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ES2666858T3 - Processing unit that has a condenser, and fully automatic gravure plate manufacturing system that uses the same - Google Patents

Processing unit that has a condenser, and fully automatic gravure plate manufacturing system that uses the same Download PDF

Info

Publication number
ES2666858T3
ES2666858T3 ES12855932.5T ES12855932T ES2666858T3 ES 2666858 T3 ES2666858 T3 ES 2666858T3 ES 12855932 T ES12855932 T ES 12855932T ES 2666858 T3 ES2666858 T3 ES 2666858T3
Authority
ES
Spain
Prior art keywords
processing
bath
condenser
processing bath
exhaust port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12855932.5T
Other languages
Spanish (es)
Inventor
Tatsuo Shigeta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Think Laboratory Co Ltd
Original Assignee
Think Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Think Laboratory Co Ltd filed Critical Think Laboratory Co Ltd
Application granted granted Critical
Publication of ES2666858T3 publication Critical patent/ES2666858T3/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/18—Curved printing formes or printing cylinders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Una unidad de procesamiento (10) que incluye un condensador (22) que va a ser usado para un sistema de procesamiento totalmente automático de fabricación de placas de huecograbado para fabricar un rollo de fabricación de placas realizando una serie de procesos en un rollo de fabricación de placas sin procesar, la unidad de procesamiento (10) comprende: un baño de procesamiento (12); medios de sujeción (16a, 16b) para sostener un cilindro de huecograbado (14) dentro del baño de procesamiento (12) una lumbrera de admisión (18) para tomar aire, que se proporciona en una parte del baño de procesamiento (12); una lumbrera de escape (20) para el escape de gas, que se proporciona en otra parte del baño de procesamiento (12), dicha lumbrera de admisión (18) se orienta en una dirección de dicha lumbrera de escape (20), dicha lumbrera de admisión (18), dicha lumbrera de escape (20) y dicho baño de procesamiento (12) definen un recorrido de flujo de fluido, en donde se mueve fluido a lo largo de dicho recorrido de flujo de fluido desde dicha parte de dicho baño de procesamiento (12) a dicha otra parte de dicho baño de procesamiento (12); un condensador (22) proporcionado entre el baño de procesamiento (12) y la lumbrera de escape (20); y una tubería de retorno de solución de procesamiento (24) para devolver, al baño de procesamiento (12), una solución de procesamiento obtenida por el condensador (22) que licua una parte del gas que va a escapar, dicho condensador (22) se dispone adyacente a dicha tubería de retorno de solución de procesamiento (24), dicho baño de procesamiento (12) y dicha lumbrera de escape (20).A processing unit (10) that includes a capacitor (22) to be used for a fully automatic gravure plate manufacturing process to manufacture a plate manufacturing roll by performing a series of processes on a manufacturing roll of unprocessed plates, the processing unit (10) comprises: a processing bath (12); fastening means (16a, 16b) for holding an intaglio cylinder (14) inside the processing bath (12) an intake port (18) for taking air, which is provided in a part of the processing bath (12); an exhaust port (20) for the escape of gas, which is provided elsewhere in the processing bath (12), said intake port (18) is oriented in a direction of said exhaust port (20), said port inlet (18), said exhaust port (20) and said processing bath (12) define a fluid flow path, where fluid is moved along said fluid flow path from said part of said bath from processing (12) to said other part of said processing bath (12); a condenser (22) provided between the processing bath (12) and the exhaust port (20); and a return line of processing solution (24) to return, to the processing bath (12), a processing solution obtained by the condenser (22) that liquefies a part of the gas to be escaped, said condenser (22) it is arranged adjacent to said return line of processing solution (24), said processing bath (12) and said exhaust port (20).

Description

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Claims (1)

imagen1image 1
ES12855932.5T 2011-12-07 2012-12-05 Processing unit that has a condenser, and fully automatic gravure plate manufacturing system that uses the same Active ES2666858T3 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011267471 2011-12-07
JP2011267471 2011-12-07
PCT/JP2012/081489 WO2013084929A1 (en) 2011-12-07 2012-12-05 Processing unit having condenser, and fully automatic gravure platemaking processing system using same

Publications (1)

Publication Number Publication Date
ES2666858T3 true ES2666858T3 (en) 2018-05-08

Family

ID=48574287

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12855932.5T Active ES2666858T3 (en) 2011-12-07 2012-12-05 Processing unit that has a condenser, and fully automatic gravure plate manufacturing system that uses the same

Country Status (7)

Country Link
US (1) US20150014154A1 (en)
EP (1) EP2789714B1 (en)
JP (1) JPWO2013084929A1 (en)
KR (1) KR20140019866A (en)
CN (1) CN103732806A (en)
ES (1) ES2666858T3 (en)
WO (1) WO2013084929A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10696082B2 (en) * 2010-10-01 2020-06-30 Think Laboratory Co., Ltd. Full-automatic gravure plate-making processing system

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10106A (en) * 1853-10-11 Improvement in covering metals with gutta-percha and caoutchouc
US2439491A (en) * 1942-06-02 1948-04-13 Schiffl Charles Enclosed electroplating tank
US4519887A (en) * 1983-06-13 1985-05-28 Think Laboratory Co., Ltd. Apparatus for automatically attaching and detaching cassette-type rolls
JPS60179302U (en) * 1984-05-07 1985-11-28 日本電気株式会社 Wet treatment equipment
US5149411A (en) * 1991-04-22 1992-09-22 Robert L. Castle Toxic fumes removal apparatus for plating tank
JP3363243B2 (en) * 1994-03-16 2003-01-08 大豊工業株式会社 Steam recovery equipment for plating process
JPH09111498A (en) * 1995-10-13 1997-04-28 Yazaki Corp Plating equipment
JP2918832B2 (en) * 1995-12-15 1999-07-12 日英ハードクローム工業株式会社 Closed recycling system for chrome plating solution, chrome plating waste solution, and chromic acid cleaning water in chrome plating
US6231728B1 (en) * 1996-11-22 2001-05-15 Hubert F. Metzger Electroplating apparatus
JP3781388B2 (en) * 1996-12-28 2006-05-31 株式会社シンク・ラボラトリー Gravure plate making factory
JPH1121680A (en) * 1997-07-01 1999-01-26 Fuji Photo Film Co Ltd Device and method for etching electrophotographic printing plate
DE10051830A1 (en) * 2000-10-19 2002-04-25 Korrotech Gmbh & Co Kg Container used for a galvanic liquid which releases corrosive vapors comprises a separator on the container edge with suction openings, and a filling body chamber with filling bodies arranged above the openings in the separator
JP2005029876A (en) 2003-07-11 2005-02-03 Think Laboratory Co Ltd Copper sulfate plating method
JP4709575B2 (en) * 2005-04-15 2011-06-22 福田金属箔粉工業株式会社 Copper foil roughening treatment method and roughening treatment liquid
CN100576578C (en) * 2006-04-20 2009-12-30 无锡尚德太阳能电力有限公司 Method for preparing solar cell electrode and electrochemical deposition device thereof
JP5004362B2 (en) 2006-05-23 2012-08-22 株式会社シンク・ラボラトリー Fully automatic production system for gravure printing roll
WO2007135898A1 (en) 2006-05-24 2007-11-29 Think Laboratory Co., Ltd. Fully automatic manufacturing system for gravure engraving roll
DE102006025847A1 (en) * 2006-06-02 2007-12-06 Merck Patent Gmbh Use of phosphinic acid in electroplating
WO2011125926A1 (en) 2010-04-06 2011-10-13 株式会社シンク・ラボラトリー Processing system for full-automatic gravure plate making
CN102425002B (en) * 2011-12-29 2014-05-28 广州杰赛科技股份有限公司 System for recycling silver plating liquid by using vacuum distillation technology and recovery method used therein

Also Published As

Publication number Publication date
EP2789714A1 (en) 2014-10-15
CN103732806A (en) 2014-04-16
KR20140019866A (en) 2014-02-17
US20150014154A1 (en) 2015-01-15
EP2789714A4 (en) 2015-09-02
WO2013084929A1 (en) 2013-06-13
EP2789714B1 (en) 2018-03-28
JPWO2013084929A1 (en) 2015-04-27

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