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WO2001050198A3 - Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme - Google Patents

Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme Download PDF

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Publication number
WO2001050198A3
WO2001050198A3 PCT/DE2000/004393 DE0004393W WO0150198A3 WO 2001050198 A3 WO2001050198 A3 WO 2001050198A3 DE 0004393 W DE0004393 W DE 0004393W WO 0150198 A3 WO0150198 A3 WO 0150198A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
production
volumetric
dimensionally arranged
connecting structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/DE2000/004393
Other languages
English (en)
French (fr)
Other versions
WO2001050198A2 (de
Inventor
Reiner Goetzen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AU31504/01A priority Critical patent/AU757191B2/en
Priority to JP2001550494A priority patent/JP2003519039A/ja
Priority to US09/914,585 priority patent/US6805829B2/en
Priority to EP00991054A priority patent/EP1196820A2/de
Priority to CA002362387A priority patent/CA2362387C/en
Publication of WO2001050198A2 publication Critical patent/WO2001050198A2/de
Priority to IS6064A priority patent/IS6064A/is
Priority to NO20014209A priority patent/NO328157B1/no
Publication of WO2001050198A3 publication Critical patent/WO2001050198A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0075—Light guides, optical cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optical Integrated Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Waveguides (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Laminated Bodies (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme. Dabei werden zur Erzeugung der Schichten unterschiedliche lichtaushärtende Materialien verwendet. Beim Austausch der Materialien werden auch die Schichtenbereiche mit neuem Material gefüllt, in denen bei der vorhergehenden Aushärtung keine Aushärtung stattfand, so dass bei der darauffolgenden Aushärtung nicht nur die oberste Schicht mit der darunterliegenden verbunden wird, sondern auch Material der obersten Schicht mit dem Material einer unterhalb der vorletzten Schicht liegenden Schicht verbunden wird. Damit ist es möglich, innerhalb der Schichtenfolge eine Struktur mit anderen Eigenschaften von Lage zu Lage miteinander zu verbinden.
PCT/DE2000/004393 1999-12-31 2000-12-08 Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme Ceased WO2001050198A2 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU31504/01A AU757191B2 (en) 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
JP2001550494A JP2003519039A (ja) 1999-12-31 2000-12-08 体積流およびエネルギー流のための、３次元的に配置された導体構造および接続構造の製造方法
US09/914,585 US6805829B2 (en) 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
EP00991054A EP1196820A2 (de) 1999-12-31 2000-12-08 Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme
CA002362387A CA2362387C (en) 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
IS6064A IS6064A (is) 1999-12-31 2001-08-28 Aðferð til að framleiða leiðni- og tengibúnað semkomið er fyrir í þrívídd fyrir rúmmáls- og orkuflæði
NO20014209A NO328157B1 (no) 1999-12-31 2001-08-30 Fremgangsmate for frembringelse av tredimensjonalt anordnede lednings- og forbindelsesstrukturer for volum- og energistrommer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19964099.8 1999-12-31
DE19964099A DE19964099B4 (de) 1999-12-31 1999-12-31 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme

Publications (2)

Publication Number Publication Date
WO2001050198A2 WO2001050198A2 (de) 2001-07-12
WO2001050198A3 true WO2001050198A3 (de) 2002-01-17

Family

ID=7935210

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/004393 Ceased WO2001050198A2 (de) 1999-12-31 2000-12-08 Verfahren zur herstellung dreidimensional angeordneter leit- und verbindungsstrukturen für volumen- und energieströme

Country Status (13)

Country Link
US (1) US6805829B2 (de)
EP (1) EP1196820A2 (de)
JP (1) JP2003519039A (de)
KR (1) KR100652036B1 (de)
CN (1) CN1211197C (de)
AU (1) AU757191B2 (de)
CA (1) CA2362387C (de)
DE (1) DE19964099B4 (de)
IS (1) IS6064A (de)
NO (1) NO328157B1 (de)
RU (1) RU2242063C2 (de)
TW (1) TWI248555B (de)
WO (1) WO2001050198A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme
DE10102063A1 (de) * 2001-01-17 2002-07-25 Alpha Technology Ges Fuer Ange Analysechip mit mehreren funktionalen Ebenen für elektrofokussiertes Spotten
DE102004013161B4 (de) * 2004-03-17 2008-04-10 microTec Gesellschaft für Mikrotechnologie mbH Mikrofluidik-Chip
DE102006008332B4 (de) * 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
US20070074579A1 (en) * 2005-10-03 2007-04-05 Honeywell International Inc. Wireless pressure sensor and method of forming same
DE102009050325B4 (de) * 2009-10-22 2014-03-20 Amphenol-Tuchel Electronics Gmbh Kontaktiervorrichtung und Verfahren zur Herstellung einer Kontaktiervorrichtung, Band mit Kontaktiervorrichtungen sowie SIM-Block
US10828828B2 (en) * 2016-11-08 2020-11-10 Flex Ltd. Method of manufacturing a part

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232024A (ja) * 1988-03-14 1989-09-18 Mitsui Eng & Shipbuild Co Ltd 光硬化性樹脂を用いた３次元模型の製造方法
US5173220A (en) * 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
EP0523981A1 (de) * 1991-07-15 1993-01-20 Fritz B. Prinz Verfahren zur Herstellung elektronischer Packungen und intelligente Strukturen durch thermisches Sprühen
EP0581445A1 (de) * 1992-07-31 1994-02-02 Texas Instruments Incorporated Verfahren und Vorrichtung zum rechnergesteuerten Herstellen aus Rechnerdaten von dreidimensionalen Gegenständen
US5398193A (en) * 1993-08-20 1995-03-14 Deangelis; Alfredo O. Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
DE4420996A1 (de) * 1994-06-16 1996-01-11 Reiner Dipl Ing Goetzen Herstellung von mikromechanischen und mikrooptischen Bauelementen sowie komplexer Mikrosysteme

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69206443T2 (de) * 1991-01-31 1996-05-30 Texas Instruments Inc Verfahren und Vorrichtung zur rechnergesteuerten Herstellung von dreidimensionalen Gegenständen aus Rechnerdaten.
WO1993020993A1 (en) * 1992-04-15 1993-10-28 Soane Technologies, Inc. Rapid prototype three-dimensional stereolithography
US5264061A (en) * 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
DE4332982A1 (de) * 1993-09-28 1995-03-30 Eos Electro Optical Syst Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts
DE19539039C2 (de) * 1994-06-16 1999-11-11 Reiner Goetzen Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen sowie komplexen Mikrosystemen
RU2210834C2 (ru) * 1998-01-28 2003-08-20 Тин Филм Электроникс Аса Способ формирования электропроводящих и/или полупроводниковых трехмерных структур, способ уничтожения этих структур и генератор/модулятор электрического поля для использования в способе формирования
RU2129320C1 (ru) * 1998-05-22 1999-04-20 Гурович Борис Аронович Способ формирования проводящей структуры
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232024A (ja) * 1988-03-14 1989-09-18 Mitsui Eng & Shipbuild Co Ltd 光硬化性樹脂を用いた３次元模型の製造方法
US5173220A (en) * 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
EP0523981A1 (de) * 1991-07-15 1993-01-20 Fritz B. Prinz Verfahren zur Herstellung elektronischer Packungen und intelligente Strukturen durch thermisches Sprühen
EP0581445A1 (de) * 1992-07-31 1994-02-02 Texas Instruments Incorporated Verfahren und Vorrichtung zum rechnergesteuerten Herstellen aus Rechnerdaten von dreidimensionalen Gegenständen
US5398193A (en) * 1993-08-20 1995-03-14 Deangelis; Alfredo O. Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
US5398193B1 (en) * 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
DE4420996A1 (de) * 1994-06-16 1996-01-11 Reiner Dipl Ing Goetzen Herstellung von mikromechanischen und mikrooptischen Bauelementen sowie komplexer Mikrosysteme

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 559 (M - 905) 12 December 1989 (1989-12-12) *

Also Published As

Publication number Publication date
JP2003519039A (ja) 2003-06-17
KR20010105354A (ko) 2001-11-28
EP1196820A2 (de) 2002-04-17
KR100652036B1 (ko) 2006-11-30
IS6064A (is) 2001-08-28
CN1358131A (zh) 2002-07-10
DE19964099A1 (de) 2001-09-13
DE19964099B4 (de) 2006-04-06
CN1211197C (zh) 2005-07-20
AU757191B2 (en) 2003-02-06
CA2362387A1 (en) 2001-07-12
CA2362387C (en) 2007-09-11
AU3150401A (en) 2001-07-16
NO20014209L (no) 2001-10-25
RU2242063C2 (ru) 2004-12-10
US20020125612A1 (en) 2002-09-12
WO2001050198A2 (de) 2001-07-12
NO328157B1 (no) 2009-12-21
US6805829B2 (en) 2004-10-19
NO20014209D0 (no) 2001-08-30
TWI248555B (en) 2006-02-01

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