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WO1998034735A1 - Dispositif doseur pour liquides - Google Patents

Dispositif doseur pour liquides Download PDF

Info

Publication number
WO1998034735A1
WO1998034735A1 PCT/IB1998/000052 IB9800052W WO9834735A1 WO 1998034735 A1 WO1998034735 A1 WO 1998034735A1 IB 9800052 W IB9800052 W IB 9800052W WO 9834735 A1 WO9834735 A1 WO 9834735A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
solder
tube
dosing device
adhesive substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB1998/000052
Other languages
English (en)
Inventor
Antal Frans Jozef Baggerman
Daniel Silvan Marcus Schwarzbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Philips AB
Philips Norden AB
Original Assignee
Philips Electronics NV
Philips AB
Philips Norden AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV, Philips AB, Philips Norden AB filed Critical Philips Electronics NV
Priority to DE69802240T priority Critical patent/DE69802240T2/de
Priority to PCT/IB1998/000052 priority patent/WO1998034735A1/fr
Priority to JP10529187A priority patent/JP2000511464A/ja
Priority to EP98900115A priority patent/EP0891230B1/fr
Publication of WO1998034735A1 publication Critical patent/WO1998034735A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F11/00—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
    • G01F11/02—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement
    • G01F11/08—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the diaphragm or bellows type
    • G01F11/088—Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it with measuring chambers which expand or contract during measurement of the diaphragm or bellows type using a deformable conduit-like element

Definitions

  • the invention relates to a liquid dosing device, comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T, and a ceramic actuator element which is in intimate contact with a portion of the external surface of the tube, the tube and the element being mutually adhered using an adhesive substance.
  • a liquid dosing device comprising an open-ended vitreous capillary tube which is connected to a reservoir for liquid, heating means for heating the liquid in the reservoir to a given temperature T, and a ceramic actuator element which is in intimate contact with a portion of the external surface of the tube, the tube and the element being mutually adhered using an adhesive substance.
  • liquids which can be dosed with such a device include molten solder, glue and flux.
  • Such a device is known from United States Patent US 4,828,886, in which the liquid is molten solder.
  • a device of this type is commonly employed in so-called "solder jet” machines, which are used to aim and fire small balls of solder at given surfaces, e.g. those of printed wiring boards.
  • molten solder in the vitreous capillary tube is ejected therefrom with the aid of the ceramic actuator (e.g. a piezoelectric or electrostrictive actuator), which can be used to apply small pressure pulses to the tube in response to an appropriate electrical input signal.
  • the ceramic actuator e.g. a piezoelectric or electrostrictive actuator
  • Such pressure pulses cause a slight, temporary contraction of the tube wall, which leads to the forceful expulsion of a droplet of solder from the open end of the tube (remote from the reservoir). Solder expelled from the tube in this manner is continually replenished with fresh solder from the reservoir, under pressure.
  • the tube and actuator element are preferably mutually adhered, so as to ensure good mechanical contact. In practice, this is achieved by providing a layer of polymeric adhesive (such as an epoxy polymer) between the tube and the actuator.
  • a disadvantage of the known device is that, as time progresses, the reliability of the liquid expulsion process often tends to deteriorate, leading to substantial variations in the drop size or drop range of the expelled liquid. It is an object of the invention to alleviate this drawback. In particular, it is an object of the invention to provide a device in which the liquid expulsion process demonstrates substantially constant characteristics as a function of (extended) time.
  • the adhesive substance is a solder having a melting point in excess of Tj.
  • the inventors have observed that the quality of the adhesion between the capillary tube and the actuator depends on the efficiency with which the relevant surfaces of the tube and actuator are wetted by the high-melting-point solder. So as to guarantee good wetting, the surfaces of the tube and actuator which are to be mutually adhered are preferably metallized. Such metallization may be performed using electroless deposition techniques such as physical or chemical vapour deposition, sputter deposition, ablative deposition, wet-chemical electroless metallization, etc.
  • a particular embodiment of a device as specified in the preceding paragraph is characterized in that metallization is realized using at least one metal selected from the group formed by Cr, Ni, Au, Ti and their alloys. These metals have a coefficient of expansion which is compatible with those of typical high-melting-point solders. Particularly good adhesion on the capillary tube can be obtained using metallizing trilayers such as Cr/C ⁇ Ni. Ni and Cr/C ⁇ Ni ⁇ /Ni y Au Ly (x ⁇ 0, y ⁇ 0).
  • T will typically have a value of the order of about 180-260°C.
  • Reservoir metals suitable for dosage by the inventive device then include solders such as Pb 38 Sn 62 , Sn 52 In 48 and Sn 965 Ag 3 . 5 , for example, such solders having melting points up to about 220° C.
  • solders such as Pb 38 Sn 62 , Sn 52 In 48 and Sn 965 Ag 3 . 5 , for example, such solders having melting points up to about 220° C.
  • the melting point of the solder to be used as an adhesive substance between the capillary tube and the actuator is preferably (but not essentially) of the order of about 15-20°C higher than T,, at the least.
  • Suitable vitreous materials for manufacture of the capillary tube in the device according to the invention include high-melting-point, high-working-point glasses such as NONE (OSRAM, GENERAL ELECTRIC, PHILIPS) and LIG 142.
  • suitable piezoelectric ceramics for manufacture of the device's actuator include high-Curie- temperature materials such as certain Pb-Zr-Ti oxides. Such materials are well known in the art.
  • the invention also relates to a solder-jetting apparatus for use e.g. in the manufacture of printed circuit boards, or the attachment of integrated circuits (chips) to the receptive conductive tracks in chip housings.
  • a solder-jetting apparatus for use e.g. in the manufacture of printed circuit boards, or the attachment of integrated circuits (chips) to the receptive conductive tracks in chip housings.
  • Such an apparatus comprises: a substrate holder (the substrate being a printed circuit board or chip housing, for example); a liquid dosing device, for producing and shooting drops of molten solder (at the substrate); - means for producing relative motion of the substrate holder with respect to the liquid dosing device, so as to allow solder drops to be shot at different locations on the substrate. Solder drops shot in this manner can be used to affix the pins of an electrical component or an integrated circuit to the conductive tracks or lands of a substrate.
  • such an apparatus is characterized in that its liquid dosing device is as claimed in any of the Claims 1-6.
  • This inventive apparatus gives more reliable performance in terms of consistency of the solder drop size and range, so that the apparatus can perform accurate solder work on fine-pitch substrates, with reduced occurrence of short-circuits or loose connections (caused by excessive variations in solder drop size).
  • Figure 1 cross-sectionally depicts part of a liquid dosing device according to the invention
  • Figure 2 renders a perspective view of part of a solder-jetting apparatus according to the invention.
  • Figure 1 schematically depicts a longitudinal cross-section of part of a liquid (solder) dosing device in accordance with the current invention.
  • the device comprises a vitreous capillary tube 1 with two open ends la, lb.
  • the end la emerges into a reservoir 3 for liquid metal, whereas the end lb narrows into a nozzle form (typically having an opening of the order of about 50-80 ⁇ m wide).
  • a piezoelectric (or electrostrictive) ceramic actuator 5 which in this case takes the form of a cylindrical sleeve surrounding part of the tube 1 and pressed against the wall 7 thereof.
  • the device additionally comprises heating means (not depicted) for heating a body of metal to a temperature T, in excess of that metal's melting point; such means are adequately described in the prior art.
  • T is 250° C.
  • the body of liquid metal produced by the heating means is stored in the reservoir 3, and is forced under pressure into the tube 1. If, in response to an electrical voltage pulse, the actuator 5 contracts against the wall 7, a droplet of molten metal (not depicted) will be forcefully expelled from the nozzle lb.
  • Such droplets typically have a diameter of about 50-100 ⁇ m and a velocity of the order of 1-3 m/s, and can typically be produced at frequencies ranging from drop-on-demand to about 1 kHz.
  • this layer 9 is comprised of a metallic solder having a melting point in excess of T 1 ⁇ e.g. Sn 5 Pb 925 Ag 25 (melting point ⁇ 287-296°C).
  • metallization layers 11 and 13 are provided on the former and latter, respectively, at least over those portions which will make contact with the adhesive layer 9.
  • the layer 11 comprises Cr and the layer 13 is comprised of Ni.
  • the layer 9 provides a coupling between the tube 1 and actuator 5 which is satisfactorily resistant to deterioration with aging.
  • the adhesive layer 9 of high-melting-point solder may be applied as follows, after provision of the metallization layers 11 and 13: (1) The capillary tube 7 is heated to a temperature of the order of about 250°C, after the actuator 5 has been placed in position around it;
  • Figure 2 renders a perspective view of part of a solder-jetting apparatus according to the invention.
  • a planar substrate holder 2 is arranged so as to be perpendicular to the longitudinal axis L of the capillary tube 1 of a liquid solder dosing device as described in Embodiment 1.
  • the holder 2 can be displaced in x- and y-directions within a plane P perpendicular to L, in such a manner that it is possible to shoot a solder drop from the tube 1 at any (x,y) -coordinate location on the holder 2.

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

Ce dispositif doseur pour liquides comporte un tube capillaire constitué de verre, à extrémité ouverte, relié à un réservoir à liquides, un générateur de chaleur destiné à chauffer le liquide présent dans ledit réservoir et ce, à une température donnée T1, ainsi qu'un actionneur céramique en contact étroit avec une partie de la surface externe du tube, le tube et l'actionneur étant rendus solidaires grâce à l'emploi d'une substance adhésive. Cette substance adhésive est un métal d'apport dont le point de fusion dépasse la température T1. Le liquide présent dans le réservoir peut être, par exemple, un métal d'apport fondu ou une colle.
PCT/IB1998/000052 1997-02-06 1998-01-15 Dispositif doseur pour liquides Ceased WO1998034735A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE69802240T DE69802240T2 (de) 1997-02-06 1998-01-15 Dosiervorrichtung für flüssigkeiten
PCT/IB1998/000052 WO1998034735A1 (fr) 1997-02-06 1998-01-15 Dispositif doseur pour liquides
JP10529187A JP2000511464A (ja) 1997-02-06 1998-01-15 液体滴下装置
EP98900115A EP0891230B1 (fr) 1997-02-06 1998-01-15 Dispositif doseur pour liquides

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97200312.3 1997-02-06
PCT/IB1998/000052 WO1998034735A1 (fr) 1997-02-06 1998-01-15 Dispositif doseur pour liquides

Publications (1)

Publication Number Publication Date
WO1998034735A1 true WO1998034735A1 (fr) 1998-08-13

Family

ID=11004648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB1998/000052 Ceased WO1998034735A1 (fr) 1997-02-06 1998-01-15 Dispositif doseur pour liquides

Country Status (1)

Country Link
WO (1) WO1998034735A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001086154A1 (fr) * 2000-05-12 2001-11-15 Central Research Laboratories Limited Procede de formation d'un joint etanche aux fluides
NL2008648C2 (nl) * 2012-04-17 2013-10-21 Nyc Be Beautiful B V Saus doseerinrichting.
CN105080788A (zh) * 2015-07-31 2015-11-25 深圳市华星光电技术有限公司 框胶涂布装置及涂布方法
CN111299072A (zh) * 2020-02-17 2020-06-19 珠海格力智能装备有限公司 喷胶管和喷胶设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828886A (en) * 1986-11-05 1989-05-09 U.S. Philips Corporation Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828886A (en) * 1986-11-05 1989-05-09 U.S. Philips Corporation Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001086154A1 (fr) * 2000-05-12 2001-11-15 Central Research Laboratories Limited Procede de formation d'un joint etanche aux fluides
NL2008648C2 (nl) * 2012-04-17 2013-10-21 Nyc Be Beautiful B V Saus doseerinrichting.
WO2013157939A1 (fr) * 2012-04-17 2013-10-24 Nyc Be Beautiful B.V. Distributeur de sauce
CN105080788A (zh) * 2015-07-31 2015-11-25 深圳市华星光电技术有限公司 框胶涂布装置及涂布方法
CN111299072A (zh) * 2020-02-17 2020-06-19 珠海格力智能装备有限公司 喷胶管和喷胶设备

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