[go: up one dir, main page]

TW200617603A - Silsesquioxane-containing compound and method for preparing the same - Google Patents

Silsesquioxane-containing compound and method for preparing the same

Info

Publication number
TW200617603A
TW200617603A TW094124856A TW94124856A TW200617603A TW 200617603 A TW200617603 A TW 200617603A TW 094124856 A TW094124856 A TW 094124856A TW 94124856 A TW94124856 A TW 94124856A TW 200617603 A TW200617603 A TW 200617603A
Authority
TW
Taiwan
Prior art keywords
silsesquioxane
compound
meth
containing compound
acrylic ester
Prior art date
Application number
TW094124856A
Other languages
Chinese (zh)
Other versions
TWI413864B (en
Inventor
Yoshiaki Horiuchi
Shingo Kanaya
Original Assignee
Nagase Chemtex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagase Chemtex Corp filed Critical Nagase Chemtex Corp
Publication of TW200617603A publication Critical patent/TW200617603A/en
Application granted granted Critical
Publication of TWI413864B publication Critical patent/TWI413864B/en

Links

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Silicon Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

There is provided a silsesquioxane-containing compound which can impart various desired functions such as photopolymerization, alkali solubility and weatherability and is suitable for a radiation-sensitive resin having characteristics of silicon resins such as transparency and heat resistance. The silsesquioxane-containing compound is obtained by the cocondensation of a copolymer of (A) a (meth)acrylic ester having a trialkoxysilyl group in the molecule and at least one of a (meth)acrylic ester having a functional group capable of imparting alkali solubility as a substituent and a (meth)acrylic ester having a functional group capable of imparting heat resistance as a substituent with a trialkoxysilane compound (C') having a carbon-carbon double bond in the molecule. The radiation-sensitive resin uses the compound. A method for producing the compound comprises performing the radical copolymerization of vinyl monomers and successively performing the cocondensation with a trialkoxysilane.
TW094124856A 2004-08-03 2005-07-22 Silsesquioxane-containing compound and method for preparing the same TWI413864B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004226978A JP4517229B2 (en) 2004-08-03 2004-08-03 Silsesquioxane-containing compound and method for producing the same

Publications (2)

Publication Number Publication Date
TW200617603A true TW200617603A (en) 2006-06-01
TWI413864B TWI413864B (en) 2013-11-01

Family

ID=36024281

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124856A TWI413864B (en) 2004-08-03 2005-07-22 Silsesquioxane-containing compound and method for preparing the same

Country Status (3)

Country Link
JP (1) JP4517229B2 (en)
KR (1) KR101196146B1 (en)
TW (1) TWI413864B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9796878B2 (en) 2012-12-26 2017-10-24 Industrial Technology Research Institute Coating composition, film prepared from the coating composition, and method for preparing the coating composition
TWI606101B (en) * 2016-12-28 2017-11-21 財團法人工業技術研究院 Coating composition and method of manufacturing the same

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4618512B2 (en) * 2005-03-08 2011-01-26 Dic株式会社 UV curable resin compositions, UV curable paints and painted products.
TWI394801B (en) 2005-03-08 2013-05-01 Dainippon Ink & Chemicals Uv-curable resin composition, uv-curable paint and coated article
DE102006032077A1 (en) * 2006-07-11 2008-01-17 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Hybrid polymer materials by copolymerization
JP4885742B2 (en) * 2007-01-05 2012-02-29 昭和電工株式会社 Photosensitive resin composition
JP4896755B2 (en) * 2007-02-01 2012-03-14 東京応化工業株式会社 Composition for forming flattening insulating film for liquid crystal display element and method for producing flattening insulating film for liquid crystal display element
JP5135820B2 (en) * 2007-02-20 2013-02-06 Jsr株式会社 Alkali-soluble polymer, radiation-sensitive composition for forming colored layer, color filter, and liquid crystal display device
EP2133744B1 (en) 2007-04-04 2011-07-13 Asahi Kasei E-materials Corporation Photosensitive resin composition
JP4899100B2 (en) * 2007-05-29 2012-03-21 ナガセケムテックス株式会社 Photosensitive composition
JP4938571B2 (en) * 2007-07-11 2012-05-23 旭化成イーマテリアルズ株式会社 Photosensitive resin composition
KR100936998B1 (en) * 2007-10-19 2010-01-15 에스화인켐 주식회사 Photosensitive polysilsesquioxane resin composition and pattern formation method of a thin film using the same
KR100930671B1 (en) * 2007-12-20 2009-12-09 제일모직주식회사 Photosensitive resin composition for color filters and color filter using same
US8138274B2 (en) * 2009-12-08 2012-03-20 Le Centre National De La Recherche Scien Process for preparation of fluorosilicon polymer
JP5515714B2 (en) * 2009-12-16 2014-06-11 Jsr株式会社 Coloring composition, color filter and color liquid crystal display element
JP6032461B2 (en) * 2011-03-30 2016-11-30 Dic株式会社 Photoresist material and method for forming photoresist film
JP5983151B2 (en) * 2011-07-29 2016-08-31 Dic株式会社 Dry etching resist material, resist film and patterned product
TW201418333A (en) * 2012-10-15 2014-05-16 Dainippon Ink & Chemicals Heat resistance material and heat resistance component
US11506979B2 (en) * 2016-12-14 2022-11-22 Rohm And Haas Electronic Materials Llc Method using silicon-containing underlayers
US11708470B2 (en) 2016-12-21 2023-07-25 Ppg Industries Ohio, Inc. Plastic substrate adhesion promoter with random copolymer
JP7152749B2 (en) * 2018-07-23 2022-10-13 小西化学工業株式会社 Polysilsesquioxane and method for producing the same
JP2020084105A (en) * 2018-11-29 2020-06-04 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Acrylic polymerized polysiloxane, composition containing the same, and cured film using the same
KR102377031B1 (en) * 2019-04-17 2022-03-22 단국대학교 산학협력단 pH sensitive drug delivery system using Poly acrylic acid-graft- Polyhedral oligomeric silsesquioxane
JP2021026029A (en) 2019-07-31 2021-02-22 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH Negative type photosensitive composition

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3070205B2 (en) * 1991-11-19 2000-07-31 ジェイエスアール株式会社 Composition for coating
JP3502495B2 (en) * 1996-01-11 2004-03-02 株式会社日本触媒 Organic-inorganic composite particles, production method and use thereof
JP4096364B2 (en) * 1995-12-06 2008-06-04 大日本インキ化学工業株式会社 Manufacturing method of composite resin
JPH09241538A (en) * 1996-03-06 1997-09-16 Shin Etsu Chem Co Ltd Powder paint
EP1004936B1 (en) * 1997-08-14 2003-10-08 Showa Denko K K Resist resin, resist resin composition, and process for patterning therewith
DE69813144T2 (en) * 1997-11-07 2003-12-04 Rohm & Haas Plastic substrates for use in electronic display systems
JP3984701B2 (en) * 1998-04-24 2007-10-03 岡本化学工業株式会社 Photosensitive composition for planographic printing plates
JP2001092129A (en) * 1999-09-24 2001-04-06 Toshiba Corp UV curable resin composition
JP3457232B2 (en) * 1999-10-19 2003-10-14 大日本塗料株式会社 Aqueous organic-inorganic composite resin emulsion, method for producing the same, and two-pack coating composition
JP2001125264A (en) * 1999-10-25 2001-05-11 Toagosei Co Ltd Curable composition
JP4447753B2 (en) * 2000-08-11 2010-04-07 株式会社カネカ Curable composition containing block copolymer
JP4846177B2 (en) * 2002-02-27 2011-12-28 三菱化学株式会社 ORGANIC-INORGANIC COMPOSITE, PROCESS FOR PRODUCING THE SAME, ACTIVE ENERGY RAY CURABLE COMPOSITION USING THE SAME, AND CURED FILM-FORMED ARTICLE
JP2003262955A (en) * 2002-03-08 2003-09-19 Toagosei Co Ltd Curing composition for etching resist
JP4718114B2 (en) * 2003-11-17 2011-07-06 信越化学工業株式会社 Silicon-containing polymer compound, resist material, and pattern forming method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9796878B2 (en) 2012-12-26 2017-10-24 Industrial Technology Research Institute Coating composition, film prepared from the coating composition, and method for preparing the coating composition
TWI606101B (en) * 2016-12-28 2017-11-21 財團法人工業技術研究院 Coating composition and method of manufacturing the same
US10457837B2 (en) 2016-12-28 2019-10-29 Industrial Technology Research Institute Coating composition and method of preparing the same

Also Published As

Publication number Publication date
JP2006045316A (en) 2006-02-16
KR101196146B1 (en) 2012-10-30
KR20060049045A (en) 2006-05-18
JP4517229B2 (en) 2010-08-04
TWI413864B (en) 2013-11-01

Similar Documents

Publication Publication Date Title
TW200617603A (en) Silsesquioxane-containing compound and method for preparing the same
TW200504170A (en) Pressure-sensitive adhesive composition and pressure-sensitive adhesive product
TW200728399A (en) Flame retardant polycarbonate resin composition having good impact, high heat resistance
EP1106649A4 (en) IMPACT MODIFIER, METHOD FOR THE PRODUCTION AND RESIN COMPOSITION THAT CONTAINS THESE
EP0373662A3 (en) Photopolymerizable liquid composition, viscoelastic product obtained from the composition, and process for producing the viscoelastic product
EP0838501A3 (en) Method and compositions for toughening polyester resins
WO2008136435A1 (en) Water-repellant/oil-repellant composition, method for production thereof, and article
ATE553155T1 (en) FLOWABILITY IMPROVER, COMPOSITION CONTAINING AROMATIC POLYCARBONATE RESIN AND MOLDED BODY THEREOF
TW200502262A (en) Curing resin composition and its uses
EP0926214A3 (en) Adhesive composition for display unit intergral with touch panel, adhesive film, display unit integral with touch panel, and production method thereof
ATE384766T1 (en) IMPACT MODIFIED COMPOSITIONS AND METHODS
EP2028220A4 (en) Molded article and method for production thereof
WO2009057980A3 (en) Photochromic compositions and photochromic films
TW200607819A (en) Resin composition comprising styrene-methylmethacrylate copolymer, artificial marble produced using the same, and the process for producing the artificial marble using the same
EP1500682A4 (en) Polyorganosiloxane-containing graft copolymer composition
MX2020010087A (en) Composition and thermoplastic moulding compound for producing mouldings of enhanced gloss.
AU2003206941A1 (en) Hail-resistant acrylic laminated glass and method for producing the same
CA2507623A1 (en) Impact-modified blends
WO2003027191A3 (en) Curable liquid resin composition
ATE407984T1 (en) INKJET INK CURED BY ULTRAVIOLET RADIATION
WO2007063037A3 (en) Method for the reesterification or esterification of side chains in polymers
TW200621818A (en) Optical semiconductor sealing material
ATE418571T1 (en) METHACRYLIC RESIN COMPOSITION
TW200420699A (en) Pressure sensitive adhesive composition and sheet
ATE338782T1 (en) IMPACT MODIFIED COMPOSITIONS AND METHODS

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees