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ES2666858T3 - Unidad de procesamiento que tiene condensador, y sistema de procesamiento totalmente automático de fabricación de placas de huecograbado que usa el mismo - Google Patents

Unidad de procesamiento que tiene condensador, y sistema de procesamiento totalmente automático de fabricación de placas de huecograbado que usa el mismo Download PDF

Info

Publication number
ES2666858T3
ES2666858T3 ES12855932.5T ES12855932T ES2666858T3 ES 2666858 T3 ES2666858 T3 ES 2666858T3 ES 12855932 T ES12855932 T ES 12855932T ES 2666858 T3 ES2666858 T3 ES 2666858T3
Authority
ES
Spain
Prior art keywords
processing
bath
condenser
processing bath
exhaust port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12855932.5T
Other languages
English (en)
Spanish (es)
Inventor
Tatsuo Shigeta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Think Laboratory Co Ltd
Original Assignee
Think Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Think Laboratory Co Ltd filed Critical Think Laboratory Co Ltd
Application granted granted Critical
Publication of ES2666858T3 publication Critical patent/ES2666858T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/18—Curved printing formes or printing cylinders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • ing And Chemical Polishing (AREA)
ES12855932.5T 2011-12-07 2012-12-05 Unidad de procesamiento que tiene condensador, y sistema de procesamiento totalmente automático de fabricación de placas de huecograbado que usa el mismo Active ES2666858T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011267471 2011-12-07
JP2011267471 2011-12-07
PCT/JP2012/081489 WO2013084929A1 (fr) 2011-12-07 2012-12-05 Unité de traitement comprenant un condenseur, et système de traitement de fabrication de clichés par gravure entièrement automatique utilisant celle-ci

Publications (1)

Publication Number Publication Date
ES2666858T3 true ES2666858T3 (es) 2018-05-08

Family

ID=48574287

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12855932.5T Active ES2666858T3 (es) 2011-12-07 2012-12-05 Unidad de procesamiento que tiene condensador, y sistema de procesamiento totalmente automático de fabricación de placas de huecograbado que usa el mismo

Country Status (7)

Country Link
US (1) US20150014154A1 (fr)
EP (1) EP2789714B1 (fr)
JP (1) JPWO2013084929A1 (fr)
KR (1) KR20140019866A (fr)
CN (1) CN103732806A (fr)
ES (1) ES2666858T3 (fr)
WO (1) WO2013084929A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2764767T3 (es) * 2010-10-01 2020-06-04 Think Labs Kk Sistema de procesamiento de fabricación de placas de huecograbado completamente automático

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10106A (en) * 1853-10-11 Improvement in covering metals with gutta-percha and caoutchouc
US2439491A (en) * 1942-06-02 1948-04-13 Schiffl Charles Enclosed electroplating tank
US4519887A (en) * 1983-06-13 1985-05-28 Think Laboratory Co., Ltd. Apparatus for automatically attaching and detaching cassette-type rolls
JPS60179302U (ja) * 1984-05-07 1985-11-28 日本電気株式会社 ウエツト処理装置
US5149411A (en) * 1991-04-22 1992-09-22 Robert L. Castle Toxic fumes removal apparatus for plating tank
JP3363243B2 (ja) * 1994-03-16 2003-01-08 大豊工業株式会社 めっき工程の蒸気回収装置
JPH09111498A (ja) * 1995-10-13 1997-04-28 Yazaki Corp めっき装置
JP2918832B2 (ja) * 1995-12-15 1999-07-12 日英ハードクローム工業株式会社 クロムめっきにおけるクロムめっき液、クロムめっき廃液、クロム酸洗浄水用クローズド・リサイクル・システム
US6231728B1 (en) * 1996-11-22 2001-05-15 Hubert F. Metzger Electroplating apparatus
JP3781388B2 (ja) 1996-12-28 2006-05-31 株式会社シンク・ラボラトリー グラビア製版工場
JPH1121680A (ja) * 1997-07-01 1999-01-26 Fuji Photo Film Co Ltd 電子写真刷版のエッチング装置及びエッチング処理方法
DE10051830A1 (de) * 2000-10-19 2002-04-25 Korrotech Gmbh & Co Kg Behälter zur Aufnahme eines aggressive Dämpfe abgebenden Mediums
JP2005029876A (ja) 2003-07-11 2005-02-03 Think Laboratory Co Ltd 硫酸銅メッキ方法
JP4709575B2 (ja) * 2005-04-15 2011-06-22 福田金属箔粉工業株式会社 銅箔の粗面化処理方法及び粗面化処理液
CN100576578C (zh) * 2006-04-20 2009-12-30 无锡尚德太阳能电力有限公司 制备太阳电池电极的方法及其电化学沉积装置
WO2007135899A1 (fr) 2006-05-23 2007-11-29 Think Laboratory Co., Ltd. Système de fabrication complètement automatisée pour rouleau à graver pour gravure
WO2007135898A1 (fr) 2006-05-24 2007-11-29 Think Laboratory Co., Ltd. Système de fabrication totalement automatisé pour cylindre à graver
DE102006025847A1 (de) * 2006-06-02 2007-12-06 Merck Patent Gmbh Verwendung von Phosphinsäure in der Galvanotechnik
PL2556960T3 (pl) 2010-04-06 2018-02-28 Think Laboratory Co., Ltd. System technologiczny do w pełni automatycznego wytwarzania płyty do druku wklęsłego
CN102425002B (zh) * 2011-12-29 2014-05-28 广州杰赛科技股份有限公司 采用减压蒸馏技术回用镀银液系统及其回收方法

Also Published As

Publication number Publication date
WO2013084929A1 (fr) 2013-06-13
KR20140019866A (ko) 2014-02-17
JPWO2013084929A1 (ja) 2015-04-27
CN103732806A (zh) 2014-04-16
EP2789714B1 (fr) 2018-03-28
US20150014154A1 (en) 2015-01-15
EP2789714A1 (fr) 2014-10-15
EP2789714A4 (fr) 2015-09-02

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