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USD648289S1 - Electroplating flow shaping plate having offset spiral hole pattern - Google Patents

Electroplating flow shaping plate having offset spiral hole pattern Download PDF

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Publication number
USD648289S1
USD648289S1 US29/377,521 US37752110F USD648289S US D648289 S1 USD648289 S1 US D648289S1 US 37752110 F US37752110 F US 37752110F US D648289 S USD648289 S US D648289S
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US
United States
Prior art keywords
hole pattern
shaping plate
spiral hole
flow shaping
offset spiral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/377,521
Inventor
Steven T. Mayer
David Porter
Robert Rash
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novellus Systems Inc
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Priority to US29/377,521 priority Critical patent/USD648289S1/en
Assigned to NOVELLUS SYSTEMS, INC. reassignment NOVELLUS SYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAYER, STEVEN T., PORTER, DAVID, RASH, ROBERT
Priority to TW100301923F priority patent/TWD148167S/en
Application granted granted Critical
Publication of USD648289S1 publication Critical patent/USD648289S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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FIG. 1 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing an embodiment of our new design;
FIG. 2 is a bottom view thereof;
FIG. 3 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 4 is a front perspective view thereof; and
FIG. 5 is a rear perspective view thereof.
FIG. 6 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a second embodiment of our new design;
FIG. 7 is a bottom view thereof;
FIG. 8 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 9 is a front perspective view thereof; and
FIG. 10 is a rear perspective view thereof.
FIG. 11 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a third embodiment of our new design;
FIG. 12 is a bottom view thereof; and
FIG. 13 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 14 is a front perspective view thereof; and
FIG. 15 is a rear perspective view thereof.
FIG. 16 is a front plan view of an electroplating flow shaping plate having offset spiral hole pattern showing a fourth embodiment of our new design;
FIG. 17 is a bottom view thereof; and
FIG. 18 is a right side elevational view thereof, the left, top and bottom side elevational views being identical images thereof;
FIG. 19 is a front perspective view thereof; and,
FIG. 20 is a rear perspective view thereof.

Claims (1)

  1. We claim the ornamental design for an electroplating flow shaping plate having offset spiral hole pattern, as shown and described.
US29/377,521 2010-10-21 2010-10-21 Electroplating flow shaping plate having offset spiral hole pattern Expired - Lifetime USD648289S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/377,521 USD648289S1 (en) 2010-10-21 2010-10-21 Electroplating flow shaping plate having offset spiral hole pattern
TW100301923F TWD148167S (en) 2010-10-21 2011-04-21 Electroplating flow shaping plate having offset spiral hole pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/377,521 USD648289S1 (en) 2010-10-21 2010-10-21 Electroplating flow shaping plate having offset spiral hole pattern

Publications (1)

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USD648289S1 true USD648289S1 (en) 2011-11-08

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US29/377,521 Expired - Lifetime USD648289S1 (en) 2010-10-21 2010-10-21 Electroplating flow shaping plate having offset spiral hole pattern

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TW (1) TWD148167S (en)

Cited By (37)

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USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US8968533B2 (en) 2012-05-10 2015-03-03 Applied Materials, Inc Electroplating processor with geometric electrolyte flow path
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
USD868995S1 (en) * 2017-11-06 2019-12-03 Hitachi High-Technologies Corporation Gas diffusion plate for a plasma processing apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
USD1042372S1 (en) * 2022-09-26 2024-09-17 Poynting Antennas (Pty) Limited Heat sink
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
US9512538B2 (en) 2008-12-10 2016-12-06 Novellus Systems, Inc. Plating cup with contoured cup bottom

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US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5660699A (en) * 1995-02-20 1997-08-26 Kao Corporation Electroplating apparatus
US5744019A (en) * 1995-11-29 1998-04-28 Aiwa Research And Development, Inc. Method for electroplating metal films including use a cathode ring insulator ring and thief ring
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US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6398926B1 (en) * 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6521102B1 (en) * 2000-03-24 2003-02-18 Applied Materials, Inc. Perforated anode for uniform deposition of a metal layer
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US20070068819A1 (en) * 2005-05-25 2007-03-29 Saravjeet Singh Electroplating apparatus based on an array of anodes
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
US7641776B2 (en) * 2005-03-10 2010-01-05 Lsi Corporation System and method for increasing yield from semiconductor wafer electroplating
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
US7670465B2 (en) * 2002-07-24 2010-03-02 Applied Materials, Inc. Anolyte for copper plating
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5660699A (en) * 1995-02-20 1997-08-26 Kao Corporation Electroplating apparatus
US5744019A (en) * 1995-11-29 1998-04-28 Aiwa Research And Development, Inc. Method for electroplating metal films including use a cathode ring insulator ring and thief ring
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US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
US6521102B1 (en) * 2000-03-24 2003-02-18 Applied Materials, Inc. Perforated anode for uniform deposition of a metal layer
US6398926B1 (en) * 2000-05-31 2002-06-04 Techpoint Pacific Singapore Pte Ltd. Electroplating apparatus and method of using the same
US7670465B2 (en) * 2002-07-24 2010-03-02 Applied Materials, Inc. Anolyte for copper plating
USD553104S1 (en) * 2004-04-21 2007-10-16 Tokyo Electron Limited Absorption board for an electric chuck used in semiconductor manufacture
US7641776B2 (en) * 2005-03-10 2010-01-05 Lsi Corporation System and method for increasing yield from semiconductor wafer electroplating
US20070068819A1 (en) * 2005-05-25 2007-03-29 Saravjeet Singh Electroplating apparatus based on an array of anodes
US7935240B2 (en) * 2005-05-25 2011-05-03 Applied Materials, Inc. Electroplating apparatus and method based on an array of anodes
US20110031112A1 (en) * 2005-05-25 2011-02-10 Manoocher Birang In-situ profile measurement in an electroplating process
USD544452S1 (en) * 2005-09-08 2007-06-12 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD587222S1 (en) * 2006-08-01 2009-02-24 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
USD614593S1 (en) * 2008-07-21 2010-04-27 Asm Genitech Korea Ltd Substrate support for a semiconductor deposition apparatus
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck

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U.S. Appl. No. 61/405,608, "Flow diverters and flow shaping plates for electroplating cells", Mayer et al., filed Oct. 21, 2010.

Cited By (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475644B2 (en) 2000-03-27 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
US8308931B2 (en) 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US9309604B2 (en) 2008-11-07 2016-04-12 Novellus Systems, Inc. Method and apparatus for electroplating
US8540857B1 (en) 2008-12-19 2013-09-24 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9464361B2 (en) 2010-07-02 2016-10-11 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
US9394620B2 (en) 2010-07-02 2016-07-19 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10190230B2 (en) 2010-07-02 2019-01-29 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD709538S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709539S1 (en) 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
US8968533B2 (en) 2012-05-10 2015-03-03 Applied Materials, Inc Electroplating processor with geometric electrolyte flow path
USD693782S1 (en) * 2012-11-19 2013-11-19 Epicrew Corporation Lid for epitaxial growing device
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10662545B2 (en) 2012-12-12 2020-05-26 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9834852B2 (en) 2012-12-12 2017-12-05 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US10301739B2 (en) 2013-05-01 2019-05-28 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9899230B2 (en) 2013-05-29 2018-02-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
USD793972S1 (en) * 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 31-pocket configuration
USD793971S1 (en) 2015-03-27 2017-08-08 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD852762S1 (en) 2015-03-27 2019-07-02 Veeco Instruments Inc. Wafer carrier with a 14-pocket configuration
USD806046S1 (en) 2015-04-16 2017-12-26 Veeco Instruments Inc. Wafer carrier with a multi-pocket configuration
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10923340B2 (en) 2015-05-14 2021-02-16 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11047059B2 (en) 2016-05-24 2021-06-29 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
USD868995S1 (en) * 2017-11-06 2019-12-03 Hitachi High-Technologies Corporation Gas diffusion plate for a plasma processing apparatus
USD1104086S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1103948S1 (en) * 2021-08-21 2025-12-02 Applied Materials, Inc. Gas distribution plate
USD1071103S1 (en) * 2022-04-11 2025-04-15 Applied Materials, Inc. Gas distribution plate
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1099858S1 (en) * 2022-05-19 2025-10-28 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1085029S1 (en) * 2022-07-19 2025-07-22 Applied Materials, Inc. Gas distribution plate
USD1042372S1 (en) * 2022-09-26 2024-09-17 Poynting Antennas (Pty) Limited Heat sink

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