KR101616898B1 - 에폭시 수지 조성물 - Google Patents
에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR101616898B1 KR101616898B1 KR1020117022852A KR20117022852A KR101616898B1 KR 101616898 B1 KR101616898 B1 KR 101616898B1 KR 1020117022852 A KR1020117022852 A KR 1020117022852A KR 20117022852 A KR20117022852 A KR 20117022852A KR 101616898 B1 KR101616898 B1 KR 101616898B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- weight
- epoxy
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2009-051846 | 2009-03-05 | ||
| JP2009051846 | 2009-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110139242A KR20110139242A (ko) | 2011-12-28 |
| KR101616898B1 true KR101616898B1 (ko) | 2016-04-29 |
Family
ID=42709701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117022852A Active KR101616898B1 (ko) | 2009-03-05 | 2010-03-02 | 에폭시 수지 조성물 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5478603B2 (ko) |
| KR (1) | KR101616898B1 (ko) |
| CN (1) | CN102341426B (ko) |
| WO (1) | WO2010101144A1 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2510042A1 (en) * | 2009-12-09 | 2012-10-17 | Dow Global Technologies LLC | Epoxy resin compositions |
| EP2585513A2 (en) | 2010-06-28 | 2013-05-01 | Dow Global Technologies LLC | Curable resin compositions |
| US9243088B2 (en) * | 2010-11-22 | 2016-01-26 | Dow Global Technologies Llc | Adduct |
| JP6317110B2 (ja) * | 2010-12-17 | 2018-05-09 | ブルー キューブ アイピー エルエルシー | ジビニルアレーンオキシドの調製方法 |
| KR101901473B1 (ko) * | 2011-05-13 | 2018-09-21 | 다우 글로벌 테크놀로지스 엘엘씨 | 절연 배합물 |
| IN2014CN04091A (ko) * | 2011-12-07 | 2015-07-10 | Dow Global Technologies Llc | |
| JP7489775B2 (ja) * | 2019-12-27 | 2024-05-24 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH351749A (de) * | 1957-02-14 | 1961-01-31 | Geigy Ag J R | Verfahren zur Stabilisierung von halogenhaltigen makromolekularen Verbindungen |
| US4603182A (en) * | 1984-10-05 | 1986-07-29 | General Electric Company | Low viscosity epoxy resin compositions |
| AU711786B2 (en) * | 1997-05-16 | 1999-10-21 | National Starch And Chemical Investment Holding Corporation | Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers |
| EP0878472A1 (en) * | 1997-05-16 | 1998-11-18 | National Starch and Chemical Investment Holding Corporation | Reactive radiation- or thermally- initiated cationically-curable epoxide monomers and compositions made from those monomers |
| JP3415047B2 (ja) | 1998-11-18 | 2003-06-09 | ジャパンエポキシレジン株式会社 | 硬化性エポキシ樹脂組成物 |
| US6617401B2 (en) * | 2001-08-23 | 2003-09-09 | General Electric Company | Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst |
| US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
| US20060275608A1 (en) * | 2005-06-07 | 2006-12-07 | General Electric Company | B-stageable film, electronic device, and associated process |
| US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
| KR101522346B1 (ko) * | 2008-03-27 | 2015-05-21 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 에폭시수지 조성물 및 경화물 |
| KR101716634B1 (ko) * | 2009-03-31 | 2017-03-14 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 에폭시수지, 에폭시수지 조성물 및 경화물 |
-
2010
- 2010-03-02 JP JP2011502760A patent/JP5478603B2/ja not_active Expired - Fee Related
- 2010-03-02 CN CN201080010145.XA patent/CN102341426B/zh active Active
- 2010-03-02 WO PCT/JP2010/053327 patent/WO2010101144A1/ja not_active Ceased
- 2010-03-02 KR KR1020117022852A patent/KR101616898B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102341426A (zh) | 2012-02-01 |
| KR20110139242A (ko) | 2011-12-28 |
| WO2010101144A1 (ja) | 2010-09-10 |
| JPWO2010101144A1 (ja) | 2012-09-10 |
| CN102341426B (zh) | 2013-07-24 |
| JP5478603B2 (ja) | 2014-04-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI440631B (zh) | 脂環式二環氧化合物之製造方法、環氧樹脂組成物之製造方法及硬化物之製造方法 | |
| KR101616898B1 (ko) | 에폭시 수지 조성물 | |
| JP5143449B2 (ja) | 熱又は活性エネルギー線硬化型接着剤 | |
| KR101716634B1 (ko) | 에폭시수지, 에폭시수지 조성물 및 경화물 | |
| EP0150850A2 (en) | Polyether compounds and processes for production thereof | |
| JP5826751B2 (ja) | エポキシ樹脂組成物及び硬化物 | |
| JP5973401B2 (ja) | グリシジルグリコールウリル類とその利用 | |
| KR20090042306A (ko) | 변성 액상 에폭시 수지, 및 그것을 이용한 에폭시 수지 조성물 및 그 경화물 | |
| KR101144420B1 (ko) | 고순도 지환식 에폭시 화합물, 그 제조 방법, 경화성에폭시 수지 조성물, 그 경화물, 및 용도 | |
| JP2004285125A (ja) | エポキシ樹脂組成物及びその硬化物 | |
| US9249256B2 (en) | Triepoxy compound and method for producing same | |
| JP2013139527A (ja) | イソシアヌレート化合物 | |
| KR910004902B1 (ko) | 에폭시드기를 함유하는 페놀 에테르 | |
| EP1538147B1 (en) | Method of producing glycidyl 2-hydroxyisobutyrate | |
| JP4390179B2 (ja) | 変性エポキシ樹脂の製造方法 | |
| JP4930967B2 (ja) | 不飽和基含有化合物およびその組成物 | |
| JP2006206652A (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JPH058928B2 (ko) | ||
| JPS6372721A (ja) | エポキシ樹脂組成物 | |
| JPH02199115A (ja) | 封止剤 | |
| JPS61197621A (ja) | 封止剤 | |
| WO2008072668A1 (ja) | フェノール樹脂、エポキシ樹脂、硬化性樹脂組成物、その硬化物、およびフェノール樹脂の製造方法 | |
| JP2009062431A (ja) | エポキシ樹脂、エポキシ樹脂組成物およびその硬化物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20110929 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20141022 Comment text: Request for Examination of Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20160401 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20160425 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20160426 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20190328 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190328 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200401 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210402 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20220323 Start annual number: 7 End annual number: 7 |
|
| PR1001 | Payment of annual fee |
Payment date: 20240315 Start annual number: 9 End annual number: 9 |