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AU3150401A - Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows - Google Patents

Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows Download PDF

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Publication number
AU3150401A
AU3150401A AU31504/01A AU3150401A AU3150401A AU 3150401 A AU3150401 A AU 3150401A AU 31504/01 A AU31504/01 A AU 31504/01A AU 3150401 A AU3150401 A AU 3150401A AU 3150401 A AU3150401 A AU 3150401A
Authority
AU
Australia
Prior art keywords
layer
structured
chemical
hardening
hardened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU31504/01A
Other versions
AU757191B2 (en
Inventor
Reiner Gotzen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
microTEC Gesellschaft fur Mikrotechnologie mbH
Original Assignee
Microtec Ges fur Mikrotechnologie Mbh
microTEC Gesellschaft fur Mikrotechnologie mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microtec Ges fur Mikrotechnologie Mbh, microTEC Gesellschaft fur Mikrotechnologie mbH filed Critical Microtec Ges fur Mikrotechnologie Mbh
Publication of AU3150401A publication Critical patent/AU3150401A/en
Application granted granted Critical
Publication of AU757191B2 publication Critical patent/AU757191B2/en
Assigned to MICROTEC GESELLSCHAFT FUR MIKROTECHNOLOGIE MBH reassignment MICROTEC GESELLSCHAFT FUR MIKROTECHNOLOGIE MBH Alteration of Name(s) in Register under S187 Assignors: GOTZEN, REINER
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0075—Light guides, optical cables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optical Integrated Circuits (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Moulding By Coating Moulds (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Waveguides (AREA)

Description

Method for the production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows This invention concerns a method for the production of three-dimensionally 5 arranged conducting and connecting structures for volumetric and energy flows. The volumetric flows can be gaseous, fluid, solid or a mixture of these aggregate states. The energy flows may have an acoustic, electric, magnetic or electromagnetic character. 10 As a rule, volumetric and energy flows of this type are realised nowadays by many various technologies. For the microsystem technology printed conductors and bonding wires are the most frequently used transport paths. For the transport of electromagnetic energies, in addition to hollow conductors glass fibres are used. Volumetric flows are realised by means of channels, hoses and pipelines. 15 With the increasing miniaturisation these conducting and connecting elements can be brought together only with great difficulty. The invention solves this task by using a structured layered construction. Layered construction methods are known from the microtechnology. Thus the German 20 patent 44 20 996 describes a method, wherein between two parallel plates, of which at least one of them is permeable by electromagnetic waves, a small amount of the light-hardening plastic material is held by virtue of the surface tension. The surface of the plastic fluid below the plate that is permeable for the electromagnetic waves is hardened, for example, by a laser beam, that is guided 25 over the surface of a 3-layer model of the structure to be generated and stored in a connected computer. The laser light hardens the plastic fluid layer by layer corresponding to the 3D model, while the distance of the plates is increased on each occasion by the thickness of a layer, so that fresh plastic material can keep flowing due alone to its surface tension in the intermediate space occurring 30 between the hardened layer and the plate. In this manner structures in the micrometer range can be produced with great accuracy. The invention makes use of this technology.
R*
For this purpose various light-hardening materials are used to produce the layers. These materials may have the most diverse physical, chemical and biological properties, for example: electrically conducting, electrically insulating, having different optical refractive indices. When diffusing the materials, the layer 5 segments are also filled with new material, in which no hardening has taken place during the previous hardening process, so that during the subsequent hardening process not only the topmost layer will be joined with the layer situated below it, but material of the topmost layer will be joined with the material of a layer situated below the last but one layer. This makes it feasible to produce a structure with a 10 layer sequence wherein the material properties differ layer by layer. These non hardened regions, which are available as channels after the hardening and flushing process, are for volume transport. Equally, these channels can be used as hollow conductors for high frequency when the walls of the channels are produced from a material with respective properties. 15 Light-conducting structures with materials having different refractive indices can also be produced. These light-conducting structures can be used in conjunction with light transistors (key word: light switches on light) for optically integrated circuits. 20 In this manner even conventional integrated circuits (IC) can be joined with one another. In this case an IC is integrated in a cavity below the last surface, thus via the connections (pads) a channel with conductive material can be produced, that can lead to a further IC or also to plug-in connectors that are manufactured in this 25 manner. ~ R4t

Claims (4)

1. A method for the production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows. For this purpose various 5 light-hardening materials are used to produce the layers. When diffusing the materials, the layer regions are also filled with new material, in which no hardening has taken place during the previous hardening process, so that during the subsequent hardening not only the topmost layer will be joined with the layer situated below it, but material of the topmost layer will be joined with 10 the material of a layer situated below the last but one layer. This makes it feasible to produce a structure with a layer sequence wherein the properties differ layer by layer.
2. A method according to claim 1, characterised by the following steps of the 15 method: a) a structured layer is generated by structured strengthening of a fluid light hardening material with selected physical, chemical or biological properties; 20 b) the structured layer is cleansed from the non-hardened material by means of a flushing process and filled with fluid light-hardening material having other physical, chemical or biological properties and covered with a defined layer thickness according to the German patent 44 20 996; 25 c) by structured strengthening regions of the first layer and the new layer are structurally hardened; d) the structured layers are cleansed from non-hardened material of the last structuring by means of a flushing process and filled with fluid light 30 hardening material having other physical, chemical and biological properties and covered with a defined layer thickness according to the German patent 44 20 996; R4~ e) by structured strengthening regions of the second layer and the new layer are structured hardened, thus generating a joining of materials having the same physical, chemical or biological properties or an insulation of same; 5 f) the structured layers are cleansed by means of a flushing process from the non-hardened material of the last structuring; g) regions not filled with material are fitted with electronic, mechanical, optical or chemical components according to the system to be produced; 10 h) the structured layers and the components are filled with fluid light-hardening material having other physical, chemical and biological properties and covered with a defined layer thickness according to the German patent 44 20 996; 15 i) by structured strengthening regions of the last but one layer and the new layer are structured hardened thus generating a joining of materials and components having the same physical, chemical or biological properties or an insulation of same; 20
3. A method according to claim 2, characterised in that a plurality of electronic, mechanical, chemical or biological/electrical components are joined with one another. 25
4. A method according to claim 3, characterised in that the joints between the components and the surrounds of the system can be used for volumetric and energy flows. I* *I
AU31504/01A 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows Ceased AU757191B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19964099 1999-12-31
DE19964099A DE19964099B4 (en) 1999-12-31 1999-12-31 Method for producing three-dimensionally arranged guide and connection structures for volume and energy flows
PCT/DE2000/004393 WO2001050198A2 (en) 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows

Publications (2)

Publication Number Publication Date
AU3150401A true AU3150401A (en) 2001-07-16
AU757191B2 AU757191B2 (en) 2003-02-06

Family

ID=7935210

Family Applications (1)

Application Number Title Priority Date Filing Date
AU31504/01A Ceased AU757191B2 (en) 1999-12-31 2000-12-08 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows

Country Status (13)

Country Link
US (1) US6805829B2 (en)
EP (1) EP1196820A2 (en)
JP (1) JP2003519039A (en)
KR (1) KR100652036B1 (en)
CN (1) CN1211197C (en)
AU (1) AU757191B2 (en)
CA (1) CA2362387C (en)
DE (1) DE19964099B4 (en)
IS (1) IS6064A (en)
NO (1) NO328157B1 (en)
RU (1) RU2242063C2 (en)
TW (1) TWI248555B (en)
WO (1) WO2001050198A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19964099B4 (en) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Method for producing three-dimensionally arranged guide and connection structures for volume and energy flows
DE10102063A1 (en) * 2001-01-17 2002-07-25 Alpha Technology Ges Fuer Ange Analysis chip, e.g. for genetic analysis, has layer comprising grid of electrically connected spots and second layer comprising conductive structure of rings connected by strips, where layers are separated by insulating layers
DE102004013161B4 (en) * 2004-03-17 2008-04-10 microTec Gesellschaft für Mikrotechnologie mbH Microfluidic chip
DE102006008332B4 (en) * 2005-07-11 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process for the production of a functional structural unit and functional structural unit
US20070074579A1 (en) * 2005-10-03 2007-04-05 Honeywell International Inc. Wireless pressure sensor and method of forming same
DE102009050325B4 (en) * 2009-10-22 2014-03-20 Amphenol-Tuchel Electronics Gmbh Contacting device and method for producing a contacting device, band with contacting devices and SIM block
US10828828B2 (en) * 2016-11-08 2020-11-10 Flex Ltd. Method of manufacturing a part

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JPH01232024A (en) * 1988-03-14 1989-09-18 Mitsui Eng & Shipbuild Co Ltd Manufacture of three-dimensional model using photosetting resin
CA2060230C (en) * 1991-01-31 2001-04-10 Steven M. Penn System, method, and process for computer-controlled manufacture of three-dimensional objects from computer data
US6175422B1 (en) * 1991-01-31 2001-01-16 Texas Instruments Incorporated Method and apparatus for the computer-controlled manufacture of three-dimensional objects from computer data
US5173220A (en) * 1991-04-26 1992-12-22 Motorola, Inc. Method of manufacturing a three-dimensional plastic article
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
WO1993020993A1 (en) * 1992-04-15 1993-10-28 Soane Technologies, Inc. Rapid prototype three-dimensional stereolithography
US5264061A (en) * 1992-10-22 1993-11-23 Motorola, Inc. Method of forming a three-dimensional printed circuit assembly
US5398193B1 (en) 1993-08-20 1997-09-16 Alfredo O Deangelis Method of three-dimensional rapid prototyping through controlled layerwise deposition/extraction and apparatus therefor
DE4332982A1 (en) * 1993-09-28 1995-03-30 Eos Electro Optical Syst Method and device for producing a three-dimensional object
DE4420996C2 (en) * 1994-06-16 1998-04-09 Reiner Dipl Ing Goetzen Method and device for producing micromechanical and micro-optical components
DE19539039C2 (en) * 1994-06-16 1999-11-11 Reiner Goetzen Device for the production of micromechanical and micro-optical components as well as complex microsystems
AU733522B2 (en) * 1998-01-28 2001-05-17 Thin Film Electronics Asa A method for generating electrical conducting and/or semiconducting structures in three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
RU2129320C1 (en) * 1998-05-22 1999-04-20 Гурович Борис Аронович Conducting structure forming process
US6549821B1 (en) * 1999-02-26 2003-04-15 Micron Technology, Inc. Stereolithographic method and apparatus for packaging electronic components and resulting structures
DE19964099B4 (en) * 1999-12-31 2006-04-06 Götzen, Reiner, Dipl.-Ing. Method for producing three-dimensionally arranged guide and connection structures for volume and energy flows

Also Published As

Publication number Publication date
DE19964099B4 (en) 2006-04-06
RU2242063C2 (en) 2004-12-10
NO20014209L (en) 2001-10-25
JP2003519039A (en) 2003-06-17
TWI248555B (en) 2006-02-01
WO2001050198A3 (en) 2002-01-17
KR20010105354A (en) 2001-11-28
CN1358131A (en) 2002-07-10
KR100652036B1 (en) 2006-11-30
WO2001050198A2 (en) 2001-07-12
AU757191B2 (en) 2003-02-06
CN1211197C (en) 2005-07-20
EP1196820A2 (en) 2002-04-17
NO328157B1 (en) 2009-12-21
CA2362387A1 (en) 2001-07-12
IS6064A (en) 2001-08-28
DE19964099A1 (en) 2001-09-13
US20020125612A1 (en) 2002-09-12
NO20014209D0 (en) 2001-08-30
US6805829B2 (en) 2004-10-19
CA2362387C (en) 2007-09-11

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