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ID21928A - Komposisi damar termoseting yang berguna sebagai penyekat pengisi bawah - Google Patents

Komposisi damar termoseting yang berguna sebagai penyekat pengisi bawah

Info

Publication number
ID21928A
ID21928A IDW990113A ID990113A ID21928A ID 21928 A ID21928 A ID 21928A ID W990113 A IDW990113 A ID W990113A ID 990113 A ID990113 A ID 990113A ID 21928 A ID21928 A ID 21928A
Authority
ID
Indonesia
Prior art keywords
component
semiconductor device
composition
circuit board
thermosetting resin
Prior art date
Application number
IDW990113A
Other languages
English (en)
Indonesian (id)
Inventor
Konarski Mark
Szcepaniak Zbigniew
Original Assignee
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite Corp filed Critical Loctite Corp
Publication of ID21928A publication Critical patent/ID21928A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01037—Rubidium [Rb]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
IDW990113A 1997-07-24 1998-07-22 Komposisi damar termoseting yang berguna sebagai penyekat pengisi bawah ID21928A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5359297P 1997-07-24 1997-07-24

Publications (1)

Publication Number Publication Date
ID21928A true ID21928A (id) 1999-08-12

Family

ID=21985312

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW990113A ID21928A (id) 1997-07-24 1998-07-22 Komposisi damar termoseting yang berguna sebagai penyekat pengisi bawah

Country Status (13)

Country Link
US (1) US6342577B1 (fr)
EP (1) EP0929592B1 (fr)
JP (1) JP2001506313A (fr)
KR (1) KR100571334B1 (fr)
CN (1) CN1197893C (fr)
AT (1) ATE320460T1 (fr)
AU (1) AU728193B2 (fr)
BR (1) BR9806065A (fr)
CA (1) CA2266314A1 (fr)
DE (1) DE69833865T2 (fr)
ID (1) ID21928A (fr)
RU (1) RU2195474C2 (fr)
WO (1) WO1999005196A1 (fr)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG88747A1 (en) * 1999-03-01 2002-05-21 Motorola Inc A method and machine for underfilling an assembly to form a semiconductor package
US6670430B1 (en) * 1999-12-17 2003-12-30 Henkel Loctite Corporation Thermosetting resin compositions comprising epoxy resins, adhesion promoters, and curatives based on the combination of nitrogen compounds and transition metal complexes
US6617399B2 (en) * 1999-12-17 2003-09-09 Henkel Loctite Corporation Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
US6548575B2 (en) 2000-12-13 2003-04-15 National Starch And Chemical Investment Holding Corporation High temperature underfilling material with low exotherm during use
JP3566680B2 (ja) * 2001-09-11 2004-09-15 富士通株式会社 半導体装置の製造方法
JP3866591B2 (ja) * 2001-10-29 2007-01-10 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
US6951907B1 (en) 2001-11-19 2005-10-04 Henkel Corporation Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
US6893736B2 (en) * 2001-11-19 2005-05-17 Henkel Corporation Thermosetting resin compositions useful as underfill sealants
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US20040094751A1 (en) * 2002-03-25 2004-05-20 Toshiaki Ogiwara Composition for filling through-holes in printed wiring boards
JP2006216720A (ja) 2005-02-02 2006-08-17 Sharp Corp 半導体装置及びその製造方法
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
RU2320040C1 (ru) * 2006-10-13 2008-03-20 ЗАО "Электроизолит" Электроизоляционный пропиточный лак
RU2470954C2 (ru) * 2007-06-11 2012-12-27 Басф Се Катализатор для отверждения эпоксидов
JP5475223B2 (ja) * 2007-10-09 2014-04-16 株式会社Ａｄｅｋａ 一液型シアネート−エポキシ複合樹脂組成物、その硬化物及びその製造方法、並びにそれを用いた封止用材料及び接着剤
WO2010068287A2 (fr) * 2008-12-11 2010-06-17 Angion Biomedica Corp. Modulateurs à petites molécules de l'activité du facteur de croissance (facteur de dispersion) des hépatocytes
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
DE102009003132A1 (de) * 2009-05-15 2010-11-18 Robert Bosch Gmbh Kunststoffformmasse sowie Verfahren zu deren Herstellung
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
SG184967A1 (en) * 2010-04-21 2012-11-29 Mitsubishi Gas Chemical Co Heat curable composition
RU2447093C1 (ru) * 2011-01-19 2012-04-10 Открытое акционерное общество "Институт пластмасс имени Г.С. Петрова" Способ получения орто-крезолноволачной эпоксидной смолы и полимерная композиция на ее основе
CN102559119A (zh) * 2011-12-13 2012-07-11 北京海斯迪克新材料有限公司 一种具有良好流变稳定性的单组份环氧包封胶及制备方法
RU2492549C1 (ru) * 2012-03-20 2013-09-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ сборки трехмерного электронного модуля
JP6289366B2 (ja) * 2012-06-08 2018-03-07 株式会社Adeka 硬化性樹脂組成物、樹脂組成物、これらを用いてなる樹脂シート、及びこれらの硬化物
JP6202857B2 (ja) * 2013-04-02 2017-09-27 株式会社東芝 電気機器用コーティング材
RU2597916C2 (ru) * 2014-11-18 2016-09-20 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Полимерный матричный материал для кондиционирования низко- и среднеактивных отработанных ионообменных смол
KR102545337B1 (ko) 2015-03-31 2023-06-19 미츠비시 가스 가가쿠 가부시키가이샤 시안산에스테르 화합물, 그 화합물을 함유하는 경화성 수지 조성물 및 그 경화물
CN105356479B (zh) * 2015-11-13 2017-12-08 湖南大学 一种c型串联滤波式级联svg及其负序补偿控制方法
KR102246076B1 (ko) * 2015-11-17 2021-05-03 한국전자통신연구원 반도체 패키지의 제조 방법
US9988308B1 (en) * 2016-05-05 2018-06-05 Five Star Products, Inc. Epoxy based material and applications therefore
WO2021049390A1 (fr) 2019-09-09 2021-03-18 株式会社Adeka Composition de résine durcissable
US20230105437A1 (en) 2020-03-25 2023-04-06 Adeka Corporation Curable resin composition and method for suppressing curing shrinkage of curable resin composition
CN116888184A (zh) 2021-03-08 2023-10-13 株式会社艾迪科 固化性树脂组合物、固化物及粘接剂
CN114214019A (zh) * 2021-12-02 2022-03-22 深圳斯多福新材料科技有限公司 一种可耐高低温的单组分胶黏剂的制备方法
KR20250048792A (ko) * 2023-07-03 2025-04-10 아사히 가세이 가부시키가이샤 에폭시 수지 조성물, 수지 페이스트, 필름형 접착제, 프린트 배선판, 반도체 칩 패키지 및 전자 장치

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH448513A (de) 1963-11-14 1967-12-15 Bayer Ag Verfahren zur Herstellung von geformten Gebilden auf Basis von Epoxydharzen
GB1305702A (fr) 1969-02-20 1973-02-07
US3862260A (en) 1973-05-07 1975-01-21 Union Carbide Corp Epoxy curing system
US4159976A (en) * 1977-03-10 1979-07-03 Loctite Corporation Curable systems containing epoxy resin and methanol or ethanol solvent to suppress the catalytic reaction between epoxy resin and an imidazole catalytic curing agent
JPS55112256A (en) * 1979-02-21 1980-08-29 Mitsubishi Electric Corp Thermosetting resin composition
JPS56125449A (en) 1980-01-29 1981-10-01 Mitsubishi Gas Chem Co Inc Curable resin composition
US4528366A (en) 1982-09-28 1985-07-09 The Dow Chemical Company Production of polytriazines from aromatic polycyanates with cobalt salt of a carboxylic acid as catalyst
US4477629A (en) 1983-07-27 1984-10-16 The Dow Chemical Company Cyanate-containing polymers
US4751323A (en) 1983-11-16 1988-06-14 The Dow Chemical Company Novel polyaromatic cyanates
US4645803A (en) 1984-02-29 1987-02-24 American Cyanamid Company Curable epoxy resin compositions
JPS62275123A (ja) 1986-05-23 1987-11-30 Toray Ind Inc プリプレグ用樹脂組成物
US4732962A (en) * 1987-02-18 1988-03-22 General Motors Corporation High temperature epoxy tooling composition of bisphenol-A epoxy, trifunctional epoxy, anhydride curing agent and an imidazole catalyst
US4742148A (en) * 1987-04-17 1988-05-03 Hexcel Corporation Modified imidazole latent epoxy resin catalysts and systems comprising them
US4859528A (en) 1987-04-17 1989-08-22 Hexcel Corporation Composite tooling
US4918157A (en) 1987-07-08 1990-04-17 Amoco Corporation Thermosetting composition comprising cyanate ester, urea compound and epoxy resin
JP3231814B2 (ja) 1991-07-12 2001-11-26 ミネソタ マイニング アンド マニュファクチャリング カンパニー 異方性導電膜
RU2084467C1 (ru) * 1992-10-20 1997-07-20 Виктор Геннадьевич Филиппов Уретансодержащие простые полиэфиры с концевыми первичными аминогруппами в качестве отвердителей эпоксидиановых смол и эпоксидная композиция на их основе (варианты)
WO1996020242A1 (fr) * 1994-12-26 1996-07-04 Ciba Specialty Chemicals Inc. Compositions de resine durcissable
US5534356A (en) * 1995-04-26 1996-07-09 Olin Corporation Anodized aluminum substrate having increased breakdown voltage
JP3777732B2 (ja) * 1996-10-15 2006-05-24 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
US5969036A (en) * 1997-06-20 1999-10-19 The Dexter Corporation Epoxy-containing die-attach compositions
JP3591758B2 (ja) * 1997-10-09 2004-11-24 住友ベークライト株式会社 液状注入封止アンダーフィル材

Also Published As

Publication number Publication date
AU8595998A (en) 1999-02-16
EP0929592B1 (fr) 2006-03-15
EP0929592A4 (fr) 2000-09-13
AU728193B2 (en) 2001-01-04
KR20000068623A (ko) 2000-11-25
CN1237186A (zh) 1999-12-01
KR100571334B1 (ko) 2006-04-14
EP0929592A1 (fr) 1999-07-21
RU2195474C2 (ru) 2002-12-27
ATE320460T1 (de) 2006-04-15
WO1999005196A1 (fr) 1999-02-04
CN1197893C (zh) 2005-04-20
DE69833865T2 (de) 2006-10-05
BR9806065A (pt) 1999-08-31
CA2266314A1 (fr) 1999-02-04
JP2001506313A (ja) 2001-05-15
US6342577B1 (en) 2002-01-29
DE69833865D1 (de) 2006-05-11

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