JP7736004B2 - 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 - Google Patents
電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜Info
- Publication number
- JP7736004B2 JP7736004B2 JP2022543360A JP2022543360A JP7736004B2 JP 7736004 B2 JP7736004 B2 JP 7736004B2 JP 2022543360 A JP2022543360 A JP 2022543360A JP 2022543360 A JP2022543360 A JP 2022543360A JP 7736004 B2 JP7736004 B2 JP 7736004B2
- Authority
- JP
- Japan
- Prior art keywords
- meth
- acrylate
- sealing
- electronic device
- substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Electroluminescent Light Sources (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020138397 | 2020-08-19 | ||
| JP2020138397 | 2020-08-19 | ||
| PCT/JP2021/028768 WO2022039019A1 (fr) | 2020-08-19 | 2021-08-03 | Composition pour le scellement de dispositif électronique, procédé de formation de film d'étanchéité de dispositif électronique, et film d'étanchéité de dispositif électronique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022039019A1 JPWO2022039019A1 (fr) | 2022-02-24 |
| JP7736004B2 true JP7736004B2 (ja) | 2025-09-09 |
Family
ID=80322672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022543360A Active JP7736004B2 (ja) | 2020-08-19 | 2021-08-03 | 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7736004B2 (fr) |
| CN (1) | CN116096563B (fr) |
| TW (1) | TWI837499B (fr) |
| WO (1) | WO2022039019A1 (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7786457B2 (ja) * | 2021-04-30 | 2025-12-16 | コニカミノルタ株式会社 | 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 |
| KR20250025435A (ko) * | 2022-07-29 | 2025-02-21 | 코니카 미놀타 가부시키가이샤 | 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 및 전자 디바이스 봉지막의 형성 방법 |
| JPWO2024024836A1 (fr) * | 2022-07-29 | 2024-02-01 | ||
| WO2025094586A1 (fr) * | 2023-10-31 | 2025-05-08 | コニカミノルタ株式会社 | Composition d'encapsulation de dispositif électronique pour impression jet d'encre, procédé de formation de film d'encapsulation de dispositif électronique et film d'encapsulation de dispositif électronique |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007092037A (ja) | 2005-09-02 | 2007-04-12 | Dainippon Ink & Chem Inc | シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル |
| JP2010030290A (ja) | 2008-06-26 | 2010-02-12 | Fujifilm Corp | バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法 |
| WO2012115175A1 (fr) | 2011-02-25 | 2012-08-30 | 富士フイルム株式会社 | Produit barrière feuilleté et procédé de fabrication du produit barrière feuilleté |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9520576B2 (en) * | 2011-11-24 | 2016-12-13 | Konica Minolta, Inc. | Gas barrier film and electronic apparatus |
| JP6019791B2 (ja) * | 2012-06-19 | 2016-11-02 | 日立化成株式会社 | 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法 |
| JP6045603B2 (ja) * | 2012-11-27 | 2016-12-14 | 富士フイルム株式会社 | 光硬化性組成物、転写材料、硬化物の製造方法、樹脂パターン製造方法、硬化膜、液晶表示装置、有機el表示装置並びにタッチパネル表示装置 |
| JP6099198B2 (ja) * | 2013-03-29 | 2017-03-22 | 日本化薬株式会社 | エネルギー線硬化型樹脂組成物及びその硬化物 |
| WO2015002100A1 (fr) * | 2013-07-04 | 2015-01-08 | Jsr株式会社 | Élément électroluminescent (el) organique |
| KR20160049953A (ko) * | 2014-10-28 | 2016-05-10 | 삼성에스디아이 주식회사 | 광경화 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 장치 |
| JP2016169297A (ja) * | 2015-03-12 | 2016-09-23 | 日東電工株式会社 | 架橋剤および硬化性樹脂組成物、偏光フィルムおよびその製造方法、光学フィルムならびに画像表示装置 |
| KR101943687B1 (ko) * | 2015-06-19 | 2019-01-30 | 삼성에스디아이 주식회사 | 유기발광표시장치 |
| JP6868345B2 (ja) * | 2016-04-22 | 2021-05-12 | 日東電工株式会社 | 硬化性樹脂組成物、偏光フィルムおよびその製造方法、光学フィルムならびに画像表示装置 |
| TWI763883B (zh) * | 2017-07-14 | 2022-05-11 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物及其硬化膜、積層體、半導體裝置、以及該等的製造方法 |
| TW201940337A (zh) * | 2018-03-23 | 2019-10-16 | 日商琳得科股份有限公司 | 氣體阻隔性層合體 |
| WO2020080217A1 (fr) * | 2018-10-19 | 2020-04-23 | 富士フイルム株式会社 | Composition de résine, film durci ainsi que procédé de fabrication de celui-ci, stratifié, et dispositif à semi-conducteurs |
-
2021
- 2021-08-03 WO PCT/JP2021/028768 patent/WO2022039019A1/fr not_active Ceased
- 2021-08-03 CN CN202180050776.2A patent/CN116096563B/zh active Active
- 2021-08-03 JP JP2022543360A patent/JP7736004B2/ja active Active
- 2021-08-05 TW TW110128911A patent/TWI837499B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007092037A (ja) | 2005-09-02 | 2007-04-12 | Dainippon Ink & Chem Inc | シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル |
| JP2010030290A (ja) | 2008-06-26 | 2010-02-12 | Fujifilm Corp | バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法 |
| WO2012115175A1 (fr) | 2011-02-25 | 2012-08-30 | 富士フイルム株式会社 | Produit barrière feuilleté et procédé de fabrication du produit barrière feuilleté |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI837499B (zh) | 2024-04-01 |
| CN116096563B (zh) | 2025-02-28 |
| JPWO2022039019A1 (fr) | 2022-02-24 |
| WO2022039019A1 (fr) | 2022-02-24 |
| TW202219232A (zh) | 2022-05-16 |
| CN116096563A (zh) | 2023-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7736004B2 (ja) | 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 | |
| TWI593736B (zh) | 用於封裝顯示器的組成物以及含有其的顯示器 裝置 | |
| CN107851730B (zh) | 有机发光显示器 | |
| TWI618238B (zh) | 有機發光二極體顯示裝置 | |
| CN107683537A (zh) | 有机发光显示器 | |
| EP3023444A1 (fr) | Composition de fabrication de film organique, dispositif d'affichage électroluminescent organique fabriqué à l'aide de ladite composition et procédé de fabrication du dispositif d'affichage | |
| KR101518498B1 (ko) | 광경화 조성물 및 상기 조성물로 형성된 보호층을 포함하는 광학 부재 | |
| JP2005235467A (ja) | 有機el素子 | |
| TWI501030B (zh) | 光可固化型組成物、包含該組成物之保護層及包含該組成物之封裝裝置 | |
| JP7786457B2 (ja) | 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜 | |
| KR20240009473A (ko) | 전자 디바이스 봉지용 조성물, 전자 디바이스 봉지막 형성 방법 및 전자 디바이스 봉지막 | |
| TWI869953B (zh) | 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜的形成方法 | |
| WO2024024836A1 (fr) | Composition pour scellement de dispositif électronique, et film de scellement de dispositif électronique ainsi que procédé de formation de celui-ci | |
| TWI869951B (zh) | 電子裝置密封用組成物、電子裝置密封膜及電子裝置密封膜之形成方法 | |
| WO2025094586A1 (fr) | Composition d'encapsulation de dispositif électronique pour impression jet d'encre, procédé de formation de film d'encapsulation de dispositif électronique et film d'encapsulation de dispositif électronique | |
| TW202300532A (zh) | 封裝有機發光二極體的組成物以及包括使用其形成的有機層之有機發光二極體顯示裝置 | |
| KR20230123787A (ko) | 광경화성 조성물, 봉지층 및 화상표시장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240625 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250408 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250527 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250729 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250811 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7736004 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |