[go: up one dir, main page]

WO1990001860A1 - Plaquette - Google Patents

Plaquette Download PDF

Info

Publication number
WO1990001860A1
WO1990001860A1 PCT/EP1989/000725 EP8900725W WO9001860A1 WO 1990001860 A1 WO1990001860 A1 WO 1990001860A1 EP 8900725 W EP8900725 W EP 8900725W WO 9001860 A1 WO9001860 A1 WO 9001860A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
epoxy resin
particles
glass fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP1989/000725
Other languages
German (de)
English (en)
Inventor
Klaus Hausotter
Christian Spohr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rockwell Collins Deutschland GmbH
Original Assignee
Teldix GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teldix GmbH filed Critical Teldix GmbH
Publication of WO1990001860A1 publication Critical patent/WO1990001860A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Definitions

  • the invention relates to a printed circuit board with the features of the preamble of claim 1.
  • the circuit boards are drilled and contacted.
  • the printed circuit boards so produced, as z. .. B_. . _ used for military purposes or for space purposes are subjected to a qualification process, among other things, a temperature change test that has to be carried out many times and reaches temperatures from -65 ° C to +125 ° C.
  • the plated-through holes in a chemical process detach from the epoxy resin compound in the area of the cut-out holes and interruptions are formed which render the circuit board unusable.
  • the object of the invention is to create a printed circuit board with little additional effort, in which this disadvantage is avoided.
  • the surfaces of the prepregs impregnated with epoxy resin are additionally coated with non-conductive, dimensionally stable particles, for example in the circuit board according to the invention, before or during the layering.
  • the glass fiber particles adhering to the prepreg are deposited together with the epoxy resin emerging from the prepregs into the spaces between the prepregs and the metal inner layers and in the cut-out holes in the metal inner layers.
  • a rough hole surface is created by the glass fiber particles embedded in the epoxy resin compound, which now protrude into the hole as small glass fiber brushes. This rough bore surface ensures a better connection of the copper through-hole to be made after drilling to the epoxy resin compound and thus prevents the through-hole from tearing.
  • the prepregs 1 impregnated with epoxy resin are coated with non-conductive, dimensionally stable particles, e.g. with glass fiber particles, sprinkled on one or both sides or briefly with one or both surfaces in one with non-conductive dimensionally stable particles, e.g. B. filled with fiberglass filled containers.
  • the printed circuit board is heated under high pressure and the epoxy resin with the glass fiber particles 3 adhering to the surface of the prepregs 1 is pressed between prepregs 1 and inner metal layer 2 and into the cut-out holes 6 of the inner metal layers 2. After the polymerization process, the printed circuit board is provided with the bores required for the through contacts 5 and cleaned.
  • the glass fiber particles 3 embedded in the epoxy resin compound now protrude from the epoxy resin compound of the bore.
  • the bores are provided with Cu vias 5, which are firmly connected to the ends of the glass fiber particles 3, as a further enlargement of part of a wall of the via 5 shown in FIG. 1, bottom left, clearly shows .
  • the voltages that occur in a subsequent temperature change test between the through-hole 5 and the epoxy resin compound that surrounds it are absorbed by the ends of the glass fiber particles 3 firmly anchored in the through-holes 5, and thus the loosening of the through-hole from the epoxy resin compound and the cracking of the through-hole 5 itself are avoided .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Pour éviter des interruptions dans la métallisation des trous de plaquettes en cas de variations importantes de température, on introduit en cours de fabrication des particules non conductrices et non déformables, par exemple des particules de fibre de verre (3), dans la masse de contact en résine époxy par un procédé de polymérisation.
PCT/EP1989/000725 1988-08-04 1989-06-27 Plaquette Ceased WO1990001860A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19883826522 DE3826522A1 (de) 1988-08-04 1988-08-04 Leiterplatte
DEP3826522.2 1988-08-04

Publications (1)

Publication Number Publication Date
WO1990001860A1 true WO1990001860A1 (fr) 1990-02-22

Family

ID=6360241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP1989/000725 Ceased WO1990001860A1 (fr) 1988-08-04 1989-06-27 Plaquette

Country Status (2)

Country Link
DE (1) DE3826522A1 (fr)
WO (1) WO1990001860A1 (fr)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2694139A1 (fr) * 1992-07-21 1994-01-28 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
WO1999031944A1 (fr) * 1997-12-17 1999-06-24 Laude Lucien Diego Supports de circuit electrique
WO1999044957A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre recouvertes d'un enduit contenant des particules inorganiques thermiquement conductrices et produits comportant de tels brins
WO1999044955A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre impregnees et produits comportant de tels brins
WO1999044959A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Stratifies renforces par des fibres de verre, plaquettes de circuits electroniques et procedes d'assemblage d'un tissu de renfort
WO1999044958A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Procedes permettant d'empecher l'abrasion des brins de fibres de verre
WO1999044956A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre recouvertes d'un enduit contenant des particules inorganiques et produits comportant de tels brins
WO2000021900A1 (fr) * 1998-10-13 2000-04-20 Ppg Industries Ohio, Inc. Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu
WO2001012701A1 (fr) * 1999-07-30 2001-02-22 Ppg Industries Ohio, Inc. Filaments de fibre de verre impregnes et produits les comprenant
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
JP2014220310A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、多層基板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993023979A1 (fr) * 1992-05-15 1993-11-25 Marina Adolfovna Sokolinskaya Substrat pour cartes de circuits imprimes et son procede de production
CN114316519B (zh) * 2022-01-05 2024-03-22 泰山玻璃纤维有限公司 碳-玻混拉板及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1048864A (en) * 1962-11-19 1966-11-23 Curran Ind Inc Method of forming printed circuit structures
DE2739494A1 (de) * 1977-08-30 1979-03-08 Kolbe & Co Hans Verfahren zum herstellen von elektrischen leiterplatten und basismaterial fuer solche
EP0186831A2 (fr) * 1985-01-02 1986-07-09 International Business Machines Corporation Méthode pour améliorer l'adhésion entre un adhésif photosensible et un substrat diélectrique.
EP0244699A2 (fr) * 1986-04-25 1987-11-11 Mitsubishi Plastics Industries Limited Substrat pour circuit imprimé

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
US3617613A (en) * 1968-10-17 1971-11-02 Spaulding Fibre Co Punchable printed circuit board base
JPS49348B1 (fr) * 1970-12-25 1974-01-07
DE3567140D1 (en) * 1985-08-14 1989-02-02 Toray Industries Laminate board containing uniformly distributed filler particles and method for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1048864A (en) * 1962-11-19 1966-11-23 Curran Ind Inc Method of forming printed circuit structures
DE2739494A1 (de) * 1977-08-30 1979-03-08 Kolbe & Co Hans Verfahren zum herstellen von elektrischen leiterplatten und basismaterial fuer solche
EP0186831A2 (fr) * 1985-01-02 1986-07-09 International Business Machines Corporation Méthode pour améliorer l'adhésion entre un adhésif photosensible et un substrat diélectrique.
EP0244699A2 (fr) * 1986-04-25 1987-11-11 Mitsubishi Plastics Industries Limited Substrat pour circuit imprimé

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2694139A1 (fr) * 1992-07-21 1994-01-28 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
WO1999031944A1 (fr) * 1997-12-17 1999-06-24 Laude Lucien Diego Supports de circuit electrique
BE1011624A4 (fr) * 1997-12-17 1999-11-09 Laude Lucien Diego Supports de circuit electrique.
WO1999044956A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre recouvertes d'un enduit contenant des particules inorganiques et produits comportant de tels brins
WO1999044959A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Stratifies renforces par des fibres de verre, plaquettes de circuits electroniques et procedes d'assemblage d'un tissu de renfort
WO1999044958A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Procedes permettant d'empecher l'abrasion des brins de fibres de verre
WO1999044955A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre impregnees et produits comportant de tels brins
WO1999044957A1 (fr) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Brins de fibres de verre recouvertes d'un enduit contenant des particules inorganiques thermiquement conductrices et produits comportant de tels brins
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
WO2000021900A1 (fr) * 1998-10-13 2000-04-20 Ppg Industries Ohio, Inc. Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu
WO2001012701A1 (fr) * 1999-07-30 2001-02-22 Ppg Industries Ohio, Inc. Filaments de fibre de verre impregnes et produits les comprenant
WO2001012702A1 (fr) * 1999-07-30 2001-02-22 Ppg Industries Ohio, Inc. Brins de fibres de verre impregnes et produits comprenant ces derniers
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
JP2014220310A (ja) * 2013-05-06 2014-11-20 株式会社デンソー 多層基板およびこれを用いた電子装置、多層基板の製造方法

Also Published As

Publication number Publication date
DE3826522A1 (de) 1990-02-08

Similar Documents

Publication Publication Date Title
DE69210079T2 (de) Zusammenschaltung von gegenüberliegenden Seiten einer Schaltplatine
DE2702844C2 (de) Verfahren zur Herstellung einer vielschichtigen gedruckten Schaltung
DE69331511T2 (de) Zweiseitig gedruckte Leiterplatte, mehrschichtige Leiterplatte und Verfahren zur Herstellung
WO1990001860A1 (fr) Plaquette
DE68926055T2 (de) Herstellungsverfahren einer mehrschichtigen Leiterplatte
DE3545989C2 (fr)
EP0361195B1 (fr) Plaque à circuit imprimé avec substrat moulé
DE3822071C2 (de) Verfahren zur Herstellung von mehrlagigen starr-flexiblen Leiterplatten
DE69923205T2 (de) Leiterplattenanordnung und verfahren zu ihrer herstellung
EP0440928A2 (fr) Procédé de fabrication d'un panneau à circuit imprimé comportant des parties rigides et flexibles
DE19615395A1 (de) Elektrostatische Schutzvorrichtung und Verfahren zu ihrer Herstellung
DE112011101132T5 (de) Verbessertes Rückbohren von mehrlagigen Schaltkreisplatinen
CH630202A5 (en) Process for producing a printed circuit board having rigid areas and at least one flexible area
DE4012100A1 (de) Leiterplatte mit einer kuehlvorrichtung und verfahren zur herstellung derselben
DE1919421C3 (de) Mehrschichtleiterplatte
CH667359A5 (de) Verfahren zur herstellung einer starre und flexible partien aufweisenden leiterplatte fuer gedruckte elektrische schaltungen.
EP1080615B1 (fr) Flan imprime multiple pour composants electroniques et procede permettant de realiser des bosses, des cadres de brasage, des ecarteurs et similaires sur le flan imprime multiple
EP0254082B1 (fr) Circuit imprimé multicouche comportant des parties rigides et flexibles
DE19627543B4 (de) Multi-Layer-Substrat sowie Verfahren zu seiner Herstellung
DE3546611C2 (fr)
DE1145231B (de) Verfahren zur Montage von Magnetkernspeichern
EP0183936A1 (fr) Circuit multicouche et procédé de fabrication des interconnexions électriques
DE2202077A1 (de) Verfahren zur Herstellung von Mehrlagenleiterplatten
DE60132306T2 (de) Unbestückte mehrschichtige Leiterplatte zum ermöglichen einer höheren Verdrahtungsdichte und Verfahren zu deren Herstellung
DE4040226C2 (de) Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayern)

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE FR GB IT LU NL SE