TWI781901B - 聚醯亞胺膜、銅張積層板及電路基板 - Google Patents
聚醯亞胺膜、銅張積層板及電路基板 Download PDFInfo
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- TWI781901B TWI781901B TW111117849A TW111117849A TWI781901B TW I781901 B TWI781901 B TW I781901B TW 111117849 A TW111117849 A TW 111117849A TW 111117849 A TW111117849 A TW 111117849A TW I781901 B TWI781901 B TW I781901B
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- diamine
- polyimide
- thermoplastic polyimide
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Classifications
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- C—CHEMISTRY; METALLURGY
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- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/0133—Elastomeric or compliant polymer
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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Applications Claiming Priority (8)
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| TW106132049A TWI775775B (zh) | 2016-09-29 | 2017-09-19 | 聚醯亞胺膜、銅張積層板及電路基板 |
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| JP2018165346A (ja) * | 2017-03-28 | 2018-10-25 | 東レ・デュポン株式会社 | ポリイミドフィルム |
| WO2020022129A1 (fr) * | 2018-07-25 | 2020-01-30 | 日鉄ケミカル＆マテリアル株式会社 | Plaque stratifiée plaquée de métal, et carte de circuit imprimé |
| JP7156877B2 (ja) * | 2018-09-18 | 2022-10-19 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及びパターン化金属張積層板 |
| KR102879222B1 (ko) * | 2018-09-28 | 2025-10-31 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 금속 피복 적층판의 제조 방법 및 회로 기판의 제조 방법 |
| JP7446741B2 (ja) * | 2018-09-28 | 2024-03-11 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7093282B2 (ja) * | 2018-09-29 | 2022-06-29 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7381197B2 (ja) * | 2018-10-31 | 2023-11-15 | 日鉄ケミカル＆マテリアル株式会社 | 回路基板及び多層回路基板 |
| CN113544191B (zh) * | 2019-03-01 | 2024-03-29 | Jsr株式会社 | 高频电路用层叠体及其制造方法、柔性印刷基板、b阶片、以及层叠体卷绕体 |
| CN113677532A (zh) | 2019-04-16 | 2021-11-19 | Ａｇｃ株式会社 | 层叠体、印刷基板的制造方法、印刷基板及天线 |
| JP7231932B2 (ja) * | 2019-05-10 | 2023-03-02 | ユニチカ株式会社 | ポリイミドフィルム |
| KR20200135028A (ko) * | 2019-05-24 | 2020-12-02 | 피아이첨단소재 주식회사 | 고탄성 폴리이미드 필름 및 이를 포함하는 연성금속박적층판 |
| JP7222089B2 (ja) * | 2019-06-27 | 2023-02-14 | 日鉄ケミカル＆マテリアル株式会社 | 樹脂フィルム、金属張積層体及びその製造方法 |
| JP7247037B2 (ja) * | 2019-06-28 | 2023-03-28 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及びパターン化金属張積層板 |
| KR102435973B1 (ko) * | 2020-07-06 | 2022-08-25 | 한화솔루션 주식회사 | 고굴곡 및 저유전성 연성 동박 적층판 |
| WO2021010783A1 (fr) * | 2019-07-17 | 2021-01-21 | 한화솔루션 주식회사 | Stratifié cuivré flexible à faible constante diélectrique et hautement flexible |
| JP7184858B2 (ja) | 2019-09-28 | 2022-12-06 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、金属張積層板及び回路基板 |
| US20240092973A1 (en) * | 2019-10-07 | 2024-03-21 | Hd Microsystems, Ltd. | Polyimide precursor, resin composition, photosensitive resin composition, method for manufacturing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface-protective film, and electronic component |
| JP7602866B2 (ja) * | 2019-10-25 | 2024-12-19 | 日鉄ケミカル＆マテリアル株式会社 | 回路基板及びその製造方法 |
| JP7429519B2 (ja) * | 2019-11-05 | 2024-02-08 | 株式会社カネカ | 多層ポリイミドフィルム |
| KR20210116311A (ko) * | 2020-03-17 | 2021-09-27 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 폴리이미드, 가교 폴리이미드, 접착제 필름, 적층체, 커버레이 필름, 수지를 구비한 구리박, 금속 피복 적층판, 회로 기판 및 다층 회로 기판 |
| JP7730627B2 (ja) * | 2020-09-14 | 2025-08-28 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルムの製造方法及び金属張積層板の製造方法 |
| JP7486393B2 (ja) | 2020-09-30 | 2024-05-17 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板、その製造方法及び回路基板 |
| KR20230086706A (ko) | 2020-10-14 | 2023-06-15 | 가부시키가이샤 가네카 | 복층 폴리이미드 필름, 금속 피복 적층판 및 복층 폴리이미드 필름의 제조 방법 |
| KR102458949B1 (ko) * | 2020-11-09 | 2022-10-26 | 엘지전자 주식회사 | 연성 인쇄회로기판용 기재 |
| CN112375221B (zh) * | 2020-11-27 | 2023-05-02 | 桂林电器科学研究院有限公司 | 一种低介电性聚酰亚胺复合薄膜及其制备方法 |
| CN112409621B (zh) * | 2020-11-27 | 2022-09-09 | 桂林电器科学研究院有限公司 | 高强度低介电性聚酰亚胺多层膜及其制备方法 |
| CN116635456A (zh) * | 2020-12-21 | 2023-08-22 | 富士胶片株式会社 | 层叠体及聚合物膜 |
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| CN113604045B (zh) * | 2021-08-31 | 2022-09-02 | 烟台丰鲁精细化工有限责任公司 | 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法 |
| KR20230076260A (ko) * | 2021-11-24 | 2023-05-31 | 피아이첨단소재 주식회사 | 다층 구조의 폴리이미드 필름 및 이의 제조방법 |
| KR102693903B1 (ko) * | 2021-11-25 | 2024-08-09 | 피아이첨단소재 주식회사 | 저유전 폴리아믹산 및 폴리이미드 필름 |
| KR20230078550A (ko) | 2021-11-26 | 2023-06-02 | 스미또모 가가꾸 가부시키가이샤 | 폴리이미드계 수지 전구체 |
| JP2023079203A (ja) | 2021-11-26 | 2023-06-07 | 住友化学株式会社 | ポリイミド系フィルム |
| JP2023136376A (ja) * | 2022-03-17 | 2023-09-29 | 株式会社カネカ | ポリイミド前駆体及びポリイミド |
| JP2023146309A (ja) * | 2022-03-29 | 2023-10-12 | 株式会社カネカ | 両面銅張積層板および両面銅張積層板の製造方法 |
| JP7734616B2 (ja) * | 2022-03-30 | 2025-09-05 | 日鉄ケミカル＆マテリアル株式会社 | アミノ化合物、当該アミノ化合物を用いたポリアミド酸及びポリイミド、並びにこれらの製造方法 |
| KR20230153791A (ko) * | 2022-04-29 | 2023-11-07 | 피아이첨단소재 주식회사 | 저유전 및 고내열 특성을 가지는 폴리이미드 필름 및 그 제조방법 |
| KR20250144379A (ko) * | 2022-12-22 | 2025-10-10 | 윙고 테크놀로지 가부시키가이샤 | 폴리이미드 화합물, 그것을 사용한 리튬 이온 이차 전지용 부극 재료, 리튬 이온 이차 전지용 부극, 및 리튬 이온 이차 전지 |
| JPWO2024142635A1 (fr) * | 2022-12-27 | 2024-07-04 |
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| JPH0725906B2 (ja) * | 1992-07-21 | 1995-03-22 | 宇部興産株式会社 | ポリイミド複合シート |
| JP2002307608A (ja) * | 2001-04-10 | 2002-10-23 | Kanegafuchi Chem Ind Co Ltd | 積層体の製造方法および多層プリント配線板 |
| JP4872185B2 (ja) | 2003-05-06 | 2012-02-08 | 三菱瓦斯化学株式会社 | 金属張り積層体 |
| EP2039715A4 (fr) * | 2006-07-06 | 2010-07-21 | Toray Industries | Polyimide thermoplastique, film de polyimide laminé et film de polyimide laminé sur feuille métallique utilisant ledit polyimide thermoplastique |
| CN100494281C (zh) * | 2007-09-27 | 2009-06-03 | 湖北省化学研究院 | 改性马来酰亚胺封端型聚酰亚胺树脂组合物及其应用 |
| JP5181618B2 (ja) * | 2007-10-24 | 2013-04-10 | 宇部興産株式会社 | 金属箔積層ポリイミド樹脂基板 |
| CN105437656A (zh) * | 2010-01-18 | 2016-03-30 | 株式会社钟化 | 多层聚酰亚胺膜及使用有该多层聚酰亚胺膜的柔性金属箔积层板 |
| JP5442491B2 (ja) * | 2010-02-26 | 2014-03-12 | 新日鉄住金化学株式会社 | 熱伝導性金属−絶縁樹脂基板及びその製造方法 |
| JP6422437B2 (ja) * | 2013-06-28 | 2018-11-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層体 |
| JP6559027B2 (ja) * | 2014-09-30 | 2019-08-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリアミド酸、ポリイミド、樹脂フィルム及び金属張積層板 |
| JP6767759B2 (ja) * | 2016-03-17 | 2020-10-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層板 |
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- 2017-09-11 JP JP2018542342A patent/JP6936239B2/ja active Active
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- 2017-09-11 CN CN201780059180.2A patent/CN109789689A/zh active Pending
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| TWI775775B (zh) | 2022-09-01 |
| WO2018061727A1 (fr) | 2018-04-05 |
| TW201825295A (zh) | 2018-07-16 |
| CN114716707A (zh) | 2022-07-08 |
| KR20190055809A (ko) | 2019-05-23 |
| CN109789689A (zh) | 2019-05-21 |
| TW202233433A (zh) | 2022-09-01 |
| JP6936239B2 (ja) | 2021-09-15 |
| JPWO2018061727A1 (ja) | 2019-07-25 |
| CN114716707B (zh) | 2024-10-11 |
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