SE9503631D0 - A method for producing a semiconductor device comprising an implantation step - Google Patents
A method for producing a semiconductor device comprising an implantation stepInfo
- Publication number
- SE9503631D0 SE9503631D0 SE9503631A SE9503631A SE9503631D0 SE 9503631 D0 SE9503631 D0 SE 9503631D0 SE 9503631 A SE9503631 A SE 9503631A SE 9503631 A SE9503631 A SE 9503631A SE 9503631 D0 SE9503631 D0 SE 9503631D0
- Authority
- SE
- Sweden
- Prior art keywords
- layer
- semiconductor layer
- producing
- semiconductor device
- implantation step
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/0445—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
- H01L21/0455—Making n or p doped regions or layers, e.g. using diffusion
- H01L21/046—Making n or p doped regions or layers, e.g. using diffusion using ion implantation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
- H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9503631A SE9503631D0 (sv) | 1995-10-18 | 1995-10-18 | A method for producing a semiconductor device comprising an implantation step |
| US08/544,979 US5849620A (en) | 1995-10-18 | 1995-10-30 | Method for producing a semiconductor device comprising an implantation step |
| PCT/SE1996/001206 WO1997015072A1 (en) | 1995-10-18 | 1996-09-27 | A method for producing a semiconductor device comprising an implantation step |
| EP96935659A EP0870323A1 (en) | 1995-10-18 | 1996-09-27 | A method for producing a semiconductor device comprising an implantation step |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9503631A SE9503631D0 (sv) | 1995-10-18 | 1995-10-18 | A method for producing a semiconductor device comprising an implantation step |
| US08/544,979 US5849620A (en) | 1995-10-18 | 1995-10-30 | Method for producing a semiconductor device comprising an implantation step |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE9503631D0 true SE9503631D0 (sv) | 1995-10-18 |
Family
ID=26662399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9503631A SE9503631D0 (sv) | 1995-10-18 | 1995-10-18 | A method for producing a semiconductor device comprising an implantation step |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0870323A1 (sv) |
| SE (1) | SE9503631D0 (sv) |
| WO (1) | WO1997015072A1 (sv) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3629011A (en) * | 1967-09-11 | 1971-12-21 | Matsushita Electric Industrial Co Ltd | Method for diffusing an impurity substance into silicon carbide |
| US3999206A (en) * | 1974-11-04 | 1976-12-21 | Vladimir Alexandrovich Babenko | Semiconductor indicating device and method for production of same |
| US4030942A (en) * | 1975-10-28 | 1977-06-21 | International Business Machines Corporation | Semiconductor masking for device fabrication utilizing ion implantation and other methods |
| US4058413A (en) * | 1976-05-13 | 1977-11-15 | The United States Of America As Represented By The Secretary Of The Air Force | Ion implantation method for the fabrication of gallium arsenide semiconductor devices utilizing an aluminum nitride protective capping layer |
| DE2631873C2 (de) * | 1976-07-15 | 1986-07-31 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines Halbleiterbauelements mit einem Schottky-Kontakt auf einem zu einem anderen Bereich justierten Gatebereich und mit kleinem Serienwiderstand |
| DD221591A1 (de) * | 1983-11-30 | 1985-04-24 | Gera Elektronik Veb | Formierverfahren fuer hochvoltanodenfolie |
| JP3146694B2 (ja) * | 1992-11-12 | 2001-03-19 | 富士電機株式会社 | 炭化けい素mosfetおよび炭化けい素mosfetの製造方法 |
| KR960009013A (ko) * | 1994-08-18 | 1996-03-22 | 김광호 | 타이타늄 나이트라이드(TiN) 게이트전극 형성방법 |
| SE9501312D0 (sv) * | 1995-04-10 | 1995-04-10 | Abb Research Ltd | Method for procucing a semiconductor device |
-
1995
- 1995-10-18 SE SE9503631A patent/SE9503631D0/sv unknown
-
1996
- 1996-09-27 EP EP96935659A patent/EP0870323A1/en not_active Withdrawn
- 1996-09-27 WO PCT/SE1996/001206 patent/WO1997015072A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO1997015072A1 (en) | 1997-04-24 |
| EP0870323A1 (en) | 1998-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE9501312D0 (sv) | Method for procucing a semiconductor device | |
| SE9601174D0 (sv) | A method for producing a semiconductor device having a semiconductor layer of SiC and such a device | |
| SE9501311D0 (sv) | Method for producing a semiconductor device having a semiconductor layer of SiC | |
| SE9501310D0 (sv) | A method for introduction of an impurity dopant in SiC, a semiconductor device formed by the mehtod and a use of a highly doped amorphous layer as a source for dopant diffusion into SiC | |
| TW365068B (en) | Semiconductor device and its manufacturing method | |
| TW356571B (en) | Method of forming stress adjustable insulator film semiconductor device and its fabrication method | |
| CA2015411A1 (en) | Procedure and apparatus for rapid thermal annealing of implanted semiconductors | |
| KR960030316A (ko) | Soi 기판의 제조방법 | |
| TW348300B (en) | Semiconductor device fabrication method and apparatus using connecting implants | |
| CA2050781A1 (en) | Process for preparing semiconductor device | |
| EP0723286A3 (en) | Field-effect transistor and manufacture method thereof | |
| TW349247B (en) | Process for producing semiconductor element | |
| EP0782194A3 (en) | A high voltage breakdown isolation semiconductor device and manufacturing process for making the device | |
| EP0844653A3 (en) | Method for reducing surface layer defects in semiconductor materials having a volatile species | |
| TW373256B (en) | A semiconductor device having discontinuous insulating regions and the manufacturing method thereof | |
| EP1179859A3 (en) | Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device | |
| EP0500130A3 (en) | Method of manufacturing an epitaxial semiconductor wafer having gettering properties | |
| TW335554B (en) | Semiconductor component with compensation implantation and method for production | |
| EP1249862A3 (en) | Semiconductor device and method for forming the same | |
| DE3170497D1 (en) | High electron mobility heterojunction semiconductor device and method of manufacturing | |
| EP0504987A2 (en) | Method of manufacturing a semiconductor device having a semiconductor body with a buried silicide layer | |
| SE9503631D0 (sv) | A method for producing a semiconductor device comprising an implantation step | |
| WO1997036317A3 (en) | A method for producing a semiconductor device having semiconductor layers of sic by the use of an implanting step and a device produced thereby | |
| EP0731500A3 (en) | Method of forming a semiconductor device comprising an oxidation step followed by a heat-treatment step | |
| EP0769810A3 (en) | Bipolar transistor and method of fabricating it |