプリッタを適用してい る。 この構成にすることにより X Yテーブル 1 8上で 2軸のガルバノス キャンミラーのスキャン方向が直行するので、 第 1図のように、 この直 行する方向を X Y方向に合わせることで、 X方向、 Y方向をそれぞれガ ルバノスキャンミラーに 1対 1に対応させることができ、 加工に際する ガルバノスキャンミラーの制御が分かリやすくシンプルな構成とするこ とができる。 In the embodiment of the present invention, the optical path structure in which the laser beam is turned back to 90 °. Therefore, a polarizing beam splitter with an incident angle of 45 ° is used. With this configuration, the scanning direction of the two-axis galvanoscan mirror is orthogonal on the XY table 18, so as shown in Fig. 1, aligning this orthogonal direction with the XY direction allows the X direction and Y Each direction can correspond to the galvano scan mirror on a one-to-one basis, and the control of the galvano scan mirror during machining is easy to understand and a simple configuration can be achieved.

偏光ビームスプリッタでの、 レーザ光の折り返し角度を 9 0 ° ょリ銳 角にした場合、 偏光ビームスプリッタの有効径を大きく し、 さらにビー ムスポット径の小さい加工を実施することが可能となる。 ただし、 この 場合は X Yテーブル上で 2軸のガルバノスキャンミラーのスキャン方向 が直行しないので、 例えば一方のガルバノスキャンミラーのスキャン方 向を X方向に合わせても、 Y方向は他方のガルバノスキャンミラーと X 方向のガルバノスキャンミラーとの合成でしかスキャンできないため、 加工に際するガルバノスキャンミラーの制御が上記レーザ光を 9 0 ° に 折り返す光路に比べて複雑になる。 実施の形態 2 .  When the turning angle of the laser beam in the polarizing beam splitter is set to 90 °, the effective diameter of the polarizing beam splitter can be increased and processing with a smaller beam spot diameter can be performed. However, in this case, the scanning direction of the two-axis galvano scan mirror does not go straight on the XY table. For example, even if the scan direction of one galvano scan mirror is aligned with the X direction, the Y direction is the same as the other galvano scan mirror. Since scanning is possible only by combining with the galvano scan mirror in the X direction, the control of the galvano scan mirror during processing is more complicated than the optical path that turns the laser beam back to 90 °. Embodiment 2.

分光した 2つのレーザ光は共に第二の偏光ビームスプリッタを経た後、 第 1図の X方向の軸に平行でかつ、 第二のガルバノスキャンミラー 1 2 の中心に導かれる必要があるため、 分光されたレーザ光 6、 7は独立し て光軸の調整を実施する必要がある。  Since the two laser beams that have been split must pass through the second polarizing beam splitter and be parallel to the axis in the X direction in Fig. 1 and be guided to the center of the second galvano scan mirror 1 2. It is necessary to adjust the optical axes of the laser beams 6 and 7 independently.

レーザ光 1 0、 1 1 を精度よく第二のガルバノスキャンミラ一 1 2に 導くためには、 第一の偏光ビームスプリッタ 5の直前に設けられたミラ 一 4 z以降の光路中において、 光路の進行方向に対して垂直で、 互いに 直交する 2軸方向に角度調整が可能なミラーがそれぞれ最低 2枚必要で あるが、 本実施の形態では、 レーザ光 1 0は第一の偏光ビームスプリツ タ 5直前のミラ一 4 zと第二の偏光ビームスプリッタ 8によリ光軸を調 整可能とし、 一方レーザ光 1 1は第一の偏光ビームスプリッタ 5と第一 のガルバノスキャンミラー 1 3により光軸を調整可能としている。 ここ で、 第一のガルバノスキャンミラー 1 3は互いにねじれの方向に角度調 整可能なミラーを 2枚有し、 互いに直交する 2軸方向に角度調整可能な 1枚のミラーと同じ機能を持つとみなせる。 In order to accurately guide the laser beams 10 and 1 1 to the second galvanoscan mirror 1 1 2, in the optical path after the mirror 4 z provided immediately before the first polarization beam splitter 5, At least two mirrors that are perpendicular to the direction of travel and can be adjusted in two axes perpendicular to each other are required. However, in the present embodiment, the laser beam 10 can be adjusted in the optical axis by the mirror 4z immediately before the first polarization beam splitter 5 and the second polarization beam splitter 8, while the laser beam 1 The optical axis 1 can be adjusted by the first polarization beam splitter 5 and the first galvano scan mirror 13. Here, the first galvano scan mirror 13 has two mirrors that can be adjusted in the direction of twist with respect to each other, and has the same function as one mirror that can be adjusted in the direction of two axes perpendicular to each other. It can be considered.

第 2図は、 この発明の実施の形態 2に係り.、 偏光ビームスプリッタを レーザ光の進行方向に対して垂直で、 互いに直交する 2軸方向に角度調 整が可能な機構を示した図である。 第 2図において、 偏光ビームスプリ ッタ 5または 8は固定ホルダ一 3 1により支持されており、 固定ホルダ 一 3 1はホルダ一支え 3 2に第一の回転軸 3 5 aを介して回転自在に支 持されている。 また、 ホルダー支え 3 2は光学系を支持する光学基台 3 6に第一の回転軸 3 5 aに直交した第二の回転軸 3 5 bを介して回転自 在に支持されている。 これにより、 偏光ビームスプリッタは光路の進行 方向に対して垂直で、 互いに直交する 2軸方向に角度調整が可能となつ ている。 また、 ホルダー支え 3 2の固定ホルダー 3 1 との接合部には固 定ホルダー 3 1の回転方向に長い第一の調整穴 3 4 aが設けられ、 第一 の固定ねじ 3 3 aが貫通し固定ホルダー 3 1にねじ込まれており、 回転 調整後、 第一の固定ねじ 3 3 aを締め付けることで固定ホルダー 3 1 を ホルダー支え 3 2に固定できる構造となっている。 ホルダー支え 3 2と 光学基台 3 6との接合部も同様に、 第二の調整穴 3 4 bと第二の固定ね じ 3 3 bにより回転調整後固定可能な構造となっている。  FIG. 2 relates to the second embodiment of the present invention, and is a diagram showing a mechanism capable of adjusting the angle of the polarization beam splitter in two axial directions perpendicular to the traveling direction of the laser light and perpendicular to each other. is there. In FIG. 2, the polarization beam splitter 5 or 8 is supported by a fixed holder 31. The fixed holder 31 is rotatable to the holder 31 via a first rotating shaft 35a. Is supported. In addition, the holder support 32 is supported by the optical base 36 supporting the optical system via a second rotation shaft 35 b perpendicular to the first rotation shaft 35 a. This makes it possible for the polarization beam splitter to adjust the angle in two axial directions perpendicular to the traveling direction of the optical path and orthogonal to each other. In addition, a first adjustment hole 3 4 a that is long in the rotation direction of the fixed holder 3 1 is provided at a joint portion of the holder support 3 2 with the fixed holder 3 1, and the first fixing screw 3 3 a passes therethrough. It is screwed into the fixed holder 3 1, and after the rotation adjustment, the fixed holder 3 1 can be fixed to the holder support 3 2 by tightening the first fixing screw 3 3 a. Similarly, the joint between the holder support 3 2 and the optical base 3 6 can be fixed after rotation adjustment by the second adjustment hole 3 4 b and the second fixing screw 3 3 b.

—方、 偏光ビームスプリッタの角度調整による偏光ビームスプリッタ を透過するレーザ光の光軸の変化量は反射するレーザ光に比べ極度に小 さく、 無視できる程度であるので、 第一の偏光ビームスプリッタ 5によ リ反射するレーザ光 7、 1 1の光軸を調整しても透過するレーザ光 6、 1 0の光軸にはほとんど影響を与えず、 第二の偏光ビームスプリッタ 8 により反射するレーザ光 6、 1 0の光軸を調整しても透過するレーザ光 7、 1 1の光軸にはほとんど影響を与えないので、 それぞれ独立して調 整することができる。 On the other hand, the change in the optical axis of the laser beam transmitted through the polarizing beam splitter by adjusting the angle of the polarizing beam splitter is extremely small compared to the reflected laser beam and is negligible. By Re-reflected laser light 7, 11 Laser light 6 that is transmitted even if the optical axis of 1 is adjusted, 10 The optical axis of 10 is hardly affected, and the laser light 6 that is reflected by the second polarization beam splitter 8 Adjusting the optical axis of 10 has almost no effect on the optical axis of transmitted laser light 7 and 11 and can be adjusted independently.

また、 ミラ一 4 Zや第一および第二の偏光ビームスプリッタ 5 , 8の 角度を調整した場合、 偏光ビームスプリッタへの入射角が 4 5 ° からず れる場合もあり、 このときレーザ光のエネルギーロスが増加するが、 通 常角度調整は微小でありエネルギーロスも微小である。 また、 レーザ発 振器の出力による補正も可能なので、 光軸調整による加工精度の向上を 優先する事が望ましい。 In addition, when the angle of the mirror 4 Z or the first and second polarizing beam splitters 5 and 8 is adjusted, the incident angle to the polarizing beam splitter may deviate from 45 °. Although the loss increases, the angle adjustment is usually small and the energy loss is also small. In addition, correction by the output of the laser oscillator is also possible, so it is desirable to give priority to improving machining accuracy by adjusting the optical axis.

次に、 上記調整機構を備えた偏光ビームスプリッタ等による光軸の調 整について説明する。  Next, adjustment of the optical axis by a polarizing beam splitter or the like equipped with the adjustment mechanism will be described.

第一の偏光ビームスプリッタ 5直前のミラー 4 zの角度調整を実施す ると、 レーザ光 1 0、 1 1は第二のガルバノスキャンミラー 1 3上で同 じ方向に移動する。 そのため、 光軸調整方向の順序としては、 まず 2つ のレーザ光に作用するミラー 4 zを用いたレーザ光 1 0の光軸の調整完 了後、 レーザ光 1 1の光軸調整を実 する必要がある。 また、 一度光軸 の調整が完了していれば、 第一の偏光ビームスプリッタ 5直前のミラー 4 Zの角度調整を実施することにより、 第二のガルバノスキャンミラ一 1 2上での 2つレーザ光の相対位置関係を保ったままレーザ光 1 0、 1 1の光軸調整を実施することができ、 精度よく第二のガルバノスキャン ミラー 1 2の中心に 2つのレーザ光を導くための光軸調整を容易にして いる。 実施の形態 3 . 第 3図はこの発明の実施の形態 3に係り、 1つのレーザ光を 2つのレ —ザ光に分光し、 2つのレーザ光を独立に走査することにより、 2箇所 同時に加工を実施することができる穴あけ用レーザ加工装置において、 マスク転写を行う光学系を有し、 特にマスク後に配置する略同一表面形 状を有した 1組の光学部品であるミラ一 4 a、 4 bもしくは 1 4 a、 1 4 b—を、 一方のミラーのビーム入射面が他方のミラーのビーム入射面に 対し垂直で、 かつ一方のミラーへのビーム入射角が他方のミラーへのビ ーム入射角と同一 (例えば 4 5 ° ) となるように配置 (例えば、 —方の ミラーで X方向から入射したレーザ光を Z方向に反射し、 その後他方の ミラーで Y方向に反射するように配置) した構成を示す構成図である。 第 3図において、 4 a、 4 bはレーザ光 2をマスク 3から第一の偏光 ビームスプリッタ 5へ導くための略同一表面形状であるミラ一、 1 4 a、 1 4 bは第一の偏光ビー厶スプリッタ 5から第二の偏光ビームスプリッ タ 8へ導くための略同一表面形状であるミラーである。 When the angle adjustment of the mirror 4 z immediately before the first polarization beam splitter 5 is performed, the laser beams 10 and 11 move in the same direction on the second galvano scan mirror 13. Therefore, as the order of the optical axis adjustment direction, first, after the optical axis adjustment of the laser beam 10 using the mirror 4 z acting on the two laser beams is completed, the optical axis adjustment of the laser beam 11 is performed. There is a need. Once the adjustment of the optical axis has been completed, the two lasers on the second galvano-scan mirror 1 2 can be obtained by adjusting the angle of the mirror 4 Z immediately before the first polarizing beam splitter 5. The optical axes of the laser beams 1 0 and 1 1 can be adjusted while maintaining the relative positional relationship of the light, and the optical axes for accurately guiding the two laser beams to the center of the second galvano scan mirror 1 2 Easy adjustment. Embodiment 3. FIG. 3 relates to the third embodiment of the present invention. By processing one laser beam into two laser beams and scanning the two laser beams independently, processing can be performed at two locations simultaneously. In a drilling laser processing device that can be used, it has an optical system that performs mask transfer, and in particular a mirror that is a set of optical components that have substantially the same surface shape to be placed after the mask. 1 4 b—the beam incident surface of one mirror is perpendicular to the beam incident surface of the other mirror, and the beam incident angle on one mirror is the same as the beam incident angle on the other mirror (for example, 45 °) (for example, a configuration where the laser beam incident from the X direction is reflected in the Z direction by the first mirror and then reflected in the Y direction by the other mirror) FIG. In FIG. 3, 4a and 4b are mirrors having substantially the same surface shape for guiding the laser beam 2 from the mask 3 to the first polarization beam splitter 5, and 14a and 14b are the first polarization. This is a mirror having substantially the same surface shape for guiding from the beam splitter 5 to the second polarizing beam splitter 8.

本実施の形態 3は、 実施の形態 1 と偏光ビームスプリッタに関しては 同一であるが、 ミラ一 4 . 1 4の配置もしくは表面形状が異なるので、 この発明の特徴である光学部品の配置について第 4図を用いて説明する。 第 4図において、 P r u ( a ) 、 P r v ( Of ) はビーム入射角 0;で入 射された入射ビームがミラーにより反射された反射ビームに係る u方向、 V方向の屈折力であり、 P t u ( a ) 、 P t v a ) はビーム入射角 of で入射された入射ビームがミラーを透過する透過ビームに係る u方向、 V方向の屈折力である。 ここで、 u方向は各ビームの進行方向に垂直で かつビーム入射面 (入射ビームと反射ビームにより形成される面) に平 行な方向であリ、 V方向は各ビームの進行方向に垂直でかつビーム入射 面に垂直な方向である。  The third embodiment is the same as the first embodiment with respect to the polarization beam splitter, but the arrangement or surface shape of the mirror 4. 14 is different. This will be described with reference to the drawings. In Fig. 4, P ru (a) and P rv (Of) are the refractive powers in the u and V directions related to the reflected beam that is incident on the beam incident angle 0; P tu (a) and P tva) are the refractive powers in the u direction and the V direction related to the transmitted beam in which the incident beam incident at the beam incident angle of passes through the mirror. Here, the u direction is perpendicular to the traveling direction of each beam and parallel to the beam incident surface (the surface formed by the incident beam and the reflected beam), and the V direction is perpendicular to the traveling direction of each beam. The direction is perpendicular to the beam entrance plane.

ここで、 屈折力 (P o w e r ) は光学部品の屈折させる性能を表すパ ラメ一夕の一つであり、 屈折面の状態を示し、 一般的に表面曲率半径 R に反比例、 屈折率 nに比例する。 第 4図において、 表面曲率半径 Rが同 心円状に均一であり、 かつ光学系に対し十分に大きく (光学部品の表面 形状を略平面であるとしたとき) 、 屈折率を nとすると、 屈折力 P r u ( ) 、 P r V ( ) は次式で与えられる。 Here, the refractive power (P ower) is a parameter that represents the refracting performance of the optical component. It is one of the lamellae and indicates the state of the refracting surface, and is generally inversely proportional to the surface curvature radius R and proportional to the refractive index n. In Fig. 4, the surface radius of curvature R is concentrically uniform and sufficiently large for the optical system (assuming the surface shape of the optical component is substantially flat), and the refractive index is n. The refractive powers P ru () and P r V () are given by the following equations.

Figure imgf000019_0001
一般的に光学部品は表面形状を平面として製作しても、 製作工程の中 'で僅かに歪みを持ち、 λΖ 1 0〜; Iノ 20程度が一般的な加工精度であ リ、 λΖ20よリ高精度で表面形状を仕上げるためには莫大な時間とコ ス卜を必要とする。 したがって、 一般的な光学部品は; 1 1 0〜; 1 2 0程度の表面曲率半径 Rを持つといえる。 例えば Z n S e ( n = 2. 4 1 ) に誘電体多層膜コーティングを施したビーム入射角 45° の偏光ビ 一ムスプリッタの場合、 (2) (3) 式より、 それぞれ次式が得られる。
Figure imgf000019_0002
Figure imgf000019_0001
In general, even if optical parts are manufactured with a flat surface shape, they are slightly distorted during the manufacturing process. ΛΖ10 ~; I No. 20 is the general processing accuracy, and λΖ20 To finish the surface shape with high accuracy, a huge amount of time and cost are required. Therefore, it can be said that a general optical component has a surface curvature radius R of about 1 1 0 to 1 20. For example, in the case of a polarization beam splitter with a beam incident angle of 45 ° with a dielectric multilayer coating applied to ZnSe (n = 2.4 1), the following equations are obtained from equations (2) and (3), respectively: It is done.
Figure imgf000019_0002

(45。) = 1.4 X (5) '  (45.) = 1.4 X (5) '

(4) (5) 式より明らかなように、 ビーム入射角 45° では、 反射 時に u方向のほうが V方向の屈折力よりも大きくなる。 この u方向と V 方向の屈折力の差が加工点にまで伝播すると、 非点収差となるので、 安 定した加工品質を得ることが困難となる可能性がある。 これに対しこの発明では、 光学系を構築するにあたり複数枚の光学部 品のうち略同一表面形状である 1組の光学部品を、 一方の光学部品のピ ーム入射面が他方の光学部品のビーム入射面に対し垂直で、 かつ一方の 光学部品へのビーム入射角が他方の光学部品へのビーム入射角と同一と なるように配置する。 (4) As is clear from Eq. (5), at the beam incident angle of 45 °, the refractive power in the u direction is greater than the refractive power in the V direction during reflection. If the difference in refractive power between the u direction and the V direction propagates to the processing point, astigmatism occurs, so it may be difficult to obtain stable processing quality. In contrast, according to the present invention, when constructing an optical system, one set of optical components having substantially the same surface shape among a plurality of optical components is used, and the beam incident surface of one optical component is that of the other optical component. It is arranged so that it is perpendicular to the beam incident surface and the beam incident angle to one optical component is the same as the beam incident angle to the other optical component.

ここで、 ミラ一 1 4 a、 1 4 bを用いて構成を説明する。 第 5図にお いて、 ミラ一 1 4 aは X方向から入射したレーザ光を Z方向に反射し、 ミラー 1 4 bはミラー 1 4 aに反射されたレーザ光を Y方向に反射する ように配置されている。 また、 ミラー 1 4 aのミラ一表面曲率半径を R aとし、 ミラ一 1 4 bのミラー表面曲率半径を R bとする。 ミラー 1 4 aの u方向の屈折力を P a r u (45° ) 、 v方向の屈折力を P a r v (45° ) とし、 ミラー 1 4 bの u方向の屈折力を P b r u (45° ) 、 v方向の屈折力を P b r v (45° ) とすると、 ミラー 1 4 bによって 反射されたレーザ光のミラー 1 4 aおよびミラー 1 4 bの合成された u 方向の屈折力 P r u、 V方向の屈折力 P r Vは以下のとおりとなる。  Here, the configuration will be described using mirrors 1 14 a and 14 b. In Fig. 5, mirror 14a reflects laser light incident from the X direction in the Z direction, and mirror 14b reflects laser light reflected by the mirror 14a in the Y direction. Has been placed. In addition, the mirror surface radius of curvature of the mirror 14 a is R a, and the mirror surface radius of curvature of the mirror 14 b is R b. The power in the u direction of mirror 14 a is P aru (45 °), the power in the v direction is P arv (45 °), and the power in the u direction of mirror 14 b is P bru (45 °), Assuming that the refractive power in the v direction is P brv (45 °), the combined refractive power P ru of the laser beam reflected by the mirror 14 b and the mirror 14 b of the laser beam 14 b and the mirror 14 b b in the V direction The refractive power P r V is as follows.

Pm = Ρα, (45°) + Pbnt (45°) = 1.4 x ^ + 2.8 x (6) P m = Ρ α , (45 °) + P bnt (45 °) = 1.4 x ^ + 2.8 x (6)

P. = Ραηι (45°) + Pbn, (45°) = 2,8 x ^ + 1.4 x - (7) P. = Ρ αηι (45 °) + P bn , (45 °) = 2,8 x ^ + 1.4 x-(7)

ここで、 ミラー 1 4 aとミラー 1 4 bは略同一表面形状であるので、 R a = R bとなり上記 P r uと P r vは略等しくなリ、 これにより u方 向と V方向の屈折力の差をキャンセルし、 結果として加工点での非点収 差を低減でき、 安定した加工品質を得ることができる。 ミラ _4 a、 ミ ラー 4 bについても同様な構成となっているので、 同様な効果が得られ る。 上記は = 4 5 ° で検討したが一般的な角度では以下のようになる。 - ^ (ひ) + (a) = 2coSひ Rn +—— cos Rb" (8) Here, since mirrors 14 a and 14 b have substantially the same surface shape, R a = R b and P ru and P rv are not substantially equal, so that the refractive power in the u and V directions As a result, the astigmatism difference at the machining point can be reduced and stable machining quality can be obtained. Since Mira_4a and Miller 4b have the same structure, the same effect can be obtained. The above was examined at = 45 °, but at a general angle, -^ (Hi) + (a) = 2co S hi R n + —— cos R b "( 8 )

Pn, = ( + ( =— cos ― Ra + 2cos a~ (9) P n , = (+ (= — cos ― R a + 2cos a ~ (9)

Rb R a = R bの場合、 (8 ) ( 9 ) 式より明らかなように、 卩 广 リ と r Vは略等しくなり、 これにより u方向と V方向の屈折力の差をキャン セルし、 = 4 5 ° の時と同様に、 加工点での非点収差を低減でき、 安 定した加工品質を得ることができる。 When R b R a = R b, 明 ら か 卩 ri and r V are approximately equal, as is clear from Eqs. (8) and (9), this cancels the difference in refractive power between u and V directions. As in the case of = 45 °, astigmatism at the machining point can be reduced, and stable machining quality can be obtained.

ところで、 光学部品を固定するホルダー部材が方向性を持つ構造とな つておリ、 このホルダーに支持されたミラーの表面曲率半径がその方向 性に沿って変化してしまい非点収差が発生する場合、 1組の前記ホルダ 一に支持されたミラ一を、 ホルダーの方向性を各入射面に対して同じ方 向に合わせるとともに、 一方の光学部品のビーム入射面が他方の光学部 品のビーム入射面に対し垂直で、 かつ一方の光学部品へのビーム入射角 が他方の光学部品へのビーム入射角と同一となるように配置する。  By the way, if the holder member that fixes the optical component has a directional structure, the surface curvature radius of the mirror supported by this holder changes along the directionality and astigmatism occurs. The mirrors supported by one set of the holders are aligned in the same direction with respect to each incident surface, and the beam incident surface of one optical component is incident on the beam of the other optical component. It is arranged so that it is perpendicular to the surface and the beam incident angle to one optical component is the same as the beam incident angle to the other optical component.

第 6図に一例を示す。 第 6図において第一の光学部品 3 7 aと第二の 光学部品 3 7 bは同一表面形状の光学部品、 第一めホルダー部材 3 8 a と第二のホルダ一部材 3 8 bは同一形状の光学部品固定部材である。 A、 Bはそれぞれホルダ一部材の持つ方向軸を示し、 このホルダーにミラ一 等の光学部品を取り付けると、 ミラー表面の曲率半径が、 A方向には R Aとなり、 B方向には R Bとなる。  Figure 6 shows an example. In FIG. 6, the first optical component 3 7a and the second optical component 3 7b are optical components having the same surface shape, and the first holder member 3 8a and the second holder one member 3 8b have the same shape. This is an optical component fixing member. A and B indicate the directional axes of each holder member. When an optical component such as a mirror is attached to this holder, the radius of curvature of the mirror surface is RA in the A direction and RB in the B direction.

第 6図のように、 第一の光学部品 3 7 aと第二の光学部品 3 7 bとを、 第一の光学部品 3 7 aのビーム入射面が第二の光学部品 3 7 bのビーム 入射面に対し垂直で、 かつ第一の光学部品 3 7 aへのビーム入射角が第 二の光学部品 3 7 bへのビーム入射角と同一 (例えば 4 5 ° ) となるよ うに配置し、 ホルダー部材の方向性を合わせるために A方向を入射面に 平行にした場合、 第二の光学部品 3 7 bの反射時の u方向、 V方向の屈 折力 P r u、 P r vは以下のようになる。 As shown in FIG. 6, the first optical component 3 7 a and the second optical component 3 7 b are connected to the first optical component 3 7 a. The beam incident surface of the first optical component 3 7 a is the beam of the second optical component 3 7 b. The beam incidence angle to the first optical component 37a is When the second optical component 3 7 b is placed so that it is the same as the beam incident angle (for example, 45 °), and the direction A is parallel to the incident surface to match the direction of the holder member, the second The bending forces P ru and P rv in the u and V directions when the optical component 3 7 b is reflected are as follows.

Ρηι = Ρ,α (45°) + ΡηΛ (45°) = 1.4 x ^ + 2.8 x - (10) - Ρη = (45°) + (45°) = 2.8 χ -^- + 1.4 χ ^- (11) Ρ ηι = Ρ, α (45 °) + Ρ ηΛ (45 °) = 1.4 x ^ + 2.8 x-(10)-Ρη = (45 °) + (45 °) = 2.8 χ-^-+ 1.4 χ ^ -(11)

( 1 0 ) ( 1 1 ) 式より明らかなように Ρ r uと Ρ r νは等しくなリ、 方向性を持ったホルダーによる 点収差をキャンセルすることができる。 これによ y、 加工点における非点収差を低減することができ、 安定した 加工品質を得ることができる。 入射角が 4 5 ° 以外のときも非点収差を キャンセルできることは上述したように明らかである。 As is clear from (1 0) and (1 1), Ρ ru and Ρ r ν are equal, and the point aberration due to the directional holder can be canceled. As a result, astigmatism at the machining point can be reduced, and stable machining quality can be obtained. As described above, it is clear that astigmatism can be canceled even when the incident angle is other than 45 °.

また、 方向性を持った安価なホルダー部材を使用することができ、 加 ェ装置のコス卜低減になるという効果がある。  In addition, an inexpensive holder member having directionality can be used, and the cost of the processing apparatus is reduced.

なお、 本実施の形態ではマスク転写を行う光学系において、 マスク後 に配置される複数枚の光学部品について説明を行った。 これは、 マスク 転写においては、 主にマスク後の光学部品の収差が加工点でのビーム品 質に影響を与えるという理由からである。 更に、 マスク前の複数枚の光 学部品についても同様の考え方で配置を行うとより効果が得ら ること は言うまでもない。  In the present embodiment, in the optical system for performing mask transfer, a plurality of optical components arranged after masking have been described. This is because, in mask transfer, aberrations of the optical components after the mask affect the beam quality at the processing point. Furthermore, it goes without saying that more effective results can be obtained by arranging a plurality of optical parts before the mask in the same way.

また、 マスク転写を行う光学系だけでなくても、 同様の考え方で光学 部品の配置を行うことにより光学的な収差を低減する効果がある。 実施の形態 4 . 2 第フ図は、 この発明の実施の形態 4に係り、 第一の偏光分離手段とし て表面が凸形状、 裏面が凹形状である偏光ビ一ムスプリッタと、 第二の 偏光分離手段として、 表面が凹形状、 裏面が凸形状である偏光ビームス プリッタを用い、 1つのレーザ光を 2つのレーザ光に分光し、 2つのレ 一ザ光を独立に走査することにより、 2箇所同時に加工を実施すること ができる穴あけ用レーザ加工装置を示す構成図である。 In addition to the optical system that performs mask transfer, the optical aberration can be reduced by arranging optical components in the same way. Embodiment 4. 2 FIG. 5 relates to Embodiment 4 of the present invention. As a first polarization separation means, a polarization beam splitter having a convex shape on the front surface and a concave shape on the back surface, and as a second polarization separation means, Using a polarized beam splitter with a concave surface and a convex back surface, one laser beam is split into two laser beams, and the two laser beams are scanned independently, thereby simultaneously processing two locations. FIG. 3 is a configuration diagram showing a laser processing apparatus for drilling that can be performed.

第 7図において、 2 2は表面が凸形状、 裏面が凹形状である偏光ビー ムスプリッタ (第 8図 (a ) 参照) 、 2 3は表面が^形状、 裏面が凸形 状である偏光ゼ一ムスプリッタ (第 8図 ( b ) 参照) である。 ここで、 それぞれの表面形状は製作機械である研磨機の形状等によって決められ るので、 制作方法を制御することによって、 所望の加工精度の平面度で 凹形状か凸形状のどちらかを選択し、 製作することができる。  In Fig. 7, 2 2 is a polarizing beam splitter with a convex shape on the front side and a concave shape on the back side (see Fig. 8 (a)). 1 splitter (see Fig. 8 (b)). Here, each surface shape is determined by the shape of the polishing machine that is the production machine, so by controlling the production method, either the concave shape or the convex shape can be selected with the flatness of the desired processing accuracy. Can be produced.

本実施の形態 4は、 実施の形態 1 と偏光ビームスプリッタの表面形状 の構成が異なっており、 この発明の特徴である偏光ビームスプリッタの 形状について説明する。  The fourth embodiment is different from the first embodiment in the configuration of the surface shape of the polarizing beam splitter, and the shape of the polarizing beam splitter, which is a feature of the present invention, will be described.

第 4図において、 P t u ( ) 、 P t V ( Of ) はビーム入射角 で入 射された入射ビームが光学部品を透過する透過ビームに係る u方向、 V 方向の屈折力であり、 表面曲率半径 Rが同心円状に均一であり、 かつ光 学系に対し十分に大きく (光学部品の表面形状を略平面であるとしたと き) 、 屈折率を nとすると、 屈折力 P t u ( a ) . P t V ( Of ) は次式 で与えられる。  In Fig. 4, P tu () and P t V (Of) are the refractive powers in the u and V directions of the transmitted beam through which the incident beam incident at the beam incident angle passes through the optical component. If the radius R is concentrically uniform and sufficiently large for the optical system (assuming that the surface shape of the optical component is a substantially flat surface), and the refractive index is n, the refractive power P tu (a) P t V (Of) is given by

Figure imgf000023_0001
例えば Z n S e ( n = 2. 4 1 ) に誘電体多層膜コーティングを施し たビーム入射角 4 5° の偏光ビームスプリッタの場合、 ( 1 2) ( 1 3 ) 式より、 それぞれ次式が得られる。
Figure imgf000023_0001
For example, in the case of a polarizing beam splitter with a beam incident angle of 45 ° with a dielectric multilayer coating on ZnSe (n = 2.4 1), the following equations are obtained from (1 2) and (1 3), respectively. can get.

^,(45°) = 3.2x- (14) ^v(450) = 1.6x^ (15) ^, (45 °) = 3.2x- (14) ^ v (45 0 ) = 1.6x ^ (15)

( 4) ( 5 ) ( 1 4) ( 1 5) 式より明らかなように、 ビーム入射角 4 5° では、 反射時だけではなく透過時も u方向のほうが V方向の屈折 力よりも大きくなる。 この u方向と V方向の屈折力の差が加工点にまで 伝播すると、 非点収差となるので、 安定した加工品質を得ることが困難 となる可能性がある。 (4) (5) (1 4) (1 5) As is clear from the equation, at the beam incident angle of 45 °, the refractive power in the u direction is larger than the refractive power in the V direction not only during reflection but also during transmission. . If this difference in refractive power between the u direction and the V direction propagates to the processing point, astigmatism occurs, and it may be difficult to obtain stable processing quality.

ここで、 偏光ビームスプリ'ッタの透過時の屈折力に着目する。 透過時 の屈折力は偏光ビームスプリッタ表面での屈折力に加え、 裏面での屈折 力が加算される。 すなわち、 ( 1 4) 、 ( 1 5 ) 式より透過時の u方向、 方向の屈折力 P t u a ( 4 5° ) 、 P t v a (4 5° ) は、 表面、 裏 面をそれぞれ 1 、 2の添字で示すと以下のようになる。  Here, attention is paid to the refractive power during transmission of the polarizing beam splitter. In addition to the refractive power at the surface of the polarizing beam splitter, the refractive power at the back is added. In other words, the refractive powers P tua (45 °) and P tva (45 °) in the u direction and direction during transmission are expressed as 1 and 2 on the front and back sides, respectively, from the equations (14) and (15). The following is shown as a subscript.

1 1 1 1

^(45°) = ia1+^H2=3.2x — +— (16) (45°) (17)^ (45 °) = ia1 + ^ H2 = 3.2x — + — (16) (45 °) (17)

Figure imgf000024_0001
したがって、 第 8図 (a) に示すように表面が凸形状 (R 1 > 0) 、 裏面が凹形状 (R 2 < 0) であると、 表面と裏面の屈折力が打ち消すた め、 透過時の屈折力は小さくなる。 結果として、 u方向と V方向の屈折 力の差が小さくなるので、 非点収差を低減する効果がある。
Figure imgf000024_0001
Therefore, as shown in Fig. 8 (a), if the surface has a convex shape (R 1> 0) and the back surface has a concave shape (R 2 <0), the refractive power of the front and back surfaces will cancel out. The refractive power of becomes small. As a result, refraction in u and V directions Since the difference in force is small, there is an effect of reducing astigmatism.

また、 第 8図 ( b ) に示すような表面が凹形状 (R 1 く 0 ) 、 裏面が 凸形状 (R 2 > 0 ) であるときも同様に表面と裏面の屈折力が打ち消す ため、 透過時の屈折力は小さくなリ、 結果として、 u方向と V方向の屈 折力の差が小さくなるので、 非点収差を低減する効果がある。  Also, when the front surface is concave (R 1 0) and the back surface is convex (R 2> 0) as shown in Fig. 8 (b), the refractive power of the front and back surfaces cancels out. The refractive power at the time is small, and as a result, the difference between the bending forces in the u direction and the V direction is small, which has the effect of reducing astigmatism.

この発明における偏光ビームスプリッタの表面形状は、 表面と裏面と の曲率半径の絶対値を同等にする必要があるので、 加工精度を通常よリ も良くすることが望ましく、 i Z 2 0以下が望ましい。  Since the surface shape of the polarizing beam splitter in this invention needs to have the same absolute value of the radius of curvature of the front surface and the back surface, it is desirable to improve the processing accuracy as usual, and i Z 20 or less is desirable. .

次に光学系全体における第一の偏光ビームスプリッタ、 並びに第二の 偏光ビームスプリッタの最適形状について説明する。  Next, the optimum shape of the first polarizing beam splitter and the second polarizing beam splitter in the entire optical system will be described.

先までの屈折力の議論と同様、 光学系全体においても個々の光学部品 の屈折力が加算され、 結果として収差が大きいか小さいかが決定される。 そこで、 第 7図の光学系において使用している第一の偏光ビームスプリ ッタ 2 2から第二の偏光ビームスプリッタ 2 3の間の光学部品について、 第一の偏光ビームスプリッタを透過するレーザ光 6の光路 Aと反射する レーザ光 7の光路 Bとに分けて説明する。  As in the previous discussion of refractive power, the refractive power of individual optical components is also added to the entire optical system, and as a result, it is determined whether the aberration is large or small. Therefore, for the optical component between the first polarizing beam splitter 22 and the second polarizing beam splitter 23 used in the optical system of FIG. The explanation is divided into the optical path A of 6 and the optical path B of the reflected laser beam 7.

光路 Aでは、 第一の偏光ビームスプリッタ 2 2を透過したレーザ光 6 がミラー 1 4 aと 1 4 bにより第二の偏光ビ一ムスプリッタ 2 3に導か れる。 ミラー 1 4 aと 1 4 bは、 比較的製作が容易であるため、 仕上げ られる平面度の精度は; 1 / 1 0〜; I Z 2 0程度のものが得られる。 ただ し、 以下に示すようにガルバノスキャンミラ一の平面度が比較的悪くな る傾向があるので、 スノ 1 5〜; I 2 0程度の精度で仕上げることが望 ましい。  In the optical path A, the laser beam 6 transmitted through the first polarization beam splitter 22 is guided to the second polarization beam splitter 23 by the mirrors 14 a and 14 b. Since the mirrors 14a and 14b are relatively easy to manufacture, the accuracy of the flatness to be finished can be as high as 1/10 ~; IZ20. However, as shown below, the flatness of the galvanoscan mirror tends to be relatively poor, so it is desirable to finish it with a precision of about 15-15; I20.

これに対し、 光路 Bでは、 第一の偏光ビームスプリッタ 2 2を反射し たレーザ光 7が第一のガルバノスキャンミラー 1 3 aと 1 3 bにより位 置決めされ、 第二の偏光ビ一ムスプリッタ 2 3に導かれる。 第一のガル バノスキャンミラー 1 3 aと 1 3 bは、 高速に動かすために非常に軽い 必要があり、 また、 ( 1 ) 式で説明したように加工品質を劣化させない ようにするためには面積を大きくする必要があるため、 薄くて広い形状 となり製作が非常に困難であり、 仕上げられる平面度は上記ミラーと比 較して悪いものになる傾向が強く、 λ Ζ, 1 0〜Λ Ζ 1 5程度である。 ま た、 表面形状としては、 より強く製作機械に依存してしまい、 例えば強 い凹形状となる。 On the other hand, in the optical path B, the laser beam 7 reflected from the first polarization beam splitter 22 is positioned by the first galvano scan mirrors 13 a and 13 b, and the second polarization beam Guided to splitter 2 3. First gal Banoscan mirrors 1 3 a and 1 3 b need to be very light to move at high speed, and the area is large to prevent degradation of machining quality as explained in equation (1). Therefore, it is very difficult to manufacture because it has a thin and wide shape, and the flatness to be finished tends to be poor compared to the above mirrors, about λ Ζ, 1 0 to Λ Ζ 15 It is. In addition, the surface shape is more strongly dependent on the production machine, for example, a strong concave shape.

光路 Αと光路 Βで個々の平面度が異なると加算される屈折力に差が発 生する可能性がある。 この屈折力の差は、 光路 Aと光路 Bによる焦点差 となる可能性がある。  If the flatness differs between the optical path Α and the optical path Β, there may be a difference in the added refractive power. This difference in refractive power may be a focal difference between optical path A and optical path B.

この発明では、 第一のガルバノスキャンミラー 1 3 aと 1 3 bの表面 形状が強い凹形状の場合、 第一の偏光ビームスプリッタ 2 2の表面形状 を凸形状、 裏面形状を凹形状とし、 第二の偏光ビームスプリッタ 2 3の 表面形状を凹形状、 裏面形状を凸形状としている。  In this invention, when the surface shape of the first galvano scan mirrors 1 3 a and 1 3 b is a strong concave shape, the surface shape of the first polarizing beam splitter 2 2 is a convex shape, and the back surface shape is a concave shape. The surface of the second polarizing beam splitter 2 3 is concave, and the back is convex.

このような構成にすることで、 光路 Aでは、 第一の偏光ビームスプリ ッタ 2 2の透過時にはほとんど屈折力を発生することがなく、 ミラー 1 4 a、 1 4 bでは表面形状の僅かな凹形状から僅かに収束方向の屈折力 を持ち、 第二の偏光ビームスプリッタ 2 3に導かれ、 第二の偏光ビーム スプリッタ 2 3の反射時に表面形状の僅かな凹形状から僅かに収束方向 の屈折力が加算される。 結果として僅かに収束方向の屈折力を持つレー ザ光となる。  With this configuration, almost no refractive power is generated in the optical path A during transmission through the first polarization beam splitter 22, and the mirrors 14 a and 14 b have a slight surface shape. It has a refractive power slightly in the convergence direction from the concave shape, and is guided to the second polarization beam splitter 2 3, and when reflected by the second polarization beam splitter 2 3, it is refracted in the convergence direction from the slight concave shape of the surface shape. The power is added. As a result, the laser light has a refractive power slightly in the convergence direction.

これに対し、 光路 Bでは、 第一の偏光ビームスプリッタ 2 2の反射時 に表面の凸形状から僅かに発散方向の屈折力を持って、 第一のガルバノ スキャンミラ一 1 3 a、 1 3 bに導かれる。 第一のガルバノスキャンミ ラ一 1 3 a、 1 3 bは強い凹形状であるため、 強い収束方向の屈折力が 加算され、 結果として僅かに収束方向の屈折力を持つレーザ光 7が第二 の偏光ビームスプリッタ 2 3をほぼ同じ屈折力のまま透過する。 On the other hand, in the optical path B, the first galvanometer scan mirror 1 3 a, 1 3 b has a refractive power slightly in the direction of divergence from the convex shape of the surface when reflected by the first polarizing beam splitter 22. Led to. Since the first galvanoscan mirrors 1 3 a and 1 3 b have a strong concave shape, the strong power in the converging direction is added. Are transmitted through the polarizing beam splitters 2 and 3 with substantially the same refractive power.

上記では、 ミラー 1 4 a、 1 4 bの表面形状を僅かな凹形状としたが、 僅かな凸形状の場合でも、 第一のガルバノスキャンミラー 1 3 aと 1 3 bの表面形状を強い凹形状のときに、 第一の偏光ビームスプリッタ 2 2 の表面形状を凸形状、 裏面形状を凹形状とし、 第二の偏光ビームスプリ ッタ 2 3の表面形状を凹形状、 裏面形状を凸形状とすることで、 光路 A と光路 Bの屈折力の差を低減することができる。 しかし、 ミラー 1 4 a、 1 4 bの表面形状を僅かな凹形状とした方が低減する効果が高いので、 凹形状が望ましい。  In the above, the surface shapes of the mirrors 14 a and 14 b are slightly concave, but even in the case of a slight convex shape, the surface shapes of the first galvano scan mirrors 13 a and 13 b are strongly concave. The first polarization beam splitter 2 2 has a convex shape, the back surface shape has a concave shape, the second polarization beam splitter 2 3 has a concave shape, and the back surface shape has a convex shape. By doing so, the difference in refractive power between optical path A and optical path B can be reduced. However, the concave shape is desirable because the surface shape of the mirrors 14 a and 14 b is reduced slightly when the surface shape is slightly concave.

以上のように、 この発明によれば、 個々の光学部品が持つ収差成分を 光学系の中でキャンセルし、 結果として、 非点収差や焦点差などの光学 的な収差の少ない光学系を得るという効果がある。  As described above, according to the present invention, the aberration component of each optical component is canceled in the optical system, and as a result, an optical system with less optical aberrations such as astigmatism and focal difference is obtained. effective.

また、 本実施の形態では、 第一の偏光分離手段として表面が凸形状、 裏面が凹形状である偏光ビームスプリッタと、 第二の偏光分離手段とし て、 表面が凹形状、 裏面が凸形状である偏光ビームスプリッタとしたが、 第一のガルバノスキャンミラー 1 3 a、 1 3 bが強い凸形状の場合は、 第一の偏光分離手段として表面が凹形状、 裏面が凸形状である偏光ビー ムスプリッタと、 第二の偏光分離手段として、 表面が凸形状、 裏面が凹 形状である偏光ビームスプリッタとした上記と逆の配置とすれば、 個々 の光学部品が持つ収差成分を光学系の中でキャンセルすることができる。 上記説明からも明らかなように、 光学系、 或いは光学系に使用する光 学部品によっては、 形状、 並びに平面度の最適値が異なることは言うま でもない。  Further, in the present embodiment, the first polarization separation means is a polarization beam splitter having a convex surface and the back surface is concave, and the second polarization separation means is a concave surface and the back surface is convex. If the first galvano scan mirrors 1 3 a and 1 3 b have a strong convex shape, the polarizing beam splitter has a concave shape on the front surface and a convex shape on the back surface. If the splitter and the polarization polarization splitter with the convex surface on the front side and concave shape on the back surface are used as the second polarization separation means, the aberration components of the individual optical components are contained in the optical system. Can be canceled. As is clear from the above description, it goes without saying that the optimum values of the shape and flatness differ depending on the optical system or optical parts used in the optical system.

また、 本実施の形態では、 第一、 第二の偏光分離手段の形状に着目し たが、 上記説明からも明らかなように他の光学部品においても同様の考 え方によリ最適値があることは言うまでもない。 また、 実施の形態を 1 、 2、 3と分けて説明したが、 これらを組み合わ せることが可能であることは言うまでもない。 産業上の利用可能性 In the present embodiment, attention has been paid to the shapes of the first and second polarization separation means. However, as is clear from the above description, the optimum value can be obtained by the same way of thinking in other optical components. Needless to say. Further, although the embodiments have been described separately as 1, 2, and 3, it goes without saying that these can be combined. Industrial applicability

この発明に係るレーザ加工装置は、 1つのレーザ光を 2つ以上のレー ザ光に分光し、 同時に 2箇所以上のレーザ加工を行う場合において、 製 作上の困難さやコス卜を低減する一方で加工品質を向上するのに適して いる。  The laser processing apparatus according to the present invention splits one laser beam into two or more laser beams, and simultaneously reduces the manufacturing difficulty and cost in the case of performing laser processing at two or more locations. Suitable for improving processing quality.

Claims

請 求 の 範 囲 The scope of the claims 1 . レーザ発振器よリ出射されたレーザ光を被加工物まで導く複数の 光学部品からなる光学系を有し、 Ίつのレーザ光を第一の偏光分離手段 1. It has an optical system composed of a plurality of optical components that guides the laser beam emitted from the laser oscillator to the workpiece. 5 で 2つのレーザ光に分光し、 一方はミラーを経由し、 他方は第一のガル バノスキャンミラーで 2軸方向に走査し、 2つのレーザ光を第二の偏光' 分離手段へ導いた後、 第二のガルバノスキャンミラーで走査し、 被加工 物を加工するレーザ加工装置において、 5 splits the light into two laser beams, one passes through the mirror, the other scans in the biaxial direction with the first galvano scan mirror, and the two laser beams are guided to the second polarization 'separation means. Later, in a laser processing device that scans with a second galvano scan mirror and processes the workpiece, 前記第一および第二の偏光分離手段をレーザ光の光軸に対して 4 5 ° The first and second polarization separation means are 45 ° to the optical axis of the laser beam. 10 に配置したことを特徴とするレーザ加工装置。 10 is a laser processing apparatus. 2 . 前記第一および第二の偏光分離手段は、 表面に誘電体多層膜コーテ ィングが形成された偏光ビームスプリッタであることを特徴とする請求 の範囲 1に記載のレーザ加工装置。 2. The laser processing apparatus according to claim 1, wherein the first and second polarization separation means are polarization beam splitters each having a dielectric multilayer coating formed on a surface thereof. 15  15 3 . 前記第一および第二の偏光分離手段は、 片方の面が凹形状、 その 裏面が凸形状であるこどを特徴とする請求の範囲 1に記載のレーザ加工 装置。  3. The laser processing apparatus according to claim 1, wherein the first and second polarization separation means have a concave shape on one side and a convex shape on the back side. 20 4 . 前記第一の偏光分離手段は、 レーザ光を反射する側の面を凸形状、 その裏面を凹形状とし、 20 4. The first polarized light separating means has a convex surface on the side that reflects the laser light, and a concave surface on the back surface. 該第一の偏光分離手段において反射されたレーザ光を表面形状が凹形 ' 状の前記第一のガルバノスキャンミラーに導き、  The laser beam reflected by the first polarization separation means is guided to the first galvano scan mirror whose surface shape is a concave shape, 前記第二の偏光分離手段は、 レーザ光を反射する側の面を凹形状、 そ 25 の裏面を凸形状としたことを特徴とする請求の範囲 3に記載のレーザ加 ェ装置。 4. The laser processing apparatus according to claim 3, wherein the second polarized light separating means has a concave surface on the side that reflects the laser light and a convex surface on the back surface thereof. 5 . 前記第一の偏光分離手段は、 レーザ光を反射する側の面を凹形状、 その裏面を凸形状とし、 5. The first polarized light separating means has a concave surface on the side that reflects the laser light and a convex surface on the back surface. 該第一の偏光分離手段において反射されたレーザ光を表面形状が凸形 状の前記第一のガルバノスキャンミラーに導き、  The laser beam reflected by the first polarization separation means is guided to the first galvano scan mirror having a convex surface shape, 前記第二の偏光分離手段は、 レーザ光を反射する側の面を凸形状、 そ の裏面を凹形状としたことを特徴とする請求の範囲 3に記載のレーザ加 ェ装置。  4. The laser processing apparatus according to claim 3, wherein the second polarized light separating means has a convex shape on the surface that reflects the laser light and a concave shape on the back surface. 6 . 前記第一および第二の偏光分離手段の表面の凹または凸形状は、 前記レーザ光の波長を λとした場合、 λ 2 0以下の精度で形成されて いることを特徴とする請求の範囲 3から 5のいずれかに記載のレーザ加 ェ装置。 6. The concave or convex shapes of the surfaces of the first and second polarization separation means are formed with an accuracy of λ 20 or less when the wavelength of the laser beam is λ. The laser processing apparatus according to any one of ranges 3 to 5. 7 . 前記光学系において、 略同一表面形状である 1組の光学部品を、 一方の光学部品のビーム入射面が他方の光学部品のビーム入射面に対し 垂直で、 かつ一方の光学部品へのビーム入射角が他方の光学部品へのビ —ム入射角と同一となるように配置することを特徴とする請求の範囲 1 から 6のいずれかに記載のレーザ加工装置。 7. In the optical system, a set of optical components having substantially the same surface shape is formed by using a beam incident surface of one optical component perpendicular to the beam incident surface of the other optical component and a beam to one optical component. 7. The laser processing apparatus according to claim 1, wherein the laser processing apparatus is arranged so that the incident angle is the same as the beam incident angle to the other optical component. 8 . 前記レーザ発振器から出射されたレーザ光が前記第 1の偏光分離 手段に至るまでのレーザ光路中にマスクを設け、 8. A mask is provided in the laser beam path from the laser beam emitted from the laser oscillator to the first polarized light separating means, このマスクと前記被加工物との間に前記 1組の光学部品を配置したこ とを特徴とする請求の範囲 7に記載のレーザ加工装置。  8. The laser processing apparatus according to claim 7, wherein the one set of optical components is disposed between the mask and the workpiece. 9 . 前記 1組の光学部品を個々に固定するホルダーを有し、 前記ホルダーに方向性がある場合、 この方向をそれぞれの光学部品の 入射面に対して同じ方向に配置したことを特徴とする請求の範囲 7に記 載のレーザ加工装置。 9. Having a holder for individually fixing the set of optical components, 8. The laser processing apparatus according to claim 7, wherein when the holder has directionality, the direction is arranged in the same direction with respect to an incident surface of each optical component. 1 0 . 前記 1組の光学部品の表面形状は、 前記レーザ光の波長を と した場合、 λ / Λ 0〜 I Z 2 0の精度で形成されていることを特徴とす る請求の範囲 6から 8のいずれかに記載のレーザ加工装置。 10. The surface shape of the one set of optical components is formed with an accuracy of λ / Λ 0 to IZ 20 when the wavelength of the laser light is taken. 9. The laser processing apparatus according to any one of 8. 1 1 . 前記第一および第二の偏光分離手段は、 レーザ光の進行方向に 垂直で、 かつ互いに直交する 2軸方向に角度調整可能な機構を備えたも のであることを特徴とする請求の範囲 1に記載のレーザ加工装置。 11. The first and second polarization separation means are provided with a mechanism capable of adjusting an angle in two axial directions perpendicular to a traveling direction of laser light and orthogonal to each other. The laser processing apparatus according to range 1. 1 2 . 前記第二の偏光分離手段からエネルギーロスとして漏れるレー ザ光を吸収するためにダンバ一を備えたことを特徴とする請求の範囲 1 に記載のレーザ加工装置。 1. The laser processing apparatus according to claim 1, further comprising a damper for absorbing laser light leaking as energy loss from the second polarization separation means.
PCT/JP2004/007893 2004-06-01 2004-06-01 Laser beam apparatus Ceased WO2005118207A1 (en)

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