USD1103948S1 - Gas distribution plate - Google Patents
Gas distribution plateInfo
- Publication number
- USD1103948S1 USD1103948S1 US29/804,613 US202129804613F USD1103948S US D1103948 S1 USD1103948 S1 US D1103948S1 US 202129804613 F US202129804613 F US 202129804613F US D1103948 S USD1103948 S US D1103948S
- Authority
- US
- United States
- Prior art keywords
- gas distribution
- distribution plate
- view
- design
- broken line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Description
The broken lines in the drawings illustrate portions of the article that form no part of the claimed design.
The dot-dash broken line, shown in FIGS. 1, 3 and 9 , illustrates a claim boundary and forms no part of the claimed design. The darker line weight broken line shown in FIGS. 3 & 9 illustrates the boundary of the enlarged view identified by area IX, shown in FIG. 3 . The lighter line weight broken line forms no part of the claimed design.
The surfaces illustrated without any surface shading form no part of the claimed design.
Claims (1)
- The ornamental design for a gas distribution plate, substantially as shown and described.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/804,613 USD1103948S1 (en) | 2021-08-21 | 2021-08-21 | Gas distribution plate |
| JP2022003334F JP1729409S (en) | 2021-08-21 | 2022-02-21 | gas distribution plate |
| TW111300840F TWD223814S (en) | 2021-08-21 | 2022-02-21 | Gas distribution plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/804,613 USD1103948S1 (en) | 2021-08-21 | 2021-08-21 | Gas distribution plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD1103948S1 true USD1103948S1 (en) | 2025-12-02 |
Family
ID=83931417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/804,613 Active USD1103948S1 (en) | 2021-08-21 | 2021-08-21 | Gas distribution plate |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD1103948S1 (en) |
| JP (1) | JP1729409S (en) |
| TW (1) | TWD223814S (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
| USD1052548S1 (en) | 2023-06-26 | 2024-11-26 | Applied Materials, Inc. | Gas diffuser |
Citations (74)
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| USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| USD407073S (en) * | 1997-12-24 | 1999-03-23 | Applied Materials, Inc. | Electrostatic chuck with improved spacing and charge migration reduction mask |
| USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
| US6037574A (en) | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
| US20030075437A1 (en) * | 2001-06-05 | 2003-04-24 | Marx Daniel R. | Ring-type sputtering target |
| US20030170388A1 (en) | 2000-06-23 | 2003-09-11 | Hiroshi Shinriki | Method for forming thin film and appatus for forming thin film |
| US20050178331A1 (en) * | 2004-02-13 | 2005-08-18 | Fourtner Lawrence C. | Electrode assembly and method for producing an electrode plate |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US20080173735A1 (en) | 2007-01-12 | 2008-07-24 | Veeco Instruments Inc. | Gas treatment systems |
| USD582949S1 (en) * | 2006-12-15 | 2008-12-16 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| USD583395S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| USD589471S1 (en) | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
| USD601521S1 (en) | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD648289S1 (en) * | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
| TWD147215S (en) | 2011-03-04 | 2012-05-21 | 應用材料股份有限公司 | Cleaning plate for inducing turbulent flow of a processing chamber cleaning gas |
| USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
| USD665055S1 (en) * | 2012-01-24 | 2012-08-07 | Asm Ip Holding B.V. | Shower plate |
| US20120199469A1 (en) * | 2011-02-09 | 2012-08-09 | Applied Materials, Inc. | Pvd sputtering target with a protected backing plate |
| US20130220547A1 (en) * | 2012-02-14 | 2013-08-29 | Tokyo Electron Limited | Substrate processing apparatus |
| USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
| USD708651S1 (en) | 2011-11-22 | 2014-07-08 | Applied Materials, Inc. | Electrostatic chuck |
| US20140346040A1 (en) * | 2012-01-18 | 2014-11-27 | Tokyo Electron Limited | Substrate processing apparatus |
| USD724701S1 (en) * | 2014-02-04 | 2015-03-17 | ASM IP Holding, B.V. | Shower plate |
| USD732145S1 (en) * | 2014-02-04 | 2015-06-16 | Asm Ip Holding B.V. | Shower plate |
| USD732644S1 (en) * | 2014-02-04 | 2015-06-23 | Asm Ip Holding B.V. | Top plate |
| USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
| US20150345020A1 (en) | 2014-05-30 | 2015-12-03 | Lam Research Corporation | Hollow cathode discharge (hcd) suppressing capacitively coupled plasma electrode and gas distribution faceplate |
| US9353440B2 (en) | 2013-12-20 | 2016-05-31 | Applied Materials, Inc. | Dual-direction chemical delivery system for ALD/CVD chambers |
| USD787458S1 (en) | 2015-11-18 | 2017-05-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| US20170191159A1 (en) | 2016-01-01 | 2017-07-06 | Applied Materials, Inc. | Non-Metallic Thermal CVD/ALD Gas Injector And Purge System |
| USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD797690S1 (en) | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
| USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| US20170365443A1 (en) | 2016-06-15 | 2017-12-21 | Applied Materials, Inc. | Gas distribution plate assembly for high power plasma etch processes |
| US20180142352A1 (en) | 2016-11-21 | 2018-05-24 | Applied Materials, Inc. | Two zone flow cooling plate design with concentric or spiral channel for efficient gas distribution assembly cooling |
| USD819580S1 (en) | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TWM576592U (en) | 2017-04-27 | 2019-04-11 | 美商應用材料股份有限公司 | Gas distribution plate and processing chamber including the same |
| USD851613S1 (en) * | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| JP1640252S (en) | 2018-03-09 | 2019-09-02 | ||
| US20190304751A1 (en) | 2018-03-29 | 2019-10-03 | Samsung Electronics Co., Ltd. | Plasma processing apparatus including gas distribution plate |
| USD864134S1 (en) * | 2018-10-24 | 2019-10-22 | Asm Ip Holding B.V. | Susceptor |
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD868993S1 (en) * | 2017-08-31 | 2019-12-03 | Hitachi High-Technologies Corporation | Electrode plate for a plasma processing apparatus |
| USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| US20210159111A1 (en) * | 2019-11-25 | 2021-05-27 | SCREEN Holdings Co., Ltd. | Substrate support device, thermal processing apparatus, substrate support method, and thermal processing method |
| USD931240S1 (en) * | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
| USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD982216S1 (en) * | 2019-07-05 | 2023-03-28 | Livingstyle Enterprises Limited | Light guiding plate having v-shaped notches |
| USD984895S1 (en) * | 2020-12-22 | 2023-05-02 | Applied Materials, Inc. | Packaging insert for a process chamber component |
| USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
| USD1008986S1 (en) * | 2021-04-26 | 2023-12-26 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing apparatus |
| USD1012051S1 (en) | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
| USD1035598S1 (en) * | 2020-09-02 | 2024-07-16 | Applied Materials, Inc. | Gas distribution plate for a semiconductor processing chamber |
| USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
| USD1052548S1 (en) * | 2023-06-26 | 2024-11-26 | Applied Materials, Inc. | Gas diffuser |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1073913S1 (en) * | 2021-11-26 | 2025-05-06 | Tomoegawa Corporation | Heat exchange plate |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1092423S1 (en) * | 2022-05-19 | 2025-09-09 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
-
2021
- 2021-08-21 US US29/804,613 patent/USD1103948S1/en active Active
-
2022
- 2022-02-21 TW TW111300840F patent/TWD223814S/en unknown
- 2022-02-21 JP JP2022003334F patent/JP1729409S/en active Active
Patent Citations (91)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD363464S (en) * | 1992-08-27 | 1995-10-24 | Tokyo Electron Yamanashi Limited | Electrode for a semiconductor processing apparatus |
| USD411516S (en) * | 1996-03-15 | 1999-06-29 | Tokyo Electron Limited | Gas diffusion plate for electrode of semiconductor wafer processing apparatus |
| US6037574A (en) | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
| USD407073S (en) * | 1997-12-24 | 1999-03-23 | Applied Materials, Inc. | Electrostatic chuck with improved spacing and charge migration reduction mask |
| US20030170388A1 (en) | 2000-06-23 | 2003-09-11 | Hiroshi Shinriki | Method for forming thin film and appatus for forming thin film |
| US20030075437A1 (en) * | 2001-06-05 | 2003-04-24 | Marx Daniel R. | Ring-type sputtering target |
| US20050178331A1 (en) * | 2004-02-13 | 2005-08-18 | Fourtner Lawrence C. | Electrode assembly and method for producing an electrode plate |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| USD548200S1 (en) * | 2005-09-29 | 2007-08-07 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD546784S1 (en) * | 2005-09-29 | 2007-07-17 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| USD601521S1 (en) | 2006-09-28 | 2009-10-06 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
| USD589471S1 (en) | 2006-09-28 | 2009-03-31 | Tokyo Electron Limited | Heater for manufacturing semiconductor |
| USD583394S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| USD583395S1 (en) * | 2006-12-15 | 2008-12-23 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| USD582949S1 (en) * | 2006-12-15 | 2008-12-16 | Tokyo Electron Limited | Cover for a heater stage of a plasma processing apparatus |
| US20080173735A1 (en) | 2007-01-12 | 2008-07-24 | Veeco Instruments Inc. | Gas treatment systems |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD648289S1 (en) * | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
| US20120199469A1 (en) * | 2011-02-09 | 2012-08-09 | Applied Materials, Inc. | Pvd sputtering target with a protected backing plate |
| TWD147215S (en) | 2011-03-04 | 2012-05-21 | 應用材料股份有限公司 | Cleaning plate for inducing turbulent flow of a processing chamber cleaning gas |
| USD664170S1 (en) | 2011-03-04 | 2012-07-24 | Applied Materials, Inc. | Cleaning plate for inducing turbulent flow of a processing chamber cleaning glass |
| USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
| USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
| USD708651S1 (en) | 2011-11-22 | 2014-07-08 | Applied Materials, Inc. | Electrostatic chuck |
| TWD165013S (en) | 2011-11-22 | 2014-12-21 | 應用材料股份有限公司 | Portion of electrostatic chuck |
| US20140346040A1 (en) * | 2012-01-18 | 2014-11-27 | Tokyo Electron Limited | Substrate processing apparatus |
| USD665055S1 (en) * | 2012-01-24 | 2012-08-07 | Asm Ip Holding B.V. | Shower plate |
| US20130220547A1 (en) * | 2012-02-14 | 2013-08-29 | Tokyo Electron Limited | Substrate processing apparatus |
| USD741823S1 (en) | 2013-07-10 | 2015-10-27 | Hitachi Kokusai Electric Inc. | Vaporizer for substrate processing apparatus |
| US9353440B2 (en) | 2013-12-20 | 2016-05-31 | Applied Materials, Inc. | Dual-direction chemical delivery system for ALD/CVD chambers |
| USD732644S1 (en) * | 2014-02-04 | 2015-06-23 | Asm Ip Holding B.V. | Top plate |
| USD733261S1 (en) * | 2014-02-04 | 2015-06-30 | Asm Ip Holding B.V. | Top plate |
| USD732145S1 (en) * | 2014-02-04 | 2015-06-16 | Asm Ip Holding B.V. | Shower plate |
| USD724701S1 (en) * | 2014-02-04 | 2015-03-17 | ASM IP Holding, B.V. | Shower plate |
| US20150345020A1 (en) | 2014-05-30 | 2015-12-03 | Lam Research Corporation | Hollow cathode discharge (hcd) suppressing capacitively coupled plasma electrode and gas distribution faceplate |
| TW201610220A (en) | 2014-05-30 | 2016-03-16 | 蘭姆研究公司 | Capacitively coupled plasma electrode and gas distribution panel capable of suppressing hollow cathode discharge |
| TWI680203B (en) | 2014-05-30 | 2019-12-21 | 美商蘭姆研究公司 | Hollow cathode discharge (hcd) suppressing capacitively coupled plasma electrode and gas distribution faceplate |
| USD797690S1 (en) | 2015-03-16 | 2017-09-19 | Nuflare Technology, Inc. | Heater for semiconductor manufacturing apparatus |
| USD837755S1 (en) * | 2015-04-16 | 2019-01-08 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD801942S1 (en) * | 2015-04-16 | 2017-11-07 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD797067S1 (en) * | 2015-04-21 | 2017-09-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD825504S1 (en) * | 2015-04-21 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD825505S1 (en) * | 2015-06-18 | 2018-08-14 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD798248S1 (en) * | 2015-06-18 | 2017-09-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD803802S1 (en) * | 2015-08-18 | 2017-11-28 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD795208S1 (en) * | 2015-08-18 | 2017-08-22 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing equipment |
| USD787458S1 (en) | 2015-11-18 | 2017-05-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
| US20170191159A1 (en) | 2016-01-01 | 2017-07-06 | Applied Materials, Inc. | Non-Metallic Thermal CVD/ALD Gas Injector And Purge System |
| USD789888S1 (en) * | 2016-01-08 | 2017-06-20 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| USD819580S1 (en) | 2016-04-01 | 2018-06-05 | Veeco Instruments, Inc. | Self-centering wafer carrier for chemical vapor deposition |
| US20170365443A1 (en) | 2016-06-15 | 2017-12-21 | Applied Materials, Inc. | Gas distribution plate assembly for high power plasma etch processes |
| USD836572S1 (en) * | 2016-09-30 | 2018-12-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD869409S1 (en) * | 2016-09-30 | 2019-12-10 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| TW201834111A (en) | 2016-11-21 | 2018-09-16 | 美商應用材料股份有限公司 | Two zone flow cooling plate design with concentric or spiral channel for efficient gas distribution assembly cooling |
| US20180142352A1 (en) | 2016-11-21 | 2018-05-24 | Applied Materials, Inc. | Two zone flow cooling plate design with concentric or spiral channel for efficient gas distribution assembly cooling |
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| TWM576592U (en) | 2017-04-27 | 2019-04-11 | 美商應用材料股份有限公司 | Gas distribution plate and processing chamber including the same |
| USD868993S1 (en) * | 2017-08-31 | 2019-12-03 | Hitachi High-Technologies Corporation | Electrode plate for a plasma processing apparatus |
| USD894137S1 (en) * | 2017-10-05 | 2020-08-25 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD851613S1 (en) * | 2017-10-05 | 2019-06-18 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD946638S1 (en) * | 2017-12-11 | 2022-03-22 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD877101S1 (en) * | 2018-03-09 | 2020-03-03 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD902165S1 (en) * | 2018-03-09 | 2020-11-17 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| JP1640252S (en) | 2018-03-09 | 2019-09-02 | ||
| US20190304751A1 (en) | 2018-03-29 | 2019-10-03 | Samsung Electronics Co., Ltd. | Plasma processing apparatus including gas distribution plate |
| USD864134S1 (en) * | 2018-10-24 | 2019-10-22 | Asm Ip Holding B.V. | Susceptor |
| USD1012051S1 (en) | 2019-06-17 | 2024-01-23 | Tokyo Electron Limited | Electrostatic chuck for semiconductor manufacturing device |
| USD982216S1 (en) * | 2019-07-05 | 2023-03-28 | Livingstyle Enterprises Limited | Light guiding plate having v-shaped notches |
| USD931240S1 (en) * | 2019-07-30 | 2021-09-21 | Applied Materials, Inc. | Substrate support pedestal |
| USD908645S1 (en) * | 2019-08-26 | 2021-01-26 | Applied Materials, Inc. | Sputtering target for a physical vapor deposition chamber |
| US20210159111A1 (en) * | 2019-11-25 | 2021-05-27 | SCREEN Holdings Co., Ltd. | Substrate support device, thermal processing apparatus, substrate support method, and thermal processing method |
| USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD970566S1 (en) * | 2020-03-23 | 2022-11-22 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1035598S1 (en) * | 2020-09-02 | 2024-07-16 | Applied Materials, Inc. | Gas distribution plate for a semiconductor processing chamber |
| USD966357S1 (en) * | 2020-12-02 | 2022-10-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD984895S1 (en) * | 2020-12-22 | 2023-05-02 | Applied Materials, Inc. | Packaging insert for a process chamber component |
| USD984972S1 (en) * | 2021-03-29 | 2023-05-02 | Beijing Naura Microelectronics Equipment Co., Ltd. | Electrostatic chuck for semiconductor manufacture |
| USD1008986S1 (en) * | 2021-04-26 | 2023-12-26 | Hitachi High-Tech Corporation | Ion shield plate for plasma processing apparatus |
| USD1073913S1 (en) * | 2021-11-26 | 2025-05-06 | Tomoegawa Corporation | Heat exchange plate |
| USD1092422S1 (en) * | 2021-11-26 | 2025-09-09 | Tomoegawa Corporation | Heat exchange plate |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1092423S1 (en) * | 2022-05-19 | 2025-09-09 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| USD1037778S1 (en) * | 2022-07-19 | 2024-08-06 | Applied Materials, Inc. | Gas distribution plate |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1052548S1 (en) * | 2023-06-26 | 2024-11-26 | Applied Materials, Inc. | Gas diffuser |
Non-Patent Citations (2)
| Title |
|---|
| Non-Final Office Action in U.S. Appl. No. 29/804,614 dated Mar. 27, 2024, 17 pages. |
| Non-Final Office Action in U.S. Appl. No. 29/804,614 dated Mar. 27, 2024, 17 pages. |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD223814S (en) | 2023-02-21 |
| JP1729409S (en) | 2022-11-09 |
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