USD494551S1 - Exhaust ring for manufacturing semiconductors - Google Patents
Exhaust ring for manufacturing semiconductors Download PDFInfo
- Publication number
- USD494551S1 USD494551S1 US29/183,528 US18352803F USD494551S US D494551 S1 USD494551 S1 US D494551S1 US 18352803 F US18352803 F US 18352803F US D494551 S USD494551 S US D494551S
- Authority
- US
- United States
- Prior art keywords
- manufacturing semiconductors
- exhaust ring
- semiconductors
- exhaust
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000004065 semiconductor Substances 0.000 title claims description 5
Images
Description
FIG. 1 is a front/top perspective view of an exhaust ring for manufacturing semiconductors showing my new design;
FIG. 2 is a top plan view thereof, the bottom plan view being a mirror image and, therefore, not shown;
FIG. 3 is a front elevational view thereof, the left-side elevational view being a mirror image and, therefore, not shown;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a reference front elevational view thereof;
FIG. 7 is a right-side cross-sectional view taken along line 7—7 in FIG. 6; and,
FIG. 8 is an enlarged, partial, cross-sectional view taken along line 8—8 in FIG. 7.
The exhaust ring for manufacturing semiconductors is used in a vacuum vessel for manufacturing semiconductors.
Claims (1)
- I claim the ornamental design for exhaust ring for manufacturing semiconductors, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002034493 | 2002-12-12 | ||
| JP2002-034493 | 2002-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD494551S1 true USD494551S1 (en) | 2004-08-17 |
Family
ID=32844046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/183,528 Expired - Lifetime USD494551S1 (en) | 2002-12-12 | 2003-06-12 | Exhaust ring for manufacturing semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD494551S1 (en) |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129218A1 (en) * | 2001-12-07 | 2004-07-08 | Toshiki Takahashi | Exhaust ring mechanism and plasma processing apparatus using the same |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
| USD696638S1 (en) * | 2013-02-18 | 2013-12-31 | Sps Inc. | Magnetic connector electrode terminal module |
| USD697038S1 (en) * | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD827592S1 (en) | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
| USD840365S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD907593S1 (en) | 2017-01-20 | 2021-01-12 | Hitachi High-Tech Corporation | Discharge chamber for a plasma processing apparatus |
| USD916038S1 (en) * | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
| USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1047884S1 (en) * | 2021-10-22 | 2024-10-22 | Nuflare Technology, Inc. | Susceptor cover |
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310453A (en) | 1992-02-13 | 1994-05-10 | Tokyo Electron Yamanashi Limited | Plasma process method using an electrostatic chuck |
| USD404372S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| USD404370S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US6068441A (en) | 1997-11-21 | 2000-05-30 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US6155915A (en) | 1999-03-24 | 2000-12-05 | Advanced Micro Devices, Inc. | System and method for independent air bearing zoning for semiconductor polishing device |
| US20030017714A1 (en) | 2001-07-12 | 2003-01-23 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| US20030124820A1 (en) | 2001-04-12 | 2003-07-03 | Johnsgard Kristian E. | Systems and methods for epitaxially depositing films on a semiconductor substrate |
| US20040025788A1 (en) | 2000-11-10 | 2004-02-12 | Masahiro Ogasawara | Plasma processing device and exhaust ring |
| US20040056017A1 (en) | 2002-03-18 | 2004-03-25 | Renken Wayne Glenn | System and method for heating and cooling wafer at accelerated rates |
-
2003
- 2003-06-12 US US29/183,528 patent/USD494551S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5310453A (en) | 1992-02-13 | 1994-05-10 | Tokyo Electron Yamanashi Limited | Plasma process method using an electrostatic chuck |
| USD404372S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| USD404370S (en) | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| US6068441A (en) | 1997-11-21 | 2000-05-30 | Asm America, Inc. | Substrate transfer system for semiconductor processing equipment |
| US6155915A (en) | 1999-03-24 | 2000-12-05 | Advanced Micro Devices, Inc. | System and method for independent air bearing zoning for semiconductor polishing device |
| US20040025788A1 (en) | 2000-11-10 | 2004-02-12 | Masahiro Ogasawara | Plasma processing device and exhaust ring |
| US20030124820A1 (en) | 2001-04-12 | 2003-07-03 | Johnsgard Kristian E. | Systems and methods for epitaxially depositing films on a semiconductor substrate |
| US20030017714A1 (en) | 2001-07-12 | 2003-01-23 | Hitachi Kokusai Electric Inc. | Substrate processing apparatus and method for manufacturing semiconductor device |
| US20040056017A1 (en) | 2002-03-18 | 2004-03-25 | Renken Wayne Glenn | System and method for heating and cooling wafer at accelerated rates |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129218A1 (en) * | 2001-12-07 | 2004-07-08 | Toshiki Takahashi | Exhaust ring mechanism and plasma processing apparatus using the same |
| USD556704S1 (en) * | 2005-08-25 | 2007-12-04 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| USD557226S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD694790S1 (en) * | 2011-09-20 | 2013-12-03 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
| USD697038S1 (en) * | 2011-09-20 | 2014-01-07 | Tokyo Electron Limited | Baffle plate |
| USD696638S1 (en) * | 2013-02-18 | 2013-12-31 | Sps Inc. | Magnetic connector electrode terminal module |
| USD770992S1 (en) * | 2015-06-12 | 2016-11-08 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD797691S1 (en) * | 2016-04-14 | 2017-09-19 | Applied Materials, Inc. | Composite edge ring |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| USD907593S1 (en) | 2017-01-20 | 2021-01-12 | Hitachi High-Tech Corporation | Discharge chamber for a plasma processing apparatus |
| USD840365S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| USD840364S1 (en) | 2017-01-31 | 2019-02-12 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD836573S1 (en) | 2017-01-31 | 2018-12-25 | Hitachi High-Technologies Corporation | Ring for a plasma processing apparatus |
| USD827592S1 (en) | 2017-01-31 | 2018-09-04 | Hitachi High-Technologies Corporation | Electrode cover for a plasma processing apparatus |
| USD871609S1 (en) * | 2017-08-31 | 2019-12-31 | Hitachi High-Technologies Corporation | Electrode plate peripheral ring for a plasma processing apparatus |
| USD916038S1 (en) * | 2019-03-19 | 2021-04-13 | Hitachi High-Tech Corporation | Grounded electrode for a plasma processing apparatus |
| USD971167S1 (en) * | 2019-08-28 | 2022-11-29 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| USD943539S1 (en) * | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| USD979524S1 (en) * | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD986190S1 (en) | 2020-03-19 | 2023-05-16 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| USD1051867S1 (en) | 2020-03-19 | 2024-11-19 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD1047884S1 (en) * | 2021-10-22 | 2024-10-22 | Nuflare Technology, Inc. | Susceptor cover |
| USD1086087S1 (en) * | 2023-03-30 | 2025-07-29 | Samsung Electronics Co., Ltd. | CMP (chemical mechanical planarization) retaining ring |
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