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USD931241S1 - Lower shield for a substrate processing chamber - Google Patents

Lower shield for a substrate processing chamber Download PDF

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Publication number
USD931241S1
USD931241S1 US29/703,658 US201929703658F USD931241S US D931241 S1 USD931241 S1 US D931241S1 US 201929703658 F US201929703658 F US 201929703658F US D931241 S USD931241 S US D931241S
Authority
US
United States
Prior art keywords
processing chamber
substrate processing
lower shield
view
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/703,658
Inventor
Sarath Babu
Ananthkrishna Jupudi
Yueh Sheng Ow
Junqi Wei
Kelvin Boh
Yuichi Wada
Kang Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US29/703,658 priority Critical patent/USD931241S1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, KANG, ZHANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Priority to TW109306129F priority patent/TWD211584S/en
Priority to TW109300802F priority patent/TWD211387S/en
Priority to JPD2020-3693F priority patent/JP1683052S/ja
Priority to JPD2020-21838F priority patent/JP1684624S/ja
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, ZHANG, KANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Priority to US29/778,108 priority patent/USD971167S1/en
Publication of USD931241S1 publication Critical patent/USD931241S1/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top isometric view of a lower shield for a substrate processing chamber, according to the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a cross-section view taken along line 8-8 in FIG. 2.
The dashed lines in FIGS. 1-8 are for the purpose of showing environmental structure, and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lower shield for a substrate processing chamber, as shown and described.
US29/703,658 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber Active USD931241S1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
TW109300802F TWD211387S (en) 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber
TW109306129F TWD211584S (en) 2019-08-28 2020-02-20 Lower shield for a substrate processing chamber
JPD2020-21838F JP1684624S (en) 2019-08-28 2020-02-27
JPD2020-3693F JP1683052S (en) 2019-08-28 2020-02-27
US29/778,108 USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/778,108 Division USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Publications (1)

Publication Number Publication Date
USD931241S1 true USD931241S1 (en) 2021-09-21

Family

ID=75378497

Family Applications (2)

Application Number Title Priority Date Filing Date
US29/703,658 Active USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
US29/778,108 Active USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Family Applications After (1)

Application Number Title Priority Date Filing Date
US29/778,108 Active USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Country Status (3)

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US (2) USD931241S1 (en)
JP (2) JP1683052S (en)
TW (2) TWD211387S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber

Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170881A1 (en) 2001-05-16 2002-11-21 Lam Research Hollow anode plasma reactor and method
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4217299B2 (en) 1998-03-06 2009-01-28 東京エレクトロン株式会社 Processing equipment
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US7651568B2 (en) 2005-03-28 2010-01-26 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
TWD121115S1 (en) * 2005-03-30 2008-01-21 東京威力科創股份有限公司 Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
CA140752S (en) * 2011-01-20 2012-01-25 Victaulic Co Of America Pipe
KR102045942B1 (en) 2011-05-31 2019-11-18 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and methods for dry etch with edge, side and back protection
US20140124089A1 (en) * 2012-11-07 2014-05-08 Mark C. Schneider Sleeve for loading a dispensing device with bulk viscous material
TWD169790S (en) * 2013-07-10 2015-08-11 日立國際電氣股份有限公司 Part of the vaporizer for substrate processing equipment
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD801928S1 (en) * 2014-10-17 2017-11-07 Ebara Corporation Rotor for rotary electrical machine
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
JP1546800S (en) * 2015-06-12 2016-03-28
JP1546512S (en) * 2015-09-04 2016-03-22
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
JP1584784S (en) * 2017-01-31 2017-08-28
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
JP1591706S (en) * 2017-02-28 2017-11-27
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020170881A1 (en) 2001-05-16 2002-11-21 Lam Research Hollow anode plasma reactor and method
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
USD872037S1 (en) * 2017-08-09 2020-01-07 Kokusai Electric Corporation Cover of seal cap for reaction chamber for semiconductor manufacturing
USD855027S1 (en) * 2018-01-22 2019-07-30 Kokusai Electric Corporation Cover of seal cap for reaction chamber of semiconductor
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2020/048303 dated Dec. 4, 2020.
Search Report for Taiwan Design Application No. 109300802, dated Aug. 5, 2020.

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber

Also Published As

Publication number Publication date
JP1684624S (en) 2021-05-10
TWD211584S (en) 2021-05-11
USD971167S1 (en) 2022-11-29
JP1683052S (en) 2021-04-12
TWD211387S (en) 2021-05-11

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