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USD684551S1 - Wafer polishing pad holder - Google Patents

Wafer polishing pad holder Download PDF

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Publication number
USD684551S1
USD684551S1 US29/396,846 US201129396846F USD684551S US D684551 S1 USD684551 S1 US D684551S1 US 201129396846 F US201129396846 F US 201129396846F US D684551 S USD684551 S US D684551S
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US
United States
Prior art keywords
polishing pad
wafer polishing
pad holder
new design
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/396,846
Inventor
Phuong Van Nguyen
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Individual
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Individual
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Publication date
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Priority to US29/396,846 priority Critical patent/USD684551S1/en
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Publication of USD684551S1 publication Critical patent/USD684551S1/en
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FIG. 1 is a top perspective view of the wafer polishing pad holder showing my new design;
FIG. 2 is a top view of the wafer polishing pad holder showing my new design;
FIG. 3 is a front view of the wafer polishing pad holder showing my new design;
FIG. 4 is a rear view of the wafer polishing pad holder showing my new design;
FIG. 5 is a right side view of the wafer polishing pad holder showing my new design;
FIG. 6 is a left side view of the wafer polishing pad holder showing my new design; and
FIG. 7 is a cross sectional view of the wafer polishing pad holder, taken from FIG. 2 as indicated showing my new design; and,
FIG. 8 is a top view of the wafer polishing pad holder without the milled island within the inside pocket showing my new design.

Claims (1)

    CLAIM
  1. The ornamental design for a wafer polishing pad holder, as shown and described.
US29/396,846 2011-07-07 2011-07-07 Wafer polishing pad holder Active USD684551S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/396,846 USD684551S1 (en) 2011-07-07 2011-07-07 Wafer polishing pad holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/396,846 USD684551S1 (en) 2011-07-07 2011-07-07 Wafer polishing pad holder

Publications (1)

Publication Number Publication Date
USD684551S1 true USD684551S1 (en) 2013-06-18

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Family Applications (1)

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US29/396,846 Active USD684551S1 (en) 2011-07-07 2011-07-07 Wafer polishing pad holder

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US (1) USD684551S1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
US20130267155A1 (en) * 2012-04-09 2013-10-10 Phuong Van Nguyen Wafer Polishing Pad Holder Template
USD702655S1 (en) * 2012-10-15 2014-04-15 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
USD703161S1 (en) * 2012-10-15 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD784937S1 (en) * 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1035600S1 (en) * 2022-02-23 2024-07-16 Rf Scientific, Llc Semiconductor test fixture
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component

Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740237A (en) 1954-09-10 1956-04-03 Spitfire Tool Co Lapping machine
US4081928A (en) 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4780991A (en) 1986-08-22 1988-11-01 General Signal Mask and pressure block for ultra thin work pieces
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5533924A (en) 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
US5597346A (en) 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5788560A (en) 1996-01-25 1998-08-04 Shin-Etsu Handotai Co., Ltd. Backing pad and method for polishing semiconductor wafer therewith
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
US6425809B1 (en) * 1999-02-15 2002-07-30 Ebara Corporation Polishing apparatus
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US6612905B2 (en) 2001-04-23 2003-09-02 Phuong Van Nguyen Silicon wafer polishing holder and method of use thereof
US6645049B2 (en) 2001-04-23 2003-11-11 Phuong Van Nguyen Polishing holder for silicon wafers and method of use thereof
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US6722949B2 (en) * 2001-03-20 2004-04-20 Taiwan Semiconductors Manufacturing Co., Ltd Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using
JP2005033139A (en) 2003-07-11 2005-02-03 Sumitomo Mitsubishi Silicon Corp Wafer holder plate for polishing semiconductor wafer
US20050041234A1 (en) * 2002-07-11 2005-02-24 Asml Netherlands B.V. Substrate holder and device manufacturing method
US6887138B2 (en) 2003-06-20 2005-05-03 Freescale Semiconductor, Inc. Chemical mechanical polish (CMP) conditioning-disk holder
US20050095963A1 (en) * 2003-10-29 2005-05-05 Texas Instruments Incorporated Chemical mechanical polishing system
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
KR100928450B1 (en) 2009-03-12 2009-11-26 에스엠21씨(주) Template assembly for cmp system of silicon wafer for semiconductor
US7632170B2 (en) * 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
JP2010105144A (en) 2008-10-30 2010-05-13 Araca Inc Wafer template for chemical and mechanical polishing and its use method
US7731567B2 (en) * 2006-09-26 2010-06-08 Disco Corporation Semiconductor wafer processing method
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus

Patent Citations (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740237A (en) 1954-09-10 1956-04-03 Spitfire Tool Co Lapping machine
US4081928A (en) 1974-05-16 1978-04-04 Texas Instruments Incorporated Silicon slice carrier block and plug assembly
US4165584A (en) 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4512113A (en) 1982-09-23 1985-04-23 Budinger William D Workpiece holder for polishing operation
US4780991A (en) 1986-08-22 1988-11-01 General Signal Mask and pressure block for ultra thin work pieces
US5193316A (en) 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5647789A (en) 1993-11-01 1997-07-15 Fujikoshi Kakai Kogyo Kabushiki Kaisha Polishing machine and a method of polishing a work
US5533924A (en) 1994-09-01 1996-07-09 Micron Technology, Inc. Polishing apparatus, a polishing wafer carrier apparatus, a replacable component for a particular polishing apparatus and a process of polishing wafers
US5597346A (en) 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
US5788560A (en) 1996-01-25 1998-08-04 Shin-Etsu Handotai Co., Ltd. Backing pad and method for polishing semiconductor wafer therewith
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
US6425809B1 (en) * 1999-02-15 2002-07-30 Ebara Corporation Polishing apparatus
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US20020160693A1 (en) * 1999-12-28 2002-10-31 Takashi Nihonmatsu Wafer polishing method and wafer polishing device
US20040053566A1 (en) * 2001-01-12 2004-03-18 Applied Materials, Inc. CMP platen with patterned surface
US6722949B2 (en) * 2001-03-20 2004-04-20 Taiwan Semiconductors Manufacturing Co., Ltd Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using
US6645049B2 (en) 2001-04-23 2003-11-11 Phuong Van Nguyen Polishing holder for silicon wafers and method of use thereof
US6612905B2 (en) 2001-04-23 2003-09-02 Phuong Van Nguyen Silicon wafer polishing holder and method of use thereof
US20050041234A1 (en) * 2002-07-11 2005-02-24 Asml Netherlands B.V. Substrate holder and device manufacturing method
US6887138B2 (en) 2003-06-20 2005-05-03 Freescale Semiconductor, Inc. Chemical mechanical polish (CMP) conditioning-disk holder
JP2005033139A (en) 2003-07-11 2005-02-03 Sumitomo Mitsubishi Silicon Corp Wafer holder plate for polishing semiconductor wafer
US20050095963A1 (en) * 2003-10-29 2005-05-05 Texas Instruments Incorporated Chemical mechanical polishing system
US20050170616A1 (en) * 2004-02-03 2005-08-04 Disco Corporation Wafer dividing method
US20060079160A1 (en) * 2004-10-12 2006-04-13 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7462094B2 (en) * 2006-09-26 2008-12-09 Disco Corporation Wafer grinding method
US7731567B2 (en) * 2006-09-26 2010-06-08 Disco Corporation Semiconductor wafer processing method
US7572173B2 (en) * 2006-11-24 2009-08-11 National Taiwan University Of Science And Technology Polishing apparatus and pad replacing method thereof
US7632170B2 (en) * 2007-06-25 2009-12-15 Novellus Systems, Inc. CMP apparatuses with polishing assemblies that provide for the passive removal of slurry
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
JP2010105144A (en) 2008-10-30 2010-05-13 Araca Inc Wafer template for chemical and mechanical polishing and its use method
KR100928450B1 (en) 2009-03-12 2009-11-26 에스엠21씨(주) Template assembly for cmp system of silicon wafer for semiconductor
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130267155A1 (en) * 2012-04-09 2013-10-10 Phuong Van Nguyen Wafer Polishing Pad Holder Template
USD702655S1 (en) * 2012-10-15 2014-04-15 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
USD703161S1 (en) * 2012-10-15 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for ion implantation
USD703162S1 (en) * 2012-10-17 2014-04-22 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD731448S1 (en) * 2013-10-29 2015-06-09 Ebara Corporation Polishing pad for substrate polishing apparatus
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
USD748593S1 (en) * 2014-03-05 2016-02-02 Hzo, Inc. Boat for use in a material deposition apparatus
USD766850S1 (en) * 2014-03-28 2016-09-20 Tokyo Electron Limited Wafer holder for manufacturing semiconductor
USD720313S1 (en) * 2014-06-16 2014-12-30 Emcore Solar Power, Inc. Semiconductor wafer with dicing positions for solar cell fabrication
USD784937S1 (en) * 2014-11-13 2017-04-25 Tokyo Electron Limited Dummy wafer
USD785576S1 (en) 2014-11-13 2017-05-02 Tokyo Electron Limited Dummy wafer
USD786810S1 (en) * 2014-11-13 2017-05-16 Tokyo Electron Limited Dummy wafer
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1090468S1 (en) 2021-09-08 2025-08-26 Lam Research Corporation Debubbler component
USD1096679S1 (en) * 2021-09-08 2025-10-07 Lam Research Corporation Debubbler component
USD1054388S1 (en) * 2021-10-15 2024-12-17 Shin-Etsu Chemical Co., Ltd. Carrier substrate for handling
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1035600S1 (en) * 2022-02-23 2024-07-16 Rf Scientific, Llc Semiconductor test fixture

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