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TWI732893B - 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物 - Google Patents

負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物 Download PDF

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Publication number
TWI732893B
TWI732893B TW106121405A TW106121405A TWI732893B TW I732893 B TWI732893 B TW I732893B TW 106121405 A TW106121405 A TW 106121405A TW 106121405 A TW106121405 A TW 106121405A TW I732893 B TWI732893 B TW I732893B
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TW
Taiwan
Prior art keywords
group
resin composition
photosensitive resin
formula
negative photosensitive
Prior art date
Application number
TW106121405A
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English (en)
Chinese (zh)
Other versions
TW201817773A (zh
Inventor
吉田健太
岩井悠
渋谷明規
Original Assignee
日商富士軟片股份有限公司
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Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW201817773A publication Critical patent/TW201817773A/zh
Application granted granted Critical
Publication of TWI732893B publication Critical patent/TWI732893B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
TW106121405A 2016-06-29 2017-06-27 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物 TWI732893B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016129367 2016-06-29
JP2016-129367 2016-06-29

Publications (2)

Publication Number Publication Date
TW201817773A TW201817773A (zh) 2018-05-16
TWI732893B true TWI732893B (zh) 2021-07-11

Family

ID=60787264

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106121405A TWI732893B (zh) 2016-06-29 2017-06-27 負型感光性樹脂組成物、硬化膜、硬化膜的製造方法、半導體元件、積層體的製造方法、半導體元件的製造方法及聚醯亞胺前驅物

Country Status (3)

Country Link
JP (1) JP6704048B2 (ja)
TW (1) TWI732893B (ja)
WO (1) WO2018003726A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7313180B2 (ja) * 2018-04-23 2023-07-24 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法
KR102533836B1 (ko) * 2018-09-26 2023-05-18 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 반도체 디바이스, 및 열염기 발생제
KR20210048519A (ko) * 2018-09-27 2021-05-03 후지필름 가부시키가이샤 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 및 반도체 디바이스
JPWO2020070924A1 (ja) * 2018-10-03 2021-09-24 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
TWI827901B (zh) * 2020-01-29 2024-01-01 日商旭化成股份有限公司 負型感光性樹脂組合物、以及使用其之聚醯亞胺及硬化浮凸圖案之製造方法
TW202219117A (zh) * 2020-08-26 2022-05-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體器件
JPWO2023181637A1 (ja) * 2022-03-25 2023-09-28
TW202424051A (zh) * 2022-09-30 2024-06-16 日商富士軟片股份有限公司 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法及半導體元件
WO2025013140A1 (ja) * 2023-07-07 2025-01-16 株式会社レゾナック ポリイミド系樹脂前駆体、感光性樹脂組成物、樹脂膜を製造する方法、及びアミド酸エステル化合物
WO2025126337A1 (ja) * 2023-12-12 2025-06-19 Ｈｄマイクロシステムズ株式会社 樹脂組成物、硬化物の製造方法、硬化物、及び電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005326579A (ja) * 2004-05-13 2005-11-24 Toyobo Co Ltd ネガ型感光性ポリイミド前駆体組成物
TW201543161A (zh) * 2014-03-27 2015-11-16 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置
TW201602193A (zh) * 2014-06-27 2016-01-16 Fujifilm Corp 熱鹼產生劑、熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3208940B2 (ja) * 1993-08-10 2001-09-17 東レ株式会社 ポリイミド前駆体組成物
JP2015151405A (ja) * 2014-02-10 2015-08-24 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品
JP6390165B2 (ja) * 2014-05-21 2018-09-19 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005326579A (ja) * 2004-05-13 2005-11-24 Toyobo Co Ltd ネガ型感光性ポリイミド前駆体組成物
TW201543161A (zh) * 2014-03-27 2015-11-16 Fujifilm Corp 感光性樹脂組成物、硬化膜、硬化膜之製造方法及半導體裝置
TW201602193A (zh) * 2014-06-27 2016-01-16 Fujifilm Corp 熱鹼產生劑、熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置

Also Published As

Publication number Publication date
WO2018003726A1 (ja) 2018-01-04
JPWO2018003726A1 (ja) 2019-04-04
JP6704048B2 (ja) 2020-06-03
TW201817773A (zh) 2018-05-16

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