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WO2004064155A1 - Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master - Google Patents

Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master Download PDF

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Publication number
WO2004064155A1
WO2004064155A1 PCT/KR2003/002804 KR0302804W WO2004064155A1 WO 2004064155 A1 WO2004064155 A1 WO 2004064155A1 KR 0302804 W KR0302804 W KR 0302804W WO 2004064155 A1 WO2004064155 A1 WO 2004064155A1
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WO
WIPO (PCT)
Prior art keywords
electro
forming
metal
laminated
master
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2003/002804
Other languages
French (fr)
Inventor
Jeong-Sik Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRAPHION TECHNOLOGIES USA LLC
Original Assignee
GRAPHION TECHNOLOGIES USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GRAPHION TECHNOLOGIES USA LLC filed Critical GRAPHION TECHNOLOGIES USA LLC
Priority to AU2003289514A priority Critical patent/AU2003289514A1/en
Publication of WO2004064155A1 publication Critical patent/WO2004064155A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Definitions

  • the present invention relates to an electro-forming master, its manufacturing method, and a metal minute pattern made by the master, in which a metal pattern for a minute conducting circuit used in semiconductor and other electronic devices is made by an electro-forming process.
  • the metal minute pattern is used in various fields.
  • the metal minute pattern has conventionally been formed by an etching process.
  • the metal minute pattern can be formed by an electro-forming process, and a repeatable electro-forming master is used to form a minute pattern which is an electro-forming member.
  • the electro-forming master is digested in an electro-forming tub to obtain a metal minute pattern. The metal minute pattern is then detached from the electro-forming master to be produced as a product.
  • the electro-forming master is again digested in the electro-forming tub to repeatedly form a new minute pattern.
  • the minute pattern is obtained by repeating the above processes.
  • An insulating material is used as the electro-forming master of the present invention. More preferably, an insulating material having elasticity is used as the electro-forming master. Also, it is preferable that the insulating material having elasticity has hetero- characteristics . To this end, a hetero-layer may separately be formed in the electro-forming master. More preferably, the insulating material has hetero- characteristics . An example of the insulating material having elasticity and hetero-characteristics includes silicon. Owing to such an insulating material, the electro-forming master of the present invention can repeatedly be used.
  • a conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion.
  • the etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained.
  • the etching process has limitation in a processing pitch due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed.
  • a metal minute pattern is formed by an electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, since a pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for electro-forming master in the present invention, waste of material is avoided.
  • each product is repeatedly formed in an electro-forming tub by an electro-forming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
  • a disposable electro-forming master has been mainly used.
  • a hardened register formed on an electrode base has been conventionally used.
  • the hardened register generates stress with the electro-forming member.
  • the stress fails to easily detach the electro-forming member from the register. That is, when the electro-forming member is detached from the register, the electro-forming member affects the register and vice versa. This leads the electro-forming member or the register to be damaged. For this reason, the electro-forming process has been conventionally considered a temporary process.
  • the electro-forming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
  • the present invention is directed to an electro-forming master, its manufacturing method, and a metal minute pattern made by the master that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
  • An object of the present invention is to provide an electro-forming master, its manufacturing method, and a metal minute pattern made by the master in which a minute pattern of metal is repeatedly formed by an electro- forming process.
  • an electro-forming master includes a concave portion formed on an upper surface of an electrode base, a root portion formed by filling an insulating material in the concave portion, and a pin portion formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
  • the insulating portion protruded higher than the surface of the electrode base is defined as the pin portion.
  • the insulating material formed below the pin portion is defined as the root portion. The root portion serves to fasten the pin portion to the electrode base.
  • the electro-forming process is performed two or more times to protrude the insulating material at a certain height upward of the surface of the electrode base.
  • the pin portion serves to limit growth of electro-forming metal in a certain shape.
  • the pin portion serves as a factor that determines the thickness of the metal minute pattern as well as its shape. That is, the thickness of the metal minute pattern is limited at the height of the pin portion.
  • To form the minute pattern at a desired thickness it is necessary to increase the height of the pin portion in response to the thickness of the minute pattern.
  • the electro-forming process is performed in the electrode base several times to form layered electro-forming metals.
  • the photoresist or the insulating material is deposited in response to the height of the layered metals.
  • the present invention is characterized in that the height of the pin portion can be increased by a desired height.
  • the thickness of the minute pattern is limited by the limited height of the register.
  • the minute pattern can thickly be formed by adjusting the height of the pin portion.
  • the insulating portion of the present invention has elasticity.
  • the insulating portion having elasticity includes silicon as a main component. More preferably, the insulating material has elasticity and insulating and hetero-characteristics . An example of the insulating material includes silicon. Silicon has elasticity in addition to excellent insulating and -hetero characteristics .
  • FIG. 1 illustrates a metal minute pattern
  • FIG. 2 illustrates a method for forming a root portion of an electro-forming master according to one embodiment of the present invention
  • FIG. 3 illustrates the state that electro-forming is implemented by digesting an incipient electro-forming master in an electro-forming tub
  • FIG. 4 illustrates the processes of forming a laminated exposing layer, and forming layered metal through an electro-forming process
  • FIG. 5 illustrates the processes of forming a laminated exposing layer, and forming a third metal layer through an electro-forming process
  • FIG. 6 illustrates a pin portion having a desired height
  • FIG. 7 illustrates a method for forming a root portion of an electro-forming master according to other embodiment of the present invention
  • FIG. 8 illustrates the state that electro-forming is implemented by digesting an incipient electro-forming master in an electro-forming tub
  • FIG. 9 illustrates the processes of forming a laminated insulating layer, and forming a layered metal through an electro-forming process
  • FIG. 10 illustrates a pin portion having a desired height by a laminated insulating layer
  • FIGs. 11a and lib illustrate a method for manufacturing an electro-forming master according to another embodiment of the present invention.
  • An electro-forming master of the present invention includes an electrode base having an insulating portion that can repeatedly be used.
  • the insulating portion protruded higher than the surface of the electrode base is defined as a pin portion.
  • a concave portion may be formed below the pin portion.
  • the insulating material filled in the concave portion is defined as a root portion in the present invention. The root portion serves to fasten the
  • the electrode base of the electro-forming master includes a conducting portion and an insulating portion on its surface.
  • the conducting portion has the same shape as that of a metal minute pattern. Metal ion of the conducting portion is grown in an electro-forming tub.
  • the insulating portion is not electrically connected.
  • an insulating material having hetero-characteristics is used as the insulating portion considering detachment of an electro-forming member. More preferably, the insulating portion has elasticity.
  • the insulating portion having elasticity effectively removes stress generated between the electro- forming member and the insulating portion.
  • the insulating portion having elasticity serves to facilitate detachment of the electro-forming member due to its elasticity.
  • FIGs. 1 to 6 illustrate the processes of manufacturing an electro-forming master according to one embodiment of the present invention.
  • FIG. 1 illustrates a metal minute pattern.
  • a pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits.
  • a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as metal minute patterns.
  • the electrode base having a pattern is formed using a film.
  • the electrode base having a pattern is used to form an electro-forming master that can repeatedly be used.
  • the electro-forming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
  • FIG. 2 illustrates a method for forming a root portion of an electro-forming master according to the present invention.
  • a photoresist 2 is deposited on an electrode base basic material 1, and a film having a specific pattern is exposed to form an exposing portion 3.
  • the upper surface of the electrode base basic material 1 is etched at a certain depth to form a concave portion 4.
  • the electrode base basic material in which the concave portion 4 is formed is defined as the electrode base 5 of the plane electro-forming master.
  • the concave portion may be formed by a mechanical process or a laser process.
  • a filling material 6 is filled in the concave portion 4 of the electrode base. The filling material 6 is then arranged to be flush with the upper surface of the electrode base.
  • the photoresist is again deposited on the filling material and the upper surface of the electrode base to form an exposing portion 7 in the photoresist using the same film. An unexposed portion is washed to form a space portion.
  • the electrode base constructed as above is defined as an incipient master.
  • FIG. 3 illustrates the state that electro-forming is implemented by digesting the incipient master in an electro-forming tub.
  • FIG. 4 illustrates the processes of forming a laminated exposing layer, and forming layered metal through an electro-forming process.
  • a photoresist 9 is deposited on the incipient master in a state that the first metal layer 8 is grown at the height of the exposing portion.
  • a laminated exposing portion 10 is formed in the photoresist portion.
  • the photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion.
  • the electro-forming process is then implemented in the electrode base 5 so that a second metal layer 11 is grown in the space portion at the height of the exposing portion 10.
  • FIG. 5 illustrates the processes of forming a laminated exposing layer, and forming a third metal layer through an electro-forming process.
  • a photoresist 12 is again deposited on the electrode base where the laminated exposing portion 10 and the second metal layer 11 are formed.
  • a laminated exposing portion 13 is formed in the photoresist portion.
  • the photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion.
  • the electro-forming process is then implemented in the electrode base 5 so that a third metal layer 14 is grown in the space portion at the height of the exposing portion 13.
  • FIG. 6 illustrates a pin portion having a desired height.
  • the laminated exposing portion and metal layers are formed at a desired height
  • the laminated exposing portion layered on the electrode base and the filling material filled in the concave portion are removed to form a space portion 15.
  • An insulating material 16 is filled in the space portion 15 at the height of the metal layers.
  • the metal layers layered on the electrode base are removed.
  • the electro-forming master is manufactured in such a manner that the insulating material 16 is formed in the space portion of the electrode base 5 at a uniform height.
  • a root portion is formed in the concave portion.
  • a pin portion is formed on the top of the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
  • a shape of the pin portion serves as a factor that determines a shape of the metal minute pattern.
  • the photoresist generally used fails to form the thick exposing portion at once.
  • the pin portion can thickly be formed by the processes of the present invention. In this respect, the present invention will be a landmark.
  • FIG. 7 to FIG. 10 illustrate processes of manufacturing an electro-forming master according to another embodiment of the present invention.
  • FIG. 7 illustrates a method for forming a root portion of an electro-forming master according to another embodiment of the present invention.
  • a photoresist 18 is deposited on an electrode base basic material 17, and a film is exposed to form an exposing portion 19. After an unexposed portion 20 is removed by the washing process, the upper surface of the electrode base basic material 17 is etched at a certain depth to form a concave portion 21.
  • the electrode base basic material in which the concave portion 21 is formed is defined as the electrode base 22 of the electro-forming master.
  • the concave portion may be formed by a mechanical process or a laser process.
  • the concave portion 21 has various shapes.
  • FIG. 8 illustrates the state that electro-forming is implemented by digesting the incipient master in an electro-forming tub. Once an electro-forming process is started in an electro-forming tub by connecting a negative electrode (-) to the electrode base 22, ionized metal starts to be coupled with the electrode base 22. The ionized metal starts to be formed in the electrode base as a minute pattern 24 of a thin metal. Once the electro- forming process is implemented in the electro-forming tub, metal ion starts to be grown on the surface of the electrode base exposed in the insulating portion 23. With the lapse of time, a metal layer 24 is formed.
  • FIG. 9 illustrates the processes of forming a laminated insulating layer, and forming a layered metal through an electro-forming process.
  • the electro-forming process is implemented by digesting the incipient master in the electro-forming tub, so that a first metal layer 25 is grown in a conducting portion of the electrode base at a certain height.
  • a space portion is formed on the insulating portion 23 by the first metal layer.
  • An insulating material is filled in the space portion at the height of the first metal layer 25 to form a laminated insulating layer 27.
  • the original insulating portion 23 > serves as a root portion 28 while the laminated insulating portion 27 laminated on the root portion serves as a pin portion.
  • a second metal layer 29 is grown on the first metal layer at a certain height by digesting the laminated insulating layer in the electro-forming tub.
  • a space portion is again formed on the laminated insulating portion 27 as the second metal layer 29 is formed.
  • the insulating material is filled in the space portion at the height of the second metal layer 29 to form a laminated insulating layer 30.
  • FIG. 10 illustrates a pin portion having a desired height by a laminated insulating layer.
  • a third metal layer 31 is grown on the second metal layer at a certain height by digesting the laminated insulating layer in the electro-forming tub.
  • a space portion is again formed on the laminated insulating portion 30- as the third metal layer 31 is formed.
  • the insulating material is filled in the space portion at the height of the third metal layer 31 to form a laminated insulating layer 32.
  • the above processes are repeated until the laminated insulating layer 32 is formed at a desired height.
  • the metal layers 25, 29 and 31 layered on the electrode base are then removed.
  • the electro-forming master in which the pin portion is formed at a desired height is manufactured on the surface of the electrode base.
  • the root portion 28 is formed in the concave portion.
  • the pin portion 32 is formed on the top of the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
  • FIGs. 11a and lib illustrate a method for manufacturing an electro-forming master according to another embodiment of the present invention.
  • the electro- forming master having a pin portion of a certain height without forming a root portion is manufactured.
  • a laminated exposing portion and metal layers are formed on a basic material of a plane electrode base.
  • a photoresist 34 is deposited on an electrode base basic material 33, and a film is exposed to form an exposing portion 35. After an unexposed portion is washed to form a space portion 36.
  • the electrode base constructed as above is defined as an incipient master.
  • a photoresist is again deposited in a state that a first metal layer 37 is grown at the height of the exposing portion 35 by implementing the electro- forming process in the incipient master.
  • A. laminated exposing portion 38 is formed on the photoresist portion.
  • the photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion.
  • the electro-forming process is then implemented in the electrode base 33 so that a second metal layer 39 is grown in the space portion at the height of the laminated exposing portion 38.
  • the photoresist is again deposited on the electrode base in which the laminated exposing portion 38 and the second metal layer 39 are formed.
  • the photoresist portion is then exposed to form a laminated exposing portion 40.
  • the photoresist except for that of the laminated exposing portion 40 is removed by a washing process to form a space portion.
  • the electro- forming process is then implemented in the electrode base so that a third metal layer 41 is grown in the space portion at the height of the laminated exposing portion 40.
  • the laminated exposing portions 35, 38 and 39 layered on the electrode base are removed to form a space portion 43.
  • An insulating material 44 is filled in the space portion 43 at the height of the metal layers. Once the insulating material 44 is hardened, the metal layers 45 layered on the electrode base are removed.
  • the electro- forming master having the insulating material 44 formed in the space portion of the electrode base 33 at a uniform height is manufactured.
  • the electrode base and the insulating hetero-material can be formed of various materials.
  • stainless steel may be used as the electrode base.
  • Stainless steel has excellent durability and serves to facilitate detachment of the electro-forming member formed of a minute pattern of thin metal such as copper or nickel.
  • an insulating material has elasticity. If the insulating material has elasticity, stress does not occur between the electro-forming member grown by the electro-forming process and the insulating ' material. In this case, the electro-forming master is detached from the insulating material without any damage.
  • silicon is used as the insulating material.
  • the insulating material is not damaged in spite of detachment of the electro- forming member because the insulating material has elasticity. Also, silicon has excellent hetero- characteristics so that it serves to facilitate detachment of the electro-forming member.
  • the present invention is characterized by the electro-forming master, its manufacturing method, and the metal minute pattern repeatedly formed by the electro- forming master.
  • the present invention is characterized in that the electro-forming master including the insulating portion is used to repeatedly form a metal minute pattern.
  • the electro-forming master of the present invention growth of electro-forming metal is limited by the pin portion in which the insulating material is formed.
  • the root portion is formed below the pin portion so that the pin portion can be fastened to the electrode base.
  • the photoresist is deposited and exposed several times in the present invention.
  • the insulating materials are layered, and the metal layers are formed by performing the electro-forming process.
  • the electro- forming master is manufactured.
  • the insulating material of the present invention has elasticity to facilitate detachment of the electro-forming member during the electro-forming process. Also, if the insulating material having elasticity is used, the electro-forming master can repeatedly be used.

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Abstract

An electro-forming master repeatedly manufactured by an electro-forming process, its manufacturing method, and a metal minute pattern formed by the electro-forming master are disclosed. The method for manufacturing an electro-forming master includes the steps of performing an electro-forming process in a surface of an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape of that of the metal minute pattern, forming metal layers in the conducting portion and a laminated exposing layer in the insulating portion, sequentially increasing the height of the metal layers and the laminated exposing layer, removing the laminated exposing layer from the electrode base to form a space portion when the metal layers and the laminated exposing layer reach a desired height, forming an insulating portion by filling an insulating material in the space portion, and removing the metal layers formed on the electrode base to form an insulating layer having a certain height on the surface of the electrode base as a pin portion.

Description

ELECTRO-FORMING MASTER HAVING A PIN PORTION AND THE
SAME MASTER-MANUFACTURING METHOD, AND METAL MINUTE
PATTERN MADE BY THE MASTER
TECHNICAL FIELD
The present invention relates to an electro-forming master, its manufacturing method, and a metal minute pattern made by the master, in which a metal pattern for a minute conducting circuit used in semiconductor and other electronic devices is made by an electro-forming process. The metal minute pattern is used in various fields. The metal minute pattern has conventionally been formed by an etching process. In the present invention, the metal minute pattern can be formed by an electro-forming process, and a repeatable electro-forming master is used to form a minute pattern which is an electro-forming member. Also, in the present invention, the electro-forming master is digested in an electro-forming tub to obtain a metal minute pattern. The metal minute pattern is then detached from the electro-forming master to be produced as a product. The electro-forming master is again digested in the electro-forming tub to repeatedly form a new minute pattern. The minute pattern is obtained by repeating the above processes. An insulating material is used as the electro-forming master of the present invention. More preferably, an insulating material having elasticity is used as the electro-forming master. Also, it is preferable that the insulating material having elasticity has hetero- characteristics . To this end, a hetero-layer may separately be formed in the electro-forming master. More preferably, the insulating material has hetero- characteristics . An example of the insulating material having elasticity and hetero-characteristics includes silicon. Owing to such an insulating material, the electro-forming master of the present invention can repeatedly be used.
BACKGROUND ART
A conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion. The etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained. Also, the etching process has limitation in a processing pitch due to lateral corrosion. Further, the etching process causes corroded material to be necessarily removed. However, in the present invention, a metal minute pattern is formed by an electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, since a pin portion in the present invention enables growth of metal within the limited range, problems such as lateral corrosion caused by etching do not occur. This enables the process in a sophisticated pitch. Unlike the etching process, since only material required for a metal minute pattern is used for electro-forming master in the present invention, waste of material is avoided.
In the present invention, each product is repeatedly formed in an electro-forming tub by an electro-forming process without etching and exposing processes. This enables that the product can be manufactured simply in comparison with the conventional method.
There has been a conventional method for forming a metal minute pattern by an electro-forming process. In the prior art, a disposable electro-forming master has been mainly used. To manufacture an electro-forming master that can repeatedly be used, a hardened register formed on an electrode base has been conventionally used. The hardened register generates stress with the electro-forming member. When the electro-forming member is detached from the register as the electro-forming process is finished, the stress fails to easily detach the electro-forming member from the register. That is, when the electro-forming member is detached from the register, the electro-forming member affects the register and vice versa. This leads the electro-forming member or the register to be damaged. For this reason, the electro-forming process has been conventionally considered a temporary process. However, since a pin portion having elasticity is used instead of the hardened register in the present invention, the insulating material does not affect the electro-forming member when the electro-forming member is detached. Therefore, the electro-forming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
DISCLOSURE OF THE INVENTION
Accordingly, the present invention is directed to an electro-forming master, its manufacturing method, and a metal minute pattern made by the master that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide an electro-forming master, its manufacturing method, and a metal minute pattern made by the master in which a minute pattern of metal is repeatedly formed by an electro- forming process.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the scheme particularly pointed out in the written description and claims hereof as well as the appended drawings .
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, an electro-forming master according to the present invention includes a concave portion formed on an upper surface of an electrode base, a root portion formed by filling an insulating material in the concave portion, and a pin portion formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base. In the present invention, the insulating portion protruded higher than the surface of the electrode base is defined as the pin portion. The insulating material formed below the pin portion is defined as the root portion. The root portion serves to fasten the pin portion to the electrode base. In the present invention, the electro-forming process is performed two or more times to protrude the insulating material at a certain height upward of the surface of the electrode base. The pin portion serves to limit growth of electro-forming metal in a certain shape. The pin portion serves as a factor that determines the thickness of the metal minute pattern as well as its shape. That is, the thickness of the metal minute pattern is limited at the height of the pin portion. To form the minute pattern at a desired thickness, it is necessary to increase the height of the pin portion in response to the thickness of the minute pattern. In the present invention, to manufacture the electro-forming master in which the height of the pin portion is increased, the electro- forming process is performed in the electrode base several times to form layered electro-forming metals. The photoresist or the insulating material is deposited in response to the height of the layered metals. The present invention is characterized in that the height of the pin portion can be increased by a desired height. In the prior art, if the electro-forming process is performed using a conventional register, the thickness of the minute pattern is limited by the limited height of the register. However, in the present invention, the minute pattern can thickly be formed by adjusting the height of the pin portion. Preferably, the insulating portion of the present invention has elasticity. The insulating portion having elasticity includes silicon as a main component. More preferably, the insulating material has elasticity and insulating and hetero-characteristics . An example of the insulating material includes silicon. Silicon has elasticity in addition to excellent insulating and -hetero characteristics .
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 illustrates a metal minute pattern;
FIG. 2 illustrates a method for forming a root portion of an electro-forming master according to one embodiment of the present invention;
FIG. 3 illustrates the state that electro-forming is implemented by digesting an incipient electro-forming master in an electro-forming tub;
FIG. 4 illustrates the processes of forming a laminated exposing layer, and forming layered metal through an electro-forming process;
FIG. 5 illustrates the processes of forming a laminated exposing layer, and forming a third metal layer through an electro-forming process; FIG. 6 illustrates a pin portion having a desired height;
FIG. 7 illustrates a method for forming a root portion of an electro-forming master according to other embodiment of the present invention; FIG. 8 illustrates the state that electro-forming is implemented by digesting an incipient electro-forming master in an electro-forming tub;
FIG. 9 illustrates the processes of forming a laminated insulating layer, and forming a layered metal through an electro-forming process;
FIG. 10 illustrates a pin portion having a desired height by a laminated insulating layer; and
FIGs. 11a and lib illustrate a method for manufacturing an electro-forming master according to another embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
An electro-forming master of the present invention includes an electrode base having an insulating portion that can repeatedly be used. In the electro-forming master of the present invention, the insulating portion protruded higher than the surface of the electrode base is defined as a pin portion. A concave portion may be formed below the pin portion. The insulating material filled in the concave portion is defined as a root portion in the present invention. The root portion serves to fasten the
-pin portion to the electrode base. In the present invention, the electrode base of the electro-forming master includes a conducting portion and an insulating portion on its surface. The conducting portion has the same shape as that of a metal minute pattern. Metal ion of the conducting portion is grown in an electro-forming tub. In the present invention, the insulating portion is not electrically connected. Preferably, an insulating material having hetero-characteristics is used as the insulating portion considering detachment of an electro-forming member. More preferably, the insulating portion has elasticity. The insulating portion having elasticity effectively removes stress generated between the electro- forming member and the insulating portion. The insulating portion having elasticity serves to facilitate detachment of the electro-forming member due to its elasticity.
FIGs. 1 to 6 illustrate the processes of manufacturing an electro-forming master according to one embodiment of the present invention.
FIG. 1 illustrates a metal minute pattern. A pattern 100 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits. To obtain such a metal minute pattern, a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the opaque portion are formed in the film as metal minute patterns. In the present invention, the electrode base having a pattern is formed using a film. The electrode base having a pattern is used to form an electro-forming master that can repeatedly be used. The electro-forming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
FIG. 2 illustrates a method for forming a root portion of an electro-forming master according to the present invention. A photoresist 2 is deposited on an electrode base basic material 1, and a film having a specific pattern is exposed to form an exposing portion 3. The upper surface of the electrode base basic material 1 is etched at a certain depth to form a concave portion 4. The electrode base basic material in which the concave portion 4 is formed is defined as the electrode base 5 of the plane electro-forming master. The concave portion may be formed by a mechanical process or a laser process. A filling material 6 is filled in the concave portion 4 of the electrode base. The filling material 6 is then arranged to be flush with the upper surface of the electrode base. Once the arranged filling material is hardened, the photoresist is again deposited on the filling material and the upper surface of the electrode base to form an exposing portion 7 in the photoresist using the same film. An unexposed portion is washed to form a space portion. The electrode base constructed as above is defined as an incipient master.
FIG. 3 illustrates the state that electro-forming is implemented by digesting the incipient master in an electro-forming tub. Once an electro-forming process is started in an electro-forming tub by connecting a negative electrode (-) to the electrode base 5, ionized metal starts to be coupled with the electrode base 5. The ionized metal starts to be formed in the electrode base as a minute pattern of a thin metal. Once the electro-forming process is implemented in the electrode base within the electro-forming tub, metal ion starts to be grown on the surface of the electrode base exposed in the exposing portion 7. With the lapse of time, a first metal layer is formed at the height of the exposing portion.
FIG. 4 illustrates the processes of forming a laminated exposing layer, and forming layered metal through an electro-forming process. A photoresist 9 is deposited on the incipient master in a state that the first metal layer 8 is grown at the height of the exposing portion. A laminated exposing portion 10 is formed in the photoresist portion. The photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion. The electro-forming process is then implemented in the electrode base 5 so that a second metal layer 11 is grown in the space portion at the height of the exposing portion 10.
FIG. 5 illustrates the processes of forming a laminated exposing layer, and forming a third metal layer through an electro-forming process. A photoresist 12 is again deposited on the electrode base where the laminated exposing portion 10 and the second metal layer 11 are formed. A laminated exposing portion 13 is formed in the photoresist portion. The photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion. The electro-forming process is then implemented in the electrode base 5 so that a third metal layer 14 is grown in the space portion at the height of the exposing portion 13.
FIG. 6 illustrates a pin portion having a desired height. When the laminated exposing portion and metal layers are formed at a desired height, the laminated exposing portion layered on the electrode base and the filling material filled in the concave portion are removed to form a space portion 15. An insulating material 16 is filled in the space portion 15 at the height of the metal layers. Once the insulating material 16 is hardened, the metal layers layered on the electrode base are removed. As a result, the electro-forming master is manufactured in such a manner that the insulating material 16 is formed in the space portion of the electrode base 5 at a uniform height. A root portion is formed in the concave portion. A pin portion is formed on the top of the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base. A shape of the pin portion serves as a factor that determines a shape of the metal minute pattern. The photoresist generally used fails to form the thick exposing portion at once. However, the pin portion can thickly be formed by the processes of the present invention. In this respect, the present invention will be a landmark. FIG. 7 to FIG. 10 illustrate processes of manufacturing an electro-forming master according to another embodiment of the present invention.
FIG. 7 illustrates a method for forming a root portion of an electro-forming master according to another embodiment of the present invention. A photoresist 18 is deposited on an electrode base basic material 17, and a film is exposed to form an exposing portion 19. After an unexposed portion 20 is removed by the washing process, the upper surface of the electrode base basic material 17 is etched at a certain depth to form a concave portion 21. The electrode base basic material in which the concave portion 21 is formed is defined as the electrode base 22 of the electro-forming master. The concave portion may be formed by a mechanical process or a laser process. The concave portion 21 has various shapes. That is, a triangular concave portion, a circular concave portion, or a trapezoidal concave portion may be formed. A filling material 23 is filled in the concave portion 21 of the electrode base. The filling material 23 is then arranged to be flush with the upper surface of the electrode base. The electrode base constructed as above is defined as an incipient master. FIG. 8 illustrates the state that electro-forming is implemented by digesting the incipient master in an electro-forming tub. Once an electro-forming process is started in an electro-forming tub by connecting a negative electrode (-) to the electrode base 22, ionized metal starts to be coupled with the electrode base 22. The ionized metal starts to be formed in the electrode base as a minute pattern 24 of a thin metal. Once the electro- forming process is implemented in the electro-forming tub, metal ion starts to be grown on the surface of the electrode base exposed in the insulating portion 23. With the lapse of time, a metal layer 24 is formed.
FIG. 9 illustrates the processes of forming a laminated insulating layer, and forming a layered metal through an electro-forming process. The electro-forming process is implemented by digesting the incipient master in the electro-forming tub, so that a first metal layer 25 is grown in a conducting portion of the electrode base at a certain height. A space portion is formed on the insulating portion 23 by the first metal layer. An insulating material is filled in the space portion at the height of the first metal layer 25 to form a laminated insulating layer 27. The original insulating portion 23 > serves as a root portion 28 while the laminated insulating portion 27 laminated on the root portion serves as a pin portion. After the laminated insulating layer is formed at the height of the first metal layer 25, a second metal layer 29 is grown on the first metal layer at a certain height by digesting the laminated insulating layer in the electro-forming tub. A space portion is again formed on the laminated insulating portion 27 as the second metal layer 29 is formed. The insulating material is filled in the space portion at the height of the second metal layer 29 to form a laminated insulating layer 30.
FIG. 10 illustrates a pin portion having a desired height by a laminated insulating layer. After the laminated insulating layer 30 is formed at the height of the second metal layer 29, a third metal layer 31 is grown on the second metal layer at a certain height by digesting the laminated insulating layer in the electro-forming tub. A space portion is again formed on the laminated insulating portion 30- as the third metal layer 31 is formed. The insulating material is filled in the space portion at the height of the third metal layer 31 to form a laminated insulating layer 32. The above processes are repeated until the laminated insulating layer 32 is formed at a desired height. The metal layers 25, 29 and 31 layered on the electrode base are then removed. As a result, the electro-forming master in which the pin portion is formed at a desired height is manufactured on the surface of the electrode base. The root portion 28 is formed in the concave portion. The pin portion 32 is formed on the top of the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
FIGs. 11a and lib illustrate a method for manufacturing an electro-forming master according to another embodiment of the present invention. The electro- forming master having a pin portion of a certain height without forming a root portion is manufactured. To manufacture such an electro-forming master, a laminated exposing portion and metal layers are formed on a basic material of a plane electrode base. A photoresist 34 is deposited on an electrode base basic material 33, and a film is exposed to form an exposing portion 35. After an unexposed portion is washed to form a space portion 36. The electrode base constructed as above is defined as an incipient master. A photoresist is again deposited in a state that a first metal layer 37 is grown at the height of the exposing portion 35 by implementing the electro- forming process in the incipient master. A. laminated exposing portion 38 is formed on the photoresist portion. The photoresist except for that of the laminated exposing portion is removed by a washing process to form a space portion. The electro-forming process is then implemented in the electrode base 33 so that a second metal layer 39 is grown in the space portion at the height of the laminated exposing portion 38. The photoresist is again deposited on the electrode base in which the laminated exposing portion 38 and the second metal layer 39 are formed. The photoresist portion is then exposed to form a laminated exposing portion 40. The photoresist except for that of the laminated exposing portion 40 is removed by a washing process to form a space portion. The electro- forming process is then implemented in the electrode base so that a third metal layer 41 is grown in the space portion at the height of the laminated exposing portion 40. Afterwards, when the laminated exposing portion and the metal layers are formed at a desired height, the laminated exposing portions 35, 38 and 39 layered on the electrode base are removed to form a space portion 43. An insulating material 44 is filled in the space portion 43 at the height of the metal layers. Once the insulating material 44 is hardened, the metal layers 45 layered on the electrode base are removed. As a result, the electro- forming master having the insulating material 44 formed in the space portion of the electrode base 33 at a uniform height is manufactured.
In the present invention, the electrode base and the insulating hetero-material can be formed of various materials. As an example, stainless steel may be used as the electrode base. Stainless steel has excellent durability and serves to facilitate detachment of the electro-forming member formed of a minute pattern of thin metal such as copper or nickel. More preferably, an insulating material has elasticity. If the insulating material has elasticity, stress does not occur between the electro-forming member grown by the electro-forming process and the insulating 'material. In this case, the electro-forming master is detached from the insulating material without any damage. In the present invention, silicon is used as the insulating material. If silicon is used as the insulating material, the insulating material is not damaged in spite of detachment of the electro- forming member because the insulating material has elasticity. Also, silicon has excellent hetero- characteristics so that it serves to facilitate detachment of the electro-forming member. The present invention is characterized by the electro-forming master, its manufacturing method, and the metal minute pattern repeatedly formed by the electro- forming master.
INDUSTRIAL APPLICABILITY
The present invention is characterized in that the electro-forming master including the insulating portion is used to repeatedly form a metal minute pattern. In the electro-forming master of the present invention, growth of electro-forming metal is limited by the pin portion in which the insulating material is formed. Also, the root portion is formed below the pin portion so that the pin portion can be fastened to the electrode base. To form the minute pattern at a desired thickness, it is necessary to increase the height of the pin portion in response to the thickness of the minute pattern. To this end, the photoresist is deposited and exposed several times in the present invention. Alternatively, the insulating materials are layered, and the metal layers are formed by performing the electro-forming process. As a result, the electro- forming master is manufactured. Preferably, the insulating material of the present invention has elasticity to facilitate detachment of the electro-forming member during the electro-forming process. Also, if the insulating material having elasticity is used, the electro-forming master can repeatedly be used.
While the present invention has been described and illustrated herein with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made therein without departing from the spirit and scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention that come within the scope of the appended claims and their equivalents.

Claims

What is claimed is:
1. An electro-forming master which forms a metal minute pattern by an electro-forming process, the electro- forming master comprising: a concave portion formed on an upper surface of an electrode base; a root portion formed by filling an insulating material in the concave portion; and a pin portion formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
2. The electro-forming master according to claim 1, wherein the pin portion has an increased height by forming metal layers and laminated insulating layers.
3. The electro-forming master according to claim 1, wherein the pin portion has an increased height by forming metal layers and laminated exposing layers.
4. The electro-forming master according to claim 1, 2 or 3, wherein the concave portion is formed by an etching process .
5. The electro-forming master according to claim 1, 2 or 3, wherein the concave portion is formed by a mechanical process or a laser process.
6. The electro-forming master according .to claim 1, 2 or 3, wherein the pin portion has elasticity.
7. The electro-forming master according to claim 6, wherein the pin portion having elasticity includes silicon as a main component.
8. A method for manufacturing an electro-forming master which forms a metal minute pattern by an electro- forming process, the method comprising the steps of: forming a concave portion on an upper surface of an electrode base; and forming a root portion and a pin portion by filling an insulating material in the concave portion, wherein the pin portion is formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
9. The method according to claim 8, wherein the pin portion has an increased height by forming metal layers and laminated insulating layers .
10. The method according to claim 8, wherein the pin portion has an increased height by forming metal layers and laminated exposing layers.
11. The method according to claim 8, 9 or 10, wherein the concave portion is formed by an etching process.
12. The method according to claim 8, 9 or 10, wherein the concave portion is formed by a mechanical process or a laser process.
13. The method according to claim 8, 9 or 10, wherein the pin portion has elasticity.
14. The method according to claim 13, wherein the pin portion having elasticity includes silicon as a main component .
15. A metal minute pattern formed by performing an electro-forming process in an electro-forming master and detached from the electro-forming master, the electro- forming master comprising a concave portion formed on an upper surface of an electrode base, and a root portion formed by filling an insulating material in the concave portion, wherein the pin portion is formed on the root portion in an integral form with the root portion and protruded upward of the surface of the electrode base.
16. The metal minute pattern according to claim 15, wherein the pin portion has an increased height by forming metal layers and laminated insulating layers.
17. The metal minute pattern according to claim 15, wherein the pin portion has an increased height by forming metal layers and laminated exposing layers.
18. The metal minute pattern according to claim 15, 16 or 17, wherein the concave portion is formed by an etching process.
19. The metal minute pattern according to claim 15, 16 or 17, wherein the concave portion is formed by a mechanical process or a laser process.
20. The metal minute pattern according to claim 15, 16 or 17, wherein the pin portion has elasticity.
21. The metal minute pattern according to claim 20, wherein the pin portion having elasticity includes silicon as a main component.
22. A method for manufacturing an electro-forming master which forms a metal minute pattern by an electro- forming process, the method comprising the steps of: performing an electro-forming process in a surface of an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape of that of the metal minute pattern; forming metal layers in the conducting portion and a laminated insulating layer in the insulating portion; sequentially increasing the height of the metal layers and the laminated insulating layer; and removing the metal layers from the electrode base when the metal layers and the laminated insulating layer reach a desired height, so that a laminated insulating layer having a certain height is formed.
23. The method according to claim 22, wherein the insulating portion is formed by filling an insulating material in the concave portion formed by an etching process .
24. The method according to claim 22, wherein the laminated insulating layer has elasticity.
25. The method according to claim 22, 23 or 24, wherein the laminated insulating layer includes silicon as a main component .
26. A method for manufacturing an electro-forming master which forms a metal minute pattern by an electro- forming process, the method comprising the steps of: performing an electro-forming process in a surface of an electrode base including an insulating portion which is not electrically connected and a conducting portion having the same shape of that of the metal minute pattern; forming metal layers in the conducting portion and a laminated exposing layer in the insulating portion; sequentially increasing the height of the metal layers and the laminated exposing layer; removing the laminated exposing layer from the electrode base to form a space portion when the metal layers and the laminated exposing layer reach a desired height; forming an insulating portion by filling an insulating material in the space portion; and removing the metal layers formed on the electrode base to form a laminated insulating layer having a certain height .
27. The method according to claim 26, wherein the insulating portion is formed by filling an insulating material in the concave portion formed by an etching process .
28. The method according to claim 26, wherein the insulating material filled in the space portion has elasticity.
29. The method according to claim 26, 27 or 28, wherein the insulating material filled in the space portion includes silicon as a main component.
PCT/KR2003/002804 2003-01-09 2003-12-23 Electro-forming master having a pin portion and the same master-manufacturing method, and metal minute pattern made by the master Ceased WO2004064155A1 (en)

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KR1020030002231A KR20040064191A (en) 2003-01-09 2003-01-09 Electroforming material of stacked thin film and fabricating method thereof

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PCT/KR2003/002856 Ceased WO2004064156A1 (en) 2003-01-09 2003-12-26 Laminate made by electro-forming and method for manufacturing the same
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WO2004064135A1 (en) 2004-07-29
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AU2003289537A1 (en) 2004-08-10
KR20040064191A (en) 2004-07-16

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