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WO2002038490A2 - Procede de production de structures sandwich verre-silicium-verre - Google Patents

Procede de production de structures sandwich verre-silicium-verre Download PDF

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Publication number
WO2002038490A2
WO2002038490A2 PCT/DE2001/004141 DE0104141W WO0238490A2 WO 2002038490 A2 WO2002038490 A2 WO 2002038490A2 DE 0104141 W DE0104141 W DE 0104141W WO 0238490 A2 WO0238490 A2 WO 0238490A2
Authority
WO
WIPO (PCT)
Prior art keywords
glass
silicon substrate
silicon
substrate
anodic bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2001/004141
Other languages
German (de)
English (en)
Other versions
WO2002038490A3 (fr
Inventor
Steffen Howitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Original Assignee
GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH filed Critical GeSiM Gesellschaft fur Silizium-Mikrosysteme mbH
Priority to EP01993578A priority Critical patent/EP1332106A2/fr
Publication of WO2002038490A2 publication Critical patent/WO2002038490A2/fr
Publication of WO2002038490A3 publication Critical patent/WO2002038490A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Definitions

  • the invention relates to a method for producing irreversibly and aligned interconnected glass-silicon-glass sandwich structures, consisting of a lower and an upper glass substrate, and an intermediate silicon substrate, at least one of the substrates being provided with a 3-D depth structuring ,
  • EP 0 633 468 A2 describes a process for the production of three-dimensional microcapillaries for the production of complex microsystems, which allows the integration of singular sensor elements using special fluidic, mechanical, electrical interface elements, the so-called channel stoppers.
  • a disadvantage of this technology can be seen in the fact that the height of the microchannel cannot deviate from the specified thickness of the silicon substrate used, which is usually a few hundred micrometers, and therefore extremely small channel volumes of 150 ... 5 nl / cm can hardly be achieved are.
  • PCT / DE 00/00768 describes a manufacturing technology for manufacturing 3-D manifolds, which is based on the use of low-temperature cofiring ceramic (short: LTCC - ceramic) and names the possibility as a specific advantage Integrate intersecting fluidic and electrical functional levels in a compact module. Cons This technology means that channel systems with channel volumes below 2 ⁇ l / cm cannot be produced in this way and that the surface quality of the ceramic material is significantly poorer because of the porosity of the materials silicon and glass. For extreme low-volume applications, this method is therefore [generally not suitable.
  • SOI wafer material silicon on insulator
  • Si-Si fusion bond 1000 ° C. for several hours.
  • the disadvantage of the high material costs and the large additional technological expenditure in the production should be countered with the introduction of the production technology according to the invention.
  • the invention has for its object to provide an inexpensive manufacturing process, particularly with a view to the mass production of glass-silicon-glass sandwich structures, which is also suitable for applications in, for example, molecular biology or biotechnology. -.
  • the object on which the invention is based is achieved in that the silicon substrate is irreversibly connected to one of the glass substrates by anodic bonding before or after its 3-D deep structuring, the bond by means of grinding, etching and polishing methods of the glass and / or Silicon side is thinned to a predetermined final thickness and that the remaining silicon surface is subsequently connected to a second In glass substrate by anodic bonding.
  • subclaims 2 and 3 show two advantageous variants of the method according to the invention.
  • FIG. 1 shows:
  • the glass-silicon-glass sandwich structures according to the invention can be used, for example, as a microreaction space in chemical analysis, the status of the chemical reaction taking place in the microcapillary 4 being able to be queried online and, due to the transparent structure, preferably by means of optical detection methods.
  • the special feature of the manufacturing process according to the invention is that the manufacture of glass-silicon-glass sandwich structures is technically possible even with the smallest channel geometries or the smallest 3-D depth structuring and can also be carried out particularly economically and in bulk.
  • the SOG process is to be understood as a silicon-on-glass process, in which the silicon substrate 1 is either attached unstructured to a glass substrate 3 by anodic bonding and subsequently thinned (variant I), or the silicon substrate 1 is structured, then with the structured one Side is fixed on the glass substrate 2 by anodic bonding and subsequently thinned (variant II).
  • variant which variant can be used depends on the design and the required quality characteristics of the end product.
  • the masking of the silicon substrate 1 by Coatings are carried out, which has been applied to the surface of the silicon substrate 1 by spin coating from Fotopolyme.ren or by a CVD coating.
  • the deep etching by wet chemical or dry chemical, anisotropically working deep etching processes is used.
  • the masking of the silicon substrate 1 is necessary, which is done by means of structured photoresists, structured metal layers or also by structured inorganic insulator layers.
  • the structured metal layers can consist of aluminum. Si0 2 or Si 3 N 4 can be used as the inorganic insulator layers.
  • Variant I of the process for producing a glass-silicon-glass sandwich structure comprises the following steps:
  • the process comprises the following steps:
  • the typical lateral dimensions of the microcapillary 4 ie the length, width and height of the microchannel, can be any value from a few 5 ⁇ m.
  • the microcapillary can take any shape and can also be connected to a microreaction space or the like.
  • Such electrode systems can be transparent or non-transparent, but in any case they can be extremely thin.
  • holes 5 can be provided in one or both glass substrates 2, 3, which ensures access perpendicular to the course of the microchannel 4.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un procédé de production de structures sandwich verre-silicium-verre assemblées de manière mutuellement réglée et irréversible. Ces structures comprennent un substrat de verre inférieur (2), un substrat de verre supérieur (3) et, intercalé entre ces deux substrats, un substrat de silicium intermédiaire (1). Au moins un substrat (1, 2, ou 3) est pourvu d'une structure 3-D profonde. Pour obtenir un procédé de fabrication économique, notamment pour une production de masse de structures sandwich verre-silicium-verre, le substrat de silicium (1) est relié, de façon irréversible avant ou après sa structuration 3D profonde, à un substrat de verre (2 ou 3) par liaison anodique. La liaison est amincie par un procédé de meulage, de gravure et de polissage sur le côté verre et/ou silicium et réduite une épaisseur finale. Ensuite, la surface de silicium restante est assemblée au deuxième substrat de verre (3; 2) par liaison anodique.
PCT/DE2001/004141 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre Ceased WO2002038490A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01993578A EP1332106A2 (fr) 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10055155 2000-11-07
DE10055155.6 2000-11-07

Publications (2)

Publication Number Publication Date
WO2002038490A2 true WO2002038490A2 (fr) 2002-05-16
WO2002038490A3 WO2002038490A3 (fr) 2002-08-15

Family

ID=7662439

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/004141 Ceased WO2002038490A2 (fr) 2000-11-07 2001-11-07 Procede de production de structures sandwich verre-silicium-verre

Country Status (2)

Country Link
EP (1) EP1332106A2 (fr)
WO (1) WO2002038490A2 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633468A2 (fr) 1993-06-03 1995-01-11 Forschungszentrum Rossendorf e.V. Microcapillaire avec des microcapteurs chimiques intégrés et procédé pour sa fabrication

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL82960A0 (en) * 1986-06-30 1987-12-20 Rosemount Inc Differential pressure sensor
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
DE4409068C2 (de) * 1994-03-14 1998-05-28 Hartmann & Braun Ag Bondverfahren und damit hergestellte Bondverbindung
AU7247198A (en) * 1997-04-18 1998-11-13 Topaz Technologies, Inc. Nozzle plate for an ink jet print head

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0633468A2 (fr) 1993-06-03 1995-01-11 Forschungszentrum Rossendorf e.V. Microcapillaire avec des microcapteurs chimiques intégrés et procédé pour sa fabrication

Also Published As

Publication number Publication date
EP1332106A2 (fr) 2003-08-06
WO2002038490A3 (fr) 2002-08-15

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