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USD808349S1 - Elastic membrane for semiconductor wafer polishing apparatus - Google Patents

Elastic membrane for semiconductor wafer polishing apparatus Download PDF

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Publication number
USD808349S1
USD808349S1 US29/574,604 US201629574604F USD808349S US D808349 S1 USD808349 S1 US D808349S1 US 201629574604 F US201629574604 F US 201629574604F US D808349 S USD808349 S US D808349S
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US
United States
Prior art keywords
semiconductor wafer
polishing apparatus
elastic membrane
wafer polishing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/574,604
Inventor
Makoto Fukushima
Hozumi Yasuda
Keisuke Namiki
Osamu Nabeya
Shingo Togashi
Satoru Yamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2013-10676F external-priority patent/JP1495739S/ja
Priority claimed from JPD2013-10672F external-priority patent/JP1494713S/ja
Priority claimed from JPD2013-10677F external-priority patent/JP1521451S/ja
Priority claimed from JPD2013-10674F external-priority patent/JP1495081S/ja
Priority claimed from JPD2013-10673F external-priority patent/JP1495738S/ja
Priority claimed from JPD2013-10678F external-priority patent/JP1521701S/ja
Priority claimed from JPD2013-10675F external-priority patent/JP1495082S/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of USD808349S1 publication Critical patent/USD808349S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a bottom plan view of a first elastic membrane for semiconductor wafer polishing apparatus showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is an enlarged perspective view of a portion taken along section 4 in FIG. 2;
FIG. 5 is a cross-sectional view taken along the line 5-5 in FIG. 2; and,
FIG. 6 is an enlarged portion view taken along line 6-6 in FIG. 5.
The broken lines shown in the drawings represent portions of the elastic membrane for semiconductor wafer polishing apparatus that form no part of the claimed design. The dashed-dot-dashed lines represent boundary lines of the claimed design.
All surfaces not shown form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
US29/574,604 2013-05-15 2016-08-17 Elastic membrane for semiconductor wafer polishing apparatus Active USD808349S1 (en)

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
JPD2013-10676F JP1495739S (en) 2013-05-15 2013-05-15
JPD2013-10672F JP1494713S (en) 2013-05-15 2013-05-15
JPD2013-10677F JP1521451S (en) 2013-05-15 2013-05-15
JPD2013-10674F JP1495081S (en) 2013-05-15 2013-05-15
JP2013-10676 2013-05-15
JP2013-10678 2013-05-15
JPD2013-10673F JP1495738S (en) 2013-05-15 2013-05-15
JP2013-10673 2013-05-15
JP2013-10675 2013-05-15
JPD2013-10678F JP1521701S (en) 2013-05-15 2013-05-15
JP2013-10677 2013-05-15
JPD2013-10675F JP1495082S (en) 2013-05-15 2013-05-15
JP2013-10672 2013-05-15
JP2013-10674 2013-05-15
JP2013-026346 2013-11-11
JP2013026348 2013-11-11
JP2013-026349 2013-11-11
JP2013026349 2013-11-11
JP2013-026348 2013-11-11
JP2013026347 2013-11-11
JP2013026346 2013-11-11
JP2013-026347 2013-11-11

Publications (1)

Publication Number Publication Date
USD808349S1 true USD808349S1 (en) 2018-01-23

Family

ID=60956707

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/574,604 Active USD808349S1 (en) 2013-05-15 2016-08-17 Elastic membrane for semiconductor wafer polishing apparatus

Country Status (1)

Country Link
US (1) USD808349S1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD981969S1 (en) * 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010029158A1 (en) 1998-07-30 2001-10-11 Yoshitaka Sasaki Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head
US6508696B1 (en) * 2000-08-25 2003-01-21 Mitsubishi Materials Corporation Wafer-polishing head and polishing apparatus having the same
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20040175951A1 (en) 2003-03-07 2004-09-09 Applied Materials, Inc. Substrate carrier with a textured membrane
US20080066682A1 (en) * 2006-03-24 2008-03-20 Tokyo Electron Limited Substrate supporting mechanism and substrate processing apparatus
US20080070479A1 (en) 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
US7357699B2 (en) 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20090068934A1 (en) 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090068935A1 (en) 2003-10-17 2009-03-12 Hiroomi Torii Polishing apparatus
US20090111362A1 (en) 2007-10-29 2009-04-30 Ebara Corporation Polishing Apparatus
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
CN301348233S (en) 2009-08-27 2010-09-15 株式会社荏原制作所 Elastic film for semiconductor wafer polishing device
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
TWD139857S (en) 2009-08-27 2011-04-11 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing equipment
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
TWD146491S (en) 2010-12-28 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD684551S1 (en) 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
US8469776B2 (en) 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
US20130316628A1 (en) 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US8859070B2 (en) 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Patent Citations (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010029158A1 (en) 1998-07-30 2001-10-11 Yoshitaka Sasaki Polishing apparatus and polishing method, and method of manufacturing semiconductor device and method of manufacturing thin film magnetic head
US6659850B2 (en) 2000-03-31 2003-12-09 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6508696B1 (en) * 2000-08-25 2003-01-21 Mitsubishi Materials Corporation Wafer-polishing head and polishing apparatus having the same
US7357699B2 (en) 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20040175951A1 (en) 2003-03-07 2004-09-09 Applied Materials, Inc. Substrate carrier with a textured membrane
US20090068935A1 (en) 2003-10-17 2009-03-12 Hiroomi Torii Polishing apparatus
US20080070479A1 (en) 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
US20090247057A1 (en) 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
US20080066682A1 (en) * 2006-03-24 2008-03-20 Tokyo Electron Limited Substrate supporting mechanism and substrate processing apparatus
US7402098B2 (en) 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US8469776B2 (en) 2006-11-22 2013-06-25 Applied Materials, Inc. Flexible membrane for carrier head
US20090068934A1 (en) 2007-09-04 2009-03-12 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
US20090111362A1 (en) 2007-10-29 2009-04-30 Ebara Corporation Polishing Apparatus
USD649126S1 (en) 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616390S1 (en) 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
TWD139857S (en) 2009-08-27 2011-04-11 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing equipment
CN301348233S (en) 2009-08-27 2010-09-15 株式会社荏原制作所 Elastic film for semiconductor wafer polishing device
USD633452S1 (en) 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD729753S1 (en) 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD711330S1 (en) 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
TWD146491S (en) 2010-12-28 2012-04-21 荏原製作所股份有限公司 Elastic film for semiconductor wafer polishing
USD684551S1 (en) 2011-07-07 2013-06-18 Phuong Van Nguyen Wafer polishing pad holder
US8859070B2 (en) 2011-11-30 2014-10-14 Ebara Corporation Elastic membrane
USD686175S1 (en) 2012-03-20 2013-07-16 Veeco Instruments Inc. Wafer carrier having pockets
USD686582S1 (en) 2012-03-20 2013-07-23 Veeco Instruments Inc. Wafer carrier having pockets
USD687791S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Multi-keyed wafer carrier
USD687790S1 (en) 2012-03-20 2013-08-13 Veeco Instruments Inc. Keyed wafer carrier
US20130316628A1 (en) 2012-05-23 2013-11-28 Samsung Electronics Co., Ltd. Flexible membranes for a polishing head
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) * 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD981969S1 (en) * 2020-12-18 2023-03-28 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber

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