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WO2004087974A1 - Machinable copper alloy - Google Patents

Machinable copper alloy Download PDF

Info

Publication number
WO2004087974A1
WO2004087974A1 PCT/FI2004/000197 FI2004000197W WO2004087974A1 WO 2004087974 A1 WO2004087974 A1 WO 2004087974A1 FI 2004000197 W FI2004000197 W FI 2004000197W WO 2004087974 A1 WO2004087974 A1 WO 2004087974A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy
oxygen
ppm
copper alloy
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/FI2004/000197
Other languages
English (en)
French (fr)
Inventor
Kalle Härkki
Tuomas Renfors
Timo VÄLIMÄKI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Outokumpu Oyj
Original Assignee
Outokumpu Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Outokumpu Oyj filed Critical Outokumpu Oyj
Publication of WO2004087974A1 publication Critical patent/WO2004087974A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Definitions

  • the invention relates to an oxygen-free copper alloy, in which there is alloyed material that improves machinability, particularly punchability.
  • the alloy is particularly suited to be used in targets where both a good electroconductivity and a good machinability are required.
  • ETP copper electrolytic tough pitch
  • the oxygen content of the most generally used copper quality is typically 200 - 400 ppm of the copper weight.
  • Oxygen is naturally bound in copper in a regular manufacturing process.
  • the oxygen content can also be kept on a desired level intentionally, because oxygen bounds harmful substances to less harmful oxides.
  • the oxide particles also increase brittleness, which improves for instance punchability.
  • the electroconductivity of copper is always the higher, the purer the copper is.
  • the thermal conductivity of copper is proportional to its electroconductivity.
  • oxygen-free copper with an oxygen content not higher than 10 ppm.
  • oxygen-free copper oxygen is prevented from getting into contact with molten copper by using a protective, reducing layer on top of the melt (for example graphite), by using protective gas (for example nitrogen) or by using a vacuum.
  • oxygen-free copper is high-tensile by nature, which in some cases results in machination problems, for example in punching.
  • the oxygen-free copper there is alloyed, as the only alloy ingredient, sulfur for 50 - 300 ppm of the alloy weight.
  • sulfur for 50 - 300 ppm of the alloy weight.
  • the alloy is suited to be used particularly in products where there is required both good electroconductivity or thermal conductivity and good machinability.
  • Such products are for instance various electroconductive components manufactured by punching.
  • the sulfur content of an oxygen-free copper according to the invention is 50 - 300 ppm, preferably 100 - 200 ppm.
  • the oxygen content of the alloy is not higher than 10 ppm, preferably not higher than 5 ppm, such as 1 - 3 ppm.
  • the machinability, and particularly the punchability, of oxygen-free copper is remarkably improved.
  • the machinability is of the same order as with ETP copper, the replacing of ETP copper by the copper according to the invention becomes possible.
  • oxygen-free copper In comparison with ETP copper, oxygen-free copper also has the advantage that there is no risk of hydrogen brittleness. Thus oxygen-free copper is better suited to be processed at high temperatures, for instance by soldering and welding.
  • the brittleness-increasing effect of sulfur is based on its occurrence as separate particles in the copper matrix.
  • Particle size has a remarkable significance, particularly in punchability behavior: the larger the particles, the better is the punchability.
  • Particle size can be affected by the cooling rate of the cast billet, and by separate thermal treatments carried out at a high temperature.
  • the alloy can be manufactured by similar manufacturing techniques as other qualities of oxygen-free copper, for example in slab or rod casting, either as horizontal or vertical casting.
  • a suitable step of the process for instance into the casting furnace, there is added a required amount of sulfur.
  • the alloy can be processed for instance into strip with a thickness of for example 0.2 - 12 mm.
  • Various products can be made of this kind of strip, for instance by punching.
  • Among said products are for example many electroconductive and heat conductive components.
  • air- conditioning holes such as in cooling fins
  • fastening holes can be made by punching.
  • This kind of strip can be manufactured particularly by using the slab casting and hot rolling route.
  • Another feasible manufacturing route is vertical casting - continuous hot extrusion.
  • oxygen-free copper alloys in which there were alloyed sulfur 50, 100, 150, 200, 250 and 300 ppm.
  • the materials were manufactured by rod casting in a vacuum furnace, they were hot extruded into the measure 39.9 * 7,2 mm and drawn to the measure 38.96*6,17 mm (red. 16 %).
  • the employed reference material was drawn flat bar, taken from production, with the measures 6 * 40 mm. Its degree of deformation was roughly the same as that of the test materials. In these materials, there were punched elongate holes (about 3*25 mm) with the same tool. In addition to punchability, the test materials were tested for electroconductivity and mechanical properties.
  • the share of the fractured zone of the whole cutting surface As the magnitude describing punchability, there can be used the share of the fractured zone of the whole cutting surface. With high-tensile materials, the share of the polished zone is relatively larger than with brittle materials. The final result is also remarkably affected by the die clearance, i.e. the distance between the die cushion and the cutting surfaces. The more tensile the material is, the smaller the clearance that must be used in order to reach the same final result. However, the smaller the cutting clearance is, the more intensive is the wearing of the tool. When increasing the cutting clearance, the share of the fracture of the whole cutting surface increases.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The invention relates to a machinable oxygen-free copper alloy containing oxygen not more than 10 ppm of the alloy weight. As the only alloy ingredient, the alloy contains sulfur for 50 - 300 ppm of the alloy weight. In this way, machinability is improved, while the electroconductivity still remains good.
PCT/FI2004/000197 2003-04-03 2004-04-01 Machinable copper alloy Ceased WO2004087974A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20030506A FI117289B (fi) 2003-04-03 2003-04-03 Työstettävä kupariseos
FI20030506 2003-04-03

Publications (1)

Publication Number Publication Date
WO2004087974A1 true WO2004087974A1 (en) 2004-10-14

Family

ID=8565918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI2004/000197 Ceased WO2004087974A1 (en) 2003-04-03 2004-04-01 Machinable copper alloy

Country Status (3)

Country Link
FI (1) FI117289B (fi)
TW (1) TW200422411A (fi)
WO (1) WO2004087974A1 (fi)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081001A (zh) * 2015-10-03 2015-11-25 淄博夸克医药技术有限公司 一种无氧铜棒的连续挤压生产工艺
WO2020122230A1 (ja) * 2018-12-13 2020-06-18 三菱マテリアル株式会社 純銅板、電子・電気機器用部材、放熱用部材

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253743A (ja) * 1986-04-24 1987-11-05 Daido Steel Co Ltd 快削無酸素銅
US4734254A (en) * 1986-12-15 1988-03-29 The Nippert Company Enhanced machining anneal resistant copper alloy
JPH062058A (ja) * 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62253743A (ja) * 1986-04-24 1987-11-05 Daido Steel Co Ltd 快削無酸素銅
US4734254A (en) * 1986-12-15 1988-03-29 The Nippert Company Enhanced machining anneal resistant copper alloy
JPH062058A (ja) * 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 139 27 April 1988 (1988-04-27) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 201 8 April 1994 (1994-04-08) *
PATENT ABSTRACTS OF JAPAN vol. 200, no. 023 10 February 2001 (2001-02-10) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105081001A (zh) * 2015-10-03 2015-11-25 淄博夸克医药技术有限公司 一种无氧铜棒的连续挤压生产工艺
WO2020122230A1 (ja) * 2018-12-13 2020-06-18 三菱マテリアル株式会社 純銅板、電子・電気機器用部材、放熱用部材
JP2020094241A (ja) * 2018-12-13 2020-06-18 三菱マテリアル株式会社 純銅材、電子・電気機器用部材、放熱用部材

Also Published As

Publication number Publication date
FI20030506L (fi) 2004-10-04
FI20030506A0 (fi) 2003-04-03
FI117289B (fi) 2006-08-31
TW200422411A (en) 2004-11-01

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