KR20180134341A - 양이온 경화성 수지 조성물 - Google Patents
양이온 경화성 수지 조성물 Download PDFInfo
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- KR20180134341A KR20180134341A KR1020187028742A KR20187028742A KR20180134341A KR 20180134341 A KR20180134341 A KR 20180134341A KR 1020187028742 A KR1020187028742 A KR 1020187028742A KR 20187028742 A KR20187028742 A KR 20187028742A KR 20180134341 A KR20180134341 A KR 20180134341A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
[해결수단] (A) 성분 : 양이온 중합성 화합물, (B) 성분 : 광양이온 중합 개시제, (C) 성분 : 열양이온 중합 개시제, 및 (D) 성분 : 이소시아눌 고리를 갖는 화합물을 함유하고, (A) 성분 100 중량부에 대해 (D) 성분 0.01~7중량부를 함유하는 양이온 경화성 수지 조성물.
Description
| (A)성분 | (B)성분 | (C)성분 | (D)성분 | 광 경화성 |
저온 경화성 |
저장 안정성 |
||||
| a1 | a2 | b1 | c1 | c'1 | d1 | d2 | ||||
| 실시예1 | 80 | 20 | 5 | 0.1 | 0.5 | 경화 | 경화 | ○ | ||
| 실시예2 | 80 | 20 | 5 | 0.1 | 1 | 경화 | 경화 | ○ | ||
| 실시예3 | 80 | 20 | 5 | 0.1 | 3 | 경화 | 경화 | ○ | ||
| 실시예4 | 80 | 20 | 5 | 0.1 | 5 | 경화 | 경화 | ◎ | ||
| 실시예5 | 95 | 5 | 5 | 0.1 | 0.5 | 경화 | 경화 | ◎ | ||
| 비교예1 | 80 | 20 | 5 | 0.1 | 경화 | 경화 | Х | |||
| 비교예2 | 80 | 20 | 5 | 0.1 | 10 | 경화 | 미경화 | ◎ | ||
| 비교예3 | 80 | 20 | 5 | 0.1 | 10 | 경화 | 미경화 | ◎ | ||
| 비교예4 | 80 | 20 | 5 | 0.1 | 0.5 | 경화 | 경화 | Х | ||
| 비교예5 | 80 | 20 | 5 | 1 | 0.5 | 경화 | 미경화 | ◎ | ||
| 비교예6 | 80 | 20 | 5 | 0.5 | 경화 | 미경화 | ◎ | |||
| 비교예7 | 80 | 20 | 0.1 | 0.5 | 미경화 | 경화 | Х | |||
Claims (5)
- (A) 성분: 양이온 중합성 화합물,
(B) 성분: 광양이온 중합 개시제,
(C) 성분: 열양이온 중합 개시제, 및
(D) 성분: 이소시아눌 고리를 갖는 화합물,
을 함유하고, (A) 성분 100질량부에 대해 (D) 성분 0.01~7질량부를 함유하는, 양이온 경화성 수지 조성물. - 제1 항에 있어서,
상기 (D) 성분이, (메타)아크릴로일기와 이소시아눌 고리 함유 화합물, 알릴기와 이소시아눌 고리 함유 화합물, 글리시딜기와 이소시아눌 고리 함유 화합물, 메르캅토기와 이소시아눌 고리 함유 화합물로 이루어진 군에서 선택되는 하나 이상인, 양이온 경화성 수지 조성물. - 제1 항 또는 제2 항에 있어서,
상기 (C) 성분이, 방향족 술포늄계 열양이온 중합 개시제 또는 방향족 요오드늄계 열양이온 중합 개시제인, 양이온 경화성 수지 조성물. - 제1 항 내지 제3 항의 어느 한 항에 있어서,
(E) 성분: 안료를 더욱 함유하는, 양이온 경화성 수지 조성물. - 제1 항 내지 제4 항의 어느 한 항에 있어서,
상기 (A) 성분이, 수소 첨가 에폭시 수지 또는 지환식 에폭시 화합물인, 양이온 경화성 수지 조성물.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2016-076244 | 2016-04-06 | ||
| JP2016076244 | 2016-04-06 | ||
| PCT/JP2017/013994 WO2017175735A1 (ja) | 2016-04-06 | 2017-04-03 | カチオン硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180134341A true KR20180134341A (ko) | 2018-12-18 |
| KR102294414B1 KR102294414B1 (ko) | 2021-08-25 |
Family
ID=60001504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187028742A Active KR102294414B1 (ko) | 2016-04-06 | 2017-04-03 | 양이온 경화성 수지 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10428214B2 (ko) |
| JP (1) | JP6933816B2 (ko) |
| KR (1) | KR102294414B1 (ko) |
| CN (1) | CN109071770B (ko) |
| WO (1) | WO2017175735A1 (ko) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7614512B2 (ja) * | 2019-12-11 | 2025-01-16 | 株式会社スリーボンド | カチオン硬化性組成物、硬化物および接合体 |
| JP7516081B2 (ja) * | 2020-03-23 | 2024-07-16 | ヘンケルジャパン株式会社 | デュアル硬化型接着剤組成物 |
| TWI883256B (zh) * | 2020-09-29 | 2025-05-11 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| JPWO2022202683A1 (ko) * | 2021-03-22 | 2022-09-29 | ||
| WO2025205910A1 (ja) * | 2024-03-29 | 2025-10-02 | ナミックス株式会社 | 重合性組成物、接着剤、封止材、硬化物、半導体装置及び電子部品 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59204676A (ja) | 1983-05-09 | 1984-11-20 | Mitsubishi Rayon Co Ltd | 高屈折率感光性接着剤 |
| JPH05171084A (ja) * | 1991-12-20 | 1993-07-09 | Nippon Soda Co Ltd | 化学めっき用レジスト樹脂組成物 |
| JPH10101904A (ja) * | 1996-09-20 | 1998-04-21 | Siemens Ag | 注型用樹脂製剤、その電気及び電子部品におけるアンダーフィリングにおける使用、及びその硬化方法 |
| KR20050059002A (ko) | 2004-12-31 | 2005-06-17 | 명지대학교 | 변류기 2차 전류 보상 방법 |
| WO2005059002A1 (ja) * | 2003-12-19 | 2005-06-30 | Henkel Corporation | カチオン硬化型エポキシ樹脂組成物 |
| KR20100016451A (ko) * | 2007-04-13 | 2010-02-12 | 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 | 이중 광개시제, 광경화성 조성물, 그것의 용도 및 3차원 물품의 제조방법 |
| WO2011093236A1 (ja) * | 2010-01-26 | 2011-08-04 | 日産化学工業株式会社 | 硬化性長鎖アルキレン基含有エポキシ樹脂組成物 |
| JP2012198427A (ja) * | 2011-03-22 | 2012-10-18 | Three Bond Co Ltd | 液晶滴下工法用シール剤 |
| WO2015178186A1 (ja) * | 2014-05-20 | 2015-11-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013084708A1 (ja) * | 2011-12-05 | 2015-04-27 | 協立化学産業株式会社 | ハードディスク装置組み立て用カチオン硬化型樹脂組成物 |
-
2017
- 2017-04-03 CN CN201780022549.2A patent/CN109071770B/zh active Active
- 2017-04-03 US US16/091,702 patent/US10428214B2/en active Active
- 2017-04-03 KR KR1020187028742A patent/KR102294414B1/ko active Active
- 2017-04-03 JP JP2018510599A patent/JP6933816B2/ja active Active
- 2017-04-03 WO PCT/JP2017/013994 patent/WO2017175735A1/ja not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59204676A (ja) | 1983-05-09 | 1984-11-20 | Mitsubishi Rayon Co Ltd | 高屈折率感光性接着剤 |
| JPH05171084A (ja) * | 1991-12-20 | 1993-07-09 | Nippon Soda Co Ltd | 化学めっき用レジスト樹脂組成物 |
| JPH10101904A (ja) * | 1996-09-20 | 1998-04-21 | Siemens Ag | 注型用樹脂製剤、その電気及び電子部品におけるアンダーフィリングにおける使用、及びその硬化方法 |
| WO2005059002A1 (ja) * | 2003-12-19 | 2005-06-30 | Henkel Corporation | カチオン硬化型エポキシ樹脂組成物 |
| KR20050059002A (ko) | 2004-12-31 | 2005-06-17 | 명지대학교 | 변류기 2차 전류 보상 방법 |
| KR20100016451A (ko) * | 2007-04-13 | 2010-02-12 | 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 | 이중 광개시제, 광경화성 조성물, 그것의 용도 및 3차원 물품의 제조방법 |
| WO2011093236A1 (ja) * | 2010-01-26 | 2011-08-04 | 日産化学工業株式会社 | 硬化性長鎖アルキレン基含有エポキシ樹脂組成物 |
| JP2012198427A (ja) * | 2011-03-22 | 2012-10-18 | Three Bond Co Ltd | 液晶滴下工法用シール剤 |
| WO2015178186A1 (ja) * | 2014-05-20 | 2015-11-26 | 積水化学工業株式会社 | 有機エレクトロルミネッセンス表示素子用封止剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6933816B2 (ja) | 2021-09-08 |
| CN109071770A (zh) | 2018-12-21 |
| KR102294414B1 (ko) | 2021-08-25 |
| WO2017175735A1 (ja) | 2017-10-12 |
| US10428214B2 (en) | 2019-10-01 |
| CN109071770B (zh) | 2020-09-11 |
| US20190136041A1 (en) | 2019-05-09 |
| JPWO2017175735A1 (ja) | 2019-02-14 |
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