USD648289S1 - Electroplating flow shaping plate having offset spiral hole pattern - Google Patents
Electroplating flow shaping plate having offset spiral hole pattern Download PDFInfo
- Publication number
- USD648289S1 USD648289S1 US29/377,521 US37752110F USD648289S US D648289 S1 USD648289 S1 US D648289S1 US 37752110 F US37752110 F US 37752110F US D648289 S USD648289 S US D648289S
- Authority
- US
- United States
- Prior art keywords
- hole pattern
- shaping plate
- spiral hole
- flow shaping
- offset spiral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
Claims (1)
- We claim the ornamental design for an electroplating flow shaping plate having offset spiral hole pattern, as shown and described.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/377,521 USD648289S1 (en) | 2010-10-21 | 2010-10-21 | Electroplating flow shaping plate having offset spiral hole pattern |
| TW100301923F TWD148167S (en) | 2010-10-21 | 2011-04-21 | Electroplating flow shaping plate having offset spiral hole pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/377,521 USD648289S1 (en) | 2010-10-21 | 2010-10-21 | Electroplating flow shaping plate having offset spiral hole pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD648289S1 true USD648289S1 (en) | 2011-11-08 |
Family
ID=44882822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/377,521 Expired - Lifetime USD648289S1 (en) | 2010-10-21 | 2010-10-21 | Electroplating flow shaping plate having offset spiral hole pattern |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD648289S1 (en) |
| TW (1) | TWD148167S (en) |
Cited By (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| USD693782S1 (en) * | 2012-11-19 | 2013-11-19 | Epicrew Corporation | Lid for epitaxial growing device |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
| USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709537S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US8968533B2 (en) | 2012-05-10 | 2015-03-03 | Applied Materials, Inc | Electroplating processor with geometric electrolyte flow path |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| USD793972S1 (en) * | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD793976S1 (en) * | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| USD806046S1 (en) | 2015-04-16 | 2017-12-26 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| USD868995S1 (en) * | 2017-11-06 | 2019-12-03 | Hitachi High-Technologies Corporation | Gas diffusion plate for a plasma processing apparatus |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| USD1042372S1 (en) * | 2022-09-26 | 2024-09-17 | Poynting Antennas (Pty) Limited | Heat sink |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1092423S1 (en) * | 2022-05-19 | 2025-09-09 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
Citations (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4304641A (en) * | 1980-11-24 | 1981-12-08 | International Business Machines Corporation | Rotary electroplating cell with controlled current distribution |
| US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
| US5660699A (en) * | 1995-02-20 | 1997-08-26 | Kao Corporation | Electroplating apparatus |
| US5744019A (en) * | 1995-11-29 | 1998-04-28 | Aiwa Research And Development, Inc. | Method for electroplating metal films including use a cathode ring insulator ring and thief ring |
| US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
| US6080291A (en) * | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
| US6398926B1 (en) * | 2000-05-31 | 2002-06-04 | Techpoint Pacific Singapore Pte Ltd. | Electroplating apparatus and method of using the same |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6521102B1 (en) * | 2000-03-24 | 2003-02-18 | Applied Materials, Inc. | Perforated anode for uniform deposition of a metal layer |
| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
| US6921468B2 (en) * | 1997-09-30 | 2005-07-26 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US20070068819A1 (en) * | 2005-05-25 | 2007-03-29 | Saravjeet Singh | Electroplating apparatus based on an array of anodes |
| USD544452S1 (en) * | 2005-09-08 | 2007-06-12 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| US7641776B2 (en) * | 2005-03-10 | 2010-01-05 | Lsi Corporation | System and method for increasing yield from semiconductor wafer electroplating |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| US7670465B2 (en) * | 2002-07-24 | 2010-03-02 | Applied Materials, Inc. | Anolyte for copper plating |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| US20110031112A1 (en) * | 2005-05-25 | 2011-02-10 | Manoocher Birang | In-situ profile measurement in an electroplating process |
-
2010
- 2010-10-21 US US29/377,521 patent/USD648289S1/en not_active Expired - Lifetime
-
2011
- 2011-04-21 TW TW100301923F patent/TWD148167S/en unknown
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4304641A (en) * | 1980-11-24 | 1981-12-08 | International Business Machines Corporation | Rotary electroplating cell with controlled current distribution |
| US5078852A (en) * | 1990-10-12 | 1992-01-07 | Microelectronics And Computer Technology Corporation | Plating rack |
| US5660699A (en) * | 1995-02-20 | 1997-08-26 | Kao Corporation | Electroplating apparatus |
| US5744019A (en) * | 1995-11-29 | 1998-04-28 | Aiwa Research And Development, Inc. | Method for electroplating metal films including use a cathode ring insulator ring and thief ring |
| US6004440A (en) * | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
| US6921468B2 (en) * | 1997-09-30 | 2005-07-26 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
| US6080291A (en) * | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
| US6497801B1 (en) * | 1998-07-10 | 2002-12-24 | Semitool Inc | Electroplating apparatus with segmented anode array |
| US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
| US6521102B1 (en) * | 2000-03-24 | 2003-02-18 | Applied Materials, Inc. | Perforated anode for uniform deposition of a metal layer |
| US6398926B1 (en) * | 2000-05-31 | 2002-06-04 | Techpoint Pacific Singapore Pte Ltd. | Electroplating apparatus and method of using the same |
| US7670465B2 (en) * | 2002-07-24 | 2010-03-02 | Applied Materials, Inc. | Anolyte for copper plating |
| USD553104S1 (en) * | 2004-04-21 | 2007-10-16 | Tokyo Electron Limited | Absorption board for an electric chuck used in semiconductor manufacture |
| US7641776B2 (en) * | 2005-03-10 | 2010-01-05 | Lsi Corporation | System and method for increasing yield from semiconductor wafer electroplating |
| US20070068819A1 (en) * | 2005-05-25 | 2007-03-29 | Saravjeet Singh | Electroplating apparatus based on an array of anodes |
| US7935240B2 (en) * | 2005-05-25 | 2011-05-03 | Applied Materials, Inc. | Electroplating apparatus and method based on an array of anodes |
| US20110031112A1 (en) * | 2005-05-25 | 2011-02-10 | Manoocher Birang | In-situ profile measurement in an electroplating process |
| USD544452S1 (en) * | 2005-09-08 | 2007-06-12 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD552565S1 (en) * | 2005-09-08 | 2007-10-09 | Tokyo Ohka Kogyo Co., Ltd. | Supporting plate |
| USD548705S1 (en) * | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| USD587222S1 (en) * | 2006-08-01 | 2009-02-24 | Tokyo Electron Limited | Attracting plate of an electrostatic chuck for semiconductor manufacturing |
| USD614593S1 (en) * | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| USD609652S1 (en) * | 2008-07-22 | 2010-02-09 | Tokyo Electron Limited | Wafer attracting plate |
| USD609655S1 (en) * | 2008-10-03 | 2010-02-09 | Ngk Insulators, Ltd. | Electrostatic chuck |
Non-Patent Citations (1)
| Title |
|---|
| U.S. Appl. No. 61/405,608, "Flow diverters and flow shaping plates for electroplating cells", Mayer et al., filed Oct. 21, 2010. |
Cited By (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8475644B2 (en) | 2000-03-27 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US9309604B2 (en) | 2008-11-07 | 2016-04-12 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8540857B1 (en) | 2008-12-19 | 2013-09-24 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
| US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
| US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9464361B2 (en) | 2010-07-02 | 2016-10-11 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| US9394620B2 (en) | 2010-07-02 | 2016-07-19 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10190230B2 (en) | 2010-07-02 | 2019-01-29 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
| USD664249S1 (en) * | 2011-07-01 | 2012-07-24 | Applied Materials, Inc. | Flow blocker plate |
| USD699199S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode plate for a plasma processing apparatus |
| USD709538S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709537S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709536S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD709539S1 (en) | 2011-09-30 | 2014-07-22 | Tokyo Electron Limited | Focusing ring |
| USD699200S1 (en) * | 2011-09-30 | 2014-02-11 | Tokyo Electron Limited | Electrode member for a plasma processing apparatus |
| US8968533B2 (en) | 2012-05-10 | 2015-03-03 | Applied Materials, Inc | Electroplating processor with geometric electrolyte flow path |
| USD693782S1 (en) * | 2012-11-19 | 2013-11-19 | Epicrew Corporation | Lid for epitaxial growing device |
| US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US10662545B2 (en) | 2012-12-12 | 2020-05-26 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9834852B2 (en) | 2012-12-12 | 2017-12-05 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
| US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| US10301739B2 (en) | 2013-05-01 | 2019-05-28 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
| USD793976S1 (en) * | 2013-05-15 | 2017-08-08 | Ebara Corporation | Substrate retaining ring |
| US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9899230B2 (en) | 2013-05-29 | 2018-02-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
| US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
| USD793972S1 (en) * | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 31-pocket configuration |
| USD793971S1 (en) | 2015-03-27 | 2017-08-08 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD852762S1 (en) | 2015-03-27 | 2019-07-02 | Veeco Instruments Inc. | Wafer carrier with a 14-pocket configuration |
| USD806046S1 (en) | 2015-04-16 | 2017-12-26 | Veeco Instruments Inc. | Wafer carrier with a multi-pocket configuration |
| US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10923340B2 (en) | 2015-05-14 | 2021-02-16 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
| US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
| USD873782S1 (en) * | 2016-05-17 | 2020-01-28 | Electro Scientific Industries, Inc | Component carrier plate |
| US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11047059B2 (en) | 2016-05-24 | 2021-06-29 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
| US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
| US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
| USD868995S1 (en) * | 2017-11-06 | 2019-12-03 | Hitachi High-Technologies Corporation | Gas diffusion plate for a plasma processing apparatus |
| USD1104086S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1103948S1 (en) * | 2021-08-21 | 2025-12-02 | Applied Materials, Inc. | Gas distribution plate |
| USD1071103S1 (en) * | 2022-04-11 | 2025-04-15 | Applied Materials, Inc. | Gas distribution plate |
| USD1092423S1 (en) * | 2022-05-19 | 2025-09-09 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| USD1099858S1 (en) * | 2022-05-19 | 2025-10-28 | Asm Ip Holding B.V. | Electrode plate for semiconductor manufacturing apparatus |
| USD1085029S1 (en) * | 2022-07-19 | 2025-07-22 | Applied Materials, Inc. | Gas distribution plate |
| USD1042372S1 (en) * | 2022-09-26 | 2024-09-17 | Poynting Antennas (Pty) Limited | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD148167S (en) | 2012-07-11 |
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