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ES2074320T3 - Dispositivo para recubrir un sustrato, en especial con capas no conductoras electricas. - Google Patents

Dispositivo para recubrir un sustrato, en especial con capas no conductoras electricas.

Info

Publication number
ES2074320T3
ES2074320T3 ES92118239T ES92118239T ES2074320T3 ES 2074320 T3 ES2074320 T3 ES 2074320T3 ES 92118239 T ES92118239 T ES 92118239T ES 92118239 T ES92118239 T ES 92118239T ES 2074320 T3 ES2074320 T3 ES 2074320T3
Authority
ES
Spain
Prior art keywords
united
substrate
network
spraying
respectively connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92118239T
Other languages
English (en)
Inventor
Joachim Dr Szczyrbowski
Gotz Dipl-Ing Teschner
Gunter Dr Brauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold AG filed Critical Leybold AG
Application granted granted Critical
Publication of ES2074320T3 publication Critical patent/ES2074320T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

EN UN PROCEDIMIENTO Y UN DISPOSITIVO PARA LA APLICACION DE CAPAS A UN SUBSTRATO DE OBJETOS (3,4) CON CONDUCTIVIDAD ELECTRICA EN ATMOSFERA REACTIVA (FIG. 1), COMPUESTO DE UNA FUENTE DE CORRIENTE (12,13,14) QUE ESTA UNIDA A LOS CATODOS (1,2) DISPUESTOS EN UNA CAMARA DE REVESTIMIENTO EVACUABLE (15), QUE ACTUAN DE FORMA ELECTRICA CONJUNTA CON LOS OBJETOS (3,4), EN EL QUE DOS ANODOS (5,6) ELECTRICOS ESTAN DISPUESTOS SEPARADOS DE LA CAMARA DE PULVERIZACION (15), QUE ESTAN PREVISTOS EN UN PLANO ENTRE LOS CATODOS (1,2) Y EL SUBSTRATO (7), POR LO QUE LAS DOS SALIDAS (12A,12B) DEL DEVANADO SECUNDARIO DE UN TRANSFORMADOR (12), UNIDO CON UN GENERADOR DE FRECUENCIA MEDIA (13) BAJO LA INTERCONEXION DE UNA BOBINA DE REACTANCIA (14), ESTAN CONECTADAS RESPECTIVAMENTE A UN CATODO (1 O 2) A TRAVES DE LOS CONDUCTORES DE ALIMENTACION (20,21), Y LOS DOS CONDUCTORES DE ALIMENTACION (20,21) ESTAN UNIDOS ENTRE SI POR MEDIO DE UN CONDUCTOR DE DERIVACION (22), EN EL QUE SE HA CONECTADO UN CIRCUITO OSCILANTE, POR EL QUE CADA UNO DE LOS DOS CONDUCTORES DE ALIMENTACION (20,21) ESTA CONECTADO RESPECTIVAMENTE TANTO A TRAVES DE UNA PRIMERA RED (16 O 17) CON LA CAMARA DE REVESTIMIENTO (15), COMO TAMBIEN A TRAVES DE LA CORRESPONDIENTE SEGUNDA RED (8 O 9) CON EL RESPECTIVO ANODO (5 O 6), Y EN EL QUE EN UN SEGUNDO CONDUCTOR DE DERIVACION (28) SE HA CONECTADO UN DIODO RECTIFICADOR (26) Y UNA RESISTENCIA (27), QUE PERMITEN UNA PULVERIZACION ASIMETRICA.
ES92118239T 1991-11-26 1992-10-24 Dispositivo para recubrir un sustrato, en especial con capas no conductoras electricas. Expired - Lifetime ES2074320T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4138794A DE4138794A1 (de) 1991-11-26 1991-11-26 Verfahren und vorrichtung zum beschichten eines substrats, insbesondere mit elektrisch nichtleitenden schichten
DE4204998A DE4204998A1 (de) 1991-11-26 1992-02-19 Verfahren und vorrichtung zum beschichten eines substrats, insbesondere mit elektrisch nichtleitenden schichten

Publications (1)

Publication Number Publication Date
ES2074320T3 true ES2074320T3 (es) 1995-09-01

Family

ID=25909489

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92118239T Expired - Lifetime ES2074320T3 (es) 1991-11-26 1992-10-24 Dispositivo para recubrir un sustrato, en especial con capas no conductoras electricas.

Country Status (4)

Country Link
EP (1) EP0546293B1 (es)
JP (1) JP3410496B2 (es)
DE (3) DE4138794A1 (es)
ES (1) ES2074320T3 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202425C2 (de) * 1992-01-29 1997-07-17 Leybold Ag Verfahren und Vorrichtung zum Beschichten eines Substrats, insbesondere mit elektrisch nichtleitenden Schichten
US5698082A (en) * 1993-08-04 1997-12-16 Balzers Und Leybold Method and apparatus for coating substrates in a vacuum chamber, with a system for the detection and suppression of undesirable arcing
DE4326100B4 (de) * 1993-08-04 2006-03-23 Unaxis Deutschland Holding Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer, mit einer Einrichtung zur Erkennung und Unterdrückung von unerwünschten Lichtbögen
US5830331A (en) * 1994-09-23 1998-11-03 Seagate Technology, Inc. Apparatus and method for sputtering carbon
DE19537212A1 (de) * 1994-10-06 1996-04-11 Leybold Ag Vorrichtung zum Beschichten von Substraten im Vakuum
CA2218279A1 (en) * 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
DE19605314C2 (de) * 1996-02-14 2002-01-31 Fraunhofer Ges Forschung Verfahren zum Bearbeiten von Substraten in einem bipolaren Niederdruck-Glimmprozeß
DE19610253C2 (de) * 1996-03-15 1999-01-14 Fraunhofer Ges Forschung Zerstäubungseinrichtung
DE19651378A1 (de) * 1996-12-11 1998-06-18 Leybold Systems Gmbh Vorrichtung zum Aufstäuben von dünnen Schichten auf flache Substrate
DE19651811B4 (de) * 1996-12-13 2006-08-31 Unaxis Deutschland Holding Gmbh Vorrichtung zum Belegen eines Substrats mit dünnen Schichten
JP3735462B2 (ja) * 1998-03-30 2006-01-18 株式会社シンクロン 金属酸化物光学薄膜の形成方法および成膜装置
DE19826297A1 (de) * 1998-06-12 1999-12-16 Aurion Anlagentechnik Gmbh Vorrichtung und Verfahren zur Vermeidung von Überschlägen bei Sputterprozessen durch eine aktive Arcunterdrückung
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
WO2002063064A1 (en) 2001-02-07 2002-08-15 Asahi Glass Company, Limited Spatter device and spatter film forming method
EP1491154A1 (en) * 2002-01-22 2004-12-29 JFE Steel Corporation Ceramic-coated instruments for medical use, ceramic-coated instruments for studying living organisms and process for producing the same
US7749622B2 (en) 2002-10-22 2010-07-06 Asahi Glass Company, Limited Multilayer film-coated substrate and process for its production
ATE543198T1 (de) * 2004-12-24 2012-02-15 Huettinger Elektronik Gmbh Plasmaanregungssystem
US8083911B2 (en) 2008-02-14 2011-12-27 Applied Materials, Inc. Apparatus for treating a substrate
US8182662B2 (en) 2009-03-27 2012-05-22 Sputtering Components, Inc. Rotary cathode for magnetron sputtering apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1068972B (de) * 1959-11-12 Dortmund-Hörder Hüttenunion Aktiengesellschaft, Dortmund Vorrichtung zum Betreiben stromstarker Glimmentladungen in Entladungsgefäßen, insbesondere zur Behandlung von in das Entladungsgefäß eingebrachten Körpern
BE539040A (es) * 1955-04-25
FR1556849A (es) * 1967-03-24 1969-02-07
US3860507A (en) * 1972-11-29 1975-01-14 Rca Corp Rf sputtering apparatus and method
DD221202A1 (de) * 1983-12-15 1985-04-17 Fi Manfred V Ardenne Einrichtung zur verhinderung von ueberschlaegen beim hochratezerstaeuben
BG41745A1 (en) * 1984-12-29 1987-08-14 Minchev Device for discontinuing of arc dicharges in gas dicharge vessel
DD252205B5 (de) * 1986-09-01 1993-12-09 Fraunhofer Ges Forschung Zerstaeubungseinrichtung
US4887005A (en) * 1987-09-15 1989-12-12 Rough J Kirkwood H Multiple electrode plasma reactor power distribution system
DE4042287C2 (de) * 1990-12-31 1999-10-28 Leybold Ag Vorrichtung zum reaktiven Aufstäuben von elektrisch isolierendem Werkstoff

Also Published As

Publication number Publication date
EP0546293A1 (de) 1993-06-16
DE4138794A1 (de) 1993-05-27
JPH05222530A (ja) 1993-08-31
DE4204998A1 (de) 1993-08-26
DE59202813D1 (de) 1995-08-10
JP3410496B2 (ja) 2003-05-26
EP0546293B1 (de) 1995-07-05

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