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KR20080061329A - 알칼리현상형 감광성 수지조성물, 그것을 이용하여 형성한액정분할배향제어용 돌기부착 기판, 및 액정표시장치 - Google Patents

알칼리현상형 감광성 수지조성물, 그것을 이용하여 형성한액정분할배향제어용 돌기부착 기판, 및 액정표시장치 Download PDF

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Publication number
KR20080061329A
KR20080061329A KR1020077007468A KR20077007468A KR20080061329A KR 20080061329 A KR20080061329 A KR 20080061329A KR 1020077007468 A KR1020077007468 A KR 1020077007468A KR 20077007468 A KR20077007468 A KR 20077007468A KR 20080061329 A KR20080061329 A KR 20080061329A
Authority
KR
South Korea
Prior art keywords
resin composition
compound
alkali
group
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020077007468A
Other languages
English (en)
Korean (ko)
Inventor
미도리 오하라
야스유키 데마치
마사유키 카와시마
타카시 토쿠하시
마사아키 시미즈
Original Assignee
도판 인사츠 가부시키가이샤
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도판 인사츠 가부시키가이샤, 가부시키가이샤 아데카 filed Critical 도판 인사츠 가부시키가이샤
Publication of KR20080061329A publication Critical patent/KR20080061329A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/064—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020077007468A 2005-10-27 2006-10-26 알칼리현상형 감광성 수지조성물, 그것을 이용하여 형성한액정분할배향제어용 돌기부착 기판, 및 액정표시장치 Ceased KR20080061329A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00312362 2005-10-27
JP2005312362 2005-10-27

Publications (1)

Publication Number Publication Date
KR20080061329A true KR20080061329A (ko) 2008-07-02

Family

ID=37967775

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077007468A Ceased KR20080061329A (ko) 2005-10-27 2006-10-26 알칼리현상형 감광성 수지조성물, 그것을 이용하여 형성한액정분할배향제어용 돌기부착 기판, 및 액정표시장치

Country Status (5)

Country Link
JP (1) JP5034939B2 (fr)
KR (1) KR20080061329A (fr)
CN (1) CN101044432B (fr)
TW (1) TW200728917A (fr)
WO (1) WO2007049665A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008139924A1 (fr) * 2007-05-09 2008-11-20 Adeka Corporation Nouveau composé époxy, composition de résine pouvant être développée par un composé alcalin, et composition de résine photosensible pouvant être développée par un composé alcalin
JP5367956B2 (ja) * 2007-05-30 2013-12-11 東洋インキＳｃホールディングス株式会社 感光性着色組成物およびカラーフィルタ
JP2009036848A (ja) * 2007-07-31 2009-02-19 Sanyo Chem Ind Ltd 感光性樹脂組成物
JP5014054B2 (ja) * 2007-10-12 2012-08-29 凸版印刷株式会社 液晶表示装置用基板及び該基板を備えた液晶表示装置
JP2009198548A (ja) * 2008-02-19 2009-09-03 Toppan Printing Co Ltd カラーフィルタ及びそれを用いた液晶表示装置
JP2009229826A (ja) * 2008-03-24 2009-10-08 Toppan Printing Co Ltd カラーフィルタとそれを備えた液晶表示装置
JP5501679B2 (ja) 2009-07-02 2014-05-28 株式会社Ａｄｅｋａ 硬化性樹脂組成物及びその硬化物
TW201113303A (en) * 2009-10-07 2011-04-16 Sumitomo Chemical Co Colored photosensitive resin compositions
US8791169B2 (en) 2011-01-27 2014-07-29 Lg Chem, Ltd. Fluorene-based resin polymer and photo-sensitive resin composition comprising the same
CN103214436A (zh) * 2013-03-29 2013-07-24 青岛俪徕精细化工有限公司 长碳链二元醇二缩水甘油醚及其制备方法
JP6677057B2 (ja) * 2015-04-15 2020-04-08 三菱ケミカル株式会社 多官能エポキシ樹脂及び中間体、エポキシ樹脂組成物、硬化物
JP7563029B2 (ja) * 2020-08-03 2024-10-08 三菱ケミカル株式会社 感光性着色樹脂組成物、硬化物、隔壁及び画像表示装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3156559B2 (ja) * 1994-09-14 2001-04-16 株式会社日本触媒 感光性樹脂の製造方法および液状感光性樹脂組成物
JPH09328527A (ja) * 1996-06-12 1997-12-22 Nippon Kayaku Co Ltd 樹脂組成物及びその硬化物
TW524813B (en) * 2000-01-18 2003-03-21 Taiyo Ink Mfg Co Ltd Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same
JPWO2002077058A1 (ja) * 2001-03-23 2004-07-15 太陽インキ製造株式会社 活性エネルギー線硬化性樹脂、これを含有する光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2003107702A (ja) * 2001-09-27 2003-04-09 Sumitomo Chem Co Ltd 樹脂組成物
JP3996802B2 (ja) * 2002-05-15 2007-10-24 太陽インキ製造株式会社 低放射線性の光硬化性・熱硬化性樹脂組成物及びその硬化被膜
JP4087650B2 (ja) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2005244150A (ja) * 2004-01-28 2005-09-08 Ajinomoto Co Inc 樹脂組成物、それを用いた接着フィルム及び多層プリント配線板
JP2005221817A (ja) * 2004-02-06 2005-08-18 Toppan Printing Co Ltd 配向制御用突起を有する基板及びそれを用いた液晶表示装置

Also Published As

Publication number Publication date
CN101044432A (zh) 2007-09-26
CN101044432B (zh) 2011-12-14
TW200728917A (en) 2007-08-01
WO2007049665A1 (fr) 2007-05-03
JP5034939B2 (ja) 2012-09-26
JPWO2007049665A1 (ja) 2009-04-30

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