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PL2165007T3 - Sposób wytrawiania miedzi i regeneracji zużytego roztworu potrawiennego - Google Patents

Sposób wytrawiania miedzi i regeneracji zużytego roztworu potrawiennego

Info

Publication number
PL2165007T3
PL2165007T3 PL08767103T PL08767103T PL2165007T3 PL 2165007 T3 PL2165007 T3 PL 2165007T3 PL 08767103 T PL08767103 T PL 08767103T PL 08767103 T PL08767103 T PL 08767103T PL 2165007 T3 PL2165007 T3 PL 2165007T3
Authority
PL
Poland
Prior art keywords
etching
recovery
spent
copper
etching solution
Prior art date
Application number
PL08767103T
Other languages
English (en)
Inventor
Harald Ottertun
Original Assignee
Sigma Eng Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sigma Eng Ab filed Critical Sigma Eng Ab
Publication of PL2165007T3 publication Critical patent/PL2165007T3/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/04—Solvent extraction of solutions which are liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/04—Solvent extraction of solutions which are liquid
    • B01D11/0446—Juxtaposition of mixers-settlers
    • B01D11/0457—Juxtaposition of mixers-settlers comprising rotating mechanisms, e.g. mixers, mixing pumps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
PL08767103T 2007-07-11 2008-07-07 Sposób wytrawiania miedzi i regeneracji zużytego roztworu potrawiennego PL2165007T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE0701681A SE531697C2 (sv) 2007-07-11 2007-07-11 Etsnings- och återvinningsförfarande
EP08767103.8A EP2165007B1 (en) 2007-07-11 2008-07-07 A method for etching copper and recovery of the spent etching solution
PCT/SE2008/000431 WO2009008801A1 (en) 2007-07-11 2008-07-07 A method for etching copper and recovery of the spent etching solution

Publications (1)

Publication Number Publication Date
PL2165007T3 true PL2165007T3 (pl) 2016-05-31

Family

ID=40228823

Family Applications (1)

Application Number Title Priority Date Filing Date
PL08767103T PL2165007T3 (pl) 2007-07-11 2008-07-07 Sposób wytrawiania miedzi i regeneracji zużytego roztworu potrawiennego

Country Status (8)

Country Link
US (1) US8236189B2 (pl)
EP (1) EP2165007B1 (pl)
JP (1) JP5608078B2 (pl)
KR (1) KR101560704B1 (pl)
CN (1) CN101688315B (pl)
PL (1) PL2165007T3 (pl)
SE (1) SE531697C2 (pl)
WO (1) WO2009008801A1 (pl)

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CN102240814B (zh) * 2010-05-12 2013-09-25 陈卓贤 一种环保型回收线路板蚀刻废液制备超细铜粉的方法
CN102259087B (zh) * 2011-07-20 2013-08-07 上海电力学院 一种具有耐蚀性能的黄铜超疏水表面的制备方法
CN102335651B (zh) * 2011-08-08 2015-12-16 上海电力学院 一种具有耐蚀性能的超疏水表面的黄铜的制备方法
CN102864306B (zh) * 2012-09-26 2014-02-05 东北大学 一种提高水溶液中铜萃取效率的方法
CN102942278A (zh) * 2012-11-22 2013-02-27 长沙铂鲨环保设备有限公司 一种酸性含铜废液的处理方法
CN203741421U (zh) * 2013-12-13 2014-07-30 陶克（苏州）机械设备有限公司 酸性蚀刻液再生设备
EP2927347A1 (en) 2014-04-01 2015-10-07 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
CN104264184A (zh) * 2014-09-12 2015-01-07 上海电力学院 一种从废旧线路板中提取金属铜的方法
CN105077561B (zh) * 2015-08-28 2016-08-31 安徽中烟工业有限责任公司 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法
CN106555055A (zh) * 2015-09-29 2017-04-05 宏齐科技股份有限公司 从含金属废液中回收固态金属的系统及方法
CN106676527B (zh) * 2015-11-06 2019-03-08 库特勒环保科技（苏州）有限公司 一种氯酸钠型酸性蚀刻液离线再生系统
CN106119853A (zh) * 2016-08-05 2016-11-16 励福(江门)环保科技股份有限公司 高效零排放废酸性铜蚀刻液回收及再生系统
CN110770177A (zh) * 2017-08-16 2020-02-07 深圳市柔宇科技有限公司 废液存储装置和湿式蚀刻系统
CN108642518A (zh) * 2018-07-09 2018-10-12 南京舜业环保科技有限公司 一种pcb酸性蚀刻液提取铜的方法及装置
CN110359051B (zh) * 2019-06-18 2020-09-22 龙建国 线路板蚀刻废液循环再利用的方法
WO2021061184A1 (en) * 2019-09-23 2021-04-01 All Green Recycling, Inc. Systems and methods of efficiently recovering precious metals using an alkaline leach, ultrasound, and electrolysis
CN111270239A (zh) * 2020-03-27 2020-06-12 Tcl华星光电技术有限公司 含铜酸性蚀刻液循环再生的方法
CN112813489B (zh) * 2020-12-30 2022-04-29 广东臻鼎环境科技有限公司 一种试剂级二水合氯化铜晶体的制备方法
CN112831784A (zh) * 2020-12-31 2021-05-25 惠州市鸿宇泰科技有限公司 一种酸性蚀刻液及提高其蚀刻精度的控制方法
CN117043395A (zh) * 2021-03-02 2023-11-10 奥特斯奥地利科技与系统技术有限公司 一种处理来自电路板和／或基板制造的蚀刻废弃物介质的方法

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JP2700982B2 (ja) * 1992-11-02 1998-01-21 鶴見曹達株式会社 エッチング処理装置
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Also Published As

Publication number Publication date
CN101688315A (zh) 2010-03-31
SE0701681L (sv) 2009-01-12
KR20100034001A (ko) 2010-03-31
JP2010533242A (ja) 2010-10-21
EP2165007A1 (en) 2010-03-24
EP2165007A4 (en) 2014-08-13
WO2009008801A1 (en) 2009-01-15
HK1141564A1 (en) 2010-11-12
SE531697C2 (sv) 2009-07-07
EP2165007B1 (en) 2015-11-11
JP5608078B2 (ja) 2014-10-15
CN101688315B (zh) 2012-07-25
US8236189B2 (en) 2012-08-07
KR101560704B1 (ko) 2015-10-15
US20110000884A1 (en) 2011-01-06

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