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WO1993023979A1 - Substrat pour cartes de circuits imprimes et son procede de production - Google Patents

Substrat pour cartes de circuits imprimes et son procede de production Download PDF

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Publication number
WO1993023979A1
WO1993023979A1 PCT/RU1992/000104 RU9200104W WO9323979A1 WO 1993023979 A1 WO1993023979 A1 WO 1993023979A1 RU 9200104 W RU9200104 W RU 9200104W WO 9323979 A1 WO9323979 A1 WO 9323979A1
Authority
WO
WIPO (PCT)
Prior art keywords
basalt
binder
τκani
service
low molecular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/RU1992/000104
Other languages
English (en)
Russian (ru)
Inventor
Marina Adolfovna Sokolinskaya
Leonid Fedorovich Kolesnichenko
Alexandr Alexandrovich Medvedev
Leonid Nikolaevich Smirnov
Anatoly Alexandrovich Ezhov
Jury Lvovich Tsybulya
Sergei Iosifovich Zalesky
Lutsia Kazimirovna Zabava
Tatyana Mikhailovna Tsybulya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to PCT/RU1992/000104 priority Critical patent/WO1993023979A1/fr
Publication of WO1993023979A1 publication Critical patent/WO1993023979A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles

Definitions

  • the foregoing level of the equipment contains an electronic service, which is based on either one or two other devices.
  • the board In order to ensure reliable operation of the circuit board, the board must have a high power supply and high specific volumetric resistance.
  • At present, the widest possible spread of radiation has been obtained from asbestos or glass fiber. 15 Asbestos rock is known as usual, in%: 39-42 510 2 ; 38-44 ⁇ ⁇ ⁇ ; 0.65-2.3 ⁇ ⁇ ⁇ ⁇ ; 0.2-0.5 * Ne 2 ⁇ 5 to 1.0 Sa ⁇ , traces of ⁇ a 2 0 and ⁇ ⁇ ⁇ , 12-15 inconsequential waters; 1.5-3 adsorbent water.
  • a good chemical composition results in a low 20% electrical power factor of 1.5-1.6 * 10 ⁇ / cm and a low specific weight of 10 cm. Otherwise, asbestos itself and asbestos waste, as shown in the research, are a cancerous material, especially affecting household wiring, and 25 do much For this, asbestos-related products are unsatisfactory in an environmentally friendly way and the user is not responsible for the health of the user.
  • a conventional manufacturing process includes a network
  • a suitable binder such as epoxy resin, sheets from glass or asbestos-free drying, drying, and the washing of liquids.
  • the task posed is solved by the fact that, in the case of a printed circuit board, made in the form of a multi-structured fabric from the Republic of Ukraine, it is sold
  • the inventive service comprising fabric from basalt-based, possesses more high dielectric properties compared with the known from
  • an average binder contains a mass of 10% of the product.
  • the task is also solved by a method of manufacturing a product for a printed circuit board, including printing of fumes in a tissue, drying, removing the waste
  • the inventive method ensures the provision of services that are equipped with a specific volumetric and specific electrical resistance. Compared to
  • the claimed service is provided with a specific electrical switch for a higher power supply and with a higher load capacity. Otherwise, we accept that you are welcome to use the equipment.
  • the claimed product support for the printing machine has a good construction made from the textiles of the country.
  • a basalt user can use a player with a diameter of 7- ⁇ m. From this, it is easy to take any well-known plain tissue and cut the sheets from it into the required size. Then these
  • the frontal fiber binder has a small binder of 0.2% to 0.5% by weight. ⁇ ⁇ 93/23979 ⁇ / ⁇ 92 / 00104
  • binder 10 It provides an acceptable binder, for example, based on pure phenylephaldehyde, polymide or epoxy resin. It is practical to use a binding agent for them from the basalt wand to mix with nitrous oxide with a particle size of 0.5 to 20 ⁇ m.
  • the product is widely used for heating, but its use is not intended to be used.
  • This epoxy binder contains 100 parts by weight. of epoxy resin - a product of the condensation of diphenyl lipopropane and thermophenylphenylpropane with an alkaline hydrous oxide and 70 weight parts. Izotetetagid-5 ruptal anhydride.
  • the indicated epoxy binder is heated up to 30 ° ⁇ and is used for treating fabric from basalt powder in the amount of 60 wt. ⁇ mass of tkani.
  • the received packages are placed in pressure and carry out pressure at a temperature of ⁇ 60 ° C and a pressure of 3.5 Sha for 140 minutes. Then, I divide the partition, and I cut it off and receive the necessary tests 15 for the purpose of sharing its electrical connection.
  • EXAMPLE 2. 5 The process is carried out in a similar way to Example I with the difference that the temperature is maintained at a pressure of 3.5 réelle Pa and a temperature of °40 ° ⁇ ; ⁇ 60 ° ⁇ and ⁇ 80 ° ⁇ for 160 minutes.
  • Example II The process is analogous to Example I with the difference: there is a difference in temperature and different pressures of 15 and 60 ° C.
  • Example 5 judging by the increase in its resistance to bending of ⁇ 80 ° C by 20-33 $, and by a simultaneous increase in heat by 38-55 $ and a decrease in the angle of electricity of 13 $ 65.
  • Example 5 judging by the increase in its resistance to bending of ⁇ 80 ° C by 20-33 $, and by a simultaneous increase in heat by 38-55 $ and a decrease in the angle of electricity of 13 $ 65.
  • Example 5 judging by the increase in its resistance to bending of ⁇ 80 ° C by 20-33 $, and by a simultaneous increase in heat by 38-55 $ and a decrease in the angle of electricity of 13 $ 65. Example 5.
  • Yu 3 React equipped with a mechanical stirrer, is loaded with a polyimide binder, the following composition: 24 g of 4,4'-diamine-diphenylmethane; 2 g of maleic acid; 45 ml of ferrous alcohol; 30 g of ENERGY EFFICIENCY BENZETO ACID, obtained as a result of
  • the mixture obtained is fed from basalt fibers, after which it is dried, dried at 80 ° C for 30 minutes.
  • the obtained elements are assembled in a package and pressurized at a temperature of ⁇ 60 ° C with a pressure of 3.5 ⁇ LPa for 60 minutes. 15 After cooling, I disassemble the process, receive free and test it from the obtained service.
  • a preliminary input of phenolic binder is a small nitride of boron with a particle size of 0.5-20 ⁇ m in the amount of 2-10 $ in the mass of the batch.
  • the two compatible products are poured into one and add the distilled water to the total volume of the mixture of 50 liters.
  • the basalt wave is turned off in the process of their radiation and temperature
  • Za ⁇ em izg ⁇ avlivayu ⁇ ⁇ an, ⁇ uyu is ⁇ lzuyu ⁇ for ⁇ lucheniya ⁇ dl ⁇ zh ⁇ i for ⁇ echa ⁇ ny ⁇ ⁇ la ⁇ , anal ⁇ gichn ⁇ ⁇ isan- n ⁇ mu ⁇ ⁇ ime ⁇ e I.
  • P ⁇ v ⁇ dya ⁇ is ⁇ y ⁇ anie diele ⁇ iches ⁇ i ⁇ S ⁇ YS ⁇ ⁇ luchenn ⁇ y ⁇ dd ⁇ zh ⁇ i in s ⁇ avnenii with ⁇ dl ⁇ zh ⁇ y, s ⁇ - de ⁇ zhaschey ⁇ an of bazal ⁇ vy ⁇ v ⁇ l ⁇ n without applying to ni ⁇ niz ⁇ m ⁇ le ⁇ ulya ⁇ n ⁇ y ⁇ liamidn ⁇ y sm ⁇ ly.
  • the test results are presented in table 9.
  • test parameter ⁇ Dini- The value of the test parameter is naming the name of the parameter. The declaration is made on May of the previous date.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

Un substrat pour cartes de circuits imprimés se compose d'une structure multicouches comprenant des feuilles de tissu de laine de basalte imprégnées d'un liant polymère contenant de préférence du nitrure de bore dont la quantité en poids est comprise entre 2 et 10 %. On peut obtenir les substrats par imprégnation des feuilles de tissu de laine de basalte d'un liant polymère, par séchage puis empilage des feuilles imprégnées, et par thermocompression de celles-ci. La surface des fibres de basalte est de préférence recouverte de 0,2 à 0,5 % de résine polyamide de faible masse moléculaire, et le liant polymère contient 2 à 10 % de nitrure de bore.
PCT/RU1992/000104 1992-05-15 1992-05-15 Substrat pour cartes de circuits imprimes et son procede de production Ceased WO1993023979A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/RU1992/000104 WO1993023979A1 (fr) 1992-05-15 1992-05-15 Substrat pour cartes de circuits imprimes et son procede de production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1992/000104 WO1993023979A1 (fr) 1992-05-15 1992-05-15 Substrat pour cartes de circuits imprimes et son procede de production

Publications (1)

Publication Number Publication Date
WO1993023979A1 true WO1993023979A1 (fr) 1993-11-25

Family

ID=20129714

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/RU1992/000104 Ceased WO1993023979A1 (fr) 1992-05-15 1992-05-15 Substrat pour cartes de circuits imprimes et son procede de production

Country Status (1)

Country Link
WO (1) WO1993023979A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2146686C1 (ru) * 1995-09-18 2000-03-20 Интернэшнл Бизнес Машинз Корпорейшн Структура материала, содержащего поперечно-сшитый полимер биологического происхождения

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
DE3711238A1 (de) * 1986-04-04 1987-10-15 Nippon Sheet Glass Co Ltd Gedruckte leiterplatte
FR2607997A1 (fr) * 1986-12-03 1988-06-10 Dynamit Nobel Ag Stratifie en polypropylene renforce de fibres et reticule, et son procede de fabrication
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
DE3711238A1 (de) * 1986-04-04 1987-10-15 Nippon Sheet Glass Co Ltd Gedruckte leiterplatte
FR2607997A1 (fr) * 1986-12-03 1988-06-10 Dynamit Nobel Ag Stratifie en polypropylene renforce de fibres et reticule, et son procede de fabrication
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2146686C1 (ru) * 1995-09-18 2000-03-20 Интернэшнл Бизнес Машинз Корпорейшн Структура материала, содержащего поперечно-сшитый полимер биологического происхождения

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