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USD494551S1 - Exhaust ring for manufacturing semiconductors - Google Patents

Exhaust ring for manufacturing semiconductors Download PDF

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Publication number
USD494551S1
USD494551S1 US29/183,528 US18352803F USD494551S US D494551 S1 USD494551 S1 US D494551S1 US 18352803 F US18352803 F US 18352803F US D494551 S USD494551 S US D494551S
Authority
US
United States
Prior art keywords
manufacturing semiconductors
exhaust ring
semiconductors
exhaust
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/183,528
Inventor
Shigeki Doba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DOBA, SHIGEKI
Application granted granted Critical
Publication of USD494551S1 publication Critical patent/USD494551S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front/top perspective view of an exhaust ring for manufacturing semiconductors showing my new design;
FIG. 2 is a top plan view thereof, the bottom plan view being a mirror image and, therefore, not shown;
FIG. 3 is a front elevational view thereof, the left-side elevational view being a mirror image and, therefore, not shown;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a reference front elevational view thereof;
FIG. 7 is a right-side cross-sectional view taken along line 7—7 in FIG. 6; and,
FIG. 8 is an enlarged, partial, cross-sectional view taken along line 8—8 in FIG. 7.
The exhaust ring for manufacturing semiconductors is used in a vacuum vessel for manufacturing semiconductors.

Claims (1)

  1. I claim the ornamental design for exhaust ring for manufacturing semiconductors, as shown and described.
US29/183,528 2002-12-12 2003-06-12 Exhaust ring for manufacturing semiconductors Expired - Lifetime USD494551S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002034493 2002-12-12
JP2002-034493 2002-12-12

Publications (1)

Publication Number Publication Date
USD494551S1 true USD494551S1 (en) 2004-08-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/183,528 Expired - Lifetime USD494551S1 (en) 2002-12-12 2003-06-12 Exhaust ring for manufacturing semiconductors

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US (1) USD494551S1 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040129218A1 (en) * 2001-12-07 2004-07-08 Toshiki Takahashi Exhaust ring mechanism and plasma processing apparatus using the same
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD696638S1 (en) * 2013-02-18 2013-12-31 Sps Inc. Magnetic connector electrode terminal module
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD907593S1 (en) 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310453A (en) 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
USD404372S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6068441A (en) 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6155915A (en) 1999-03-24 2000-12-05 Advanced Micro Devices, Inc. System and method for independent air bearing zoning for semiconductor polishing device
US20030017714A1 (en) 2001-07-12 2003-01-23 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
US20030124820A1 (en) 2001-04-12 2003-07-03 Johnsgard Kristian E. Systems and methods for epitaxially depositing films on a semiconductor substrate
US20040025788A1 (en) 2000-11-10 2004-02-12 Masahiro Ogasawara Plasma processing device and exhaust ring
US20040056017A1 (en) 2002-03-18 2004-03-25 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310453A (en) 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
USD404372S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6068441A (en) 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US6155915A (en) 1999-03-24 2000-12-05 Advanced Micro Devices, Inc. System and method for independent air bearing zoning for semiconductor polishing device
US20040025788A1 (en) 2000-11-10 2004-02-12 Masahiro Ogasawara Plasma processing device and exhaust ring
US20030124820A1 (en) 2001-04-12 2003-07-03 Johnsgard Kristian E. Systems and methods for epitaxially depositing films on a semiconductor substrate
US20030017714A1 (en) 2001-07-12 2003-01-23 Hitachi Kokusai Electric Inc. Substrate processing apparatus and method for manufacturing semiconductor device
US20040056017A1 (en) 2002-03-18 2004-03-25 Renken Wayne Glenn System and method for heating and cooling wafer at accelerated rates

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040129218A1 (en) * 2001-12-07 2004-07-08 Toshiki Takahashi Exhaust ring mechanism and plasma processing apparatus using the same
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD696638S1 (en) * 2013-02-18 2013-12-31 Sps Inc. Magnetic connector electrode terminal module
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD907593S1 (en) 2017-01-20 2021-01-12 Hitachi High-Tech Corporation Discharge chamber for a plasma processing apparatus
USD840365S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD840364S1 (en) 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD827592S1 (en) 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD871609S1 (en) * 2017-08-31 2019-12-31 Hitachi High-Technologies Corporation Electrode plate peripheral ring for a plasma processing apparatus
USD916038S1 (en) * 2019-03-19 2021-04-13 Hitachi High-Tech Corporation Grounded electrode for a plasma processing apparatus
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD979524S1 (en) * 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD1051867S1 (en) 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1047884S1 (en) * 2021-10-22 2024-10-22 Nuflare Technology, Inc. Susceptor cover
USD1086087S1 (en) * 2023-03-30 2025-07-29 Samsung Electronics Co., Ltd. CMP (chemical mechanical planarization) retaining ring

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