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TW355826B - Automatic semiconductor part handler - Google Patents

Automatic semiconductor part handler

Info

Publication number
TW355826B
TW355826B TW086110560A TW86110560A TW355826B TW 355826 B TW355826 B TW 355826B TW 086110560 A TW086110560 A TW 086110560A TW 86110560 A TW86110560 A TW 86110560A TW 355826 B TW355826 B TW 355826B
Authority
TW
Taiwan
Prior art keywords
belt
respect
handler
semiconductor part
automatic semiconductor
Prior art date
Application number
TW086110560A
Other languages
English (en)
Inventor
Connor S Bruce O
Zinovy Alshine
Original Assignee
Aseco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aseco Corp filed Critical Aseco Corp
Application granted granted Critical
Publication of TW355826B publication Critical patent/TW355826B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S209/00—Classifying, separating, and assorting solids
    • Y10S209/923—Feed through including at least one endless conveyor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
TW086110560A 1996-07-31 1997-07-24 Automatic semiconductor part handler TW355826B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/678,426 US6112905A (en) 1996-07-31 1996-07-31 Automatic semiconductor part handler

Publications (1)

Publication Number Publication Date
TW355826B true TW355826B (en) 1999-04-11

Family

ID=24722737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086110560A TW355826B (en) 1996-07-31 1997-07-24 Automatic semiconductor part handler

Country Status (6)

Country Link
US (2) US6112905A (zh)
JP (1) JP2000513101A (zh)
KR (1) KR19990063665A (zh)
DE (1) DE19780745T1 (zh)
TW (1) TW355826B (zh)
WO (1) WO1998005059A2 (zh)

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* Cited by examiner, † Cited by third party
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US6112905A (en) * 1996-07-31 2000-09-05 Aseco Corporation Automatic semiconductor part handler
JP4046391B2 (ja) * 1997-11-28 2008-02-13 松下電器産業株式会社 プリント基板の搬送装置および搬送方法
DE19823283A1 (de) * 1998-05-25 1999-12-02 Basf Ag Pipettierautomat
KR100285658B1 (ko) * 1998-11-06 2001-04-02 정문술 핸들러의멀티스택커
TW490564B (en) * 1999-02-01 2002-06-11 Mirae Corp A carrier handling apparatus for module IC handler, and method thereof
JP2002350496A (ja) * 2001-05-23 2002-12-04 Mitsubishi Electric Corp 半導体素子の搬送装置
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US20040197183A1 (en) * 2001-06-22 2004-10-07 Cho Jae Hyuk Exchanger for tray feeder
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US7902477B1 (en) * 2005-06-17 2011-03-08 Xilinx, Inc. Integrated circuit test work station
DE102007001722B4 (de) * 2007-01-11 2009-03-12 Hubertus Heigl Vorrichtung zum Aufnehmen, Transportieren und Sortieren von elektronischen Bauelementen
WO2008142753A1 (ja) * 2007-05-18 2008-11-27 Advantest Corporation トレイ格納装置、電子部品試験装置及びトレイ格納方法
KR101810505B1 (ko) 2012-07-20 2017-12-20 (주)테크윙 테스트핸들러용 픽앤플레이스장치
CN104254758B (zh) * 2013-01-30 2016-07-06 日锻汽门株式会社 工件的检查设备
CN103763866B (zh) * 2014-01-27 2016-09-14 苏州市运泰利自动化设备有限公司 Pcb板拆翻贴自动化一体机
US11159784B2 (en) 2014-10-23 2021-10-26 Cognex Corporation System and method for calibrating a vision system with respect to a touch probe
JP6517324B2 (ja) 2015-08-03 2019-05-22 日鍛バルブ株式会社 エンジンバルブの軸接部の探傷検査方法および装置
CN106624257B (zh) * 2017-02-27 2022-04-22 江苏创源电子有限公司 一种自动装盖板设备
CN107803696A (zh) * 2017-11-06 2018-03-16 南通西洛克自动化设备有限公司 载具盖板连线装置
JP7443151B2 (ja) * 2020-04-30 2024-03-05 ニデックインスツルメンツ株式会社 搬送システム
CN111822376A (zh) * 2020-08-12 2020-10-27 深圳市诺泰芯装备有限公司 一种芯片常高温测试分选一体机

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Also Published As

Publication number Publication date
US6112905A (en) 2000-09-05
WO1998005059A3 (en) 1999-04-22
DE19780745T1 (de) 1998-07-23
KR19990063665A (ko) 1999-07-26
JP2000513101A (ja) 2000-10-03
WO1998005059A2 (en) 1998-02-05
US6234321B1 (en) 2001-05-22

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