[go: up one dir, main page]

TWI248555B - Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows - Google Patents

Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows Download PDF

Info

Publication number
TWI248555B
TWI248555B TW089126539A TW89126539A TWI248555B TW I248555 B TWI248555 B TW I248555B TW 089126539 A TW089126539 A TW 089126539A TW 89126539 A TW89126539 A TW 89126539A TW I248555 B TWI248555 B TW I248555B
Authority
TW
Taiwan
Prior art keywords
layer
chemical
materials
structured
physical
Prior art date
Application number
TW089126539A
Other languages
English (en)
Inventor
Reiner Gotzen
Original Assignee
Reiner Gotzen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reiner Gotzen filed Critical Reiner Gotzen
Application granted granted Critical
Publication of TWI248555B publication Critical patent/TWI248555B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0075—Light guides, optical cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optical Integrated Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Waveguides (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Moulding By Coating Moulds (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Description

A7 1248555 ___B7 _ 五、發明說明（/ ) (請先閱讀背面之注意事項再填寫本頁) 本發明關於一種製造供體積流及能量流用的三度空間 排列的傳導與連接構造的方法。此能量流可具有聲音、電 氣、磁性、或電磁的性質。 這類體積流與能量流在今日一般利用許多不同技術達 成。對於微系統技術而言，導電路（電路板上的線路狀銅 箔）與「結合電線」是最常用的運送路徑。要運送電磁能 量，除了空心導體（Hohlleiter)外還用玻璃纖維。而體積 流則利用流道、軟管及管路運送。在日益迷你化的場合， 這些傳導與連接元件仍極難整合。 本發明解決此問題之道係使用構造化（strukturieren) 的層狀結構。層構建方法係在微技術習知者。因而德專利 DE-PS 44 20 996提到一種方法，其中在二個互相平行的板 (它們之中至少有一個可通過電磁波）之間少量的可用光 硬化的塑膠利用表面張力保持住，舉例而言，在該可透過 電磁波的板下方的塑膠液表面利用雷射光束硬化，該雷射 光係依照所要產生的構造的一種三層式模型（該模型儲存 在一連接的電腦中）沿該表面上被導引作照射。此雷射光 使塑膠液依該三度空間的層模型一層接一層地硬化，如此 板的距離變大了一個層的厚度，因此新鮮的塑膠材料僅靠 其表面張力就能後流到硬化之層與板之間產生的中間空間 中，依此方式可以很準確地產生微米範圍的構造。 本發明要利用這種技術。 在此利用不同之光硬化材料以產生該層，這些材料^ 具不同物理、化學與生物性質，例如有導電性、電絕綠性 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） V1248555 A7 B7
I 五、發明說明 、不同光折射指2。在更換材料時，也膽岭 材料填滿（在先前_化程序中，該空片段 2新 ，因此在瞧的，不贿上卵=化） 接合，而且最上層的材料也和次上層下方那靥層 到-層地互相接合，瞻作體難的_者，'係 化的區域’ Μ些職在硬化及冲綱程後可紗 同樣地、，如果流道的壁由具有相對應性質的材^則 追些流道也可用於作闻頻率的空心導體。 利用具有不同折射指數的材料可產生導光的構造。這 種導光構造可用於連接光電晶體（關鍵字：光切換光）成 光積體電路。 大 用此方式也可將傳統積體電路（IC)互相連接’如此 在上-個表面下將-1C整合在-空腔中，如此可經由該接 頭〔墊（pad)產生一條具有傳導材料的流道，該材料可再 一直通到其他1C或用此方式製造的插頭。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 請 先 閱 讀 背 |
頁 訂

Claims (1)

1248555 韶 C8 D8 六、申請專利範圍 業時未硬化的材料； ..................I-----0^------ (請先閱讀背面之注意事項再塡寫本頁) (g) 將未被材料充塡的區域依所要製的系統而定設以電 子式、機械式、光學式或化學式構件； (h) 將該構造化的層及構件利用具不同物理、化學、生 物性質的液態可光硬化的材料充塡，並蓋以一定的層厚度 的由液態可光硬化的材料構成的層，如此造成具有相同物 理、化學或生物性質的材料的結合，或這些材料的隔絕， 以造成構成構件的結合； .⑴重覆步驟(a)〜(h)直到三度空間構成建構起來爲止， 其中在二個平面平行的板之間隨少量的光硬化塑膠產生各 層，其中 有數個電子、機械或化學的構件互相結合，且這種構 件之間以及系統環境之間結合可用於體積及能量流。 2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 1248555 -—— 9a 3 3d' I t 'x # i·' · ..D8_ -- nr-il I _ 六、申請專利日不爹正 l · 一_植製造供liifk及能量流用的三度空間排列的 傳導與連接構造的方法’用該傳導與連接構造形成層狀構 造的複雜微系統，其中各層利用少量光硬化的塑膠在二個 平面平行的板之間產生，其中至少有一板可通過電磁液， 且該少量的塑膠利用表面張力保持住，其中該薄層利用該 電磁波藉著所要產生的構造的一種層狀三度空間的層模型 照射，且該電磁波利用這種模型一層一層地在所照射的位 置構造化及硬化，其中該板間的距離在各步驟對應的層厚 度加大，因此新鮮的塑膠材料可補充流入該二板之間的中 間空間’其特徵在：包含以下方法步驟⑻〜⑴： (a) 將一液態可光硬化的有所選之物理、化學、生物性 質的材作構造化式的鞏固而產生一構造化的層； (b) 將此構造化的層用冲刷程序洗，除去硬化的材料， 並用具有其他物理、化學或生物性質的液態可光硬化材料 充塡，並層蓋一定之層厚度的相同材料； (c) 利用構造化式鞏固作用，將第一層的區域與新的層 作構造化式的硬化； (d) 將構造化的層作冲刷作業，將上一次構造化未硬化 的材料除去，並用具有其他物理、化學及生物性質的液態 可光硬化材料充塡並依蓋到一定的層厚度； (e) 利用構造化式鞏固作用將第二層及新的層作構造化 硬化，如此將具有相同物理、化學或生物性質的材料接合 或造成該材料之絕緣； ⑴將此構造化之層利用冲刷過程，除去上次構造化作 1 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) ........................…… (請先閲讀背面之注意事項再塡寫本頁) 、1Tf
TW089126539A 1999-12-31 2000-12-13 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows TWI248555B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19964099A DE19964099B4 (de) 1999-12-31 1999-12-31 Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme

Publications (1)

Publication Number Publication Date
TWI248555B true TWI248555B (en) 2006-02-01

Family

ID=7935210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089126539A TWI248555B (en) 1999-12-31 2000-12-13 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows

Country Status (13)

Country Link
US (1) US6805829B2 (zh)
EP (1) EP1196820A2 (zh)
JP (1) JP2003519039A (zh)
KR (1) KR100652036B1 (zh)
CN (1) CN1211197C (zh)
AU (1) AU757191B2 (zh)
CA (1) CA2362387C (zh)
DE (1) DE19964099B4 (zh)
IS (1) IS6064A (zh)
NO (1) NO328157B1 (zh)
RU (1) RU2242063C2 (zh)
TW (1) TWI248555B (zh)
WO (1) WO2001050198A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme
DE10102063A1 (de) * 2001-01-17 2002-07-25 Alpha Technology Ges Fuer Ange Analysechip mit mehreren funktionalen Ebenen für elektrofokussiertes Spotten
DE102004013161B4 (de) * 2004-03-17 2008-04-10 microTec Gesellschaft für Mikrotechnologie mbH Mikrofluidik-Chip
DE102006008332B4 (de) * 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
US20070074579A1 (en) * 2005-10-03 2007-04-05 Honeywell International Inc. Wireless pressure sensor and method of forming same
DE102009050325B4 (de) * 2009-10-22 2014-03-20 Amphenol-Tuchel Electronics Gmbh Kontaktiervorrichtung und Verfahren zur Herstellung einer Kontaktiervorrichtung, Band mit Kontaktiervorrichtungen sowie SIM-Block
US10828828B2 (en) * 2016-11-08 2020-11-10 Flex Ltd. Method of manufacturing a part

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232024A (ja) * 1988-03-14 1989-09-18 Mitsui Eng & Shipbuild Co Ltd 光硬化性樹脂を用いた３次元模型の製造方法
ATE131111T1 (de) * 1991-01-31 1995-12-15 Texas Instruments Inc Verfahren und vorrichtung zur rechnergesteuerten herstellung von dreidimensionalen gegenständen aus rechnerdaten.
US6175422B1 (en) * 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
US5173220A (en) * 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
EP0640034A4 (en) * 1992-04-15 1995-08-30 Soane Technologies Inc THREE-DIMENSIONAL STEREOLITHOGRAPHY FOR QUICKLY PROTOTYPE PRODUCTION.
US5264061A (en) * 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
US5398193B1 (en) * 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
DE4332982A1 (de) * 1993-09-28 1995-03-30 Eos Electro Optical Syst Verfahren und Vorrichtung zum Herstellen eines dreidimensionalen Objekts
DE19539039C2 (de) * 1994-06-16 1999-11-11 Reiner Goetzen Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen sowie komplexen Mikrosystemen
DE4420996C2 (de) * 1994-06-16 1998-04-09 Reiner Dipl Ing Goetzen Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen
DE69937485T2 (de) * 1998-01-28 2008-08-21 Thin Film Electronics Asa Methode zur herstellung zwei- oder dreidimensionaler elektrisch leitender oder halbleitender strukturen, eine löschmethode derselben und ein generator/modulator eines elektrischen feldes zum gebrauch in der herstellungsmethode
RU2129320C1 (ru) * 1998-05-22 1999-04-20 Гурович Борис Аронович Способ формирования проводящей структуры
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
DE19964099B4 (de) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Verfahren zur Herstellung dreidimensional angeordneter Leit- und Verbindungsstrukturen für Volumen- und Energieströme

Also Published As

Publication number Publication date
AU3150401A (en) 2001-07-16
US6805829B2 (en) 2004-10-19
CN1211197C (zh) 2005-07-20
RU2242063C2 (ru) 2004-12-10
CA2362387A1 (en) 2001-07-12
US20020125612A1 (en) 2002-09-12
DE19964099B4 (de) 2006-04-06
NO328157B1 (no) 2009-12-21
CA2362387C (en) 2007-09-11
CN1358131A (zh) 2002-07-10
NO20014209D0 (no) 2001-08-30
WO2001050198A3 (de) 2002-01-17
DE19964099A1 (de) 2001-09-13
EP1196820A2 (de) 2002-04-17
WO2001050198A2 (de) 2001-07-12
NO20014209L (no) 2001-10-25
AU757191B2 (en) 2003-02-06
KR100652036B1 (ko) 2006-11-30
IS6064A (is) 2001-08-28
KR20010105354A (ko) 2001-11-28
JP2003519039A (ja) 2003-06-17

Similar Documents

Publication Publication Date Title
Yu et al. Electronically programmable, reversible shape change in two-and three-dimensional hydrogel structures
Jiang et al. Highly-stretchable 3D-architected mechanical metamaterials
CN112867601B (zh) 用于制造空间上变化的介电材料的方法、通过该方法制造的制品及其用途
Carlson et al. Active, programmable elastomeric surfaces with tunable adhesion for deterministic assembly by transfer printing
US8315499B1 (en) Functionally-graded three-dimensional ordered open-cellular microstructure and method of making same
CN105711088B (zh) 一种光固化3d打印机
TWI248555B (en) Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
JP2011033876A (ja) 光センサモジュールの製造方法およびそれによって得られた光センサモジュール
Liu et al. Dynamic laser prototyping for biomimetic nanofabrication
WO2015041189A1 (ja) 多層配線基板の製造方法及びこれに用いる三次元造形装置
CN101093263B (zh) 光波导及其制造方法以及光通信模块
JPWO2006059510A1 (ja) 光配線基板および光電気混載基板
Lee et al. Printing Conductive Micro‐Web Structures via Capillary Transport of Elastomeric Ink for Highly Stretchable Strain Sensors
CN104199252B (zh) 一种实现光刻胶微结构的方法
Wang et al. Sandwiched polyethylene shrink film masking with tunable resolution and shape for liquid alloy patterning
CN218286722U (zh) 一种多功能材料激光诱导光固化成型3d打印机
KR20230060227A (ko) 심재 내부에 부품 수납이 가능하고, 투명하고 전면볼록변형 특성을 갖는 샌드위치 판재 및 그 제조방법
US20190160730A1 (en) Hybrid polymeric structure, a method for fabricating a hybrid polymeric structure and a method for connecting two polymeric layers with the hybrid polymeric structure
DE202012103238U1 (de) Leiterbahnen für Berührungssensoren
US20130177697A1 (en) Implementing enhanced optical mirror coupling and alignment utilizing two-photon resist
Jung et al. 3D Stretchable Electronics with Stretchable Interlayer Connectors
KR101086466B1 (ko) 고분자 광결합 소자의 정렬을 위한 임프린트 금형의 제작 방법 및 이를 이용한 광결합 소자의 제작 방법
CN111076751B (zh) 一种基于ald镀膜的高灵敏度光波导传感器及其制备方法
CN118406194A (zh) 一种柔性介电层与电容式压力传感器及其制备方法
Zhang et al. Applications of Dry Film Photoresist in Micromachining: A Review

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees