TW200811316A - Device and method for electrolytic coating - Google Patents
Device and method for electrolytic coating Download PDFInfo
- Publication number
- TW200811316A TW200811316A TW096113679A TW96113679A TW200811316A TW 200811316 A TW200811316 A TW 200811316A TW 096113679 A TW096113679 A TW 096113679A TW 96113679 A TW96113679 A TW 96113679A TW 200811316 A TW200811316 A TW 200811316A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- conductive
- strip
- cathode
- strips
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000000576 coating method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 12
- 229910021645 metal ion Inorganic materials 0.000 claims abstract description 7
- 150000003839 salts Chemical class 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 8
- 238000005868 electrolysis reaction Methods 0.000 claims description 8
- 239000002689 soil Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 2
- 239000011707 mineral Substances 0.000 claims description 2
- 238000009987 spinning Methods 0.000 claims description 2
- 241000251468 Actinopterygii Species 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000000284 resting effect Effects 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 34
- 239000000463 material Substances 0.000 description 17
- 229910052759 nickel Inorganic materials 0.000 description 17
- 229940021013 electrolyte solution Drugs 0.000 description 8
- 238000000151 deposition Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005246 galvanizing Methods 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 241000237858 Gastropoda Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 241000282373 Panthera pardus Species 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 241000239226 Scorpiones Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003187 abdominal effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 238000005115 demineralization Methods 0.000 description 1
- 230000002328 demineralizing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000001523 electrospinning Methods 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- -1 polyphenylene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06112723 | 2006-04-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200811316A true TW200811316A (en) | 2008-03-01 |
Family
ID=38236519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096113679A TW200811316A (en) | 2006-04-18 | 2007-04-18 | Device and method for electrolytic coating |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20090101511A1 (fr) |
| EP (1) | EP2010699A2 (fr) |
| JP (1) | JP2009534527A (fr) |
| KR (1) | KR20090009876A (fr) |
| CN (1) | CN101473072A (fr) |
| BR (1) | BRPI0710241A2 (fr) |
| CA (1) | CA2649786A1 (fr) |
| IL (1) | IL194754A0 (fr) |
| RU (1) | RU2420616C2 (fr) |
| TW (1) | TW200811316A (fr) |
| WO (1) | WO2007118875A2 (fr) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2422455T3 (es) | 2005-08-12 | 2013-09-11 | Modumetal Llc | Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos |
| TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
| KR20100126505A (ko) * | 2008-03-13 | 2010-12-01 | 바스프 에스이 | 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물 |
| NL1035265C2 (nl) * | 2008-04-07 | 2009-10-08 | Meco Equip Eng | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
| BR122013014461B1 (pt) | 2009-06-08 | 2020-10-20 | Modumetal, Inc | revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada |
| TW201121680A (en) * | 2009-12-18 | 2011-07-01 | Metal Ind Res & Dev Ct | Electrochemical machining device and machining method and electrode unit thereof. |
| KR101103450B1 (ko) * | 2010-07-27 | 2012-01-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
| US20120231574A1 (en) * | 2011-03-12 | 2012-09-13 | Jiaxiong Wang | Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells |
| US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
| HK1220743A1 (zh) | 2013-03-15 | 2017-05-12 | Modumetal, Inc. | 具有高硬度的镍铬纳米层压涂层 |
| EP2971266A4 (fr) | 2013-03-15 | 2017-03-01 | Modumetal, Inc. | Procédé et appareil d'application en continu de revêtements métalliques nanostratifiés |
| CN105189826B (zh) | 2013-03-15 | 2019-07-16 | 莫杜美拓有限公司 | 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金 |
| EP2971264A4 (fr) | 2013-03-15 | 2017-05-31 | Modumetal, Inc. | Revêtements nanostratifiés |
| EP2799939A1 (fr) * | 2013-04-30 | 2014-11-05 | Universo S.A. | Support pour le traitement de pièces de micromécanique |
| KR101419276B1 (ko) * | 2013-08-27 | 2014-07-15 | (주)엠에스티테크놀로지 | 플라즈마 전해 산화에 의한 코팅 형성 방법 |
| EP3194163A4 (fr) | 2014-09-18 | 2018-06-27 | Modumetal, Inc. | Procédés de préparation d'articles par procédés de dépôt électrochimique et de fabrication rapide |
| CA2961508C (fr) | 2014-09-18 | 2024-04-09 | Modumetal, Inc. | Procede et appareil d'application en continu de revetements metalliques nanostratifies |
| DE102015121349A1 (de) | 2015-12-08 | 2017-06-08 | Staku Anlagenbau Gmbh | Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung |
| KR101681083B1 (ko) * | 2016-06-26 | 2016-12-01 | 주식회사 지에스아이 | 곡면부를 포함하는 상대전극을 갖는 도금장치 |
| CA3036191A1 (fr) | 2016-09-08 | 2018-03-15 | Modumetal, Inc. | Procedes pour obtenir des revetements stratifies sur des pieces et articles fabriques a partir de ceux-ci |
| US12227869B2 (en) | 2016-09-09 | 2025-02-18 | Modumetal, Inc. | Application of laminate and nanolaminate materials to tooling and molding processes |
| KR102412452B1 (ko) | 2016-09-14 | 2022-06-23 | 모두메탈, 인크. | 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법 |
| US12076965B2 (en) | 2016-11-02 | 2024-09-03 | Modumetal, Inc. | Topology optimized high interface packing structures |
| CA3057836A1 (fr) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Plongeurs de levage dotes de revetements deposes par electrodeposition, et systemes et procedes de production de ceux-ci |
| CN110770372B (zh) | 2017-04-21 | 2022-10-11 | 莫杜美拓有限公司 | 具有电沉积涂层的管状制品及其生产系统和方法 |
| WO2019210264A1 (fr) | 2018-04-27 | 2019-10-31 | Modumetal, Inc. | Appareils, systèmes et procédés de production d'une pluralité d'articles pourvus de revêtements nano-stratifiés à l'aide d'une rotation |
| CN110952121B (zh) * | 2018-12-17 | 2023-12-05 | 嘉兴瑞通智能装备有限公司 | 焊带制造装置和电镀机构及其电镀方法 |
| CN110306218B (zh) * | 2019-07-15 | 2024-11-08 | 中国石油天然气集团有限公司 | 一种发动机主轴孔自动控制式刷镀设备 |
| CN113512749A (zh) * | 2020-12-08 | 2021-10-19 | 郑州大学 | 一种电镀金刚石刀具实验装置 |
| US20240200222A1 (en) * | 2021-04-21 | 2024-06-20 | Mitsubishi Electric Corporation | Plating electrode and plating method that uses the plating electrode |
| CN113400698B (zh) * | 2021-05-11 | 2022-12-20 | 重庆金美新材料科技有限公司 | 一种导电传动带及其制备方法、薄膜水电镀设备 |
| CN115896907A (zh) * | 2022-10-19 | 2023-04-04 | 重庆金美新材料科技有限公司 | 一种阴极导电机构和电镀系统 |
| DE102023120210B4 (de) * | 2023-07-28 | 2025-03-13 | Ce Cell Engineering Gmbh | Anlage zur elektrischen Kontaktierung von Wafersolarzellen, Inline-Produktionsvorrichtung und Herstellungsverfahren für eine Wafersolarzelle |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1756267U (de) * | 1957-06-27 | 1957-11-14 | Aschaffenburger Zellstoffwerke | Polsterkissen fuer verpakkungszwecke und als sitzkissen geeignet. |
| DE1756267A1 (de) * | 1968-04-27 | 1971-10-07 | Carl Klingspor | Galvanisiervorrichtung fuer Gewebe |
| LU80496A1 (fr) * | 1978-11-09 | 1980-06-05 | Cockerill | Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole |
| SU1435668A1 (ru) * | 1986-06-09 | 1988-11-07 | Предприятие П/Я В-8657 | Устройство дл двусторонней жидкостной обработки плоских изделий |
| DE4413149A1 (de) * | 1994-04-15 | 1995-10-19 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
| GB0005883D0 (en) * | 2000-03-13 | 2000-05-03 | Lowe John M | Electro-plating apparatus and a method of electoplating |
| WO2003038158A2 (fr) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Dispositif de galvanisation et systeme de galvanisation concus pour revetir des structures deja conductrices |
| DE10234705B4 (de) * | 2001-10-25 | 2008-01-17 | Infineon Technologies Ag | Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen |
| DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
-
2007
- 2007-04-17 CA CA002649786A patent/CA2649786A1/fr not_active Abandoned
- 2007-04-17 KR KR1020087028157A patent/KR20090009876A/ko not_active Withdrawn
- 2007-04-17 RU RU2008145108/02A patent/RU2420616C2/ru not_active IP Right Cessation
- 2007-04-17 CN CNA2007800226453A patent/CN101473072A/zh active Pending
- 2007-04-17 WO PCT/EP2007/053707 patent/WO2007118875A2/fr not_active Ceased
- 2007-04-17 US US12/297,864 patent/US20090101511A1/en not_active Abandoned
- 2007-04-17 BR BRPI0710241-0A patent/BRPI0710241A2/pt not_active IP Right Cessation
- 2007-04-17 JP JP2009505867A patent/JP2009534527A/ja not_active Withdrawn
- 2007-04-17 EP EP07728172A patent/EP2010699A2/fr not_active Withdrawn
- 2007-04-18 TW TW096113679A patent/TW200811316A/zh unknown
-
2008
- 2008-10-22 IL IL194754A patent/IL194754A0/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20090101511A1 (en) | 2009-04-23 |
| RU2008145108A (ru) | 2010-05-27 |
| BRPI0710241A2 (pt) | 2011-08-09 |
| WO2007118875A3 (fr) | 2008-08-07 |
| IL194754A0 (en) | 2009-08-03 |
| CN101473072A (zh) | 2009-07-01 |
| RU2420616C2 (ru) | 2011-06-10 |
| CA2649786A1 (fr) | 2007-10-25 |
| KR20090009876A (ko) | 2009-01-23 |
| EP2010699A2 (fr) | 2009-01-07 |
| WO2007118875A2 (fr) | 2007-10-25 |
| JP2009534527A (ja) | 2009-09-24 |
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