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WO2004057669A1 - Electro-forming master, its manufacturing method, and metal minute pattern made by it - Google Patents

Electro-forming master, its manufacturing method, and metal minute pattern made by it Download PDF

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Publication number
WO2004057669A1
WO2004057669A1 PCT/KR2003/002779 KR0302779W WO2004057669A1 WO 2004057669 A1 WO2004057669 A1 WO 2004057669A1 KR 0302779 W KR0302779 W KR 0302779W WO 2004057669 A1 WO2004057669 A1 WO 2004057669A1
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WO
WIPO (PCT)
Prior art keywords
electro
hetero
forming
insulating
minute pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2003/002779
Other languages
French (fr)
Inventor
Jeong-Sik Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GRAPHION TECHNOLOGIES USA LLC
Original Assignee
GRAPHION TECHNOLOGIES USA LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020020084669A external-priority patent/KR20040055536A/en
Priority claimed from KR1020020085639A external-priority patent/KR20040055538A/en
Application filed by GRAPHION TECHNOLOGIES USA LLC filed Critical GRAPHION TECHNOLOGIES USA LLC
Priority to AU2003289552A priority Critical patent/AU2003289552A1/en
Publication of WO2004057669A1 publication Critical patent/WO2004057669A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation

Definitions

  • the present invention relates to an electro-forming master, its manufacturing method, and a metal minute pattern, in which a metal pattern for a minute conducting circuit used in semiconductor and other electronic devices is made by an electro-forming process.
  • the metal minute pattern is used in various fields.
  • the metal minute pattern has conventionally been formed by an etching process.
  • the metal minute pattern can be formed by an electro-forming process, and a repeatable electro-forming master is used to form a minute pattern which is an electro-forming member.
  • the electro- forming master is digested in an electro-forming tub to obtain a metal minute pattern.
  • An insulating hetero- material is used as the electro-forming master of the present invention. More preferably, an insulating hetero-material having elasticity is used as the electro-forming master.
  • the electro-forming master of the present invention can repeatedly be used because of an insulating hetero-material having elasticity.
  • a conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion.
  • the etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained.
  • the _ etching process has limitation in a processing pitch due to lateral corrosion. .Further, the etching process causes corroded material to be necessarily removed.
  • a metal minute pattern is formed by an electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process.
  • an insulating hetero-material in the present invention enables problems such as lateral corrosion caused by etching not to occur. This enables the process in a sophisticated pitch.
  • waste of material is avoided.
  • each product is exposed to be repeatedly formed in an electro-forming tub by an electro-forming process without etching. This enables that the product can be manufactured simply in comparison with the conventional method.
  • the electro-forming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
  • the present invention is directed to an electro-forming master, its manufacturing method, and a metal minute pattern that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
  • An object of the present invention is to provide an electro-forming master, its manufacturing method, and a metal minute pattern in which a minute pattern of metal is repeatedly formed by an electro-forming process.
  • an electro-forming master includes a concave portion formed on an upper surface of an electrode base, and an insulating hetero-material portion is formed by filling an insulating hetero- material in the concave portion, wherein the surface of the insulating hetero-material portion is flush with the surface of the concave portion.
  • the concave portion is formed by an etching process, a mechanical process, or a laser process.
  • an insulating hetero-material portion having foaming property is used.
  • the insulating hetero-material portion of the present invention has elasticity.
  • the insulating hetero-material portion having elasticity includes silicon as a main component. Silicon has elasticity in addition to excellent insulating and hetero characteristics .
  • FIG. 1 illustrates a metal minute pattern
  • FIG. 2 illustrates the state that electro-forming is implemented by digesting an electro-forming master in an electro-forming tub
  • FIG. 3 illustrates a plane electro-forming master according to one embodiment of the present invention
  • FIG. 4 illustrates a method for manufacturing a metal minute pattern using a plane electro-forming master of FIG. 3; '
  • FIG. 5 illustrates a method for manufacturing a plane electro-forming master according to another embodiment of the present invention
  • FIG. 6 illustrates a method for manufacturing a plane electro-forming master according to other embodiment of the present invention.
  • FIGs. 7a and 7b illustrate a plane electro-forming master using a foaming hetero-material according to another embodiment of the present invention.
  • An electro-forming master of the present invention includes a plane electro-forming master and a foaming electro-forming master.
  • the plane electro-forming master is defined as one in which the surface of a hetero-material is flush with the surface of an electrode base.
  • the foaming electro- forming master is defined as one in which a hetero- material of the plane electro-forming master is foamed.
  • FIG. 1 illustrates a metal minute pattern.
  • a pattern 2 is made of a metal minute pattern.
  • Such a metal minute pattern is used in various fields such as semiconductor or minute circuits.
  • a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the, opaque portion are formed in the film as metal minute patterns.
  • the film having patterns is used to form an electro-forming master that can repeatedly be used.
  • the electro-forming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
  • FIG. 2 illustrates the state that electro-forming is implemented by digesting an electro-forming master in an electro-forming tub.
  • FIG. 3 illustrates a plane electro-forming master according to one embodiment of the present invention. As shown in FIG. 3, a photoresist 4 is deposited on an electrode base basic material 5 at a uniform thickness.
  • an exposing portion 6 is formed.
  • the photoresist that is not exposed is washed to form a space portion 7.
  • the electrode base basic material 5 in which the space portion 7 is formed is digested in an electro-forming tub.
  • the electro-forming process is then performed so that ion metal is grown in the space portion 7.
  • the electro-forming process continues to form an electro-forming member over the entire electrode base basic material 5.
  • the electro-forming process is performed until a thick body 8 is formed. Afterwards, once the thick body 8 is detached from the electrode base basic material 5, the thick body 8 serves as the electrode base 8 having a concave groove only in the exposing portion 6.
  • An insulating hetero-material ' 10 is filled in the concave groove of the electrode base 8.
  • the insulating hetero-material 10 is then arranged in parallel with the surface of the electrode base. Subsequently, once the hetero-material is hardened, the plane electro-forming master is completed. Since the electrode base 8 has a strong structure, it is desirable in manufacturing a powerful electro-forming master.
  • a surface portion 9 of the electrode base is interposed in the insulating hetero-material and then exposed.
  • FIG. 4 illustrates a method for manufacturing a metal minute pattern using the plane electro-forming master of FIG. 3. Once the electro-forming process is performed in the electro-forming tub, metal ion is grown in the surface portion 9 of the electrode base exposed in the insulating hetero-material 10 to manufacture a metal minute pattern 11.
  • FIG. 5 illustrates a method for manufacturing a plane electro-forming master according to another embodiment of the present invention.
  • the plane electro- forming master can be manufactured by various methods .
  • a photoresist 13 is deposited on an electrode base basic material 12, and a film having a specific pattern is exposed to form an exposing portion 14.
  • the upper surface of the electrode base basic material 12 is etched at a certain depth to form a concave groove 15.
  • the electrode base basic material in which the concave groove is formed serves as the electrode base of the plane electro-forming master.
  • An insulating hetero- material 16 is filled in the concave groove 15 of the electrode base.
  • the insulating hetero-material is arranged to be flush with the upper surface of the electrode base. Once the arranged hetero-material is hardened, the plane electro-forming master is completed.
  • the electro-forming process is then performed in. the plane electro-forming master to form a desired metal minute pattern.
  • FIG. 6 illustrates a method for manufacturing a plane electro-forming master according to other embodiment of the present invention.
  • a concave groove 19 is formed in the upper surface of the electrode base basic material 17 by a mechanical process or laser process.
  • the electrode base basic material in which the concave groove 19 is formed serves as the electrode base 18 of the plane electro-forming master.
  • An insulating , hetero-material 20 is filled in the concave groove 19 of the electrode base.
  • the insulating hetero-material is arranged to be flush with the upper surface of the electrode base. Once the arranged hetero-material is hardened, the plane electro-forming master is completed.
  • FIGs. 7a and 7b illustrate a plane electro-forming master using a foaming hetero-material according to another embodiment of the present invention.
  • a plane electro-forming master based on a foaming hetero- material is obtained by giving physical changes such as temperature change to the plane electro-forming master filled with an insulatin.g hetero-material so as to foam and expand the hetero-material.
  • the hetero-material of the plane electro-forming master is filled with the foaming hetero-material and is foamed by changing physical conditions, the hetero-material has an arc shaped surface.
  • the surface of the hetero- material in the plane electro-forming master is flush with the upper surface of the electrode base 21, the surface of the hetero-material in the plane electro- forming master based on the foaming hetero-material is higher than the upper surface of the electrode base.
  • the foamed hetero-material below the surface of the electrode base serves as a root portion while that above the surface of the electrode base serves as an insulating protrusion. Therefore, if the electro- forming process is performed in the plane electro- forming master based on the foaming hetero-material 24, metal ions are grown only inside the arc shaped hetero- material. As a result, the metal ions can be prevented from being grown outside the arc shaped hetero-material. Silicon mixed with a foaming material foamed by heat may be used as the foaming hetero-material. In this case, once the hetero-material is filled and heated, it is to be expanded.
  • the upper surface of the electrode base basic material is etched at a certain depth to form an etching groove.
  • An insulating hetero- material 25 is filled in the etching groove.
  • the surface of the insulating hetero-material 25 is arranged to be flush with the upper surface of the electrode base. Afterwards, once the hetero-material is foamed, it is to be expanded to form a foaming hetero-material 26.
  • the electrode base and the insulating hetero-material can be formed of various materials.
  • stainless steel may be used as the electrode base.
  • Stainless steel has excellent durability and serves to facilitate detachment of the electro-forming member formed of a minute pattern of thin metal such as copper or nickel.
  • an insulating hetero-material having elasticity is used as a hetero-material. If the insulating hetero-material has elasticity, stress does not occur between the electro- forming member grown by the electro-forming process and the hetero-material. In this case, the electro-forming master is detached from the hetero-material without any damage.
  • silicon is used as the hetero-material. If silicon is used as the hetero- material, the hetero-material is not damaged in spite of detachment of the electro-forming member because the hetero-material has elasticity. Also, silicon serves to facilitate detachment of the electro-forming member.
  • the present invention is characterized by the electro-forming master, its manufacturing method, and the metal minute pattern repeatedly formed by the electro-forming master.
  • the present invention is characterized in that the electro-forming master including the insulating hetero- material is used to repeatedly form a metal minute pattern.
  • the insulating hetero-material of the present invention has elasticity to facilitate detachment of the electro-forming member during the electro-forming process.
  • the hardened register conventionally used for the electro-forming process is damaged or the electro-forming member is damaged by the register when the grown electro-forming member is detached from the electro-forming master.
  • the insulating hetero-material having elasticity is not affected by detachment of the electro-forming member. Therefore, the hetero-material of the present invention can repeatedly be used.
  • the electro-forming member affects the register and vice versa. In this case, if detachment of the electro-forming member is performed, the electro- forming member or the register is to be damaged. If strong material is selected so as not to damage the register, the electro-forming member is to be damaged. For this reason, the register for the electro-forming process has been conventionally considered a temporary use. However, the insulating hetero-material having elasticity is used in the present invention instead of the hardened register, so that the metal minute pattern can repeatedly be formed by more simple process than the conventional process.
  • the conventional etching process for forming a metal minute pattern has limitation because it employs a method based on metal corrosion.
  • the etching process causes corroded ' material to be necessarily removed.
  • the metal minute pattern is formed by the electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. Unlike the etching process, since only material required for the metal minute pattern is used for the electro-forming master, waste of material is avoided.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

An electro-forming master, its manufacturing method, and a metal minute pattern repeatedly formed by the electro-forming master are disclosed. The electro-forming master includes a concave portion formed on an upper surface of an electrode base, and an insulating hetero-material portion is formed by filling an insulating hetero-material in the concave portion, wherein the surface of the insulating hetero-material portion is flush with the surface of the concave portion. The concave portion is formed by an etching process, a mechanical process, or a laser process. The insulating hetero-material portion having foaming property is used. Preferably, the insulating hetero-material portion has elasticity. The insulating hetero-material portion having elasticity includes silicon as a main component. Silicon has elasticity in addition to excellent insulating and hereto characteristics.

Description

ELECTRO-FORMING MASTER, ITS MANUFACTURING METHOD, AND METAL MINUTE PATTERN MADE BY IT
TECHNICAL FIELD The present invention relates to an electro-forming master, its manufacturing method, and a metal minute pattern, in which a metal pattern for a minute conducting circuit used in semiconductor and other electronic devices is made by an electro-forming process. The metal minute pattern is used in various fields. The metal minute pattern has conventionally been formed by an etching process. In the present invention, the metal minute pattern can be formed by an electro-forming process, and a repeatable electro-forming master is used to form a minute pattern which is an electro-forming member. Also, in the present invention, the electro- forming master is digested in an electro-forming tub to obtain a metal minute pattern. An insulating hetero- material is used as the electro-forming master of the present invention. More preferably, an insulating hetero-material having elasticity is used as the electro-forming master. The electro-forming master of the present invention can repeatedly be used because of an insulating hetero-material having elasticity.
BACKGROUND ART
A conventional etching process for forming a metal minute pattern has limitation in accuracy because it employs a method based on metal corrosion. The etching process causes a processing material corrosion in both vertical and lateral directions. In this case, accuracy in dimensions cannot be obtained. Also, the _ etching process has limitation in a processing pitch due to lateral corrosion. .Further, the etching process causes corroded material to be necessarily removed.
However, in the present invention, a metal minute pattern is formed by an electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. In other words, an insulating hetero-material in the present invention enables problems such as lateral corrosion caused by etching not to occur. This enables the process in a sophisticated pitch. Unlike the etching process; since only material required for a metal minute pattern is used for electro-forming master in the present invention, waste of material is avoided.
In the present invention, each product is exposed to be repeatedly formed in an electro-forming tub by an electro-forming process without etching. This enables that the product can be manufactured simply in comparison with the conventional method.
There has been a conventional method for forming a metal minute pattern by an electro-forming process based on a hardened register on an electrode base. The hardened register generates stress with the electro- forming member. When the electro-forming member is detached from the register as an electro-forming process is finished, the stress fails to easily detach the electro-forming member from the register. That is, when the electro-forming member is detached from the register, the electro-forming member affects the register and vice versa. This leads the electro-forming member or the register to be damaged. For this reason, the electro- forming process has been conventionally considered a temporary process. However, since an insulating hetero- material having elasticity is used instead of the hardened register in the present invention, the hetero- material does not affect the electro-forming member when the electro-forming member is detached. Therefore, the electro-forming master of the present invention is characterized in that its detachment is simple so as to enable repeated use.
DISCLOSURE OF THE INVENTION
Accordingly, the present invention is directed to an electro-forming master, its manufacturing method, and a metal minute pattern that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide an electro-forming master, its manufacturing method, and a metal minute pattern in which a minute pattern of metal is repeatedly formed by an electro-forming process.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the scheme particularly pointed out in the written description and claims hereof as well as the appended drawings.
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, an electro-forming master according to the present invention includes a concave portion formed on an upper surface of an electrode base, and an insulating hetero-material portion is formed by filling an insulating hetero- material in the concave portion, wherein the surface of the insulating hetero-material portion is flush with the surface of the concave portion. The concave portion is formed by an etching process, a mechanical process, or a laser process. In the present invention, an insulating hetero-material portion having foaming property is used. Preferably, the insulating hetero-material portion of the present invention has elasticity. The insulating hetero-material portion having elasticity includes silicon as a main component. Silicon has elasticity in addition to excellent insulating and hetero characteristics .
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 illustrates a metal minute pattern; FIG. 2 illustrates the state that electro-forming is implemented by digesting an electro-forming master in an electro-forming tub; FIG. 3 illustrates a plane electro-forming master according to one embodiment of the present invention;
FIG. 4 illustrates a method for manufacturing a metal minute pattern using a plane electro-forming master of FIG. 3;'
FIG. 5 illustrates a method for manufacturing a plane electro-forming master according to another embodiment of the present invention; FIG. 6 illustrates a method for manufacturing a plane electro-forming master according to other embodiment of the present invention; and
FIGs. 7a and 7b illustrate a plane electro-forming master using a foaming hetero-material according to another embodiment of the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
An electro-forming master of the present invention includes a plane electro-forming master and a foaming electro-forming master. In the present invention, the plane electro-forming master is defined as one in which the surface of a hetero-material is flush with the surface of an electrode base. The foaming electro- forming master is defined as one in which a hetero- material of the plane electro-forming master is foamed.
FIG. 1 illustrates a metal minute pattern. A pattern 2 is made of a metal minute pattern. Such a metal minute pattern is used in various fields such as semiconductor or minute circuits. To obtain such a metal minute pattern, a film having a transparent portion and an opaque portion is first used. Patterns of the transparent portion and the, opaque portion are formed in the film as metal minute patterns. In the present invention, the film having patterns is used to form an electro-forming master that can repeatedly be used. The electro-forming master of the present invention is characterized in that it enables mass production of a metal minute pattern.
FIG. 2 illustrates the state that electro-forming is implemented by digesting an electro-forming master in an electro-forming tub. Once an electro-forming process is started in an electro-forming tub by connecting a negative electrode (-) to an electrode base 3, ionized metal starts to be coupled with the electrode base 3. The ionized metal starts to be formed in the electrode base as a minute pattern 11 of a thin metal. Conductive metal such as nickel and copper is used as an electro- forming metal .
FIG. 3 illustrates a plane electro-forming master according to one embodiment of the present invention. As shown in FIG. 3, a photoresist 4 is deposited on an electrode base basic material 5 at a uniform thickness.
Once the photoresist 4 is exposed using a film having a pattern, an exposing portion 6 is formed. The photoresist that is not exposed is washed to form a space portion 7. The electrode base basic material 5 in which the space portion 7 is formed is digested in an electro-forming tub. The electro-forming process is then performed so that ion metal is grown in the space portion 7. The electro-forming process continues to form an electro-forming member over the entire electrode base basic material 5. The electro-forming process is performed until a thick body 8 is formed. Afterwards, once the thick body 8 is detached from the electrode base basic material 5, the thick body 8 serves as the electrode base 8 having a concave groove only in the exposing portion 6. An insulating hetero-material' 10 is filled in the concave groove of the electrode base 8. The insulating hetero-material 10 is then arranged in parallel with the surface of the electrode base. Subsequently, once the hetero-material is hardened, the plane electro-forming master is completed. Since the electrode base 8 has a strong structure, it is desirable in manufacturing a powerful electro-forming master. A surface portion 9 of the electrode base is interposed in the insulating hetero-material and then exposed.
FIG. 4 illustrates a method for manufacturing a metal minute pattern using the plane electro-forming master of FIG. 3. Once the electro-forming process is performed in the electro-forming tub, metal ion is grown in the surface portion 9 of the electrode base exposed in the insulating hetero-material 10 to manufacture a metal minute pattern 11.
FIG. 5 illustrates a method for manufacturing a plane electro-forming master according to another embodiment of the present invention. The plane electro- forming master can be manufactured by various methods . A photoresist 13 is deposited on an electrode base basic material 12, and a film having a specific pattern is exposed to form an exposing portion 14. The upper surface of the electrode base basic material 12 is etched at a certain depth to form a concave groove 15. The electrode base basic material in which the concave groove is formed serves as the electrode base of the plane electro-forming master. An insulating hetero- material 16 is filled in the concave groove 15 of the electrode base. The insulating hetero-material is arranged to be flush with the upper surface of the electrode base. Once the arranged hetero-material is hardened, the plane electro-forming master is completed. The electro-forming process is then performed in. the plane electro-forming master to form a desired metal minute pattern.
FIG. 6 illustrates a method for manufacturing a plane electro-forming master according to other embodiment of the present invention. A concave groove 19 is formed in the upper surface of the electrode base basic material 17 by a mechanical process or laser process. The electrode base basic material in which the concave groove 19 is formed serves as the electrode base 18 of the plane electro-forming master. An insulating, hetero-material 20 is filled in the concave groove 19 of the electrode base. The insulating hetero-material is arranged to be flush with the upper surface of the electrode base. Once the arranged hetero-material is hardened, the plane electro-forming master is completed.
FIGs. 7a and 7b illustrate a plane electro-forming master using a foaming hetero-material according to another embodiment of the present invention. A plane electro-forming master based on a foaming hetero- material is obtained by giving physical changes such as temperature change to the plane electro-forming master filled with an insulatin.g hetero-material so as to foam and expand the hetero-material. Once the hetero-material of the plane electro-forming master is filled with the foaming hetero-material and is foamed by changing physical conditions, the hetero-material has an arc shaped surface. Although the surface of the hetero- material in the plane electro-forming master is flush with the upper surface of the electrode base 21, the surface of the hetero-material in the plane electro- forming master based on the foaming hetero-material is higher than the upper surface of the electrode base. In this case, the foamed hetero-material below the surface of the electrode base serves as a root portion while that above the surface of the electrode base serves as an insulating protrusion. Therefore, if the electro- forming process is performed in the plane electro- forming master based on the foaming hetero-material 24, metal ions are grown only inside the arc shaped hetero- material. As a result, the metal ions can be prevented from being grown outside the arc shaped hetero-material. Silicon mixed with a foaming material foamed by heat may be used as the foaming hetero-material. In this case, once the hetero-material is filled and heated, it is to be expanded.
As shown in FIG. 7b, the upper surface of the electrode base basic material is etched at a certain depth to form an etching groove. An insulating hetero- material 25 is filled in the etching groove. The surface of the insulating hetero-material 25 is arranged to be flush with the upper surface of the electrode base. Afterwards, once the hetero-material is foamed, it is to be expanded to form a foaming hetero-material 26.
In the present invention, the electrode base and the insulating hetero-material can be formed of various materials. As an example, stainless steel may be used as the electrode base. Stainless steel has excellent durability and serves to facilitate detachment of the electro-forming member formed of a minute pattern of thin metal such as copper or nickel. More preferably, an insulating hetero-material having elasticity is used as a hetero-material. If the insulating hetero-material has elasticity, stress does not occur between the electro- forming member grown by the electro-forming process and the hetero-material. In this case, the electro-forming master is detached from the hetero-material without any damage. In the present invention, silicon is used as the hetero-material. If silicon is used as the hetero- material, the hetero-material is not damaged in spite of detachment of the electro-forming member because the hetero-material has elasticity. Also, silicon serves to facilitate detachment of the electro-forming member.
The present invention is characterized by the electro-forming master, its manufacturing method, and the metal minute pattern repeatedly formed by the electro-forming master.
INDUSTRIAL APPLICABILITY
The present invention is characterized in that the electro-forming master including the insulating hetero- material is used to repeatedly form a metal minute pattern. Preferably, the insulating hetero-material of the present invention has elasticity to facilitate detachment of the electro-forming member during the electro-forming process. The hardened register conventionally used for the electro-forming process is damaged or the electro-forming member is damaged by the register when the grown electro-forming member is detached from the electro-forming master. However, in the present invention, the insulating hetero-material having elasticity is not affected by detachment of the electro-forming member. Therefore, the hetero-material of the present invention can repeatedly be used. There has been a conventional method for forming a metal minute pattern by an electro-forming process based on a hardened register on an electrode base. Strong stress occurs between the hardened register and the electro- forming member. The electro-forming member affects the register and vice versa. In this case, if detachment of the electro-forming member is performed, the electro- forming member or the register is to be damaged. If strong material is selected so as not to damage the register, the electro-forming member is to be damaged. For this reason, the register for the electro-forming process has been conventionally considered a temporary use. However, the insulating hetero-material having elasticity is used in the present invention instead of the hardened register, so that the metal minute pattern can repeatedly be formed by more simple process than the conventional process.
Furthermore, the conventional etching process for forming a metal minute pattern has limitation because it employs a method based on metal corrosion. The etching process causes corroded' material to be necessarily removed. However, in the present invention, the metal minute pattern is formed by the electro-forming process that can obtain more precise metal pattern than a metal pattern obtained by the etching process. Unlike the etching process, since only material required for the metal minute pattern is used for the electro-forming master, waste of material is avoided.
While the present invention has been described and illustrated herein with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made therein without departing from the spirit and scope of the invention. Thus, it is intended that the present invention covers the modifications and variations of this invention that come within the scope of the appended claims and their equivalents .

Claims

What is claimed is:
1. An electro-forming master which forms a metal minute pattern by an electro-forming process, the electro-forming master comprising: a concave portion formed on an upper surface of an electrode base; and an insulating hetero-material portion formed by filling an insulating hetero-material in the concave portion, wherein the surface of the insulating hetero- material portion is flush with the surface of the concave portion.
2. The electro-forming master according to claim 1, wherein the concave portion is formed by an etching process .
3. The electro-forming master according to claim 1, wherein the concave portion is formed by a mechanical process or a laser process.
4. The electro-forming master according to claim 1, 2 or 3, wherein the insulating hetero-material portion has elasticity.
5. The electro-forming master according to claim 1, 2 or 3, wherein the insulating hetero-material portion has foaming property.
6. The electro-forming master according to claim 4, wherein the insulating hetero-material portion having elasticity includes silicon as a main component.
7. A method for manufacturing an electro-forming master which forms a metal minute pattern by an electro- forming process, the method comprising the steps of: forming a concave portion on an upper surface of an electrode base; and forming an insulating hetero-material portion by filling an insulating hetero-material in the concave portion, wherein the surface of the insulating hetero- material portion is flush with the surface of the concave portion.
8. The method according to claim 7, wherein ~ the concave portion is formed by an etching process.
9. The method according to claim 7, wherein the concave portion is formed by a mechanical process or a laser process.
10. The method according to claim 7, 8 or 9, wherein the insulating hetero-material portion has elasticity.
11. The method according to claim 7, 8 or 9, wherein the insulating hetero-material portion has foaming property.
12. The method according to claim 10, wherein the insulating hetero-material portion having elasticity includes silicon as a main component.
13. A metal minute pattern formed by performing an electro-forming process in an electro-forming master, the metal minute pattern comprising: a concave portion formed on an upper surface of an electrode base; and an insulating hetero-material portion formed by filling an insulating hetero-material in the concave portion, wherein the surface of the insulating hetero- material portion is flush with the surface of the concave portion.
14. The metal minute pattern according to claim 13, wherein the concave portion is formed by an etching process .
15. The metal minute pattern according to claim 13, wherein the concave portion is formed by a mechanical process or a laser process.
1,6. The metal minute pattern according to claim 13, 14 or 15, wherein the insulating hetero-material portion has elasticity.
17. The metal minute pattern according to claim 13, 14 or 15, wherein the insulating hetero-material portion has foaming property.
18. The metal minute pattern according to claim 16, wherein the insulating hetero-material portion having elasticity includes silicon as a main component.
PCT/KR2003/002779 2002-12-20 2003-12-19 Electro-forming master, its manufacturing method, and metal minute pattern made by it Ceased WO2004057669A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003289552A AU2003289552A1 (en) 2002-12-20 2003-12-19 Electro-forming master, its manufacturing method, and metal minute pattern made by it

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020020084669A KR20040055536A (en) 2002-12-20 2002-12-20 Chip on film by electroplating and its manufacturing method.
KR10-2002-0084669 2002-12-20
KR1020020085639A KR20040055538A (en) 2002-12-21 2002-12-21 Jeonju master and manufacturing method
KR10-2002-0085639 2002-12-21

Publications (1)

Publication Number Publication Date
WO2004057669A1 true WO2004057669A1 (en) 2004-07-08

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WO (1) WO2004057669A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03144652A (en) * 1989-10-31 1991-06-20 Mita Ind Co Ltd Electrophotographic sensitive body
JPH0649679A (en) * 1992-08-03 1994-02-22 Dainippon Printing Co Ltd Formation of fine pattern
JPH09133915A (en) * 1995-11-09 1997-05-20 Matsushita Electric Ind Co Ltd Fine pattern forming method, master substrate, and color filter formed using the same
JPH10319222A (en) * 1997-05-16 1998-12-04 Matsushita Electric Ind Co Ltd Manufacturing method of fine pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03144652A (en) * 1989-10-31 1991-06-20 Mita Ind Co Ltd Electrophotographic sensitive body
JPH0649679A (en) * 1992-08-03 1994-02-22 Dainippon Printing Co Ltd Formation of fine pattern
JPH09133915A (en) * 1995-11-09 1997-05-20 Matsushita Electric Ind Co Ltd Fine pattern forming method, master substrate, and color filter formed using the same
JPH10319222A (en) * 1997-05-16 1998-12-04 Matsushita Electric Ind Co Ltd Manufacturing method of fine pattern

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