KR20130013502A - Manufacturing method of mold for nano imprint and mold for nano imprint by using the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a mold for nanoimprint, wherein a plurality of grid patterns are formed on a substrate, a metal grid pattern is formed on the grid pattern, a plating layer is formed on the metal grid pattern, and the metal grid is formed. By manufacturing a mold for nanoimprint by separating a mold made of a pattern and the plating layer from the lattice pattern, it is possible to provide a mold for nanoimprint with improved durability and reliability while reducing manufacturing costs and improving process efficiency. .

Description

Manufacturing method of mold for nano imprint and mold for nano imprint manufactured using the same {Manufacturing method of mold for nano imprint and mold for nano imprint by using the same}

The present invention relates to the field of manufacturing a mold for nanoimprint.

The polarizer or the polarizer refers to an optical device that derives linearly polarized light having a specific vibration direction among unpolarized light such as natural light. In general, when the period of the metal line array is shorter than the half wavelength of the incident electromagnetic wave, the polarization component (s wave) parallel to the metal line is reflected and the vertical polarization component (p wave) is transmitted. Using this phenomenon, a planar polarizer having excellent polarization efficiency, high transmittance, and a wide viewing angle can be manufactured. Such devices are called line grid polarizers or wire grid polarizers.

Recently, a technique for manufacturing the above-described wire grid polarizer using a nano imprint process has been proposed. The nanoimprint process is a technique for forming a nanoscale pattern in an imprint form by using a mold, and the nanoimprint process forms a lattice pattern through a relatively simple process as compared with a conventional photo-lithography process. can do. In addition, in the nanoimprint process, when the lattice pattern is formed using a mold having a nanoscale width, a nanoscale lattice pattern that cannot be implemented by a photolithography process can be formed, thereby increasing productivity and reducing manufacturing costs. Has the advantage.

In order to form a lattice pattern using the nanoimprint process described above, a mold having a pattern having a desired shape must first be manufactured. Among such molds, molds made using silicon wafers or quartz have a high frequency of breakage during the process, so that the mold is formed by electroplating nickel, as disclosed in Korean Patent Publication No. 10-2007-0072949 for mechanical properties. A manufacturing technique has been proposed. 1A to 1C illustrate a mold manufacturing process using electroplating disclosed in Korean Patent Laid-Open Publication No. 10-2007-0072949. 1A to 1C, first, as shown in FIG. 1A, a master mold is manufactured by forming a grating pattern 13 on a substrate 11. A conductive seed layer 14 for pre-plating is formed on the grid pattern 13. Thereafter, a metal layer 15 is formed on the conductive seed layer 14 through a pre-plating process to finally manufacture a mold. However, the mold manufacturing method using the electroplating is difficult to form the conductive seed layer 14, a pore (16) is formed in the mold during the electroplating process to reduce the durability and mechanical properties of the mold, manufacturing In the process of separating a mold from the lattice pattern 13, there is a problem in that the probability of breakage of the master mold increases.

Korean Patent Publication No. 10-2007-0072949 (published Jul. 10, 2007)

The present invention has been proposed to solve the above-described problems, forming a plurality of grid patterns on the substrate, a metal grid pattern on the grid pattern, a plating layer formed on the metal grid pattern, By separating a mold consisting of the metal grid pattern and the plating layer from the lattice pattern, a mold having a fine pitch is implemented, thereby providing a mold for nanoimprint with improved durability and reliability while reducing manufacturing cost and improving process efficiency. It is for that purpose.

In the method of manufacturing a mold for nanoimprint of the present invention for solving the above problems, a plurality of grid patterns are formed on a substrate, a metal grid pattern is formed on the grid pattern, and a plating layer is formed on the metal grid pattern. And separating the mold consisting of the metal grid pattern and the plating layer from the lattice pattern.

In the method of manufacturing a mold for nanoimprinting of the present invention, forming the lattice pattern includes applying a UV curable resin on the substrate to form a lattice base layer, pressing the lattice base layer with an imprint mold, and forming the lattice pattern. And irradiating ultraviolet rays to the base layer to cure the lattice base layer.

In the method of manufacturing a mold for imprinting nano imprint of the present invention, the lattice pattern may be formed by coating a thermosetting resin on the substrate to form a lattice base layer, and pressing the lattice base layer with a heated imprint mold. Hardening the lattice base layer.

In the method of manufacturing a mold for nanoimprint of the present invention, the width of the lattice pattern is preferably formed in 20nm to 200nm.

In the method of manufacturing a mold for nanoimprint according to the present invention, the forming of the metal grid pattern includes depositing a metal material on the grid pattern to form a metal grid base layer and wet etching the metal grid base layer. It can be done by.

In the method for manufacturing a mold for nanoimprint of the present invention, the metal material is preferably made of Ni or Ni alloy.

In the method for manufacturing a nano imprint mold of the present invention, the metal material may be deposited on the grating pattern by at least one of a sputtering method, a chemical vapor deposition method, and an evaporation method.

In the method for manufacturing a mold for nanoimprint of the present invention, the forming of the plating layer may be performed by electroplating.

In the method for manufacturing a mold for nanoimprint of the present invention, the plating layer is preferably formed of the same material as the metal grid pattern, more preferably may be made of Ni or Ni alloy.

The mold for nanoimprint of the present invention for solving the above problems can be produced by the above-described method.

According to the present invention, a metal mold having a fine pitch of 200 nm or less can be manufactured, and in particular, a mold made of nickel can be manufactured, thereby providing a mold for nanoimprint with improved durability and reliability. It works.

In addition, according to the present invention, it is possible to manufacture a mold for nanoimprint with improved durability by using a simple pre-plating method, it has an effect of improving the manufacturing process efficiency, reducing the manufacturing cost of the mold by not undergoing a separate complicated process .

1a to 1c is a manufacturing process diagram briefly showing a mold manufacturing method according to the prior art.
2 is a flowchart illustrating a method for manufacturing a mold for nanoimprint according to the present invention.
3A to 3H are manufacturing process diagrams showing a method for manufacturing a mold for nanoimprint according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments described herein and the configurations shown in the drawings are only a preferred embodiment of the present invention, and that various equivalents and modifications may be made thereto at the time of the present application. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention. The following terms are terms defined in consideration of functions in the present invention, and the meaning of each term should be interpreted based on the contents throughout the present specification. The same reference numerals are used for parts having similar functions and functions throughout the drawings.

2 is a flowchart illustrating a method for manufacturing a mold for nanoimprint according to the present invention.

Referring to FIG. 2, in the method for manufacturing a nanoimprint mold according to the present invention, a lattice pattern is formed on a substrate (S1), a metal lattice pattern is formed on the lattice pattern (S3), and a plating layer is formed on the metal lattice pattern. Forming (S5), and separating the mold consisting of the metal grid pattern and the plating layer from the grid pattern (S7) can be made.

Substrate used in the step S1 is preferably made of a transparent substrate, as a material, plastic, sapphire, etc. composed of various polymers such as glass, quartz, acrylic, PC and PET can be used, and various other materials can be used. On the other hand, the grid pattern is a concept including a projection pattern and a groove formed between each projection pattern, the period means the distance between one grid pattern and the adjacent grid pattern. Hereinafter, a process of forming a plurality of grid patterns will be described.

The process of forming the lattice pattern may be performed by a nano imprinting process. That is, a lattice base layer is formed by applying a polymer resin on a substrate.

The polymer resin coating described above may be performed by a spin coating method, a die coating method, a roll coating method, a dip coating method, a cast method, a screen printing method, a transfer method, and more preferably, a spin coating method and a die coating method. , It is preferable to be applied through any one of the roll coating method, but is not limited thereto.

On the other hand, an ultraviolet curable resin or a thermosetting resin may be used as the polymer resin. For example, when UV curable resin is used, after forming the lattice base layer, the imprint mold having grooves and protrusions is aligned on the lattice base layer. Here, the plurality of grooves and protrusions of the imprint mold are repeatedly formed at a predetermined distance from each other. Further, the grooves of the imprint mold correspond to the positions where the grid pattern is to be formed.

Thereafter, the groove portion of the imprint mold is pressed to contact the lattice base layer, and then irradiated with ultraviolet rays to perform photocuring. As a result, a plurality of grating patterns are formed on a portion of the substrate corresponding to the groove of the imprint mold. At this time, the width W of the groove is preferably implemented in the range of 20nm to 200nm, but is not limited thereto. And the width of the lattice pattern formed at the portion corresponding to the groove is in the range of 20 nm to 200 nm. However, this is only one example, and the width of the imprint mold groove and the width of the lattice pattern may be selected in consideration of the width of the nanoimprint mold to be formed later.

Meanwhile, in the above-described embodiment, the polymer resin forming the lattice base layer is described as an ultraviolet curable resin. However, a thermosetting resin may also be used. Accordingly, thermosetting is performed by pressing the lattice base layer with a heated imprint mold. The lattice pattern of the present invention can also be formed.

After the lattice pattern is formed, a metal grid pattern is formed on the lattice pattern (S3).

Here, the metal grid pattern is defined as collectively encompassing a pattern formed on the grid pattern, and the metal grid pattern formation of the present invention may be performed as follows. First, the metal grid base layer is formed by depositing a metal material on the lattice pattern by any deposition method that has been developed and commercialized, such as sputtering, chemical vapor deposition, and evaporation, or can be implemented according to future technological developments. In this case, the deposited metal material may include at least one of conductive nickel (Ni), aluminum (Al), gold (Au), silver (Ag), chromium (Cr) copper (Cu), or an alloy thereof. , Nickel (Ni) or nickel alloy is preferably used. This is to improve the durability and releasability of the mold for nanoimprint to be formed later.

After forming the metal lattice base layer, the etching process is performed to etch the spaced space between the lattice patterns to form the metal lattice pattern. Here, the portion to be etched may be etched not only a spaced space between the grating patterns, but also a portion of the metal lattice base layer formed on the grating pattern as needed. On the other hand, it is preferable that a wet etching process is used as the above-described etching process. In this case, the width and thickness of the metal grid pattern may be adjusted by adjusting the wet etching time. The metal grid pattern of the present invention thus formed has a structure in which the fine protrusion patterns are arranged at regular intervals.

On the other hand, the metal grid pattern may be formed so that the cross-sectional shape has a variety of structures, such as square, triangle, semi-circular, or may be formed in the form of a triangle, a square, a sine wave and the like. That is, the metal grid pattern may be formed to have a certain period in one direction regardless of the cross-sectional structure.

After the metal grid pattern is formed, a plating layer is formed on the metal grid pattern (S5), and the formation of the plating layer may be performed by electro-forming. In addition, the material to be pre-plated is preferably the same material as the above-described metal grid pattern, more preferably using nickel (Ni) or nickel alloy.

When electroplating is performed using nickel (Ni), the gap between the metal lattice patterns is narrow, so that the growth of nickel in the horizontal direction is limited and grows in the vertical direction. In addition, the growth pattern is radially grown so that the plating layers formed on the metal lattice pattern are finally connected to each other at a constant height growth. Accordingly, it is possible to obtain a mold having a structure in which a metal grid pattern is finally formed under the plating layer.

After the plating layer is formed, the mold having the lattice pattern and the above-described plating layer and the metal lattice pattern is separated from the substrate and the lattice pattern (S7), thereby obtaining a mold for nanoimprint.

The nanoimprint mold of the present invention manufactured by the above-described method is implemented with a fine pitch of 200nm or less, in particular, when the nanoimprint mold is manufactured using nickel, durability and reliability are improved.

In addition, as the release property of the nanoimprint mold is improved, the possibility of breakage of the master mold (substrate and lattice pattern) that can be generated during the separation process can be reduced, and thus, the lattice pattern formed on the substrate formed in the manufacturing process can be manufactured for the nanoimprint mold. It can also be recycled in the process, which adds to the economic benefits of further reducing manufacturing costs.

In addition, according to the present invention, it is possible to manufacture a mold for nanoimprint with improved durability by using a simple pre-plating method, it has a manufacturing process efficiency improvement effect, a manufacturing cost reduction effect by not undergoing a separate complex process.

3a to 3h is a manufacturing process diagram showing a manufacturing method for a nano imprint according to an embodiment of the present invention.

2 to 3H, the lattice base layer 130 is formed by applying a polymer resin onto the substrate 110 as shown in FIG. 3A.

Thereafter, as shown in FIG. 3B, the imprint mold 210 is aligned on the lattice base layer 130. Here, the imprint mold 210 has a plurality of protrusions 211 arranged at regular intervals and a plurality of grooves formed between each protrusion, as described above in the description of FIG. 2. Here, the width W of the groove is preferably implemented in the range of 20 nm to 200 nm, but is not limited thereto. As described above with reference to FIG. 2.

After pressing the upper portion of the grating base layer 130 with the imprint mold 210 as shown in FIG. 3c, the imprint mold 210 is separated to form the grating pattern 131 as shown in FIG. 3d. In this case, before pressing and separating the lattice base layer 130 with the imprint mold 310, if the material constituting the lattice base layer 130 is a thermosetting resin, a thermosetting process is involved. This involves photocuring through irradiation.

After the lattice pattern is formed, a metal grid base layer 140 is formed by depositing a metal material on the lattice pattern 131 as shown in FIG. 3E. In this case, the metal lattice base layer 140 may be formed to fill all the spaces between the grid patterns 131 as shown in FIG. 3E, or although not shown in the drawing, the metal grid base layer 140 may be uniformly disposed between the grid patterns 131. It may be formed so that a space is provided. By providing a predetermined space between the grating pattern 131, to facilitate the etching of the metal grid base layer 140 in the subsequent wet etching process.

Here, the metal material deposited on the grid pattern 131 may be deposited through any deposition method that is currently developed and commercialized, such as sputtering, chemical vapor deposition, and evaporation, or may be implemented according to future technological developments. In addition, the metal material may include at least one of conductive nickel (Ni), aluminum (Al), gold (Au), silver (Ag), chromium (Cr) copper (Cu), or an alloy thereof. It is preferable that (Ni) or a nickel alloy is used as described above in the description of FIG. 2.

After the metal grid base layer 140 is formed, the space A between the grid patterns 131 is etched through a wet etching process to form the metal grid pattern 150 as illustrated in FIG. 3F. In this case, the width and thickness of the metal grid pattern 150 may be adjusted by adjusting the time for performing the wet etching, as described above with reference to FIG. 2.

After the metal grid pattern 150 is formed, a plating layer is formed on the metal grid pattern 150. In this case, the material used for forming the plating layer is preferably the same material as the material forming the metal grid pattern 150, and more preferably nickel (Ni) or nickel alloy is used as described above in FIG. When the electroplating is performed, the gap between the metal grid patterns 150 is narrow, so that the growth of the plating layer in the horizontal direction is limited and grows in the vertical direction. In addition, the growth pattern is radially grown so that the plating layer 170 having a form connected to each other is formed on the metal grid pattern 150 as shown in FIG. 3G. Accordingly, the mold 300 having the structure in which the metal grid pattern 150 is formed below the plating layer 170 may be obtained as described above with reference to FIG. 2.

After the mold 300 is formed on the grating pattern 131, the substrate 110 and the grating pattern 131 may be separated to obtain the nanoimprint mold 300 as illustrated in FIG. 3H.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Those skilled in the art will appreciate that many suitable modifications and variations are possible in light of the present invention. Accordingly, all such suitable modifications and variations and equivalents should be considered to be within the scope of the present invention.

110: substrate
130: lattice base layer
131: grid pattern
140: metal grid base layer
150: metal grid pattern
170: plating layer
210: imprint mold
211: imprint mold protrusion
300: mold

Claims (11)

Forming a plurality of grid patterns on the substrate,
Forming a metal grid pattern on the grid pattern,
Forming a plating layer on the metal grid pattern;
And a mold comprising the metal grid pattern and the plating layer, separated from the lattice pattern.
The method according to claim 1,
Forming the grid pattern,
Applying a UV curable resin on the substrate to form a lattice base layer,
Pressing the lattice base layer with an imprint mold,
And irradiating the lattice base layer with ultraviolet rays to cure the lattice base layer.
The method according to claim 1,
Forming the grid pattern,
Applying a thermosetting resin on the substrate to form a lattice base layer,
And pressing the lattice base layer with a heated imprint mold to cure the lattice base layer.
The method according to claim 1,
The width of the grid pattern is a nano imprint mold manufacturing method is formed in 20nm to 200nm.
The method according to claim 1,
Forming the metal grid pattern,
Depositing a metal material on the grid pattern to form a metal grid base layer,
A method for manufacturing a mold for nanoimprinting comprising wet etching the metal grid base layer.
The method according to claim 5,
The metal material is,
Method for producing a mold for nanoimprint made of Ni or Ni alloy.
The method according to claim 5,
The metal material is,
A method for manufacturing a mold for nanoimprint deposited on the lattice pattern by at least one of a sputtering method, a chemical vapor deposition method, and an evaporation method.
The method according to claim 1,
Forming the plating layer,
Method for manufacturing a mold for nanoimprint made of electroplating method.
The method according to claim 1,
The plating layer,
The nanoimprint mold manufacturing method is formed of the same material as the metal grid pattern.
The method according to claim 9,
The plating layer,
Method for producing a mold for nanoimprint consisting of Ni or Ni alloy.
In the mold for imprint,
The mold for nanoimprint manufactured by the method of any one of Claims 1-10.

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