TW200829726A

TW200829726A - Method and device for electrolytic coating

Info

Publication number: TW200829726A
Application number: TW096139950A
Authority: TW
Inventors: Rene Lochtman; Juergen Kaczun; Norbert Wagner; Juergen Pfister; Gert Pohl
Original assignee: Basf Ag
Priority date: 2006-11-28
Filing date: 2007-10-24
Publication date: 2008-07-16
Also published as: BRPI0719665A2; WO2008065069A1; KR20090083489A; CN101542022A; IL198594A0; US20090301891A1; RU2009124293A; EP2099954A1; JP2010511103A

Abstract

The invention relates to a device for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), which comprises at least one electrolyte bath (3) having at least one rotatably mounted roller (2) connectable as a cathode, which contacts the base layer (9) during the electrolytic coating, the base layer (9) being covered by an electrolyte solution (5) contained in the electrolyte bath (3) and being moved relative to the at least one roller (2) during the coating. The at least one roller (2) connectable as a cathode is connected cathodically during the contact with the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9). The invention furthermore relates to a method for the electrolytic coating of a structured or full-surface base layer (9) on a surface of a substrate (7), the base layer (9) being surrounded by an electrolyte solution (5) and being contacted by at least one roller (2) connectable as a cathode. The roller (2) connectable as a cathode is connected cathodically when it contacts the base layer (9) and is connected neutrally or anodically as soon as there is no contact with the base layer (9).

Description

200829726 九、發明說明：【發明所屬之技術領域】本發明係關於一種用於將一結構化或全表面基層予以電解鍍覆於一基板之表面上的裝置及方法，該裝置包含至少一個電解質槽，該至少一個電解質槽具有可作為一陰極連接之至少一個可旋轉安裝滾筒，該至少一個滚筒在該電解鍍覆期間接觸該基層，該基層係由一含於該電解質槽中之電解質溶液覆蓋且在該鍍覆期間相對於該至少一個滾筒移動。根據本發明之裝置及根據本發明之方法適用於（例如）產生印刷電路板上之導體軌道、RFID天線、應答器天線或其他天線結構、晶片卡模組、扁平電鏡、座位加熱器、笛導體、太陽電池中或LCD/電裝榮幕中之導體軌道或任何形式之電解鍍覆產口口。s亥裝置亦適用於產生用於(例如)屏蔽電磁輻射、用於熱傳導或用作封裝之產品上的裝飾或功能表面。【先前技術】人們已知-_於在介電基板上電解地放大導電結構之厚度的方法及裝置（例如’ W0_A細5/嶋降此處所述之裝置適用於錢覆可掉沾士 # ‘ 復』撓f生支撐件。此等支撐件饋入一滾筒周圍’繞其縱向車由緩絲鐘#同^ 琛疋轉之囡柱形電極固持於該滾筒之外圓周上。電極分別藉由屏蔽元件封閉。荡上施加待鐘覆結構’且與之箱接觸的電極經陰極地連接。不與待鍍覆之箱㈣之電㈣可⑽如）予以替換。滾筒較佳僅半浸沒於電 125702.doc 200829726 解質溶液中。此防止金屬沈積於不與箔接觸之電極上。封閉圓柱形電極之屏蔽元件係由例如橡膠或塑膠之介電材料製成。根據WO-A 2005/076680之實施例之一缺陷為其僅適用於鍍覆可撓性電路支撐件。硬質電路支撐件無法藉由該裝置而鍍覆。另一缺陷為對電極恆定地施加電壓，以致金屬亦可能沈積於不與待鍍覆之可撓性支撐件接觸的電極上。【發明内容】本發明之一目標為提供一種用於電解鍍覆之裝置，用該裝置有可旎將結構化或全表面基層予以鍍覆於一基板之表面上，該基板可為硬質或可撓的，且其中電極上之金屬沈積得以減少或防止。該目標係藉由一種用於將一結構化或全表面基層予以電解鍍覆於一基板之表面上的裝置來達成，該裝置包含至少 -個電解質槽，該至少—個電解f槽具有可作為_陰極連接之至少一個可旋轉安裝滾筒，該至少一個滾筒在電解鍍覆期間接觸該基層。該基層係由—含於該電解質槽中之電解質溶液覆蓋且在該錢覆期間相對於該一個滾筒移動。該滾筒在與該基層接觸期間經陰極地連接且一旦不存在與該基層之接觸便中性地或陽極地連接。该基層在該鍍覆㈣相對於該滾筒移動之事實意謂將具有該基層之基板靜態地固持且將該滾筒移動越過該基板:、或將該滚筒靜態地固持且將具有該基層之基板沿著該滾筒移動。 125702.doc 200829726 當不存在與該基層之接觸時中性地連接該滾筒之優勢為在此時間期間無沈積發生於該滚筒上。當不存在與該基層之接觸時陽極地連接該滾筒之優勢為可能已在陰極連接期間沈積於滾筒表面上之金屬在此時間期間得以再次移除。200829726 IX. Description of the Invention: The present invention relates to an apparatus and method for electrolytically plating a structured or full-surface substrate onto a surface of a substrate, the apparatus comprising at least one electrolyte bath The at least one electrolyte bath has at least one rotatably mounted roller that can be connected as a cathode, the at least one roller contacting the substrate during the electrolytic plating, the substrate being covered by an electrolyte solution contained in the electrolyte bath Movement relative to the at least one drum during the plating. The device according to the invention and the method according to the invention are suitable, for example, for producing conductor tracks on a printed circuit board, RFID antennas, transponder antennas or other antenna structures, wafer card modules, flat electron mirrors, seat heaters, flute conductors , the conductor track in the solar cell or in the LCD / Denso screen or any form of electrolytic plating port. The sigma device is also suitable for producing decorative or functional surfaces on products such as shielded electromagnetic radiation, used for heat conduction or used as a package. [Prior Art] It is known that a method and a device for electrolytically amplifying the thickness of a conductive structure on a dielectric substrate (for example, 'W0_A5/嶋嶋此处此处此处此处此处此处此处此处此处 # # # # # The 'supporting member' is fed to a roller. The support member is fed around a roller. The longitudinal electrode is held by a slow wire clock. The cylindrical electrode is held on the outer circumference of the roller. It is closed by the shielding element. The electrode which is applied with the structure to be covered and which is in contact with the box is connected by the cathode. It is not replaced with the electric (4) of the box (4) to be plated. Preferably, the drum is only sub- immersed in the electrolyte solution. This prevents metal from depositing on the electrodes that are not in contact with the foil. The shield member that seals the cylindrical electrode is made of a dielectric material such as rubber or plastic. One of the drawbacks of the embodiment according to WO-A 2005/076680 is that it is only suitable for plating flexible circuit supports. The hard circuit support cannot be plated by the device. Another drawback is the constant application of a voltage to the electrodes so that the metal may also deposit on the electrodes that are not in contact with the flexible support to be plated. SUMMARY OF THE INVENTION It is an object of the present invention to provide an apparatus for electrolytic plating by which a structured or full-surface substrate can be plated on the surface of a substrate which can be rigid or Scratched, and wherein metal deposition on the electrodes is reduced or prevented. The object is achieved by a device for electrolytically plating a structured or full-surface substrate onto the surface of a substrate, the device comprising at least one electrolyte bath, the at least one electrolytic f-groove having At least one rotatable mounting roller of the cathode connection, the at least one roller contacting the substrate during electrolytic plating. The substrate is covered by an electrolyte solution contained in the electrolyte bath and moved relative to the one drum during the money blanket. The drum is cathode-connected during contact with the substrate and is neutral or anode-bonded once there is no contact with the substrate. The fact that the base layer moves relative to the drum in the plating (4) means that the substrate having the base layer is statically held and the drum is moved over the substrate: or the drum is statically held and the substrate having the base layer is The drum moves. 125702.doc 200829726 The advantage of neutrally connecting the drum when there is no contact with the substrate is that no deposits occur on the drum during this time. The advantage of anodically connecting the drum when there is no contact with the substrate is that the metal that may have deposited on the drum surface during the cathode connection is removed again during this time.

一基板之表面上之可電解鍍覆之結構化或全表面基層可 (例如）藉由熟習此項技術者已知之印刷電路板製造方法來產生。在此種狀況下，例如，藉由熟習此項技術者已知之蝕刻及抗蝕方法來處理一在一面或兩面包有銅之基板，以便產生一結構化、可電解鍍覆之銅基層。儘管如此，亦可月b使用熟習此項技術者已知之所有其他方法。此外，一基板之表面上之可電解鍍覆之結構化或全表面基層可（例如）藉由將至少含有可電鍍顆粒及基質材料之分政液塗覆至一結構化或全表面基層上、至少部分地乾燥及/ 或至少部分地固化所塗覆分散液、及視情況藉由至少部分地化學、才勿1戍機械移除該&質而|導電顆粒暴露於剩餘基層之表面上來產生。舉例而言’硬質或可撓性支撐件適於用作上面可應用待電解鍍覆之結構化或全表面基層的㈣件。支揮件較佳為不導電的。此意謂電阻率大於1〇9 〇hm(歐姆)xcm。合適之支撑件為(例如)增強或未增強聚合物，諸如彼等按照慣例用於印刷電路板之聚人榀 n V 〇物。合適之聚合物為環氧樹脂或改性環氧樹脂，例如雙官能或多官能雙酚Α或雙酚F樹脂、環氧盼酸清漆樹脂1化環氧樹脂、芳族《胺增強或玻璃纖維增強或紙張增_氧樹脂⑽如，fr4) ;玻璃纖維增 125702.doc 200829726 強塑膠；液晶聚合物（LCP);聚苯硫醚（PPS);聚甲醛 (POM);聚芳基醚酮（PAEK);聚醚醚酮（PEEK);聚醯胺 (PA);聚碳酸酯（ρ〇 ;聚對苯二甲酸丁二醇酯（PBT);聚對苯二甲酸乙二醇酯（PET);聚醯亞胺（pi);聚醯亞胺樹脂；氰酸酯；雙馬來醯亞胺-三嗪樹脂；耐綸；乙烯基酯樹脂；聚酯；聚酯樹脂；聚醯胺；聚苯胺；酚樹脂；聚吡洛；聚萘二甲酸乙二醇酯（pEN);聚甲基丙烯酸甲酯；聚乙烯二氧噻吩；酚系樹脂塗佈之芳族聚醯胺紙張；聚四氟乙烯（PTFE);三聚氰胺樹脂；聚矽氧樹脂；氟樹脂；烷基化聚苯醚（APPE);聚醚醯亞胺（PEI);聚苯醚（ppo);聚丙烯（PP);聚乙烯（PE);聚颯（PSU);聚醚砜（PES);聚芳基酿胺（PAA);聚氣乙烯（PVC);聚苯乙烯（ps);丙烯腈-丁二烯·苯乙烯（ABS);丙烯腈·苯乙烯丙烯酸酯（ASA);苯乙烯丙烯腈（SAN)及上述聚合物之兩者或兩者以上之混合物 (摻合物），其可以多種形式存在。基板可包含熟習此項技術者已知之添加物，例如阻燃劑。印刷電路板工業中習知之其他基板亦為合適的。此外，複合材料、泡沫樣聚合物、styropor®、 Styrodur®、聚胺基甲酸酯（PU)、陶瓷表面、織物、漿、板、紙張、聚合物塗佈之紙張、木材、礦物材料、矽、玻璃、植物組織及動物組織為合適之基板。基板可為硬質或可撓的。基層較佳在基質材料中含有可電解鍍覆顆粒。為產生該基層’例如’ ’塗覆在基質材料中含有可電解鑛覆顆粒之分 125702.doc -10- 200829726 散液。導電顆粒可為由任何導電材料、不同導電材料之混合物或導電材料與不導電材料之混合物製成之任何幾何2 狀的顆粒。合適之導電材料為（例如）碳、導電金屬錯合物、導電有機化合物或導電聚合物或金屬，較佳為鋅、鎳、銅、錫、鈷、錳、鐵、鎂、鉛、鉻、鉍、銀、金、鋁、鈦、鈀、鉑、钽及其合金或含有此等金屬中之至少一者的金屬混合物。合適之合金為（例如）CuZn、CuSn、An electrolytically plateable structured or full surface substrate on the surface of a substrate can be produced, for example, by a printed circuit board manufacturing process known to those skilled in the art. In such a situation, a substrate having copper on one or both of the breads is treated, for example, by etching and resisting methods known to those skilled in the art, to produce a structured, electrolytically plated copper-based layer. Nonetheless, all other methods known to those skilled in the art may be used. In addition, an electrolytically plateable structured or full-surface substrate on the surface of a substrate can be applied, for example, by applying a chemical solution containing at least electroplatable particles and a matrix material to a structured or full-surface substrate. At least partially drying and/or at least partially curing the applied dispersion, and optionally by at least partially chemically, mechanically removing the & mass | conductive particles exposed to the surface of the remaining substrate to produce . For example, a rigid or flexible support is suitable for use as a (four) piece of structured or full surface substrate to which electrolytic plating is to be applied. The support member is preferably non-conductive. This means that the resistivity is greater than 1〇9 〇hm (ohm) xcm. Suitable supports are, for example, reinforced or unreinforced polymers such as those conventionally used in printed circuit boards. Suitable polymers are epoxy resins or modified epoxy resins, such as difunctional or polyfunctional bisphenolphthalein or bisphenol F resins, epoxy acid varnish resins, epoxy resins, aromatic amine reinforcing or glass fibers. Reinforcement or paper addition_Oxygen resin (10), eg fr4); glass fiber increase 125702.doc 200829726 strong plastic; liquid crystal polymer (LCP); polyphenylene sulfide (PPS); polyoxymethylene (POM); polyaryl ether ketone ( PAEK); polyetheretherketone (PEEK); polydecylamine (PA); polycarbonate (ρ〇; polybutylene terephthalate (PBT); polyethylene terephthalate (PET) Polyimine (pi); polyimine resin; cyanate; bismaleimide-triazine resin; nylon; vinyl ester resin; polyester; polyester resin; polyamine; Aniline; phenol resin; polypyrrole; polyethylene naphthalate (pEN); polymethyl methacrylate; polyethylene dioxythiophene; phenolic resin coated aromatic polyamide paper; polytetrafluoroethylene Ethylene (PTFE); melamine resin; polyoxyn oxy resin; fluororesin; alkylated polyphenylene ether (APPE); polyether quinone imine (PEI); polyphenylene ether (ppo); polypropylene (PP); (PE); Polyfluorene (PSU); polyethersulfone (PES); polyarylamine (PAA); polyethylene (PVC); polystyrene (ps); acrylonitrile-butadiene styrene (ABS); Nitrile styrene acrylate (ASA); styrene acrylonitrile (SAN) and a mixture (blend) of two or more of the above polymers, which may exist in various forms. The substrate may comprise those skilled in the art. Additives such as flame retardants are known. Other substrates known in the printed circuit board industry are also suitable. In addition, composites, foam-like polymers, styropor®, Styrodur®, polyurethanes, Ceramic surfaces, fabrics, pulp, board, paper, polymer coated paper, wood, mineral materials, tantalum, glass, plant tissue and animal tissue are suitable substrates. The substrate may be hard or flexible. The matrix material contains electrolessly plateable particles. To produce the base layer 'for example', a dispersion of 125702.doc -10- 200829726 is applied to the matrix material containing electroless ore-coated particles. The conductive particles may be made of any conductive material. a mixture of different conductive materials or Any geometrically shaped particle made of a mixture of a conductive material and a non-conductive material. Suitable conductive materials are, for example, carbon, a conductive metal complex, a conductive organic compound or a conductive polymer or metal, preferably zinc or nickel. , copper, tin, cobalt, manganese, iron, magnesium, lead, chromium, ruthenium, silver, gold, aluminum, titanium, palladium, platinum, rhodium and alloys thereof or a mixture of metals containing at least one of these metals. The alloy is, for example, CuZn, CuSn,

CuNi、SnPb、SnBi、SnCo、NiPb、ZnFe、ZnNi、ZnC(^CuNi, SnPb, SnBi, SnCo, NiPb, ZnFe, ZnNi, ZnC (^

ZnMn。鋁、鐵、銅、鎳、鋅、碳及其混合物尤其較佳。可電解鍍覆顆粒較佳具有0.001 ^1111至1〇〇 μιη、較佳 0.005 μιη至50 μιη及尤其較佳〇·〇1 μm至10 μιη之平均顆粒直徑。平均顆粒直徑可藉助於雷射繞射量測而確定，例如使用一Microtrac Χ100裝置。顆粒直徑之分布視其產生方法而定。雖然複數個最大值亦為可能的，但直徑分布通常僅包含一個最大值。可電解鍍覆顆粒之表面可至少部分地具備一塗層。合適之塗層本質上可為無機（例如，Si〇2、磷酸鹽）或有機的。當然，可電解鍍覆顆粒亦可用一金屬或金屬氧化物而鍍覆。金屬可同樣地以至少部分氧化形式存在。若意欲使兩種或兩種以上不同金屬形成可電解鍍覆顆粒，則此可使用此等金屬之一混合物來完成。金屬尤其較佳選自由鋁、鐵、銅、鎳及鋅組成之群。儘管如此，可電解鍍覆顆粒亦可含有一第一金屬及一第二金屬，其中該第一金屬係以一合金（與該第一金屬或一 125702.doc -11 - 200829726 或多種其他金屬）之形式存在，或可電解鍍覆顆粒可含有兩種不同合金。除可電解鍍覆顆粒之選擇之外，可電解鍍覆顆粒之形狀亦對鍍覆後分散液之特性有影響。對於形狀而言，熟習此項技術者已知之眾多變體為可能的。可電解鍍覆顆粒之形狀可（例如）為針狀、圓柱狀、板狀或球狀。此等顆粒形狀表不理想化形狀且實際形狀可（例如）由於生產而與其存在ZnMn. Aluminum, iron, copper, nickel, zinc, carbon and mixtures thereof are especially preferred. The electrolytically plateable particles preferably have an average particle diameter of from 0.001 ^ 11 11 to 1 μm, preferably from 0.005 μm to 50 μm, and particularly preferably from 1 μm to 10 μm. The average particle diameter can be determined by means of laser diffraction measurements, for example using a Microtrac(R) 100 device. The distribution of particle diameters depends on the method of production. Although a plurality of maximum values are also possible, the diameter distribution usually contains only one maximum value. The surface of the electrolessly plateable particles may be at least partially provided with a coating. Suitable coatings can be inorganic (e.g., Si2, phosphate) or organic in nature. Of course, the electrolytically plateable particles may also be plated with a metal or metal oxide. The metal can likewise be present in at least partially oxidized form. If two or more different metals are intended to form electrolessly plateable particles, this can be accomplished using a mixture of one of these metals. The metal is particularly preferably selected from the group consisting of aluminum, iron, copper, nickel and zinc. Nevertheless, the electrolytically plateable particles may also comprise a first metal and a second metal, wherein the first metal is an alloy (with the first metal or a 125702.doc -11 - 200829726 or a plurality of other metals) The form exists, or the electrolytically plateable particles may contain two different alloys. In addition to the choice of electrolytically plateable particles, the shape of the electrolytically plateable particles also has an effect on the properties of the dispersion after plating. Many variations known to those skilled in the art are possible for the shape. The shape of the electrolytically plateable particles may be, for example, a needle shape, a cylindrical shape, a plate shape or a spherical shape. These particle shapes represent imperfect shapes and the actual shape can exist, for example, due to production

較大或較小差異。舉例而言，淚珠狀顆粒為本發明之範嘴中理想化球形形狀之一真實偏差。具有各種顆粒形狀之可電解鍍覆顆粒可購得。田使用可電解鍍覆顆粒之混合物時，個別混合搭配物亦可具有不同顆粒形狀及/或粒徑。亦可能使用具有不同粒徑及/或顆粒形狀之-種類型之可電解鑛覆顆粒的混合物。在不同顆粒形狀及/或粒徑之狀況下，金屬銘、鐵、銅、鎳及鋅以及碳同樣較佳。如匕提及，可電解鍍、，〃、穴形式添加至分政液中。该等粉末（例如，金屬 W 知末）為市售商品或可易於精助於已知方法來產生，例如藉目孟屬鹽之溶液電解沈積或化予還原或藉由（例如）藉助於氫來還原氧化粉末，藉 ::金屬:融物噴射或霧化、尤其噴射或霧化至冷㈣ =氣體或水)中。氣體及水霧化及金屬氧化物還原為較佺的。具有較佳粒徑之金屬粉末亦屬粉末而產生。-球磨機(例如)適用於：。研磨較粗糙金除氣體及水霧化之外，用於產座生知基-鐵粉末之羰基·鐵 125702.doc •12- 200829726 粉末製程在鐵之狀況下為較佳的。此藉由五羰基鐵之熱分解來完成。此描述於（例如）Ullman丨s Encycl〇pedia 〇fLarge or small differences. For example, teardrop shaped particles are one of the true deviations of the idealized spherical shape in the mouth of the invention. Electroless plated particles having various particle shapes are commercially available. When a mixture of electrolessly plateable particles is used in the field, the individual mixed admixtures may also have different particle shapes and/or particle sizes. It is also possible to use a mixture of electroless mineral coated particles of the type having different particle diameters and/or particle shapes. Metals, iron, copper, nickel and zinc as well as carbon are also preferred in the case of different particle shapes and/or particle sizes. As mentioned, it can be added to the chemical liquid in the form of electrolytic plating, enamel and hole. Such powders (e.g., metals) are either commercially available or can be readily prepared by known methods, such as electrolytic deposition or reduction of a solution of a salt of the genus Methyl, or by, for example, hydrogen. To reduce the oxidized powder, by: metal: melt spray or atomization, especially spray or atomization to cold (4) = gas or water). Gas and water atomization and metal oxide reduction are relatively embarrassing. A metal powder having a preferred particle size is also produced by a powder. - Ball mill (for example) is suitable for: Grinding coarser gold In addition to gas and water atomization, it is used for the production of carbonyl-iron from base-iron powder. 125702.doc •12- 200829726 The powder process is preferred in the case of iron. This is accomplished by thermal decomposition of iron pentoxide. This is described, for example, in Ullman丨s Encycl〇pedia 〇f

Industrial Chemistry，第 5版，第 A14卷，第 599 頁中。五羰基鐵之分解可（例如）在一包含一管於較佳垂直位置之諸如石英玻璃或V2A鋼之耐火材料的可加熱分解器中於高溫及高壓下發生，該分解器係藉由一（例如）由加熱槽、加熱線或一供加熱介質流過之加熱夾套組成之加熱器具來封閉。片晶狀可電解鍍覆顆粒可藉由生產過程中之最佳化條件來控制或藉由機械處理（例如，藉由在一攪拌器球磨機中處理）之後而獲得。按照乾燥基層之總重量來表示，可電解鍍覆顆粒之比例較佳處於20重量％至98重量％之範圍内。可電解鍍覆顆粒之比例之一較佳範圍為按照乾燥基層之總重量表示之3 〇重量％至95重量％。舉例而言，具有一顏料親和錨定基團之黏合劑、天然及合成聚合物及其衍生物、天然樹脂以及合成樹脂及其衍生物、天然橡膠、合成橡膠、蛋白質、纖維素衍生物、乾性及非乾性油等適於用作基質材料。其可能_但無需·為化學或物理固化，例如空氣固化、輻射固化或溫度固化。基質材料較佳為聚合物或聚合物換合物。較佳作為基質材料之聚合物為（例如）ABs(丙烯腈-丁二稀-苯乙烯）；ASA(丙烯腈-苯乙烯丙烯酸酯）；丙烯酸系丙稀酸S旨；醇酸樹脂；乙酸乙稀烷酯；乙酸乙烯烷酯共聚 125702.doc -13- 200829726 物，尤其乙酸乙烯亞甲酯、乙烯乙酸乙烯酯、乙酸乙烯丁酯，伸烷基乙烯基氯共聚物；胺基樹脂；醛及酮樹脂；纖維素及纖維素衍生物，尤其羥烷基纖維素，諸如乙酸酯、丙酸醋、丁酸_之纖維素酯，羧烷基纖維素，硝酸纖維素；環氧丙烯酸酯；環氧樹脂；改性環氧樹脂，例如雙官能或多官能雙酚A或雙酚F樹脂、環氧-酚醛清漆樹脂、漠化環氧樹脂、環脂族環氧樹脂；脂族環氧樹脂、環氧丙基醚、乙烯基醚、乙烯-丙烯酸共聚物；烴樹脂；MAbs(亦含有丙烯酸酯單元之透明ABS);三聚氰胺樹脂、順丁稀二酸酸酐共聚物；甲基丙烯酸脂；天然橡膠；合成橡膠；氯橡膠；天然樹脂；松香樹脂；蟲膠；紛系樹脂；聚酯；聚酯樹脂’諸如苯酯樹脂；聚颯；聚醚颯；聚醢胺；聚醯亞胺；聚苯胺；聚吡咯；聚對苯二甲酸丁二醇酯（PBT);聚碳酸酯（例如來自Bayer AG之Makrolon®);丙烯酸聚酯；聚醚丙烯酸酯；聚乙浠；聚乙烯噻吩；聚萘二甲酸乙二醇酯；聚對苯二甲酸乙二醇酯（PET);聚對苯二甲酸乙二醇酯二醇（PETG);聚丙烯；聚甲基丙烯酸甲酯（PMMA);聚苯醚（PPO);聚苯乙烯（PS)、聚四氟乙烯（PTFE);聚四氫呋喃；聚醚（例如，聚乙烯二醇、聚丙烯二醇）；聚乙烯化合物，尤其聚氯乙烯（PVC)、PVC共聚物、PVdC、聚乙酸乙烯酯以及其共聚物、視情況部分水解之聚乙烯醇、聚乙烯醇縮醛、聚乙酸乙烯酯、聚乙烯吡咯啶酮、聚乙烯醚、溶解狀態中及作為分散液之聚乙烯丙烯酸酯及曱基丙烯酸酯以及其共聚物、聚丙烯酸酯及聚苯乙烯共聚物；聚苯乙 125702.doc -14- 200829726 烯（經抗衝擊改性或未經抗衝擊改性）；聚胺基甲酸醋，非交聯或與異氰酸酯交聯；聚胺基甲酸酯丙烯酸酯；苯乙烯丙烯酸系共聚物；苯乙烯丁二烯嵌段共聚物（例如，來自 BASF AG 之 Styroflex® 或 Styrolux®，來自 cpc 之 κ_Industrial Chemistry, 5th edition, Volume A14, page 599. Decomposition of iron pentacarbonyl can occur, for example, at a high temperature and pressure in a heatable decomposer comprising a tube of refractory material such as quartz glass or V2A steel in a preferred vertical position, the decomposer being by one ( For example, the heating device consists of a heating tank, a heating wire or a heating jacket through which a heating medium flows. The platelet-shaped electrolessly plateable particles can be obtained by optimization under conditions in the production process or by mechanical treatment (for example, by treatment in a stirrer ball mill). The proportion of the electrolytically plateable particles is preferably in the range of 20% by weight to 98% by weight, based on the total weight of the dry base layer. One of the ratios of the electrolytically plateable particles is preferably in the range of from 3% by weight to 95% by weight based on the total weight of the dry base layer. For example, a binder having a pigment affinity anchoring group, natural and synthetic polymers and derivatives thereof, natural resins and synthetic resins and derivatives thereof, natural rubber, synthetic rubber, protein, cellulose derivatives, dryness And non-drying oils and the like are suitable as a matrix material. It may be _ but not required to be chemically or physically cured, such as air curing, radiation curing or temperature curing. The matrix material is preferably a polymer or polymer blend. Preferred polymers for the matrix material are, for example, ABs (acrylonitrile-butadiene-styrene); ASA (acrylonitrile-styrene acrylate); acrylic acrylic acid S; alkyd resin; Dilute alkyl ester; vinyl acetate alkyl ester copolymer 125702.doc -13- 200829726, especially vinyl acetate, ethylene vinyl acetate, vinyl acetate, alkyl vinyl chloride copolymer; amine resin; aldehyde and Ketone resin; cellulose and cellulose derivatives, especially hydroxyalkyl cellulose, such as acetate, propionic acid vinegar, cellulose ester of butyric acid, carboxyalkyl cellulose, cellulose nitrate; epoxy acrylate; Epoxy resin; modified epoxy resin, such as bifunctional or polyfunctional bisphenol A or bisphenol F resin, epoxy-novolac resin, desertified epoxy resin, cycloaliphatic epoxy resin; aliphatic epoxy resin , epoxidized propyl ether, vinyl ether, ethylene-acrylic acid copolymer; hydrocarbon resin; MAbs (transparent ABS also containing acrylate units); melamine resin, cis-butyl diacid anhydride copolymer; methacrylate; natural Rubber; synthetic rubber; chlorine rubber; Resin; rosin resin; shellac; variegated resin; polyester; polyester resin such as phenyl ester resin; polyfluorene; polyether oxime; polyamine; polyimine; polyaniline; polypyrrole; Butylene dicarboxylate (PBT); polycarbonate (eg Makrolon® from Bayer AG); acrylic polyester; polyether acrylate; polyacetam; polyethylene thiophene; polyethylene naphthalate; Ethylene terephthalate (PET); polyethylene terephthalate diol (PETG); polypropylene; polymethyl methacrylate (PMMA); polyphenylene ether (PPO); polystyrene (PS), polytetrafluoroethylene (PTFE); polytetrahydrofuran; polyether (for example, polyethylene glycol, polypropylene glycol); polyethylene compounds, especially polyvinyl chloride (PVC), PVC copolymer, PVdC, poly Vinyl acetate and copolymers thereof, partially hydrolyzed polyvinyl alcohol, polyvinyl acetal, polyvinyl acetate, polyvinylpyrrolidone, polyvinyl ether, in a dissolved state, and as a dispersion of polyethylene acrylate And mercapto acrylate and copolymers thereof, polyacrylate and polystyrene copolymerization Polyphenyl Ethylene 125702.doc -14- 200829726 Ether (modified with or without impact modification); Polyurethane carboxylic acid, non-crosslinked or crosslinked with isocyanate; Polyurethane acrylate Ester; styrene acrylic copolymer; styrene butadiene block copolymer (for example, Styroflex® or Styrolux® from BASF AG, κ from cpc)

ResinTM);蛋白質，例如酪蛋白；SIS ;三嗪樹脂、雙馬來醯亞胺三嗪樹脂（BT)、氰酸酯樹脂（CE)、烷基化聚苯醚 (APPE)。兩種或兩種以上聚合物之混合物亦可形成基質材料。土、ResinTM); proteins such as casein; SIS; triazine resin, bismaleimide triazine resin (BT), cyanate resin (CE), alkylated polyphenylene ether (APPE). A mixture of two or more polymers may also form a matrix material. earth,

尤其較佳作為基質材料之聚合物為丙烯酸酯、丙烯酸系樹脂、纖維素衍生物、甲基丙稀酸脂、甲基丙烯酸樹脂、三聚氰胺及胺基樹脂、聚烯烴、聚醯亞胺、環氧樹脂、改性環氧樹脂（例如，雙官能或多官能雙酚A或雙酚f樹脂、環氧-酚醛清漆樹脂、溴化環氧樹脂、環脂族環氧樹脂脂族環氧樹脂、環氧丙基_、乙縣_及1 ㈣脂、聚胺基甲酸酯、聚酯、聚乙烯醇縮醛、聚乙酸乙烯酯、聚苯乙烯、聚苯乙烯共聚物、聚苯乙烯丙烯酸酯、苯乙烯丁二烯後段共聚物、乙酸乙烯烯S旨及乙烯基氣共聚物、聚酿胺及其共聚物。作為印刷電路板之生產中分散液之基質材料，較佳使用熱固化或輻射固化樹脂，例如改性環氧樹脂，諸如雙官能 =官能雙紛A或雙紛F樹脂、環氧__清漆樹脂、漠化環氧樹脂、環脂族環氧樹脂；脂族環氧樹脂、環氧丙基喊、氣酸酉旨、乙稀基鰱、紛系樹脂、聚酿亞胺、三聚氮^ 樹脂及胺基樹脂、聚胺基甲酸醋、聚醋及纖維素衍生物。 125702.doc -15- 200829726 按照乾燥塗層之蛐舌旦七* _ .,. 、心、里來表示，有機黏合劑組份之比例較佳為0.01重量〇/〇 5 θ 〇/ 里至6〇重1%。該比例較佳為0.1重量％至 45重篁％、更佳為〇·5重量。/。至”重量％。為能夠將含有導電顆粒及基質材料之分散液塗覆至支擇件上’可此外將一溶劑或一溶劑混合物添加至分散液中：便調整適用於各別塗覆方法之分散液黏度。合適之 (例如)脂族及芳族煙(例如，正辛烧、環己院、甲苯、:: 苯)二醇(例如，甲醇、乙醇、1-丙醇、2-丙醇、丁醇、2_ 丁醇戊醇）、多凡醇（諸如，甘油、乙二醇、丙二醇、新戊二醇）、烷基i旨(例如’乙酸甲醋、乙酸乙醋、乙酸丙醋：乙酸丁醋、乙酸異丁醋、乙酸異丙醋、3-甲基丁醇)、烷氧基醇(例如’甲氧基丙醇、甲氧基丁醇、乙氧醇）、烧基苯（例如’乙基苯、異丙基苯）、丁基乙二醇、二土醇烷基乙二酵乙酸酯（例如，丁基乙二醇乙 _ 一土乙一醇乙酸酯）、二丙綱醇、二乙二醇二烷基鱗、一乙—醇單燒基鱗、二丙二醇：m二丙二醇單烷基醚、一乙二醇烷基醚乙酸酯、二丙二醇烷基醚乙酸酉曰 ^烷一丙二醇及醚、二乙二醇及醚、DBE(二價酉夂酉曰）(例如，乙鱗、四氫σ夫喊）、氣化乙烯、乙二醇、乙一醇乙I自曰、乙二醇二甲酯、甲酚、内酯（例如，丁内酉曰）、_ (例如，丙綱、2_ 丁酮、環己嗣、甲基乙基明 (ΜΕΚ)、甲基異丁基酮（ΜΙΒΚ))、二甲基乙二醇、二氣甲烷、甲二醇、甲二醇乙酸酯、甲基酚（鄰·、間_、對·甲酚）、吡咯啶酮（例如，Ν-甲基-2-吡咯啶酮）、丙二醇、碳 125702.doc -16 - 200829726 酸丙二醋、四氯化碳、？笨、三經甲基丙烷(τΜρ)、芳族 l及此合物、脂族烴及混合物、醇系單@ (例如，箱品醇）、水及此等溶劑中之兩者或兩者以上之混合物。Particularly preferred polymers for the matrix material are acrylates, acrylic resins, cellulose derivatives, methyl acrylates, methacrylic resins, melamine and amine resins, polyolefins, polyimides, epoxies. Resin, modified epoxy resin (for example, difunctional or polyfunctional bisphenol A or bisphenol f resin, epoxy-novolac resin, brominated epoxy resin, cycloaliphatic epoxy resin aliphatic epoxy resin, ring Oxypropyl _, B _ and 1 (iv) fat, polyurethane, polyester, polyvinyl acetal, polyvinyl acetate, polystyrene, polystyrene copolymer, polystyrene acrylate, Styrene butadiene post-copolymer, vinyl acetate S and vinyl gas copolymer, poly-branched amine and copolymers thereof. As a matrix material for the dispersion in the production of printed circuit boards, it is preferred to use heat curing or radiation curing. Resin, such as modified epoxy resin, such as bifunctional = functional double A or double F resin, epoxy _ varnish resin, desertified epoxy resin, cycloaliphatic epoxy resin; aliphatic epoxy resin, ring Oxypropyl propyl, qi, 乙, 稀Various resins, poly-imine, tri-nitrogen resin and amine-based resin, polyurethane vinegar, polyester and cellulose derivatives. 125702.doc -15- 200829726 According to the dry coating of the tongue 7* _ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , More preferably, it is 5% by weight. To "% by weight. In order to be able to apply a dispersion containing conductive particles and a matrix material to the support member", a solvent or a solvent mixture may be further added to the dispersion. Medium: Adjust the viscosity of the dispersion suitable for the respective coating method. Suitable (for example) aliphatic and aromatic cigarettes (for example, Zhengxin, Cyclohexyl, toluene, :: benzene) diol (for example, methanol) , ethanol, 1-propanol, 2-propanol, butanol, 2-butanol pentanol), polyhydric alcohol (such as glycerol, ethylene glycol, propylene glycol, neopentyl glycol), alkyl i (eg ' Methyl acetate, ethyl acetate, propylene acetate: butyl acetate, isobutyl acetonate, isopropyl acetate, 3-methylbutanol, alkoxy alcohol (eg ' Methoxypropanol, methoxybutanol, ethoxylated alcohol), alkyl benzene (eg 'ethyl benzene, cumene benzene), butyl glycol, di-alkaline alkyl ethanediacetate acetate (e.g., butyl glycol ethyl bromide acetate), dipropanol, diethylene glycol dialkyl scale, monoethyl alcohol monoalkyl scale, dipropylene glycol: m dipropylene glycol monoalkane Ether, monoethylene glycol alkyl ether acetate, dipropylene glycol alkyl ether acetate, propylene glycol and ether, diethylene glycol and ether, DBE (divalent ruthenium) (for example, B scale , tetrahydro sulphur shouting), gasified ethylene, ethylene glycol, ethyl alcohol, ethyl ruthenium, ethylene glycol dimethyl ester, cresol, lactone (for example, butane), _ (for example, a , 2_butanone, cyclohexanone, methyl ethylamine (ΜΕΚ), methyl isobutyl ketone (ΜΙΒΚ), dimethyl glycol, di-methane, dimethyl glycol, methyl glycol acetate , methylphenol (o-, m-, p-cresol), pyrrolidone (for example, Ν-methyl-2-pyrrolidone), propylene glycol, carbon 125702.doc -16 - 200829726 acid propylene glycol, Carbon tetrachloride,? Stupid, tri-methylpropane (τΜρ), aromatic l and the like, aliphatic hydrocarbons and mixtures, alcoholic mono@ (for example, box alcohol), water, and two or more of these solvents a mixture.

較佳溶劑為醇類（例如，乙醇、丨-丙醇、2-丙醇、卜丁醇）、烧氧基醇（例如，甲氧基丙醇、乙氧基丙醇、丁基乙二醇、二丁基乙二醇）、丁内酯、二乙二醇二烷基醚、二乙二醇單烧基趟'二丙二醇二m二丙二醇單燒基鍵、醋(例如’乙酸乙醋、乙酸丁醋、丁基乙二醇乙酸酯、二丁基乙二醇乙酸酯、〔乙二醇烷基醚乙酸酯、二丙二醇烷基醚乙酸酯、DBE)、醚(例如，四氫呋喃）、多元醇 (諸如’甘油、乙二醇、丙二醇、新戊二醇）、酮⑽如，丙酮、甲基乙基_、甲基異丁基酮、環己酮)、烴(例如，環己烷、乙基苯、甲苯、二甲苯）、N_甲基_2·吡咯啶_ 及其混合物。當使用喷墨方法將分散液塗覆至支撐件上時，烷氧基醇類(例如’乙氧基丙醇、丁基乙二醇、二丁基乙二醇)及多元醇（諸如，甘油、酯（例如，二丁基乙二醇乙酸酯、丁基乙二醇乙酸酉旨水、環己酮、二丙二醇甲基醚乙酸酯丁内酯、N·甲基錢、酬及其混合物作為溶劑尤其較佳。在液體基質材料（例如，液體環氧樹脂、兩烯酸酯）之狀況下，各別黏度可替代性地經由塗覆期間之溫度、或經由溶劑與溫度之組合來調整。此外，分散液可含有分散劑組份。此分散劑組份由一或 125702.doc -17- 200829726 多種分散劑組成。原則上，熟習此項技術者已知之應用於分散液中及先前技術中所描述之所有分散劑為合適的。較佳分散劑為界面活性劑或界面活性劑混合物，例如陰離、、 4 陽離子、兩性或非離子界面活性劑。 :散劑可在按照分散液之總重量表示之〇〇1重量％至5〇重量％之範圍内被使用。該比例較佳為〇1重量％至25重量 °/〇、尤其較佳為〇·2重量％至10重量0/〇。此外，根據本發明之分散液可含有填料組份。此填料組份可由-或多種填料組成。舉例而言，可金屬化塊狀物之填料組份可含有呈纖維、層或顆粒形式之填料或其混合物。此等填料組份較佳為市f產品，例如碳及礦物填料。口此外，可能使用諸如玻璃粉之填料或增強物、礦物纖維須日日、氫氧化鋁、諸如氧化鋁或氧化鐵之金屬氧化物农母、石英粉末、碳酸鈣、硫酸鋇、二氧化鈦或矽灰石。此外，可使用其他添加物，諸如搖變劑，例如矽石、矽酉文孤例如氣相二氧化矽（aerosil)或膨潤土；或有機搖變 d及稠化劑，例如聚丙烯酸、聚胺基甲酸酯、水合蓖麻油、木料、脂肪酸、脂肪酸醯胺、增塑劑、網聯劑、消泡劑、潤滑劑、乾燥劑、交聯劑、光引發劑、錯隔劑、蠟、顏料、導電聚合物顆粒。填料組份之比例較佳為按照乾燥塗層之總重量表示之〇.〇1重里/0至50重量％。〇a重量。/。至^❹重量％進一步較佳， 125702.doc 200829726 且0.3重量％至20重量％尤其較佳。此外，根據本發明之分散液中可存在處理助劑及穩定劑，諸如UV穩定劑、潤滑劑、腐蝕抑制劑及阻燃劑。其比例通常為按照分散液之總重量表示之001重量％至5重量 °/〇。該比例較佳為0.05重量％至3重量％。結構化或全表面基層較佳藉由使用分散液用任何印刷方法印刷至支撐件上。可能印刷結構化表面之印刷方法為 (例如）卷筒或薄板印刷方法，諸如絲網印刷、凹版印刷、彈性凸版印刷、活版印刷、移印、喷墨印刷、如 DE10051850中所描述之Lasers〇nicd^法或平版印刷。然而，亦可使用熟習此項技術者已知之任何其他印刷方法。亦可能使用另一習知及廣泛已知塗佈方法來塗覆該表面。該等塗佈方法為（例如）澆鑄、塗刷、刀片刮抹、刷塗、噴塗、浸沒、滾塗、灑粉、流體化床或其類似方法。藉由印刷或塗佈方法所產生之結構化或全區域表面的厚度較佳在 0·01 μιη與50 μιη之間、更佳在〇〇5 μιη與25 μιη之間及尤其較佳在0·1 μηι與15 μηι之間變化。該等層可全表面或以結構化方式經塗覆。可視印刷方法而印刷不同精細結構。作為替代方案，亦可能藉由塗覆一黏接層並隨後轉移可電解鑛覆顆粒來塗覆基層。黏接層之材料在此種狀況下較佳對應於如上文所述之分散液之基質材料。黏接層較佳藉由一印刷方法來塗覆。該印刷方法可為與上文所述用於塗覆分散液之方法相同的方法。 125702.doc -19- 200829726 轉移介質轉移至黏接層可電解鍍覆顆粒可（例如）上。舉例而言，上面可塗覆可電解錄覆顆粒之任何硬質或可撓性支撐件適於用作轉移介質。用於轉移介質之合適材枓為(例如)金屬、玻璃、陶:是、塑膠或任何複合材料。塗覆該基層後’可能使其中所含之可電解㈣顆粒至少部分地暴露以便直接獲得可電解鑛覆成核隨後電解鑛覆期間可沈積至該等成核點上以形層。若該等顆粒由可易於氧化之材料組成，則有時亦必須預先至少部分地移除氧化層。視方法所進行之方式而定， (例如)藉由使用酸性電解質溶液，氧化層之移除可能已在電解鑛覆進行時同時發生，而無需額外製程步驟。 υ 暴露可電解鑛覆顆粒之-優勢為：為獲得—連續導電表面，藉由暴露該等顆粒，該基層僅需要含有一定比例之可電解鑛覆難，該比mb不«該等顆粒之狀況下所需之比例低約5重量％至1〇重量％。其他優勢為正產生之塗^之均質性及連續性以及高製程可靠性。 ' 可電解鍍覆顆粒可機械地（例如藉由刷塗、研磨、磨碎、喷砂或用超臨界二氧化碳噴擊）、物理地（例如藉由加熱、雷射、UV光、電暈或電漿放電）或化學地暴露。在化學暴露之狀況下，較佳使用與基質材料相容之化學品或化學品混合物。在化學暴露之狀況下’可將基質材料至少:: 分地溶解於該表面上並（例如）藉由溶劑洗 ° 1干我者可藉助於合適之試劑使基質材料之化學結構至少部分地分穿γ 暴露可電解鍍覆顆粒。使得基質材料膨脹之試劑亦2用t 125702.doc -20- 200829726 暴露可電解鍍覆顆粒。該膨脹生成待沈積之金屬離子可自電解質溶液進入之空腔，以使較大數目之可電解鍍覆顆粒可經金屬化。隨後電解沈積之金屬層的結合、均質性及連績性顯著較佳於先前技術中所描述之方法。由於所暴露之可電解鍍覆顆粒數目較大，金屬化之製程速率亦較高，從而了達成額外之成本優勢。若基質材料為（例如）環氧樹脂、改性環氧樹脂、環氧-酚醛清漆樹脂、聚丙烯酸酯、ABS、苯乙烯_丁二烯共聚物或聚醚，則可無電極鍍覆及/或可電解鍍覆顆粒較佳藉由使用氧化劑來暴露。氧化劑破壞基質材料之結合，以便可溶解黏合劑並可藉此暴露該等顆粒。合適之氧化劑為（例如）錳酸鹽，諸如高錳酸鉀、錳酸鉀、高錳酸鈉、錳酸鈉丨過氧化氣，氣氟；在諸如猛鹽、錮鹽、絲鹽、嫣鹽及始鹽之催化劑存在下之氧氣；臭氧；五氧化二釩；二氧化硒；多硫化銨溶液；在氨或胺存在下之硫；二氧化錳；鐵酸鉀；重鉻酸鹽/硫酸；於硫酸中或於乙酸中或於乙酸酐中之鉻酸；硝酸；氫碘酸；氳溴酸；重鉻酸吡啶鑌；鉻酸-咄啶錯合物；鉻酸酐；鉻（VI)氧化物；過碘酸；四乙酸鉛；西昆；甲基酸；蒽覼；溪；氣；氟；鐵（111)鹽溶液；硫酸氮鹽溶液；過碳酸鈉；含氧鹵酸鹽，諸如氯酸鹽或溴酸鹽或碘酸鹽；高_酸鹽，諸如高碘酸鈉或高氣酸鈉；過硼酸納；重鉻酸鹽，諸如重鉻酸鈉；過硫酸鹽，諸如過氧二硫酉文钟、過氧單硫酸卸；氣鉻酸ϋ比唆鏽；次_酸鹽，例如次氣化納；在親電子試劑存在下之二曱亞砜；第三丁基氯過 125702.doc •21 - 200829726 氧化物；3_氣過苯甲酸鹽；2义二甲基丙駿；高碘烷；乙二醯氯；脲過氧化氫加合物；脲過氧化氫；2_二乳碘基苯甲酸；過氧單硫酸鉀；^氣過苯甲酸；n_甲基嗎啉4氧化物；2_甲基丙_2_基氫過氧化物；過氧乙酸·，特戊駿，四氧化餓，過硫酸氫卸；釕（in)及（iv)鹽；在 2,2^，6·四甲基哌啶基-N-氧化物存在下之氧氣；三乙醯氧基咼碘烷；三氟過氧乙酸；三甲基乙醛；硝酸銨。可視情況增加製程期間之溫度以便改良暴露製程。Preferred solvents are alcohols (for example, ethanol, hydrazine-propanol, 2-propanol, butanol), alkoxy alcohols (for example, methoxypropanol, ethoxypropanol, butyl glycol). , dibutyl glycol), butyrolactone, diethylene glycol dialkyl ether, diethylene glycol monoalkyl hydrazine 'dipropylene glycol dim dipropylene glycol monoalkyl bond, vinegar (eg 'acetic acid ethyl vinegar, Butyl acetate, butyl glycol acetate, dibutyl glycol acetate, [ethylene glycol alkyl ether acetate, dipropylene glycol alkyl ether acetate, DBE), ether (for example, Tetrahydrofuran), polyol (such as 'glycerin, ethylene glycol, propylene glycol, neopentyl glycol), ketone (10) such as acetone, methyl ethyl _, methyl isobutyl ketone, cyclohexanone), hydrocarbons (for example, Cyclohexane, ethylbenzene, toluene, xylene), N-methyl 2·pyrrolidinium _ and mixtures thereof. When a dispersion is applied to a support using an inkjet method, alkoxy alcohols (eg, 'ethoxypropanol, butyl glycol, dibutyl glycol) and polyols (such as glycerin) And esters (for example, dibutyl glycol acetate, butyl glycol acetate, water, cyclohexanone, dipropylene glycol methyl ether acetate butyrolactone, N. methyl money, and Mixtures are especially preferred as solvents. In the case of liquid matrix materials (eg, liquid epoxy resins, dienoates), the individual viscosities may alternatively be via the temperature during coating, or via a combination of solvent and temperature. In addition, the dispersion may contain a dispersant component consisting of one or a plurality of dispersants of 125702.doc -17- 200829726. In principle, it is known to those skilled in the art to apply to dispersions and previously All dispersants described in the art are suitable. Preferred dispersants are surfactants or surfactant mixtures, such as anionic, tetracationic, amphoteric or nonionic surfactants: powders may be in accordance with the dispersion Total weight It is used in the range of 1% by weight to 5% by weight. The ratio is preferably from 1% by weight to 25% by weight, more preferably from 〇2% by weight to 10% by weight/%. The dispersion of the invention may contain a filler component. The filler component may be comprised of - or a plurality of fillers. For example, the filler component of the metallizable mass may comprise fillers in the form of fibers, layers or granules or mixtures thereof. These filler components are preferably commercially available, such as carbon and mineral fillers. In addition, it is possible to use fillers or reinforcements such as glass frit, mineral fibers, aluminum hydroxide, metals such as alumina or iron oxide. Oxide mother, quartz powder, calcium carbonate, barium sulfate, titanium dioxide or ash. In addition, other additives may be used, such as a rocking agent, such as vermiculite, orphan, such as aerosil. Or bentonite; or organic shake d and thickeners, such as polyacrylic acid, polyurethane, hydrated castor oil, wood, fatty acids, fatty acid guanamine, plasticizers, network agents, defoamers, lubricants Desiccant, A crosslinking agent, a photoinitiator, a spacer, a wax, a pigment, and a conductive polymer particle. The proportion of the filler component is preferably 重1 里1 /50 to 50% by weight based on the total weight of the dry coating. a weight of /% to ❹% by weight is further preferably, 125702.doc 200829726 and 0.3% by weight to 20% by weight is particularly preferred. Further, a treatment aid and a stabilizer such as UV may be present in the dispersion according to the present invention. The stabilizer, the lubricant, the corrosion inhibitor and the flame retardant are usually in a ratio of from 001% by weight to 5% by weight, based on the total weight of the dispersion. The ratio is preferably from 0.05% by weight to 3% by weight. The full or full surface substrate is preferably printed onto the support by any printing method using a dispersion. The printing method that may print the structured surface is, for example, a roll or sheet printing process such as screen printing, gravure printing, and elasticity. Letterpress, typography, pad printing, ink jet printing, Lasers 〇nicd method or lithography as described in DE 10051850. However, any other printing method known to those skilled in the art can be used. It is also possible to coat the surface using another conventional and widely known coating method. Such coating methods are, for example, casting, brushing, blade scraping, brushing, spraying, immersing, rolling, dusting, fluidized beds or the like. The thickness of the structured or full-area surface produced by the printing or coating method is preferably between 0. 01 μm and 50 μm, more preferably between 5 μιη and 25 μηη, and particularly preferably 0. Change between 1 μηι and 15 μηι. The layers can be applied over the entire surface or in a structured manner. Different fine structures are printed by visual printing methods. Alternatively, it is also possible to coat the substrate by applying an adhesive layer and subsequently transferring the electro-oxidizable ore-coated particles. The material of the adhesive layer preferably corresponds to the matrix material of the dispersion as described above under such conditions. The adhesive layer is preferably applied by a printing method. The printing method may be the same as the method for coating the dispersion described above. 125702.doc -19- 200829726 Transfer of Transfer Media to Adhesive Layer Electrolessly plateable particles can be applied, for example. For example, any rigid or flexible support on which the electrolessly recordable particles can be coated is suitable for use as a transfer medium. Suitable materials for the transfer medium are, for example, metal, glass, ceramic: yes, plastic or any composite material. After coating the substrate, the electrolyzable (tetra) particles contained therein may be at least partially exposed to directly obtain an oxidizable mineral nucleation nucleation and then deposited onto the nucleation sites to form a layer during the electrolytic ore coating. If the particles are composed of a material that can be easily oxidized, it is sometimes necessary to at least partially remove the oxide layer in advance. Depending on the manner in which the method is carried out, for example, by using an acidic electrolyte solution, the removal of the oxide layer may have occurred simultaneously while the electrolytic coating is being performed, without the need for additional processing steps.暴露 Exposing the electrolyzable ore-coated particles - the advantage is that in order to obtain a continuous conductive surface, by exposing the particles, the substrate only needs to contain a certain proportion of electrolyzable ore, which is not the condition of the particles The lower ratio required is from about 5% by weight to about 1% by weight. Other advantages are the homogeneity and continuity of the coating being produced and the high process reliability. ' Electrolyticly plateable particles can be mechanically (for example by brushing, grinding, grinding, sandblasting or spraying with supercritical carbon dioxide), physically (for example by heating, laser, UV light, corona or electricity) Slurry discharge) or chemical exposure. In the case of chemical exposure, it is preferred to use a chemical or chemical mixture that is compatible with the matrix material. In the case of chemical exposure, the matrix material can be at least: dissolved on the surface and, for example, washed by a solvent. The chemical structure of the matrix material can be at least partially separated by means of a suitable reagent. Wear gamma to expose electrolessly plated particles. The agent which causes the matrix material to expand is also exposed to the electrolessly plateable particles by t 125702.doc -20-200829726. The expansion produces a metal ion to be deposited that can enter the cavity from the electrolyte solution such that a greater number of electrolytically plateable particles can be metallized. Subsequent bonding, homogeneity and success of the electrodeposited metal layer are significantly better than those described in the prior art. Due to the large number of electrolytically plateable particles exposed, the metallization process rate is also high, thereby achieving an additional cost advantage. If the matrix material is, for example, an epoxy resin, a modified epoxy resin, an epoxy novolak resin, a polyacrylate, an ABS, a styrene-butadiene copolymer or a polyether, electrodeless plating and/or Or the electrolytically plateable particles are preferably exposed by using an oxidizing agent. The oxidant destroys the bond of the matrix material to dissolve the binder and thereby expose the particles. Suitable oxidizing agents are, for example, manganates such as potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, peroxygen gas, gaseous fluorine; in such as eucalyptus, barium, silk, barium salts And oxygen in the presence of a catalyst of the initial salt; ozone; vanadium pentoxide; selenium dioxide; ammonium polysulfide solution; sulfur in the presence of ammonia or an amine; manganese dioxide; potassium ferrite; dichromate/sulfuric acid; Chromic acid in sulfuric acid or in acetic acid or in acetic anhydride; nitric acid; hydroiodic acid; hydrazine bromate; pyridinium dichromate; chromate-acridine complex; chromic anhydride; chromium (VI) oxide ; periodic acid; lead tetraacetate; Xikun; methyl acid; hydrazine; creek; gas; fluorine; iron (111) salt solution; sulfuric acid nitrogen salt solution; sodium percarbonate; oxyhalide, such as chloric acid Salt or bromate or iodate; high-acid salt, such as sodium periodate or sodium sulphate; sodium perborate; dichromate, such as sodium dichromate; persulphate, such as peroxydisulfide Shu Wenzhong, peroxymonosulfate unloading; bismuth chromite bismuth rust; sub-acid salt, such as sub-gasification sodium; disulfoxide in the presence of electrophile; Tributyl chloride over 125702.doc •21 - 200829726 oxide; 3_gas perbenzoate; 2 dimethyl propyl benzoate; high iodine; ethylene dichloride; urea hydrogen peroxide adduct; urea Hydrogen peroxide; 2_di-lactoiodobenzoic acid; potassium peroxymonosulfate; benzoic acid; n-methylmorpholine 4 oxide; 2-methylpropan-2-yl hydroperoxide; Oxyacetic acid, Tetrajun, tetraoxide, hydrogen peroxide dehydrogenate; strontium (in) and (iv) salts; oxygen in the presence of 2,2^,6·tetramethylpiperidinyl-N-oxide ; triethoxy oxime iodine; trifluoro peracetic acid; trimethyl acetaldehyde; ammonium nitrate. Increasing the temperature during the process can be used to improve the exposure process.

L 較佳使用錳酸鹽，例如高錳酸鉀、錳酸鉀、高錳酸鈉、殼酸納；過氧化氫；义甲基嗎啉_N_氧化物；過碳酸鹽，例如過碳酸鈉或過碳酸鉀；過硼酸鹽，例如過硼酸鈉或過硼酸鉀；過硫酸鹽，例如過硫酸鈉或過硫酸鉀；過氧二硫酉文鈉、過氧二硫酸鉀及過氧二硫酸銨以及過氧單硫酸鈉、過氧單硫酸鉀及過氧單硫酸銨；次氣化鈉；脲過氧化氫加合物；含氧鹵酸鹽，諸如氯酸鹽或溴酸鹽或碘酸鹽；高鹵酉夂置諸如鬲破酸鈉或高氣酸鈉；過氧二硫酸四丁基銨； -比’鐵（III)鹽溶液；五氧化二鈒丨重鉻酸。比σ定鑌；鹽酸；溴；氯；重鉻酸鹽。尤其較佳使用高錳酸鉀、錳酸鉀、高錳酸鈉、錳酸鈉、過氧化氫及其加合物、過硼酸鹽、過碳酸鹽、過硫酸鹽、過氧二硫酸鹽、次氯化鈉及高氯酸鹽。為暴露含有（例如）諸如聚酯樹脂、丙烯酸聚酯、聚醚丙稀酸酉旨、聚酯胺基甲酸酯之酯結構的基質材料中的可電解鍍覆顆粒，較佳（例如）使用酸性或鹼性化學品及/或化學品 125702.doc -22- 200829726 混合物。較佳酸性化學品及/或化學品混合物為（例如）濃酸或稀i，諸如鹽酸、硫酸、磷酸或硝酸。視基質材料而定，諸如甲酸或乙酸之有機酸亦可能合適。合適之鹼性化予口α及/或化學品混合物為（例如）鹼，諸如氫氧化鈉、氫氧化鉀、氫氧化銨；或碳酸鹽，例如碳酸鈉或碳酸鈣。可視情況增加製程期間之溫度以便改良暴露製程。 /合劑亦可用以暴露基質材料中之可電解鍍覆顆粒。因為基質材料必須溶解於溶劑中或因溶劑而膨脹，故溶劑必須適口於基質材料。當使用基質材料溶解於襄面之溶劑時，使該基層與該溶劑僅接觸較短時間以使基質材料之上層得以 >谷合並藉此溶解。較佳溶劑為二甲苯、甲苯、函化烴、丙酮、甲基乙基酮（ΜΕΚ)、甲基異丁基酮（Μιβκ)、二乙二酉予單丁基醚。可視情況增加溶解製程期間之溫度以便改良溶解行為。此外，亦可能藉由使用機械方法來暴露可電解鍍覆顆粒口適之機械方法為（例如）刷塗、研磨、用研磨劑拋光或用喷水器加壓噴擊、喷砂或用超臨界二氧化碳喷擊。分別藉由忒械械方法來移除經固化、經印刷之結構化基層的貝層藉此，含於基質材料中之可電解鍍覆顆粒得到暴露。热白此項技術者已知之所有研磨劑可用作用於拋光之研磨劑。合適之研磨劑為（例如）浮石粉。為藉由用喷水器加 I：喷擊來移除經固化之分散液之頂層，該喷水器較佳含有小固體顆粒’例如具有40 μπι至120 _、較佳60 μιη至80 125702.doc -23- 200829726 μηι之平均粒徑分布之浮石L preferably uses a manganate such as potassium permanganate, potassium manganate, sodium permanganate, sodium sulphate; hydrogen peroxide; methylmorpholine _N_oxide; percarbonate such as sodium percarbonate Or potassium percarbonate; perborate, such as sodium perborate or potassium perborate; persulfate, such as sodium persulfate or potassium persulfate; sodium peroxodisulphate, potassium peroxydisulfate and ammonium peroxodisulfate And sodium peroxymonosulfate, potassium peroxymonosulfate and ammonium peroxymonosulfate; subsodium sulphate; urea hydroperoxide adduct; oxyhalide, such as chlorate or bromate or iodate High-halogenation such as sodium sulphate or sodium sulphate; tetrabutylammonium peroxydisulfate; - than iron (III) salt solution; bismuth pentoxide dichromate. Ratio σ 镔; hydrochloric acid; bromine; chlorine; dichromate. Particularly preferred are potassium permanganate, potassium manganate, sodium permanganate, sodium manganate, hydrogen peroxide and its adducts, perborate, percarbonate, persulphate, peroxodisulfate, secondary Sodium chloride and perchlorate. For exposing electrolessly plateable particles in a matrix material containing, for example, an ester structure such as a polyester resin, an acrylic polyester, a polyether acrylate, or a polyester urethane, preferably, for example, Acid or alkaline chemicals and / or chemicals 125702.doc -22- 200829726 mixture. Preferred acidic chemicals and/or chemical mixtures are, for example, concentrated acids or dilute i, such as hydrochloric acid, sulfuric acid, phosphoric acid or nitric acid. Depending on the matrix material, organic acids such as formic acid or acetic acid may also be suitable. Suitable alkaline acyl and/or chemical mixtures are, for example, bases such as sodium hydroxide, potassium hydroxide, ammonium hydroxide; or carbonates such as sodium carbonate or calcium carbonate. The temperature during the process can be increased as appropriate to improve the exposure process. The mixture can also be used to expose electrolessly plateable particles in the matrix material. Since the matrix material must be dissolved in a solvent or expanded by a solvent, the solvent must be suitable for the matrix material. When a solvent of the matrix material is dissolved in the surface of the crucible, the base layer is contacted with the solvent only for a short period of time so that the upper layer of the matrix material is combined with the > valley to thereby dissolve. Preferred solvents are xylene, toluene, a functional hydrocarbon, acetone, methyl ethyl ketone (oxime), methyl isobutyl ketone (Μιβκ), and diethyl hydrazine to monobutyl ether. The temperature during the dissolution process may be increased as appropriate to improve dissolution behavior. In addition, it is also possible to expose the electrolytically platable particles by mechanical means such as brushing, grinding, polishing with abrasives or pressure spraying with a water jet, sand blasting or supercritical Carbon dioxide spray. The electrolessly plated particles contained in the matrix material are exposed by a mechanical means to remove the cured, printed structured substrate layer. All of the abrasives known to those skilled in the art can be used as a grinding agent for polishing. Suitable abrasives are, for example, pumice powder. In order to remove the top layer of the solidified dispersion by adding a spray: I: spray, the water spray preferably contains small solid particles 'for example, having 40 μπι to 120 _, preferably 60 μηη to 80 125702. Doc -23- 200829726 μηι The average particle size distribution of pumice

Mm之物（Α〗2〇3)以及具有大於3 粒徑的石英粉末（Si02)。若可電解鍍覆顆粒含有可易於氧化之材料，則在一較佳方法變體中’在金屬層形成於該結構化或全表面基層上之财將氧化層至少部分地移除。舉例而t，氧化層在此種狀況下可化學地及/或機械地移除。可處理該基層以便自可電解鑛覆顆粒化學地移除-氧化層之合適物質為(例如)Mm (Α 〇 2〇3) and quartz powder (Si02) having a particle size larger than 3. If the electroless plateable particles contain a material that is susceptible to oxidation, then in a preferred method variant the oxide layer is at least partially removed from the formation of the metal layer on the structured or full surface substrate. By way of example, the oxide layer can be removed chemically and/or mechanically under such conditions. A suitable material that can be treated to chemically remove the oxide layer from the electroless ore-coated particles is, for example,

酸，諸如濃硫酸或稀硫酸或濃鹽酸或稀鹽酸、摔樣酸、鱗酸、醯胺基石黃酸、甲酸、乙酸。用於自可電錢㈣粒移除氧化層之合適機械方法大體與用於暴露該等顆粒之機械方法相同。用於鍍覆之電解質溶液之組合物視意欲使基板上之基層被鍵覆之金屬而定。原則上，比該基層之最不貴金屬貴或與其同樣貴之所有金屬可用於電解鍍覆。藉由電解鐘覆沈積之習知金屬為（例如）金 '鎳、鈀、鉑、銀、錫、銅或鉻。一或多個所沈積層之厚度處於熟習此項技術者已知之習知範圍内，且並非為本發明所必需。用於鍍覆導電結構之合適電解質溶液為熟習此項技術者所已知的，例如來自 Werner 川lek，Gusti Keller，Handbueh der Leiterplattentechnik [Handbook of printed circuit technology], Eugen G. Leuze Verlag，2003，第 4卷，第 332 至352頁。在一個實施例中，當將具有該基層之基板傳送穿過電解質槽時，將經安裝以能夠陰極地連接且旋轉之至少一個滾 125702.doc -24- 200829726 筒靜態地固持於該電解質槽中。在傳送且期間，該滾筒移動越過該基層。該 /土曰之土板 Λ 土層猎此得到接觸。只要該滾筒與該基層接觸且經陰極地連接，金屬便質溶液沈積於該基層上.形成一連續金屬層。An acid such as concentrated sulfuric acid or dilute sulfuric acid or concentrated hydrochloric acid or dilute hydrochloric acid, falling acid, squaric acid, guanyl lithic acid, formic acid, acetic acid. Suitable mechanical methods for removing the oxide layer from the chargeable (four) particles are generally the same as the mechanical methods used to expose the particles. The composition of the electrolyte solution for plating is intended to be such that the base layer on the substrate is bonded to the metal. In principle, all metals which are more expensive or otherwise expensive than the least precious metal of the base layer can be used for electrolytic plating. A conventional metal deposited by electrolysis of a clock is, for example, gold 'nickel, palladium, platinum, silver, tin, copper or chromium. The thickness of one or more of the deposited layers is within the known ranges known to those skilled in the art and is not essential to the invention. Suitable electrolyte solutions for plating conductive structures are known to those skilled in the art, for example from Werner L. Lek, Gusti Keller, Handbueh der Leiterplattentechnik [Handbook of printed circuit technology], Eugen G. Leuze Verlag, 2003, Volume 4, pages 332-352. In one embodiment, when the substrate having the substrate is transferred through the electrolyte bath, at least one roller 125702.doc -24-200829726 that is mounted to be cathode-connected and rotatable is statically held in the electrolyte bath . During transport and during the transfer, the drum moves past the base layer. The / soil slab Λ soil layer hunting this contact. The metallic cleaning solution is deposited on the substrate as long as the roller is in contact with the substrate and is connected via the cathode to form a continuous metal layer.

為產生-較厚金屬層於該基層上，較佳：至少兩個# 極地連接滾筒串聯地連接於該電解f槽中。藉由串聯地連接之可陰極連接滾筒來增加該基層與該陰極之接觸時間。由於接觸時間較長’更多金屬沈積於該基層上。此引起兮基層之-較厚金屬塗層。為減少或甚至完全防止於滚筒之表面上之金屬沈積，較佳藉由防止電解質溶液被傳遞至滚筒之表面上之屏蔽罩來將該等滾筒封閉。該屏蔽罩本身較佳由不導電材料製成’以便防止屏蔽罩變得帶負電荷而使金屬可沈積於其上。用於屏蔽罩之合適材料為（例如）諸如 PVC之塑膠、EPDM、聚矽氧橡膠。忒等屏蔽罩係朝向具有該基層之該基板開口，以使該滾筒可在此側接觸該基層。為使得該基板可沿著由該屏蔽罩封閉之滾筒饋入，而不損壞該基層或一已產生於該基層上之金屬塗層，較佳在該屏蔽罩與該基板之表面之間形成一間隙。為使儘可能少之電解質溶液沿著該間隙進入屏蔽罩與滾筒之間的空間，較佳藉由一彈性凸緣來閉合在屏蔽罩與基板之表面之間的間隙。用於該彈性凸緣之合適材料為具有低於基層之表面或金屬塗層之表面之硬度的任何彈性體。此防止該表面受到損壞。用於該彈性凸緣之合適材料為（例如）EPDM、聚矽氧橡膠。 125702.doc •25- 200829726 ®電解質溶液進入屏蔽罩與滚筒之間時，其因沈積金屬離子於该滾筒上而耗盡。該彈性凸緣大體上防止新電解質 >谷液流入。金屬離子之濃度逐漸減小亦使於該滾筒上之金屬沈積減少或甚至當達到一對應低濃度時，完全防止金屬沈積。To produce a thicker metal layer on the substrate, preferably: at least two # pole connection rollers are connected in series to the electrolytic f-groove. The contact time of the substrate with the cathode is increased by a cathode connectable roller connected in series. Due to the longer contact time, more metal is deposited on the substrate. This causes a thicker metal coating on the base layer. In order to reduce or even completely prevent metal deposition on the surface of the drum, it is preferred to close the drum by preventing the electrolyte solution from being transferred to the shield on the surface of the drum. The shield itself is preferably made of a non-conductive material to prevent the shield from becoming negatively charged so that metal can be deposited thereon. Suitable materials for the shield are, for example, plastics such as PVC, EPDM, polyoxyethylene rubber. The shield is oriented toward the substrate having the substrate such that the roller can contact the substrate on the side. In order to enable the substrate to be fed along the roller closed by the shield without damaging the base layer or a metal coating that has been generated on the substrate, a gap between the shield and the surface of the substrate is preferably formed. gap. In order to allow as little electrolyte solution as possible to enter the space between the shield and the roller along the gap, it is preferred to close the gap between the shield and the surface of the substrate by a resilient flange. A suitable material for the elastic flange is any elastomer having a hardness lower than the surface of the base layer or the surface of the metal coating. This prevents the surface from being damaged. Suitable materials for the resilient flange are, for example, EPDM, polyoxyxene rubber. 125702.doc •25- 200829726 ® When the electrolyte solution enters between the shield and the drum, it is depleted by depositing metal ions on the drum. The resilient flange substantially prevents new electrolyte > valley liquid from flowing in. The gradual decrease in the concentration of metal ions also reduces the metal deposition on the drum or even prevents metal deposition when a correspondingly low concentration is reached.

作為替代方案，該彈性凸緣亦可能閉合在屏蔽罩與滾筒之間的間隙。藉由閉合在屏蔽罩與滾筒之間的間隙，仍可能移動滾筒。若藉由_彈性凸緣來閉合在屏蔽罩與滾筒之間的間隙，則此亦大體上防止電解質溶液在滾筒之區域中不存在基板時進入屏蔽罩與滾筒之間的空間。此外，在屏蔽罩與基板之表面之間的間隙亦可能藉由一具有一彈性表面之滾筒來大體上密封。為此，具有一彈性表面之滾靖方面對具備該基層之基板表面施加壓力，且另一方面對可陰極連接滾筒施加壓力。作為替代方案，具有-彈性表面之滾筒亦可能一方面對具備該面施加壓☆，且另一方面對屏蔽罩施加壓力。在= 體中i在屏蔽罩與可陰極連接滾筒之間的間隙亦可藉^ 有-彈性表面之滾筒來大體上密封。為此nmi 面之滾筒一方面對屏蔽罩施加壓力，且另一乂連接滾筒施加壓力。極若在屏蔽罩與可陰極連接滾筒之間的間隙係分別藉性凸緣或具有-彈性表面之滾筒來大體上密封，極連接滾筒之彼部分（其位於該屏蔽罩外）分別與電解㈣液接觸。然而’在此區域中，金屬可沈積於可陰極連接滾 125702.doc -26 - 200829726 筒之表面上。使在基板之表面與可陰極連接滾筒之間的間隙閉合大體上防止電解質溶液能夠流至可陰極連接滾筒之表面。此大體上防止金屬沈積於可陰極連接滚筒上。彈性凸緣或具有一彈性表面之滾筒較佳經排列，以使每田具有一待鍍覆之結構化或全表面基層之基板接觸可陰極連接滾筒時，在基板與滾筒之間的間隙便得以密封，從而無電解質溶液可流至滾筒上且同時可陰極連接滾筒與屏蔽罩之間的空間亦藉由彈性凸緣或具有一彈性表面之滾筒來大體上密封。-旦可陰極連接滾筒之區域中不存在基板且滾筒因此中性地連接，於屏蔽罩與可陰極連接滾筒之間，環繞可陰極連接滾筒之空間便較佳藉由彈性凸緣或具 2一彈性表面之滾筒來大體上密封，以使儘可能少之電解貝+液可w人此工間中。以此種方式’電解質溶液始終遠離可陰極連接滾筒之表面，且因此大體上防止金屬沈積於可陰極連接滾筒上。此之優勢為滾筒之操作時間得到延長，因為無需如此頻繁地替換滾筒。可藉以密封在基板與屏蔽罩之間或在可陰極連接滚筒與屏蔽罩之間的間隙的具有一彈性表面之滾筒可（例如）包含 (例如）由金屬（例如，鋼或鋁）製成之非彈性核心，及一彈f生^層該彈性塗層為（例如卜epdm或聚石夕氧橡膠塗層作為替代方案，具有一彈性表面之滾筒當然亦可能完王由彈性材料製成。然而，此接著需要具有足夠高之強度’以便防止具有一彈性表面之滾筒至少部分地壓縮且拉 125702.doc -27- 200829726 伸穿過可陰極連接滾筒與基板之間。滾筒係完全由彈性材料製成時，與用:密::彈性表面之 ⑴如）適於用作用於其之材料。舉例^ 材 EPDM或聚矽氧橡膠製成。 σ滾疴則可由為在電解質溶液中產峰_ 或全表面其Μ 抓",L動並藉此容許於結構化 :¾王表面基層上之沈積，一僻儿之屏蔽罩之門。、 ° 乂土为別固持於兩個滾筒坍。该％極較佳經設計為一可、、儿牮臨k 珊格％極。此提供Alternatively, the resilient flange may also close the gap between the shield and the drum. It is still possible to move the drum by closing the gap between the shield and the drum. If the gap between the shield and the drum is closed by the elastic flange, this also substantially prevents the electrolyte solution from entering the space between the shield and the drum when the substrate is not present in the area of the drum. In addition, the gap between the shield and the surface of the substrate may also be substantially sealed by a roller having a resilient surface. To this end, the rolling surface having a resilient surface applies pressure to the surface of the substrate having the base layer, and on the other hand, applies pressure to the cathode connectable roller. Alternatively, the drum with the elastic surface may also exert pressure on the one hand on the one hand and pressure on the shield on the other hand. The gap between the shield and the cathodically connectable roller in the body can also be substantially sealed by a roller with a resilient surface. For this purpose, the roller of the nmi face exerts pressure on the shield on the one hand and pressure is applied to the other roller on the other side. If the gap between the shield and the cathodically connectable roller is substantially sealed by a flange or a roller having an elastic surface, the other part of the pole connecting the drum (which is located outside the shield) and the electrolysis (4) Liquid contact. However, in this region, metal can be deposited on the surface of the cathode connectable roller 125702.doc -26 - 200829726. Closing the gap between the surface of the substrate and the cathodically connectable roller substantially prevents electrolyte solution from flowing to the surface of the cathodically connectable roller. This generally prevents metal from depositing on the cathodically connectable roller. The elastic flange or the roller having a resilient surface is preferably arranged such that when a substrate having a structured or full-surface substrate to be plated is in contact with the cathode-connectable roller, the gap between the substrate and the roller is The seal is such that no electrolyte solution can flow to the drum while the space between the cathode connection drum and the shield is also substantially sealed by a resilient flange or a drum having a resilient surface. - the substrate can be connected to the drum in the region where the cathode is not present, and the drum is thus neutrally connected. Between the shield and the cathode connectable roller, the space surrounding the cathode-connectable roller is preferably by an elastic flange or The roller of the elastic surface is substantially sealed so that as little electrolysis can be used in this chamber. In this manner, the electrolyte solution is always away from the surface of the cathodically connectable roller, and thus the metal is substantially prevented from depositing on the cathodically connectable roller. This has the advantage that the operating time of the drum is extended because there is no need to replace the drum so frequently. The drum having a resilient surface that can be sealed between the substrate and the shield or between the cathode and the shield can be, for example, made of, for example, metal (eg, steel or aluminum). The non-elastic core, and the elastic layer of the elastic coating are (for example, an epdm or a polysulfide rubber coating as an alternative, the roller having a resilient surface may of course be made of an elastic material. This then needs to have a sufficiently high strength 'to prevent the roller having a resilient surface from being at least partially compressed and pulling 125702.doc -27-200829726 through the cathode connectable roller and the substrate. The roller system is entirely made of elastic material For the time of use, the use of: dense:: elastic surface (1), for example, is suitable for use as a material therefor. An example is made of EPDM or polyoxyethylene rubber. The σ roll can be made by pulsing the peak in the electrolyte solution or the entire surface, and thereby allowing the structuring: deposition on the surface layer of the king's surface, a secluded shield door. , ° The earth is not fixed on the two rollers 坍. The % is extremely well designed to be one, and the child is close to the K. This offer

C 接、穿符係：電解質溶液之優勢。尤其當個別可陰極連彈性凸緣或具有-彈性表面之滾筒密封時， I讀極傳遞電解質溶液確保在兩個滾筒之間分別存在具有足約金屬離子之電解質溶液，因為彈性凸緣或具有一㈣表面之滾筒阻礙或甚至防止分別於兩個可陰極連接滾筒之間、於電解質槽内部之各個區域之間的液體交換。作為電解質傳遞之選項之㈣方案，亦可能❹可溶陽極。可溶陽極則較佳含有結構化或全表面基層所電解鑛覆之金屬。在電流流動期間’在此種狀況下，來自可溶陽極之金屬進入溶液中且隨後沈積於陰極地連接之基層上對個別可陰極連接滾筒之電力供應（例如）經由滑動接點而發生。滑動接點較佳形成於屏蔽罩内部。將可陰極連接滾筒壓至滑動接點上產生一電流流動，且滾筒變成陰極地連接。舉例而言，滾筒係藉由待鍍覆之結構化或全表面基層位於上面之基板而壓抵滑動接點。為此，可陰極連接滾筒可垂直於基板之表面移位。一旦不存在基板與可陰極連接滾筒接觸，一力便作用於滾筒上以便將其自滑動接點移 125702.doc -28- 200829726 該基板，可陰極連接滚筒與此力反向地上升_ 板^ ^ °右基板在—水平方向上移動幻袞筒位於該基 ’則其大體m衰筒之區域中不存在基板時使用力’滾筒係藉由重力而自滑動接點移除。當基板之定位及傳达方向不同於此時’自滑動接點移除滚筒所需之力可 (例如）藉由彈簧元件而施加。C Connect, wear the system: the advantages of electrolyte solution. In particular, when individual cathodes are connected to elastic flanges or cylinders having an elastic surface, the I-reader delivers an electrolyte solution to ensure that there is an electrolyte solution having a sufficient amount of metal ions between the two cylinders, since the elastic flange or has one (d) The surface of the drum impedes or even prevents liquid exchange between the two cathode connectable rollers and between the various regions inside the electrolyte bath. As an option for electrolyte delivery (4), it may also be a soluble anode. The soluble anode preferably contains a metal that is electrolytically coated by a structured or full surface substrate. During current flow, 'in this condition, the supply of electricity from the cathode of the soluble anode into the solution and subsequent deposition on the cathode connected to the cathode can occur, for example, via a sliding contact. The sliding contact is preferably formed inside the shield. Pressing the cathode connectable roller to the sliding contact creates a current flow and the drum becomes cathode connected. For example, the roller is pressed against the sliding contact by the substrate on which the structured or full surface substrate to be plated is located. To this end, the cathode connectable roller can be displaced perpendicular to the surface of the substrate. Once there is no substrate in contact with the cathodically connectable roller, a force is applied to the roller to move it from the sliding contact. 125702.doc -28- 200829726 The substrate can be connected to the roller and the force rises in the opposite direction _ plate ^ ^ ° The right substrate moves in the horizontal direction - the illusion tube is located at the base 'there is no substrate in the area of the main m casket. The force is used to remove the roller from the sliding contact by gravity. When the substrate is positioned and conveyed differently than the force required to remove the roller from the sliding contact, it can be applied, for example, by a spring element.

作為藉由滑動接點使可陰極連接滾筒帶電之替代方案，亦可能（例如）使㈣測滾筒是否與—待鍍覆之基層接觸之感測器。-旦债測到可陰極連接滾筒正接觸一待鍍覆之基層，便對可陰極連接滾筒施加一電壓。一旦感測器憤測不存在〃待鍍覆之基層之接觸，便再次中斷電流流動。偵測滾筒疋否與一具有一待鍍覆之結構化或全表面基層之基板接觸的感測器為(例如)光學或機械的。當使用感測器以便偵測可陰極連接滾筒是否與一待鍍覆之基層接觸時，亦可能自電解質槽外部產生電流供應。則（例如）電流供應可絰由滾筒軸上之滑環發生。使用一光學或機械感測器調節電流供應為較佳，尤其當基板僅具有極小厚度時。在此種狀況下，基板之厚度將不足以誘發足夠大之行程以便將滾筒壓抵滑動接點，以便產生電流供應。此為（例如）當待鍍覆之基層位於一薄箔載體上之狀況。在薄箔載體之狀況下，至少一個滾筒亦可自然地永久地陰極地連接。如前所述，與自先前技術所得知之系統相比’其所導致之金屬沈積藉由屏蔽預防而顯著地減少。此提供相應成本優勢，因為該等滾筒具有較長操作時間及較 125702.doc -29- 200829726 短維護間隔。為同時鏡覆一具有結構化或全表面基層形成於上面之基板的上側及下側，在一個實施例中，兩個滾筒分別彼此面對且基板於其間饋入穿過。以此種方式，可同時鍍覆基板之上側上之基層及基板之下側上的基層。相互對置之滾筒之另一優勢為其可同時用於將基板傳送穿過電解質槽。為此’驅動滚筒中之至少一些。作為替代方案，基板亦可藉由具有一面對滾筒之傳送裝置來傳送。該傳送裝置可（例如）包含經個別驅動之滾筒，基板係於其上輸送。此外，亦可能使輸送裝置包含一（例如）基板位於上面之輸送帶。然而，若存在一面對滾筒之輸送裝置，則僅可鍍覆基板之一側。在此種狀況下，為鍍覆一可能存在於基板之下側上之基層，必須使基板轉向且使其再次饋入穿過電解鍍覆裝置，或提供一供基板饋入之第二裝置。已將基板饋入穿過電解鍍覆裝置之後，較佳使基板旋轉。基板繞著旋轉之旋轉軸線轉在此種狀況下係垂直於基板之待鍍覆基層而排列。如在基板之傳送方向上所見之最初為寬且短的結構藉由旋轉而對準，以使得其如在旋轉後之傳送方向上所見為窄且長的。此延長一個別可陰極連接，筒接觸該結構之接觸時間。此使沈積於該結構上之金屬量增加，且因此使層厚度增加。旋轉基板之後，其可經饋入而再次穿過同一裝置或穿過一於下游之第二裝置。在另一實施例中，可陰極連接滾筒排列於一旋轉滾筒之 125702.doc -30- 200829726 外圓周上。在此實施例中，例如，可能將陽極排列於旋轉滾筒内部。為此，可陰極連接滾筒排列於上面之旋轉滾？係經設計為一空心軸。不與基板接觸之彼等滾筒可(例由屏蔽罩覆蓋。、此=屏蔽罩係用以集中自中心陽極至基板之路徑上之— 人電机的分布，且限制自陽極地連接之接觸滾筒至輔助陰極之二次電流的電流分布。金屬化基板之電效率可藉此改良。儘管如此，此等屏蔽罩並非絕對必要的。為移除可能已沈積於陰極地連接之滾筒上之金屬，在所有實細例中，較佳使不與基板上之結構化或全表面基層接觸，彼等滾筒陽極地連接m陽極連接，先前沈積於滾筒上之金屬得以再次自其移除。作為替代方案’亦可能 (j如）在操作暫―期間將沈積於滾筒上之材料自其清除。可陰極連接滚筒亦可藉由將滾筒取出電解質槽來清潔。缺而，因滾筒串聯地排列，此僅t未正鑛覆基板時係可= 的。右可陰極連接滾筒係排列於一旋轉軸上，則有可能將不接觸基層之彼等可陰極連接滾筒移除並清潔。用於電解鍍覆結構化或全表面基層於一基板上的根據本發明之方法及根據本發明之裝置適用於(例如)產生印刷電路板上之導體軌道。該等印刷電路板為（例如）具有多層内層及多層外層之印刷電路板、板上微通道晶片、可撓性及硬質印刷電路板，且（例如）安裝於諸如電腦、電話、電視、電力汽車組件、鍵盤、無線電、視訊、CD、CD-ROM 及DVD播放機、遊戲控制台、量測及調節設備、感測器、 125702.doc •31 · 200829726 廚房電氣設備、電動玩具等之產品中。可撓性電路支撐件上之導電結構亦可藉由根據本發明之方法來鍍覆。該等可撓性電路支撐件為（例如）由用於上面印刷導電結構之支撐件之上文提及的材料所製成的塑膠薄膜。此外，根據本發明之方法及根據本發明之裝置適用於產生RFID天線、應答器天線或其他天線結構、晶片卡模組、扁平電纜、座位加熱器、箔導體、太陽電池中或LCD/ 電漿螢幕中之導體執道、電容器、箔電容器、電阻器、對As an alternative to charging the cathode connectable roller by means of a sliding contact, it is also possible, for example, to have (4) measure whether the roller is in contact with the substrate to be plated. Once the bond is measured, the cathode connection roller is in contact with a substrate to be plated, and a voltage is applied to the cathode connectable roller. Once the sensor insults that there is no contact with the substrate to be plated, the current flow is again interrupted. The sensor that detects whether the roller is in contact with a substrate having a structured or full-surface substrate to be plated is, for example, optical or mechanical. When a sensor is used to detect whether the cathode connectable roller is in contact with a substrate to be plated, it is also possible to generate a current supply from outside the electrolyte bath. Then, for example, the current supply can occur from the slip ring on the drum shaft. It is preferred to use an optical or mechanical sensor to adjust the current supply, especially when the substrate has only a very small thickness. Under such conditions, the thickness of the substrate will not be sufficient to induce a sufficiently large stroke to press the roller against the sliding contact to produce a current supply. This is for example the case when the substrate to be plated is on a thin foil carrier. In the case of a thin foil carrier, at least one of the rollers can also be naturally and permanently cathode-connected. As previously mentioned, the resulting metal deposition is significantly reduced by shielding prevention as compared to systems known from the prior art. This provides a corresponding cost advantage as these rollers have a longer operating time and a shorter maintenance interval than 125702.doc -29-200829726. To simultaneously mirror the upper and lower sides of a substrate having a structured or full-surface substrate formed thereon, in one embodiment, the two rollers are respectively facing each other and the substrate is fed therethrough. In this manner, the base layer on the upper side of the substrate and the base layer on the lower side of the substrate can be simultaneously plated. Another advantage of mutually opposed rollers is that they can be used simultaneously to transport substrates through the electrolyte bath. For this, at least some of the rollers are driven. Alternatively, the substrate can also be transported by having a conveyor facing the drum. The transfer device can, for example, comprise an individually driven roller onto which the substrate is attached. In addition, it is also possible for the transport device to comprise, for example, a conveyor belt on which the substrate is located. However, if there is a conveying device facing the drum, only one side of the substrate can be plated. In this case, in order to plate a substrate which may be present on the underside of the substrate, the substrate must be turned and fed again through the electrolytic plating apparatus, or a second means for feeding the substrate. After the substrate has been fed through the electrolytic plating apparatus, the substrate is preferably rotated. The substrate is rotated about the axis of rotation of the rotation in such a manner as to be aligned perpendicular to the substrate to be plated of the substrate. The structure which is initially wide and short as seen in the conveying direction of the substrate is aligned by rotation so that it is narrow and long as seen in the conveying direction after the rotation. This extends the contact time of a cathode connection that contacts the structure. This increases the amount of metal deposited on the structure and thus increases the layer thickness. After rotating the substrate, it can be fed through the same device again or through a second device downstream. In another embodiment, the cathode connectable roller is arranged on the outer circumference of 125702.doc -30-200829726 of a rotating drum. In this embodiment, for example, it is possible to arrange the anode inside the rotary drum. To this end, the cathode can be connected to the rotating roller arranged on the drum. It is designed as a hollow shaft. The rollers that are not in contact with the substrate may be covered by the shield cover. For example, the shield cover is used to concentrate the distribution of the human motor from the center anode to the substrate, and the contact roller is connected from the anode. The current distribution to the secondary current of the auxiliary cathode. The electrical efficiency of the metallized substrate can be improved by this. However, such shields are not absolutely necessary. To remove the metal that may have been deposited on the drum connected to the cathode, In all practical examples, it is preferred not to be in contact with the structured or full-surface substrate on the substrate, and the rollers are anodically connected to the m-anode connection, and the metal previously deposited on the roller is again removed therefrom. It is also possible to remove the material deposited on the drum from it during the operation period. The cathode connection roller can also be cleaned by taking the roller out of the electrolyte bath. However, because the rollers are arranged in series, this is only t can not be used to cover the substrate. If the right cathode connection roller is arranged on a rotating shaft, it is possible to remove and clean the cathode connectable rollers that do not touch the substrate. The method according to the invention for electrolytically plating a structured or full-surface substrate on a substrate and the device according to the invention are suitable, for example, for producing conductor tracks on a printed circuit board. The printed circuit boards are, for example, Printed circuit board with multiple layers of inner and multi-layer outer layers, on-board microchannel wafers, flexible and rigid printed circuit boards, and for example mounted on such as computers, telephones, televisions, electric vehicle components, keyboards, radios, video, CDs , CD-ROM and DVD players, game consoles, measurement and adjustment equipment, sensors, 125702.doc •31 · 200829726 in kitchen electrical equipment, electric toys, etc. Conductive on flexible circuit support The structure may also be plated by the method according to the invention. The flexible circuit supports are, for example, plastic films made of the above-mentioned materials for the support for printing the conductive structures thereon. Furthermore, the method according to the invention and the device according to the invention are suitable for generating RFID antennas, transponder antennas or other antenna structures, wafer card modules, flat cables, Bit heaters, foil conductors, solar cells or in LCD / plasma screen conductor of the executors, capacitors, foil capacitors, resistors, for

流器或電熔絲。舉例而言，二維或三維模製互連裝置亦可藉由根據本發明之方法來產生。此外可此產生具有用於有機電子組件之接點的天線，以及在由不導電材料組成之表面上產生用於電磁屏蔽之塗層0 此外’可能在用於應用於燃料電池中之雙極板之流場的情形下使用。根據本發明之方法及根據本發明之裝置的應用範圍允許金屬化、甚至不導電基板之不昂貴生產，該等基板尤其料交換ϋ及感_、f_射吸收器或氣體障壁或裝飾部件，尤其是用於機動車輛、衛生、玩且、家庭及辦公區域及封裝以及_之裝飾部件。本發明亦可應用於銀行鈔票、信用卡、身份證件等之安㈣刷之領域。可藉 Π:本發明之方法使織物電性地且磁性地功能化(天、、良傳輸态、RFID及應答器天線、感測5! . ^ 靜電（甚至用於塑膠）、屏蔽罩等）。一 D 口，、、^件、抗此外，可能產生整合電子組件上之接觸點或接觸墊或互 125702.doc -32 - 200829726 連件。根據本發明之方法及根據本發明之裝置可同樣地用於 (例如）在印刷電路板、RFID天線或應答器天線、扁平電纜、目標在於穿過接觸印刷電路板上側及下側之箔導體中之孔、通道、盲孔等的金屬化。當使用其他基板時，此亦得到應用。根據本發明設計之裝置中所產生或藉由根據本發明之方法所產生之金屬化製品_若其包含可磁化金屬-則亦可用於可磁化功能部件領域，諸如磁性台、磁性遊戲、（例如）冰箱門上之磁性表面。其亦可用於良好熱導率有利之領域，例如用於座位加熱器之箔、地板加熱及絕緣材料。根據本發明f解鑛覆之表面之較佳用途為裏面以此種方式產生之產品係用作印刷電路板、RFID天線、應答器天線、座位加熱器、扁平電纜、無接點晶片卡、在一側或兩側包層之薄金屬荡或聚合物支撐件、料體、太陽電池中或CD/電水螢幕中之導體執道或用作裝飾應用（例如，用於封裝材料）的彼等用途洋吕之’根據本發明之方法及根據本發明之裝置可用於電解錢覆經個別化之板，例如印刷電路板。、可陰極連接滾筒之尺寸及滾筒至滾筒之距離係由待均— 電鑛之最小結構長度指示。待電鍵之最小結構長小，應選擇之兩個滚筒之間的距離愈小，且因此滚筒= 亦愈小。仅將在下文藉助於圖式更詳細地被解釋。該等圖式 125702.doc -33- 200829726 分別以實例之形式展示僅-個可能之實施例。不同於所提及之實施例，本發明亦可自然地以其他實施例或以此等實施例之組合來實施。【實施方式】圖1展示一具有串聯地連接之相互對置之滾筒的根據本發明設計之裝置。一根據本發明設計之電解鍍覆裝置i包含可陰極連接之滾筒2。在此處所表示之實施例中，三個滚筒2分別串聯地連接且兩個滾筒2分別彼此面對。滾筒2位於一槽3中。槽3含有一電解質溶液5。電解質溶液之組合物視意欲使鍍覆發生之材料而定。通常，藉由電解方法塗覆一金屬塗層。可藉由電解鍍覆沈積之習知金屬為（例如）金、鎳、鈀、鉑、銀、錫、銅或鉻。然而，原則上’比基層之最不貴金屬貴或與其同樣貴之所有金屬可用於該電解鍍覆。若需要，則待鍍覆之基板亦可接連穿過複數個裝置。若必要，則在此種狀況下，基板上之基層可甚至接連地用不同金屬來鍍覆。電解鍍覆裝置1經供應有基板7，該基板包含一可電解鑛覆之基層9。基層9可經組態以使其為結構化或全表面的。在圖1中所表示之實施例中，基層9為結構化的。此外，在基板7之上側11與基板7之下側13上存在一經電解鍍覆之基層9。具有可電解鍍覆基層9之基板7分別於兩個對置之滾筒2之間饋入穿過。藉由將基板7饋入穿過，其移動方向由一箭頭15表示，滾筒2垂直於基板7之移動方向15移位。在 125702.doc _ 34 · 200829726 一使基板7與基層9接觸之第一滾筒對17之狀況下，起始位置係由虛線表示且接觸後之位置由一實線表示。由於基板7之厚度，第一滾筒對17之上滾筒上升且第一滾缚對1 7之下滾筒降低。作為此移動之結果，第一滾筒對 1 7之滚筒2分別由一滑動接點丨9接觸。經由滑動接點丨9，第一滾筒對17之滾筒2經陰極地連接。作為滾筒2與基板7 上之基層9接觸之結果，基層9亦陰極地連接。金屬自電解質溶液5沈積於基層9上。為使僅少許或較佳無金屬沈積於經陰極地連接之滾筒2 上，滾筒2分別藉由屏蔽罩21而封閉。屏蔽罩幻大體上防止電解質溶液到達滚筒2之表面。為使滾筒保持可旋轉且可徑向移位，較佳地，彈性凸緣23形成於屏蔽罩上。當一滾筒對之兩個滾筒之間不存在基板時，如（例如）第二滾筒對25或第三滾筒對27之狀況，彈性凸緣23較佳對滾筒2施加壓力。一旦具有基層9之基板7已於一滾筒對17之兩個對置滾筒2之間饋入穿過_如圖丨中對於第一滾筒對丨7所表示_ 彈丨生凸緣23較佳分別對基板7之上側丨丨或下侧13施加壓力。藉此閉合一在基板7與屏蔽罩21之間的間隙。無電解質溶液可到達滾筒2。因此，無金屬可類似地自電解質溶液沈積於滾筒2上。、作為彈性凸緣23之替代方案，亦可能提供—具有一彈性表面之滾筒’其—方面接觸滚筒2之表面且另-方面接觸屏蔽罩27或基板7。在此處所表示之實施例中，一陽極29分別固持於兩個屏 125702.doc -35- 200829726 蔽罩21之間。陽極29較佳經設計為—柵格陽極。因為電解貝洛液5中金屬離子之濃度因金屬沈積於可電解鍍祕層9上而減小，較佳可能供應新電解質溶液。舉 J而。右陽極29經設計為柵格陽極，則可能經由如圖1 中由前頭31所表示之陽極29來供應電解質溶液。沿著陽極 29供應電解質溶液具有將新電㈣溶液傳遞至；衰筒2之間的中間區域中的優勢。由於(例如)如圖i中所表示當無基板 7於滾筒之間饋入穿過時彼此觸碰且否則接觸基板7之滾筒的疋位，有可能僅交換在兩個分別鄰近之滾筒之間的中間空間中之電解質溶液具有巨大困難。作為替代方案，亦可能在陽極29中形成通道，電解質溶液穿過該等通道而傳遞。在此種狀況下，不必將陽極29設計為栅格電極。藉由在方向15上移動基板7，個別滾筒對17、25、27由基板7上之基層9接連地接觸。基板7饋入穿過之滾筒對 17、25、27分別由相應滑動接點19接觸。滚筒2係串聯地連接之事實使待鍍覆之基層9與一經陰極地連接之電極的接觸時間增加，該電極此處設計為滾筒2。可沈積一較厚層。基板7係（例如）藉由驅動滚筒對17、25、27之個別滾筒2 而傳送穿過滾筒對17、25、27之間。作為替代方案，可驅動滾筒對17、25、27之所有滾筒2。然而，較佳分別驅動位於基板7之同一側上之滚筒2。因此，舉例而言，可驅動基板7之下側13上之滾筒2或基板7之上側11上的滾筒2。 125702.doc -36 - 200829726 2上1Λ2Γ 罩㈣有少量金屬沈積於滾筒 2上’則滚缚2可經移除或陽極地連接而陽極連接可（例如）藉由陽極地連接滑動接點Μ且將^不^ ::基層之基板饋入穿過該裝置來進行，以使滾筒2接著接觸經陽極地連接之滑動接點19。圖2表示根據本發明之裝置之—第：實施例。 ΓCurrent or electric fuse. For example, a two-dimensional or three-dimensional molded interconnection device can also be produced by the method according to the invention. Furthermore, it is possible to produce an antenna having a contact for an organic electronic component, and to produce a coating for electromagnetic shielding on a surface composed of a non-conductive material. Furthermore, it may be used in a bipolar plate for use in a fuel cell. Used in the case of the flow field. The method according to the invention and the scope of application of the device according to the invention allow for the inefficient production of metallized, even non-conductive substrates, which are especially intended to exchange enthalpy and sensitivities, or gas barriers or decorative elements, Especially for motor vehicles, sanitary, play, home and office areas and packaging and decorative parts. The invention can also be applied to the field of banknotes, credit cards, identity documents, etc. The method of the present invention allows the fabric to be electrically and magnetically functionalized (days, good transmission states, RFID and transponder antennas, sensing 5! . ^ electrostatic (even for plastics), shields, etc.) . A D port, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The method according to the invention and the device according to the invention can likewise be used, for example, in printed circuit boards, RFID antenna or transponder antennas, flat cables, foil conductors intended to pass through the side and underside of the contact printed circuit board Metallization of holes, channels, blind holes, and the like. This also applies when other substrates are used. A metallized article produced in accordance with the method of the present invention or produced by the method according to the invention, if it comprises a magnetizable metal, can also be used in the field of magnetizable functional components, such as magnetic tables, magnetic games, (eg The magnetic surface on the refrigerator door. It can also be used in areas where good thermal conductivity is advantageous, such as foils for seat heaters, floor heating and insulation. A preferred use of the surface of the demineralized coating according to the present invention is that the product produced in this manner is used as a printed circuit board, an RFID antenna, a transponder antenna, a seat heater, a flat cable, a contactless wafer card, Thin metal slabs on one or both sides of the cladding or polymer supports, bodies, conductors in solar cells or CD/electric water screens or used as decorative applications (eg for packaging materials) The use of the method according to the invention and the device according to the invention can be used for electrolysis of individual coated panels, such as printed circuit boards. The size of the cathode connectable drum and the distance from the drum to the drum are indicated by the minimum structural length of the electric-to-mine. The minimum structure length of the key to be used is smaller, and the smaller the distance between the two rollers to be selected, and therefore the smaller the drum =. It will only be explained in more detail below with the aid of the drawings. The figures 125702.doc -33- 200829726 show only a possible embodiment in the form of an example. The present invention may be naturally practiced in other embodiments or combinations of the embodiments, in addition to the embodiments described. [Embodiment] Figure 1 shows a device according to the invention having a mutually opposed drum connected in series. An electrolytic plating apparatus i designed in accordance with the present invention comprises a drum 2 which is connectable to the cathode. In the embodiment shown here, the three rollers 2 are respectively connected in series and the two rollers 2 respectively face each other. The drum 2 is located in a tank 3. The tank 3 contains an electrolyte solution 5. The composition of the electrolyte solution is intended to be the material from which the plating takes place. Typically, a metal coating is applied by an electrolytic method. A conventional metal which can be deposited by electrolytic plating is, for example, gold, nickel, palladium, platinum, silver, tin, copper or chromium. However, in principle, all metals which are more expensive than the least precious metal of the base layer or which are equally expensive may be used for the electrolytic plating. If desired, the substrate to be plated can also be passed through a plurality of devices. If necessary, in this case, the base layer on the substrate can be plated with different metals even in succession. The electrolytic plating apparatus 1 is supplied with a substrate 7, which comprises an electrolytically-depositable base layer 9. The base layer 9 can be configured to be structured or full surface. In the embodiment shown in Figure 1, the base layer 9 is structured. Further, an electrolytically plated substrate 9 is present on the upper side 11 of the substrate 7 and the lower side 13 of the substrate 7. The substrate 7 having the electrolessly plated substrate 9 is fed through between the two opposed rolls 2, respectively. By feeding the substrate 7 therethrough, its moving direction is indicated by an arrow 15, and the drum 2 is displaced perpendicularly to the moving direction 15 of the substrate 7. In the case of a first roller pair 17 which causes the substrate 7 to be in contact with the base layer 9 in the case of 125702.doc _ 34 · 200829726, the starting position is indicated by a broken line and the position after the contact is indicated by a solid line. Due to the thickness of the substrate 7, the roller above the first roller pair 17 is raised and the first roller pair is lowered below the roller. As a result of this movement, the rollers 2 of the first roller pair 17 are respectively contacted by a sliding contact 丨9. The drum 2 of the first roller pair 17 is connected via a cathode via a sliding contact 丨9. As a result of the contact of the drum 2 with the base layer 9 on the substrate 7, the base layer 9 is also cathode-connected. A metal self-electrolytic solution 5 is deposited on the base layer 9. In order to deposit only a little or preferably no metal on the cathode-connected drum 2, the drum 2 is closed by a shield 21, respectively. The shield phantom substantially prevents the electrolyte solution from reaching the surface of the drum 2. In order to keep the drum rotatable and radially displaceable, preferably, the resilient flange 23 is formed on the shield. When there is no substrate between the two rollers of a pair of rollers, such as, for example, the condition of the second roller pair 25 or the third roller pair 27, the resilient flange 23 preferably applies pressure to the roller 2. Once the substrate 7 having the base layer 9 has been fed through between the two opposed rollers 2 of a pair of rollers 17, as indicated by the first roller pair 7 in the figure _, the elastic flanges 23 are preferably respectively separated. Pressure is applied to the upper side or the lower side 13 of the substrate 7. Thereby, a gap between the substrate 7 and the shield case 21 is closed. The electroless solution can reach the drum 2. Therefore, no metal can be similarly deposited on the drum 2 from the electrolyte solution. As an alternative to the resilient flange 23, it is also possible to provide a roller having a resilient surface which in contact with the surface of the drum 2 and which otherwise contacts the shield 27 or the substrate 7. In the embodiment shown herein, an anode 29 is held between the two screens 125702.doc-35-200829726, respectively. The anode 29 is preferably designed as a grid anode. Since the concentration of the metal ions in the electrolyzed belo solution 5 is reduced by the deposition of the metal on the electroplatable secret layer 9, it is preferable to supply a new electrolyte solution. J. The right anode 29 is designed as a grid anode, and it is possible to supply the electrolyte solution via the anode 29 as indicated by the front head 31 in FIG. Supplying the electrolyte solution along the anode 29 has the advantage of transferring the new electric (tetra) solution to the intermediate region between the failure cartridges 2. Since, for example, as shown in Fig. i, when no substrate 7 is touched between the rollers, and the cylinders of the substrate 7 are otherwise touched, it is possible to exchange only between the two adjacent rollers. The electrolyte solution in the intermediate space has great difficulty. Alternatively, it is also possible to form channels in the anode 29 through which the electrolyte solution is passed. In this case, it is not necessary to design the anode 29 as a grid electrode. By moving the substrate 7 in the direction 15, the individual roller pairs 17, 25, 27 are successively contacted by the base layer 9 on the substrate 7. The pair of rollers 17, 25, 27 through which the substrate 7 is fed are respectively contacted by the respective sliding contacts 19. The fact that the drums 2 are connected in series increases the contact time of the substrate 9 to be plated with a cathode-connected electrode, which is here designed as a drum 2. A thicker layer can be deposited. The substrate 7 is conveyed between the pair of rollers 17, 25, 27, for example, by driving individual rollers 2 of the pair of rollers 17, 25, 27. Alternatively, all of the rollers 2 of the pair of rollers 17, 25, 27 can be driven. However, it is preferable to drive the drum 2 on the same side of the substrate 7, respectively. Thus, for example, the drum 2 on the lower side 13 of the substrate 7 or the drum 2 on the upper side 11 of the substrate 7 can be driven. 125702.doc -36 - 200829726 2Upper 1Λ2Γ Cover (4) A small amount of metal is deposited on the drum 2' then the shackle 2 can be removed or anodically connected and the anodic connection can be, for example, connected to the sliding joint by means of an anode The substrate of the substrate is fed through the device such that the roller 2 then contacts the sliding contact 19 that is connected via the anode. Figure 2 shows a first embodiment of the device according to the invention. Γ

在圖2中所表示之實施例中，可陰極連接滾筒2排列於一可凝轉軸41上。然㈣圖4所表示之實施例中不同，圖2中所表示之實施例中’―具有一基層9形成於上面之基板7可僅在—侧得龍覆。如圖丨中所表示之實施例中，滚筒2係藉由具有彈性凸緣23形成於上面之屏蔽罩η來封閉。具有待電解鍍覆之基層9之基板7係沿著裝置1饋入。 ^少一個滾筒2藉㈣觸基層9。作為滾筒2與基層9接觸之結果，基層9變為陰極地連接。金屬沈積於基層9上。如在圖1中所表示之實施例中以及在圖2中所表示之實施例中，僅使表面11接觸基層9之滚筒2經陰極地連接。上面排列滾筒2之可旋轉軸41較佳經設計為一空心軸。在軸41内部，存在一陽極43。為移除可能已沈積於滾筒2上之金屬，不與基層9接觸之彼等滾筒2可陽極地連接。較佳地，最遠離待鍍覆之基層9 之彼等滾筒2係陽極地連接。陽極連接滾筒在圖2中係以參考符號45提供。乂陽極連接滾筒45較佳面對使得電流可能流動之陰極47。為避免短路，較佳在陽極43與陽極連接滾筒45之間存在 125702.doc -37- 200829726 屏敝罩49。不正接觸基層9且不陰極地連接之彼等滾筒2較佳為中性的。此等滾筒可由屏蔽罩51覆蓋。作為提供陽極連接滾筒45用於清潔之實施例變體的替代方案，亦可能將不與基層9接觸之滾筒2移除且在裝置丄外部清潔。然而，若建議使用陽極連接滾筒45用於清潔，則較佳整個裝置1由電解質溶液5覆蓋。在移除滚筒2用於清潔之實施例中，足以使基板7之表面u由電解質溶液覆蓋。不接觸基板7之上側11上之基層9的彼等滾筒2可位於電解貝溶液外部。儘管如此，必須使陽極43同樣地位於電解吳溶液5中。然而，在此種狀況下，陽極43亦可能位於軸41外部，而非位於如圖2中所表示之設計為一空心軸之軸41内部。【圖式簡單說明】圖1展不一具有串聯地連接之相互對置之滾筒的根據本發明設計之裝置。圖2展示一根據本發明設計之裝置，其中可陰極連接滾筒排列於一可旋轉軸上。【主要元件符號說明】 1 電解鍍覆裝置 2 滾筒 3 槽 5 電解質溶液 7 基板 125702.doc -38· 200829726 9 基層 11 上側 13 下側 15 移動方向 17 第一滾筒對 19 滑動接點 21 屏蔽罩 23 彈性凸緣 25 第二滾筒對 27 第三滾筒對 29 陽極 31 電解質供應 41 軸 43 陽極 45 陽極連接滾筒 47 陰極 49 屏蔽罩 51 屏蔽罩 125702.doc •39-In the embodiment shown in Fig. 2, the cathode connectable roller 2 is arranged on a condensable shaft 41. However, in the embodiment shown in Fig. 4, in the embodiment shown in Fig. 2, the substrate 7 having a base layer 9 formed thereon can be covered only on the side. In the embodiment shown in Fig. ,, the drum 2 is closed by a shield η having an elastic flange 23 formed thereon. A substrate 7 having a base layer 9 to be electrolytically plated is fed along the apparatus 1. ^ One less roller 2 borrows (four) touches the base layer 9. As a result of the contact of the drum 2 with the base layer 9, the base layer 9 is connected to the cathode. Metal is deposited on the base layer 9. As in the embodiment shown in Fig. 1 and in the embodiment shown in Fig. 2, only the drum 2, which has the surface 11 in contact with the substrate 9, is cathode-connected. The rotatable shaft 41 on which the drum 2 is arranged is preferably designed as a hollow shaft. Inside the shaft 41, there is an anode 43. In order to remove the metal which may have been deposited on the drum 2, the rollers 2 which are not in contact with the substrate 9 may be anodically connected. Preferably, the rollers 2, which are furthest from the base layer 9 to be plated, are anodically connected. The anode connection drum is provided in Figure 2 with reference numeral 45.阳极 The anode connection roller 45 preferably faces the cathode 47 which allows current to flow. To avoid short circuits, it is preferred to have a 125702.doc -37-200829726 screen cover 49 between the anode 43 and the anode connection drum 45. The rollers 2 which are not in contact with the base layer 9 and are not cathode-connected are preferably neutral. These rollers can be covered by the shield 51. As an alternative to providing an embodiment variant of the anode connection drum 45 for cleaning, it is also possible to remove the drum 2 which is not in contact with the substrate 9 and to clean the outside of the apparatus. However, if it is recommended to use the anode connecting roller 45 for cleaning, it is preferred that the entire apparatus 1 be covered by the electrolyte solution 5. In the embodiment in which the roller 2 is removed for cleaning, it is sufficient to cover the surface u of the substrate 7 with the electrolyte solution. The rollers 2 which do not contact the base layer 9 on the upper side 11 of the substrate 7 may be located outside the electrolytic solution. Nevertheless, the anode 43 must be placed in the electrolytic solution 5 as such. However, in this case, the anode 43 may also be located outside the shaft 41 rather than inside the shaft 41 designed as a hollow shaft as shown in Fig. 2. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a device according to the present invention having mutually opposed rollers connected in series. Figure 2 shows a device designed in accordance with the present invention in which the cathode connectable rollers are arranged on a rotatable shaft. [Main component symbol description] 1 Electrolytic plating device 2 Drum 3 Slot 5 Electrolyte solution 7 Substrate 125702.doc -38· 200829726 9 Base layer 11 Upper side 13 Lower side 15 Moving direction 17 First roller pair 19 Sliding contact 21 Shield 23 Elastic flange 25 second roller pair 27 third roller pair 29 anode 31 electrolyte supply 41 shaft 43 anode 45 anode connection roller 47 cathode 49 shield 51 shield 125702.doc • 39-

Claims

200829726 X. Patent application scope: A device for electrolytically plating a structured or full-surface base layer (9) on the surface of a substrate (7), comprising at least one electrolyte bath () to; an electrolyte The trough has at least one rotatable mounting drum (2) that can be connected as a cathode, the at least one drum contacting the base layer (9) during the electrolytic plating, the base layer (9) being contained in the electrolyte tank ( The electrolyte solution (5) in 3\ is covered and moved relative to the day-to-day drum (2) during the plating, wherein the at least one roller (2) which can be connected as a cathode is in contact with the base layer (9) During the contact, the cathode is connected, and the substrate is connected to the substrate (9) in a neutral or anode manner. 2. The device of claim 1, wherein the cathode can be connected as a cathode. A drum (2) is statically held in the electrolyte tank (7), and the substrate (7) having the base layer (9) is conveyed through the electrolyte tank (3).

3. A device according to the invention, wherein at least two rollers (2) which can be connected as a cathode are connected in series in the electrolyte tank (3). 4. The apparatus of claim 1, wherein the rollers (7) substantially prevent electrolysis f solution (5) from being transferred to the surfaces of the rollers (2) by means of a shield (21) (4) shield. A device according to claim 4, wherein a gap is formed between the shield (9) and the surface of the substrate (7). The device of claim 5, wherein the gap between the shield (21) and the "face" of the substrate (7) is closed by the -elastic flange (23). 7. If request 5 > ^ , , the device, wherein the gap between the shield (21) and the substrate (7) 125702.doc 200829726 «Hai surface is sealed by a roller having a resilient surface. 8·如靖In the device of the crucible, an anode is held between the shields (21) which can serve as a cathode of the two rollers (7). The length 8 is disposed, wherein the anode (29) is designed as a A device of the invention, wherein the electrolyte solution is transferable between two shields (21) in the region of the anode (29). The power supply to the drums (2), which can be connected as a cathode, takes place via a sliding contact (19). 12. The apparatus of claim 11, wherein the drums (2) can be connected as a cathode Pressing the sliding contact (19) by the substrate (7). 13. The device of claim 1, wherein the two rollers (2) Don't face each other, and the substrate (7) is fed in between so that a base layer can be simultaneously plated on the upper side (11) and the lower side (13) of the substrate (7). Device 1 wherein the transfer device faces the rollers (2), the transfer device transports the substrate (7) along the rollers (2). 15. The device of claim 1 wherein it can be used as a cathode connection The drums (2) are arranged on the circumference of a rotating shaft (41). The apparatus of claim 15, wherein the rotating shaft (41) is designed as a hollow shaft in which at least one anode is arranged. (43) A method for electrolytically plating a structured or full-surface base layer (9) on a surface of a substrate (7) which is wound by an electrolyte solution (5) At least one roller (7) that can be connected as a cathode is connected to 125702.doc 200829726. The roller (7) which can be used as a cathode connection is connected through the cathode when it contacts the base layer (9) and/or the substrate (7), and once Contact with: 曰 () and / or β Hai substrate (7) is neutral or anode connected for removal The method of claim 17, wherein the method of claim 17, wherein after the first electrolytic bonding process, the plate () (10) is rotated perpendicular to the axis of the surface to be plated, and then subjected to an electrolytic plating again. 19. The device of claim 1 or the method of claim 17, for producing a conductor track on a printed circuit board, an RFm antenna, a transponder antenna or other antenna structure, a chip card module, a flat cable , conductors in seat heaters, box conductors, solar cells, or LCD/plasma screens, used to create enamel or functional surfaces for screen electromagnetic radiation, for heat conduction, or as a packaged product. , & used to produce # 形式形式形式实施实施实施实施实施实施实施实施 203 ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° Conductor tracks in card modules, flat electrical windings, seat heaters, box conductors, solar cells or LCD/plasma screens for the production of products for shielding electromagnetic radiation, for heat conduction or for packaging Or functional surface, or to produce any form of electrolytic plating products. 125702.doc