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WO2002038490A3 - Method for producing glass-silicon-glass sandwich structures - Google Patents

Method for producing glass-silicon-glass sandwich structures Download PDF

Info

Publication number
WO2002038490A3
WO2002038490A3 PCT/DE2001/004141 DE0104141W WO0238490A3 WO 2002038490 A3 WO2002038490 A3 WO 2002038490A3 DE 0104141 W DE0104141 W DE 0104141W WO 0238490 A3 WO0238490 A3 WO 0238490A3
Authority
WO
WIPO (PCT)
Prior art keywords
glass
silicon
sandwich structures
substrate
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/004141
Other languages
German (de)
French (fr)
Other versions
WO2002038490A2 (en
Inventor
Steffen Howitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Original Assignee
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH filed Critical GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority to EP01993578A priority Critical patent/EP1332106A2/en
Publication of WO2002038490A2 publication Critical patent/WO2002038490A2/en
Publication of WO2002038490A3 publication Critical patent/WO2002038490A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Micromachines (AREA)

Abstract

The invention relates to a method for producing glass-silicon-glass sandwich structures which are connected irreversibly and in such a way that they are adjusted to correspond. Said structures consist of a bottom and a top glass substrate (2, 3) and a silicon substrate (1) in-between. At least one of the substrates (1; 2; 3) is provided with 3D depth structuring. The aim of the invention is to provide a low-cost production method, especially with a view to mass production of glass-silicon-glass sandwich structures. To this end, the silicon substrate (1) is irreversibly connected to one of the glass substrates (2; 3) before or after the 3D depth structuring. The bond is reduced to a predetermined end thickness from the glass and/or the silicon side by means of grinding, etching and polishing methods and the remaining silicon surface is then connected to a second glass substrate (3; 2) by anodic bonding.
PCT/DE2001/004141 2000-11-07 2001-11-07 Method for producing glass-silicon-glass sandwich structures Ceased WO2002038490A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01993578A EP1332106A2 (en) 2000-11-07 2001-11-07 Method for producing glass-silicon-glass sandwich structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10055155 2000-11-07
DE10055155.6 2000-11-07

Publications (2)

Publication Number Publication Date
WO2002038490A2 WO2002038490A2 (en) 2002-05-16
WO2002038490A3 true WO2002038490A3 (en) 2002-08-15

Family

ID=7662439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004141 Ceased WO2002038490A2 (en) 2000-11-07 2001-11-07 Method for producing glass-silicon-glass sandwich structures

Country Status (2)

Country Link
EP (1) EP1332106A2 (en)
WO (1) WO2002038490A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000335A1 (en) * 1986-06-30 1988-01-14 Rosemount Inc. Differential pressure sensor
EP0389071A2 (en) * 1989-01-30 1990-09-26 Dresser Industries Inc. Method for fabricating semiconductor diaphragms
DE4409068A1 (en) * 1994-03-14 1996-01-25 Mannesmann Ag Oxidised silicon layer to boron-silicate glass bonding method
WO1998047712A1 (en) * 1997-04-18 1998-10-29 Topaz Technologies, Inc. Nozzle plate for an ink jet print head

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4318407A1 (en) 1993-06-03 1994-12-08 Rossendorf Forschzent Microcapillary with integrated chemical microsensors and process for their manufacture

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000335A1 (en) * 1986-06-30 1988-01-14 Rosemount Inc. Differential pressure sensor
EP0389071A2 (en) * 1989-01-30 1990-09-26 Dresser Industries Inc. Method for fabricating semiconductor diaphragms
DE4409068A1 (en) * 1994-03-14 1996-01-25 Mannesmann Ag Oxidised silicon layer to boron-silicate glass bonding method
WO1998047712A1 (en) * 1997-04-18 1998-10-29 Topaz Technologies, Inc. Nozzle plate for an ink jet print head

Also Published As

Publication number Publication date
EP1332106A2 (en) 2003-08-06
WO2002038490A2 (en) 2002-05-16

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