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SE0701681L - Etsnings- och återvinningsförfarande - Google Patents

Etsnings- och återvinningsförfarande

Info

Publication number
SE0701681L
SE0701681L SE0701681A SE0701681A SE0701681L SE 0701681 L SE0701681 L SE 0701681L SE 0701681 A SE0701681 A SE 0701681A SE 0701681 A SE0701681 A SE 0701681A SE 0701681 L SE0701681 L SE 0701681L
Authority
SE
Sweden
Prior art keywords
etching
solution
etching solution
recovery
organic extraction
Prior art date
Application number
SE0701681A
Other languages
English (en)
Other versions
SE531697C2 (sv
Inventor
Harald Ottertun
Original Assignee
Sigma Engineering Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sigma Engineering Ab filed Critical Sigma Engineering Ab
Priority to SE0701681A priority Critical patent/SE531697C2/sv
Priority to PL08767103T priority patent/PL2165007T3/pl
Priority to HK10107988.7A priority patent/HK1141564B/xx
Priority to US12/665,960 priority patent/US8236189B2/en
Priority to KR1020107000541A priority patent/KR101560704B1/ko
Priority to CN2008800241068A priority patent/CN101688315B/zh
Priority to EP08767103.8A priority patent/EP2165007B1/en
Priority to JP2010516004A priority patent/JP5608078B2/ja
Priority to PCT/SE2008/000431 priority patent/WO2009008801A1/en
Publication of SE0701681L publication Critical patent/SE0701681L/sv
Publication of SE531697C2 publication Critical patent/SE531697C2/sv

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/04—Solvent extraction of solutions which are liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/04—Solvent extraction of solutions which are liquid
    • B01D11/0446—Juxtaposition of mixers-settlers
    • B01D11/0457—Juxtaposition of mixers-settlers comprising rotating mechanisms, e.g. mixers, mixing pumps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SE0701681A 2007-07-11 2007-07-11 Etsnings- och återvinningsförfarande SE531697C2 (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SE0701681A SE531697C2 (sv) 2007-07-11 2007-07-11 Etsnings- och återvinningsförfarande
PL08767103T PL2165007T3 (pl) 2007-07-11 2008-07-07 Sposób wytrawiania miedzi i regeneracji zużytego roztworu potrawiennego
HK10107988.7A HK1141564B (en) 2007-07-11 2008-07-07 A method for etching copper and recovery of the spent etching solution
US12/665,960 US8236189B2 (en) 2007-07-11 2008-07-07 Method for etching copper and recovery of the spent etching solution
KR1020107000541A KR101560704B1 (ko) 2007-07-11 2008-07-07 구리를 에칭하고 소모된 에칭 용액을 회수하는 방법
CN2008800241068A CN101688315B (zh) 2007-07-11 2008-07-07 用于蚀刻铜和回收废蚀刻溶液的方法
EP08767103.8A EP2165007B1 (en) 2007-07-11 2008-07-07 A method for etching copper and recovery of the spent etching solution
JP2010516004A JP5608078B2 (ja) 2007-07-11 2008-07-07 銅のエッチング方法および使用済みエッチング溶液の回収方法
PCT/SE2008/000431 WO2009008801A1 (en) 2007-07-11 2008-07-07 A method for etching copper and recovery of the spent etching solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0701681A SE531697C2 (sv) 2007-07-11 2007-07-11 Etsnings- och återvinningsförfarande

Publications (2)

Publication Number Publication Date
SE0701681L true SE0701681L (sv) 2009-01-12
SE531697C2 SE531697C2 (sv) 2009-07-07

Family

ID=40228823

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0701681A SE531697C2 (sv) 2007-07-11 2007-07-11 Etsnings- och återvinningsförfarande

Country Status (8)

Country Link
US (1) US8236189B2 (sv)
EP (1) EP2165007B1 (sv)
JP (1) JP5608078B2 (sv)
KR (1) KR101560704B1 (sv)
CN (1) CN101688315B (sv)
PL (1) PL2165007T3 (sv)
SE (1) SE531697C2 (sv)
WO (1) WO2009008801A1 (sv)

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* Cited by examiner, † Cited by third party
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CN102240814B (zh) * 2010-05-12 2013-09-25 陈卓贤 一种环保型回收线路板蚀刻废液制备超细铜粉的方法
CN102259087B (zh) * 2011-07-20 2013-08-07 上海电力学院 一种具有耐蚀性能的黄铜超疏水表面的制备方法
CN102335651B (zh) * 2011-08-08 2015-12-16 上海电力学院 一种具有耐蚀性能的超疏水表面的黄铜的制备方法
CN102864306B (zh) * 2012-09-26 2014-02-05 东北大学 一种提高水溶液中铜萃取效率的方法
CN102942278A (zh) * 2012-11-22 2013-02-27 长沙铂鲨环保设备有限公司 一种酸性含铜废液的处理方法
CN103757634B (zh) * 2013-12-13 2016-04-20 陶克（苏州）机械设备有限公司 一种漂洗水循环系统及漂洗水循环方法
EP2927347A1 (en) 2014-04-01 2015-10-07 Sigma Engineering Ab Oxidation of copper in a copper etching solution by the use of oxygen and/or air as an oxidizing agent
CN104264184A (zh) * 2014-09-12 2015-01-07 上海电力学院 一种从废旧线路板中提取金属铜的方法
CN105077561B (zh) * 2015-08-28 2016-08-31 安徽中烟工业有限责任公司 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法
CN106555055A (zh) * 2015-09-29 2017-04-05 宏齐科技股份有限公司 从含金属废液中回收固态金属的系统及方法
CN106676527B (zh) * 2015-11-06 2019-03-08 库特勒环保科技（苏州）有限公司 一种氯酸钠型酸性蚀刻液离线再生系统
CN106119853A (zh) * 2016-08-05 2016-11-16 励福(江门)环保科技股份有限公司 高效零排放废酸性铜蚀刻液回收及再生系统
CN110770177A (zh) * 2017-08-16 2020-02-07 深圳市柔宇科技有限公司 废液存储装置和湿式蚀刻系统
CN108642518A (zh) * 2018-07-09 2018-10-12 南京舜业环保科技有限公司 一种pcb酸性蚀刻液提取铜的方法及装置
CN110359051B (zh) * 2019-06-18 2020-09-22 龙建国 线路板蚀刻废液循环再利用的方法
WO2021061184A1 (en) * 2019-09-23 2021-04-01 All Green Recycling, Inc. Systems and methods of efficiently recovering precious metals using an alkaline leach, ultrasound, and electrolysis
CN111270239A (zh) * 2020-03-27 2020-06-12 Tcl华星光电技术有限公司 含铜酸性蚀刻液循环再生的方法
CN112813489B (zh) * 2020-12-30 2022-04-29 广东臻鼎环境科技有限公司 一种试剂级二水合氯化铜晶体的制备方法
CN112831784A (zh) * 2020-12-31 2021-05-25 惠州市鸿宇泰科技有限公司 一种酸性蚀刻液及提高其蚀刻精度的控制方法
WO2022184688A1 (en) * 2021-03-02 2022-09-09 At&S Austria Technologie & Systemtechnik Aktiengesellschaft A method of processing an etching waste medium from circuit board and/or substrate manufacture

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Also Published As

Publication number Publication date
WO2009008801A1 (en) 2009-01-15
PL2165007T3 (pl) 2016-05-31
EP2165007A4 (en) 2014-08-13
US8236189B2 (en) 2012-08-07
JP5608078B2 (ja) 2014-10-15
KR20100034001A (ko) 2010-03-31
HK1141564A1 (en) 2010-11-12
SE531697C2 (sv) 2009-07-07
CN101688315A (zh) 2010-03-31
EP2165007A1 (en) 2010-03-24
EP2165007B1 (en) 2015-11-11
US20110000884A1 (en) 2011-01-06
KR101560704B1 (ko) 2015-10-15
JP2010533242A (ja) 2010-10-21
CN101688315B (zh) 2012-07-25

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