SU1360927A1 - Method of soldering articles with passing current - Google Patents
Method of soldering articles with passing current Download PDFInfo
- Publication number
- SU1360927A1 SU1360927A1 SU864097222A SU4097222A SU1360927A1 SU 1360927 A1 SU1360927 A1 SU 1360927A1 SU 864097222 A SU864097222 A SU 864097222A SU 4097222 A SU4097222 A SU 4097222A SU 1360927 A1 SU1360927 A1 SU 1360927A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- parts
- soldering
- solder
- gap
- quality
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000002269 spontaneous effect Effects 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Изобретение касаетс пайки и относитс к способам капилл рной пайки металлов и сплавов с нагревом зоны соединени проход щим током и может быть использовано в различных отрасл х машиностроени . Дл повышени качества па ных соединений и упроцлени технологического процесса тонколистовые детали собирают внахлестку. Прихватывают точечной сваркой, размещают р дом с зазором припой и пропускают через сварные соединени электриче- - ский ток, подключа источник питани к свободным концам деталей. Выделение тепла концентрируетс в точечных сварных соединени х , и припой затекает в па емый зазор Б благопри тных услови х. 2 ил. SS слThe invention relates to soldering and relates to methods of capillary soldering of metals and alloys with heating of the junction zone by passing current and can be used in various fields of engineering. To improve the quality of the solder joints and to simplify the technological process, thin sheet parts are assembled overlapping. They seize spot welding, place the solder next to the gap, and pass an electric current through the welded joints, connecting the power source to the free ends of the parts. Heat release is concentrated in spot-welded joints, and the solder flows into the soldered gap B under favorable conditions. 2 Il. SS cl
Description
Изобретение относитс к пайке, в частности к способам капилл рной пайки металлов и сплавов с нагревом зоны соединени проход щим током, и. может быть использовано в различных отрасл х машиностроени .The invention relates to soldering, in particular, to methods for the capillary soldering of metals and alloys with heating of the joint zone by passing current, and. can be used in various fields of engineering.
Целью изобретени вл етс повышение качеств а па ных соединений и упрощение технологического процесса.The aim of the invention is to improve the quality of paired compounds and simplify the process.
На фиг. 1 показаны собранные внахлестку детали, приготовленные к пайке; на фиг. 2 многосекционное соединение, па емое за один технологический цикл.FIG. 1 shows the overlapped parts prepared for brazing; in fig. 2 multisection connection, paired in one technological cycle.
Способ осуществл етс следующим образом .The method is carried out as follows.
а равномерный нагрев деталей ведет к снижению дефектов типа пор, непропаев, позвол ет точно регулировать параметры процесса пайки. Размещение припо у входа в па ный зазор исключает дефекты сварной and uniform heating of parts leads to a reduction in pore, non-solder type defects, which allows precise control of the parameters of the soldering process. Placing the solder at the entrance to the gap gap eliminates defects in the welded
Тонколистовые детали 1 и 2 собирают точки и способствует образованию качественвнахлестку и прихватывают точечной сваркой . Припой 3 располагают у входа в па льный зазор. Производ т нагрев, дл чего к свободным концам собранных деталей 1 и 2 подвод т напр жение с помощью контактных устройств. При прохождении электрического тока через изделие выдел етс тепло. Поскольку в сварных точках 4 происходит резкое уменьшение проходного сечени , то с ростом электросопротивлени именно на сварных точках выдел етс основна теплова энерги , что ведет к более быстрому нагреву деталей в области нахлестки, обеспечивающей плавление припо , его затекание в зазор и формиров.ание па ного соединени .Sheet parts 1 and 2 collect points and contribute to the formation of quality overlap and grab by spot welding. Solder 3 is placed at the entrance to the gap. Heat is produced, for which the free ends of the assembled parts 1 and 2 are energized by contact devices. When electric current passes through the product, heat is generated. Since the welded points 4 sharply reduce the flow cross section, with increasing electrical resistance, it is the welded points that produce the main heat energy, which leads to faster heating of parts in the overlap region, which melts the solder, leaks into the gap and forms a solid compounds.
Способ позвол ет па ть многосекционные издели (фиг. 2), в которых даже при неравномерном распределении тепла междуThe method allows the fusion of multi-sectional products (Fig. 2), in which, even with an uneven distribution of heat between
2020
2525
30thirty
ного па ного шва. Создание регулируемой системы позвол ет па ть многосекционные издели , значительно сократив цикл пайки.foot foot seam. The creation of an adjustable system allows multisection products to be welded, significantly reducing the soldering cycle.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU864097222A SU1360927A1 (en) | 1986-07-25 | 1986-07-25 | Method of soldering articles with passing current |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU864097222A SU1360927A1 (en) | 1986-07-25 | 1986-07-25 | Method of soldering articles with passing current |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1360927A1 true SU1360927A1 (en) | 1987-12-23 |
Family
ID=21248880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU864097222A SU1360927A1 (en) | 1986-07-25 | 1986-07-25 | Method of soldering articles with passing current |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1360927A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5568892A (en) * | 1994-06-16 | 1996-10-29 | Lucent Technologies Inc. | Alignment and bonding techniques |
| RU2198770C1 (en) * | 2001-10-29 | 2003-02-20 | Общество с ограниченной ответственностью "Сплитстоун" | Segment of diamond cutting tool |
-
1986
- 1986-07-25 SU SU864097222A patent/SU1360927A1/en active
Non-Patent Citations (1)
| Title |
|---|
| Груздев Б. Л. и др. Повышение прочностных характеристик нахлесточных соединений листовых конструкций, выполн емых контактной сваркой.-Сварочное производство, 1975, № 9, с. 25-27. Патент US № 3141949, кл. 219-85, 1962. Лашко И. Ф., Лашко-Авак н С. В. Пайка металлов.- М.: Машгиз, 1959, с. 240. * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5568892A (en) * | 1994-06-16 | 1996-10-29 | Lucent Technologies Inc. | Alignment and bonding techniques |
| US5700987A (en) * | 1994-06-16 | 1997-12-23 | Lucent Technologies Inc. | Alignment and bonding techniques |
| RU2198770C1 (en) * | 2001-10-29 | 2003-02-20 | Общество с ограниченной ответственностью "Сплитстоун" | Segment of diamond cutting tool |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3860778A (en) | Melt welding by high frequency electrical current | |
| GB1114857A (en) | Welding process using beamed radiant energy | |
| CN107803593A (en) | A kind of high frequency lasers silk filling composite welding apparatus and method | |
| SU1360927A1 (en) | Method of soldering articles with passing current | |
| US3710068A (en) | Preheating of welding slag for better starting | |
| GB191314518A (en) | Method and Apparatus for the Electrical Soldering of Metals. | |
| JPS60130475A (en) | Mig welding method | |
| CN114951869B (en) | A method and device for current-assisted double-beam laser fuse brazing coil butt joints | |
| SU1558588A1 (en) | Method of electric resistance brazing | |
| US3674973A (en) | Laydown electroslag welding process | |
| KR900004596B1 (en) | Manufacturing method of heat exchanger | |
| CN116231413B (en) | Manufacturing method of copper-aluminum composite new energy terminal | |
| JP3098024U (en) | Induction heating hybrid arc welding equipment | |
| SU903017A1 (en) | Electric fusion welding method | |
| SU1731495A1 (en) | Device for contact soldering | |
| SU1237339A1 (en) | Method of soldering sintered metal parts | |
| RU2009806C1 (en) | Method of electric resistance soldering | |
| JPH09234559A (en) | Brazing method and brazing device | |
| SU626905A1 (en) | Method of twin-arc welding of t-joint corner welds | |
| JPH03118976A (en) | Butt welding method for tough pitch copper plates, etc. | |
| SU1252103A1 (en) | Method of soldering tube panel with tubes | |
| JPH1024320A (en) | Manufacturing method of steel pipe | |
| SU556010A1 (en) | The method of contact welding rod with plate | |
| US3912897A (en) | Method and apparatus for welding electrically conductive wires | |
| SU104248A1 (en) | The method of electric fusion welding |