TWI452437B - An exposure method, a pattern forming method, and an exposure apparatus, and an element manufacturing method - Google Patents
An exposure method, a pattern forming method, and an exposure apparatus, and an element manufacturing method Download PDFInfo
- Publication number
- TWI452437B TWI452437B TW096144730A TW96144730A TWI452437B TW I452437 B TWI452437 B TW I452437B TW 096144730 A TW096144730 A TW 096144730A TW 96144730 A TW96144730 A TW 96144730A TW I452437 B TWI452437 B TW I452437B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- pattern
- exposure
- regions
- matrix
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 44
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 claims description 339
- 230000003287 optical effect Effects 0.000 claims description 84
- 239000011159 matrix material Substances 0.000 claims description 45
- 238000005286 illumination Methods 0.000 claims description 33
- 238000001514 detection method Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 13
- 230000003321 amplification Effects 0.000 claims description 3
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 2
- 238000005520 cutting process Methods 0.000 description 35
- 238000005259 measurement Methods 0.000 description 34
- 239000004973 liquid crystal related substance Substances 0.000 description 23
- 101100029960 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) PLM2 gene Proteins 0.000 description 16
- 239000011521 glass Substances 0.000 description 15
- 239000007788 liquid Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052769 Ytterbium Inorganic materials 0.000 description 3
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- 238000001459 lithography Methods 0.000 description 3
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- 230000001133 acceleration Effects 0.000 description 2
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- 238000005530 etching Methods 0.000 description 2
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- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000001429 stepping effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
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- 239000013307 optical fiber Substances 0.000 description 1
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- 238000011896 sensitive detection Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006317905 | 2006-11-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200841130A TW200841130A (en) | 2008-10-16 |
| TWI452437B true TWI452437B (zh) | 2014-09-11 |
Family
ID=39467768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096144730A TWI452437B (zh) | 2006-11-27 | 2007-11-26 | An exposure method, a pattern forming method, and an exposure apparatus, and an element manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TWI452437B (fr) |
| WO (1) | WO2008065977A1 (fr) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101124179B1 (ko) | 2003-04-09 | 2012-03-27 | 가부시키가이샤 니콘 | 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
| TWI569308B (zh) | 2003-10-28 | 2017-02-01 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造 方法 |
| TWI519819B (zh) | 2003-11-20 | 2016-02-01 | 尼康股份有限公司 | 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法 |
| TWI412067B (zh) | 2004-02-06 | 2013-10-11 | 尼康股份有限公司 | 偏光變換元件、光學照明裝置、曝光裝置以及曝光方法 |
| US20090046268A1 (en) | 2005-05-12 | 2009-02-19 | Yasuhiro Omura | Projection optical system, exposure apparatus, and exposure method |
| US8451427B2 (en) | 2007-09-14 | 2013-05-28 | Nikon Corporation | Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method |
| JP5267029B2 (ja) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | 照明光学装置、露光装置及びデバイスの製造方法 |
| WO2009050977A1 (fr) | 2007-10-16 | 2009-04-23 | Nikon Corporation | Système optique d'éclairage, appareil d'exposition et procédé de fabrication de dispositif |
| WO2009050976A1 (fr) | 2007-10-16 | 2009-04-23 | Nikon Corporation | Système optique d'éclairage, appareil d'exposition et procédé de fabrication de dispositif |
| US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
| US9116346B2 (en) | 2007-11-06 | 2015-08-25 | Nikon Corporation | Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method |
| JP5360057B2 (ja) | 2008-05-28 | 2013-12-04 | 株式会社ニコン | 空間光変調器の検査装置および検査方法、照明光学系、照明光学系の調整方法、露光装置、およびデバイス製造方法 |
| JP5493403B2 (ja) * | 2008-06-19 | 2014-05-14 | 株式会社ニコン | 露光方法及び装置、並びにデバイス製造方法 |
| JPWO2010001537A1 (ja) | 2008-06-30 | 2011-12-15 | 株式会社ニコン | 表示素子の製造方法及び製造装置、薄膜トランジスタの製造方法及び製造装置、及び回路形成装置 |
| JP5737972B2 (ja) * | 2011-01-28 | 2015-06-17 | 株式会社アルバック | 真空蒸着装置 |
| CN103969958B (zh) * | 2013-01-25 | 2016-03-30 | 上海微电子装备有限公司 | 一种多曝光视场拼接系统和方法 |
| CN105527795B (zh) | 2014-09-28 | 2018-09-18 | 上海微电子装备（集团）股份有限公司 | 曝光装置及离焦倾斜误差补偿方法 |
| JP6926596B2 (ja) * | 2017-03-31 | 2021-08-25 | ウシオ電機株式会社 | 露光装置および露光方法 |
| CN109709775A (zh) * | 2019-03-13 | 2019-05-03 | 苏州微影激光技术有限公司 | 一种曝光设备及曝光方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11231549A (ja) * | 1998-02-12 | 1999-08-27 | Nikon Corp | 走査型露光装置および露光方法 |
| TW200307182A (en) * | 2002-05-22 | 2003-12-01 | Nikon Corp | Exposing method, exposing device and manufacturing method for device |
| TW200606601A (en) * | 2004-06-17 | 2006-02-16 | Fuji Photo Film Co Ltd | A plotting device and a plotting method |
| TW200608160A (en) * | 2004-07-09 | 2006-03-01 | Fuji Photo Film Co Ltd | Exposure device and exposure method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001183844A (ja) * | 1999-12-22 | 2001-07-06 | Sharp Corp | 露光方法 |
| JP4428792B2 (ja) * | 2000-03-06 | 2010-03-10 | キヤノン株式会社 | 露光装置 |
| JP4172204B2 (ja) * | 2002-05-22 | 2008-10-29 | 株式会社ニコン | 露光方法及び露光装置、デバイス製造方法 |
-
2007
- 2007-11-26 TW TW096144730A patent/TWI452437B/zh active
- 2007-11-26 WO PCT/JP2007/072715 patent/WO2008065977A1/fr not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11231549A (ja) * | 1998-02-12 | 1999-08-27 | Nikon Corp | 走査型露光装置および露光方法 |
| TW200307182A (en) * | 2002-05-22 | 2003-12-01 | Nikon Corp | Exposing method, exposing device and manufacturing method for device |
| TW200606601A (en) * | 2004-06-17 | 2006-02-16 | Fuji Photo Film Co Ltd | A plotting device and a plotting method |
| TW200608160A (en) * | 2004-07-09 | 2006-03-01 | Fuji Photo Film Co Ltd | Exposure device and exposure method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008065977A1 (fr) | 2008-06-05 |
| TW200841130A (en) | 2008-10-16 |
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