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FI20030919L - Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti - Google Patents

Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti Download PDF

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Publication number
FI20030919L
FI20030919L FI20030919A FI20030919A FI20030919L FI 20030919 L FI20030919 L FI 20030919L FI 20030919 A FI20030919 A FI 20030919A FI 20030919 A FI20030919 A FI 20030919A FI 20030919 L FI20030919 L FI 20030919L
Authority
FI
Finland
Prior art keywords
thin film
film component
electronic thin
manufacturing
electronic
Prior art date
Application number
FI20030919A
Other languages
English (en)
Swedish (sv)
Other versions
FI20030919A7 (fi
FI20030919A0 (fi
Inventor
Antti Kemppainen
Terho Kololuoma
Markus Tuomikoski
Raimo Korhonen
Pasi Laakkonen
Pekka Koivukunnas
Original Assignee
Avantone Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avantone Oy filed Critical Avantone Oy
Priority to FI20030919A priority Critical patent/FI20030919L/fi
Publication of FI20030919A0 publication Critical patent/FI20030919A0/fi
Priority to BRPI0411591-0A priority patent/BRPI0411591A/pt
Priority to PCT/FI2004/050098 priority patent/WO2004111729A1/en
Priority to CNA200480023159XA priority patent/CN1836190A/zh
Priority to RU2006101405/04A priority patent/RU2006101405A/ru
Priority to CA002529329A priority patent/CA2529329A1/en
Priority to US10/561,225 priority patent/US20080012151A1/en
Priority to JP2006516250A priority patent/JP2007527106A/ja
Priority to EP04742248A priority patent/EP1636652A1/en
Publication of FI20030919A7 publication Critical patent/FI20030919A7/fi
Publication of FI20030919L publication Critical patent/FI20030919L/fi

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/466Lateral bottom-gate IGFETs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/468Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/491Vertical transistors, e.g. vertical carbon nanotube field effect transistors [CNT-FETs]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/17Passive-matrix OLED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621Providing a shape to conductive layers, e.g. patterning or selective deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/821Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • H10K85/111Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10Organic polymers or oligomers
    • H10K85/111Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
FI20030919A 2003-06-19 2003-06-19 Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti FI20030919L (fi)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20030919A FI20030919L (fi) 2003-06-19 2003-06-19 Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti
EP04742248A EP1636652A1 (en) 2003-06-19 2004-06-18 A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
RU2006101405/04A RU2006101405A (ru) 2003-06-19 2004-06-18 Способ и устройство для изготовления электронного тонкопленочного элемента и электронный тонкопленочный элемент
PCT/FI2004/050098 WO2004111729A1 (en) 2003-06-19 2004-06-18 A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
CNA200480023159XA CN1836190A (zh) 2003-06-19 2004-06-18 用于制造电子薄膜元件的方法和设备以及电子薄膜元件
BRPI0411591-0A BRPI0411591A (pt) 2003-06-19 2004-06-18 método e aparelho para fabricar componentes eletrÈnicos de filme fino, e, componente eletrÈnico de filme fino
CA002529329A CA2529329A1 (en) 2003-06-19 2004-06-18 A method and an apparatus for manufacturing an electronic thin-film component and an electronic thin-film component
US10/561,225 US20080012151A1 (en) 2003-06-19 2004-06-18 Method and an Apparatus for Manufacturing an Electronic Thin-Film Component and an Electronic Thin-Film Component
JP2006516250A JP2007527106A (ja) 2003-06-19 2004-06-18 薄膜電子部品の製造方法および製造装置ならびに薄膜電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030919A FI20030919L (fi) 2003-06-19 2003-06-19 Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti

Publications (3)

Publication Number Publication Date
FI20030919A0 FI20030919A0 (fi) 2003-06-19
FI20030919A7 FI20030919A7 (fi) 2004-12-20
FI20030919L true FI20030919L (fi) 2004-12-20

Family

ID=8566276

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030919A FI20030919L (fi) 2003-06-19 2003-06-19 Menetelmä ja laitteisto elektronisen ohutkalvokomponentin valmistamiseksi sekä elektroninen ohutkalvokomponentti

Country Status (9)

Country Link
US (1) US20080012151A1 (fi)
EP (1) EP1636652A1 (fi)
JP (1) JP2007527106A (fi)
CN (1) CN1836190A (fi)
BR (1) BRPI0411591A (fi)
CA (1) CA2529329A1 (fi)
FI (1) FI20030919L (fi)
RU (1) RU2006101405A (fi)
WO (1) WO2004111729A1 (fi)

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JP4506605B2 (ja) 2005-07-28 2010-07-21 ソニー株式会社 半導体装置の製造方法
DE102005035589A1 (de) * 2005-07-29 2007-02-01 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines elektronischen Bauelements
GB0523163D0 (en) * 2005-11-14 2005-12-21 Suisse Electronique Microtech Patterning of conductive layers with underlying compressible spacer layer or spacer layer stack
US9174400B2 (en) * 2006-02-15 2015-11-03 Osram Opto Semiconductors Gmbh Method for producing structures in optoelectronic components and device for this purpose
DE102006047388A1 (de) 2006-10-06 2008-04-17 Polyic Gmbh & Co. Kg Feldeffekttransistor sowie elektrische Schaltung
GB2448730A (en) * 2007-04-25 2008-10-29 Innos Ltd Fabrication of Planar Electronic Circuit Devices
US7935566B2 (en) 2007-05-14 2011-05-03 Nanyang Technological University Embossing printing for fabrication of organic field effect transistors and its integrated devices
JP5319910B2 (ja) * 2007-11-07 2013-10-16 コバレントマテリアル株式会社 導電性パターンの埋設形成方法、積層基板の製造方法及び微細流路構造体の製造方法
PT103951A (pt) * 2008-01-31 2009-07-31 Univ Nova De Lisboa Processamento de elementos eléctricos e/ou electrónicos em substratos de material celulósico
EP2244302B1 (en) * 2008-02-12 2016-05-18 Konica Minolta Holdings, Inc. Method for forming an organic semiconductor layer and method for manufacturing an organic thin film transistor
PT103999B (pt) * 2008-03-20 2012-11-16 Univ Nova De Lisboa Processo de utilização e criação de papel à base de fibras celulósicas naturais, fibras sintéticas ou mistas como suporte físico e meio armazenador de cargas elétricas em transístores de efeito de campo com memória autossustentáveis usando óxidos sem
WO2009134697A2 (en) * 2008-04-30 2009-11-05 Applied Materials, Inc. Roll to roll oled production system
JP2010237375A (ja) * 2009-03-31 2010-10-21 Mitsui Chemicals Inc 微細構造体およびそれを用いた光学素子
JP5572693B2 (ja) * 2009-04-17 2014-08-13 コーニンクレッカ フィリップス エヌ ヴェ 高い明度を有する、透明な有機発光デバイス
WO2010132613A2 (en) * 2009-05-13 2010-11-18 The Regents Of The University Of California High resolution light emitting devices
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US8347492B2 (en) * 2010-02-05 2013-01-08 Energy Focus, Inc. Method of making an arrangement for collecting or emitting light
WO2012134161A2 (ko) * 2011-03-29 2012-10-04 국립대학법인 울산과학기술대학교 산학협력단 그라펜 시트, 이를 포함하는 투명 전극, 활성층, 이를 구비한 표시소자, 전자소자, 광전소자, 배터리, 태양전지 및 염료감응 태양전지
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KR102054190B1 (ko) * 2017-01-23 2019-12-10 동우 화인켐 주식회사 고성능 필름형 터치 센서 및 그 제조방법
CN108538210A (zh) * 2017-03-06 2018-09-14 浙江斯玛特信息科技有限公司 透明led全彩显示屏
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CN111525031A (zh) * 2020-04-06 2020-08-11 杭州纤纳光电科技有限公司 一种钙钛矿的三结叠层太阳能电池及其制备方法
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Also Published As

Publication number Publication date
FI20030919A7 (fi) 2004-12-20
BRPI0411591A (pt) 2006-08-29
JP2007527106A (ja) 2007-09-20
RU2006101405A (ru) 2006-06-27
CA2529329A1 (en) 2004-12-23
FI20030919A0 (fi) 2003-06-19
WO2004111729A1 (en) 2004-12-23
US20080012151A1 (en) 2008-01-17
CN1836190A (zh) 2006-09-20
EP1636652A1 (en) 2006-03-22

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