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WO2002038490A3 - Procede de production de structures sandwich verre-silicium-verre - Google Patents

Procede de production de structures sandwich verre-silicium-verre Download PDF

Info

Publication number
WO2002038490A3
WO2002038490A3 PCT/DE2001/004141 DE0104141W WO0238490A3 WO 2002038490 A3 WO2002038490 A3 WO 2002038490A3 DE 0104141 W DE0104141 W DE 0104141W WO 0238490 A3 WO0238490 A3 WO 0238490A3
Authority
WO
WIPO (PCT)
Prior art keywords
glass
silicon
sandwich structures
substrate
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/004141
Other languages
German (de)
English (en)
Other versions
WO2002038490A2 (fr
Inventor
Steffen Howitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Original Assignee
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH filed Critical GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority to EP01993578A priority Critical patent/EP1332106A2/fr
Publication of WO2002038490A2 publication Critical patent/WO2002038490A2/fr
Publication of WO2002038490A3 publication Critical patent/WO2002038490A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un procédé de production de structures sandwich verre-silicium-verre assemblées de manière mutuellement réglée et irréversible. Ces structures comprennent un substrat de verre inférieur (2), un substrat de verre supérieur (3) et, intercalé entre ces deux substrats, un substrat de silicium intermédiaire (1). Au moins un substrat (1, 2, ou 3) est pourvu d'une structure 3-D profonde. Pour obtenir un procédé de fabrication économique, notamment pour une production de masse de structures sandwich verre-silicium-verre, le substrat de silicium (1) est relié, de façon irréversible avant ou après sa structuration 3D profonde, à un substrat de verre (2 ou 3) par liaison anodique. La liaison est amincie par un procédé de meulage, de gravure et de polissage sur le côté verre et/ou silicium et réduite une épaisseur finale. Ensuite, la surface de silicium restante est assemblée au deuxième substrat de verre (3; 2) par liaison anodique.
PCT/DE2001/004141 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre Ceased WO2002038490A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01993578A EP1332106A2 (fr) 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10055155 2000-11-07
DE10055155.6 2000-11-07

Publications (2)

Publication Number Publication Date
WO2002038490A2 WO2002038490A2 (fr) 2002-05-16
WO2002038490A3 true WO2002038490A3 (fr) 2002-08-15

Family

ID=7662439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004141 Ceased WO2002038490A2 (fr) 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre

Country Status (2)

Country Link
EP (1) EP1332106A2 (fr)
WO (1) WO2002038490A2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000335A1 (fr) * 1986-06-30 1988-01-14 Rosemount Inc. Detecteur de pression differentielle
EP0389071A2 (fr) * 1989-01-30 1990-09-26 Dresser Industries Inc. Methode de fabrication de membranes semiconductrices
DE4409068A1 (de) * 1994-03-14 1996-01-25 Mannesmann Ag Bondverfahren und Bondinterface zur Durchführung des Bondverfahrens
WO1998047712A1 (fr) * 1997-04-18 1998-10-29 Topaz Technologies, Inc. Plaque de buse pour tete d'impression par jet d'encre

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4318407A1 (de) 1993-06-03 1994-12-08 Rossendorf Forschzent Mikrokapillare mit integrierten chemischen Mikrosensoren und Verfahren zu ihrer Herstellung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000335A1 (fr) * 1986-06-30 1988-01-14 Rosemount Inc. Detecteur de pression differentielle
EP0389071A2 (fr) * 1989-01-30 1990-09-26 Dresser Industries Inc. Methode de fabrication de membranes semiconductrices
DE4409068A1 (de) * 1994-03-14 1996-01-25 Mannesmann Ag Bondverfahren und Bondinterface zur Durchführung des Bondverfahrens
WO1998047712A1 (fr) * 1997-04-18 1998-10-29 Topaz Technologies, Inc. Plaque de buse pour tete d'impression par jet d'encre

Also Published As

Publication number Publication date
EP1332106A2 (fr) 2003-08-06
WO2002038490A2 (fr) 2002-05-16

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